CN109860437A - Flexible organic light emitting display panel and preparation method thereof - Google Patents
Flexible organic light emitting display panel and preparation method thereof Download PDFInfo
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- 239000004642 Polyimide Substances 0.000 claims description 13
- 229920001721 polyimide Polymers 0.000 claims description 13
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
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Abstract
The invention discloses flexible organic light emitting display panels and preparation method thereof.Specifically, the invention proposes a kind of methods for making flexible organic light emitting display panel, comprising: provide hard substrate；Photoresist layer is formed in the side of the hard substrate；Flexible substrate is formed far from the side of the hard substrate in the photoresist layer；Organic Light Emitting Diode is formed far from the side of the photoresist layer in the flexible substrate；And the flexible substrate and the hard substrate are removed using developer solution.This method can easily remove flexible substrate and hard substrate as a result, promote the process rate of flexible organic light emitting display panel, reduce production cost.
Description
Technical field
The present invention relates to field of display technology, and in particular, to flexible organic light emitting display panel and preparation method thereof.
Background technique
Organic electroluminescent (OLED) display technology is because of its self-luminous, wide viewing angle, contrast are high, compared with low power consumption, high anti-
Answer thin speed, ultra lightweight, soft display, screen capable of crimping, the advantages that thermal adaptability is strong, manufacture craft is simple, it has also become
The research hotspot of photoelectric display technical field.In recent years, being constantly progressive with manufacture craft and technology, flexible organic electroluminescence
Luminescence display (flexible OLED) technology has also obtained vigorous growth, such as current many smart phones, smartwatch etc.
Using flexible OLED technology.Flexible OLED technology generallys use flexible substrate, and it is soft that Organic Light Emitting Diode is produced on this
On property substrate.Compared to other technologies, the characteristics of flexible OLED technology is can be made light, very thin, non-friable, and have certain
Deformability, can be bent, distort even curling, fold.Thus Flexible Displays skill can be played in specific application
The advantage of art.
However, current flexible organic light emitting display panel and preparation method thereof, still has much room for improvement.
Summary of the invention
In one aspect of the invention, the invention proposes a kind of methods for making flexible organic light emitting display panel.Root
According to the embodiment of the present invention, this method comprises: providing hard substrate；Photoresist layer is formed in the side of the hard substrate；?
The photoresist layer forms flexible substrate far from the side of the hard substrate；In the flexible substrate far from the photoresist layer
Side formed Organic Light Emitting Diode；And the flexible substrate and the hard substrate are removed using developer solution.As a result,
This method can easily remove flexible substrate and hard substrate, promote the process rate of flexible organic light emitting display panel,
Reduce production cost.
According to an embodiment of the invention, being formed after the photoresist layer, formed before the flexible substrate, this method into
One step includes: to form the first protective layer far from the side of the hard substrate in the photoresist layer, wherein the flexible substrate
Orthographic projection in the hard substrate, positioned at first protective layer within the scope of the orthographic projection in the hard substrate.By
This, when later use developer solution separates flexible substrate and hard substrate, which can preferably protect flexible liner
Bottom avoids developed corrosion of flexible substrate etc., further improves the product of prepared flexible organic light emitting display panel
Yield and service performance.
According to an embodiment of the invention, being formed after the flexible substrate, formed before the Organic Light Emitting Diode, it should
Method further comprises: the flexible substrate far from first protective layer side formed the second protective layer, described second
Protective layer wraps up upper surface and the side wall of the flexible substrate.First protective layer and the second protective layer can wrap up as a result,
The flexible substrate is protected, when later use developer solution being avoided to separate flexible substrate and hard substrate, the developed liquid of flexible substrate
Corrosion etc. further improves the product yield and service performance of prepared flexible organic light emitting display panel.
According to an embodiment of the invention, the material for forming first protective layer and second protective layer includes dioxy
SiClx.The material properties is stablized as a result, the corrosion of resistance to development can preferably protect flexible substrate, and the material is formed
First protective layer and the second protective layer will not influence the Flexible Displays performance of the flexibility organic light emitting display panel.
According to an embodiment of the invention, first protective layer and second protective layer with a thickness of 50-300 μm.
The thinner thickness of first protective layer and the second protective layer as a result, can not only protect flexible substrate not by the corrosion of developer solution,
The Flexible Displays performance of the flexibility organic light emitting display panel is not influenced also.
According to an embodiment of the invention, the material for forming the flexible substrate includes the high molecular material of acid and alkali-resistance, it is described
High molecular material includes at least one of polyimides, polyethylene, polypropylene, polystyrene, polyethylene terephthalate.
The chemical property of the flexible substrate is stablized as a result, is not easy developed corrosion, further improves the flexibility organic light emitting display
The service performance of panel.
According to an embodiment of the invention, being formed after the flexible substrate, formed before the Organic Light Emitting Diode, institute
The method of stating further comprises: forming driving function layer far from the side of the photoresist layer in the flexible substrate.As a result, into one
Step improves the service performance of the flexibility organic light emitting display panel.
According to an embodiment of the invention, formed after the Organic Light Emitting Diode, by the flexible substrate and described hard
Before matter substrate desquamation, the method further includes: the Organic Light Emitting Diode far from the driving function layer one
Side forms encapsulated layer.The service performance of the flexibility organic light emitting display panel is further improved as a result,.
According to an embodiment of the invention, this method comprises: the hard substrate side be coated with polystyrene photoresist,
To form the photoresist layer；In side steam coating silicon dioxide of the photoresist layer far from the hard substrate, so as to shape
At the first protective layer；It is coated with polyimide solution far from the side of the hard substrate in first protective layer, to be formed
The flexible substrate；In side steam coating silicon dioxide of the flexible substrate far from the photoresist layer, to form the second guarantor
Sheath；Driving function layer is formed far from the side of the flexible substrate in second protective layer；It is remote in the driving function layer
Side from second protective layer forms the Organic Light Emitting Diode；In the Organic Light Emitting Diode far from the driving
The side of functional layer forms encapsulated layer；The panel for being formed with the encapsulated layer is placed in the developer solution and is developed, it is described
Photoresist layer dissolution, first protective layer and hard substrate removing.This method can be easily by flexible substrate as a result,
It is removed with hard substrate, promotes the process rate of flexible organic light emitting display panel, reduce production cost.
In another aspect of this invention, the invention proposes a kind of flexible organic light emitting display panels.It is according to the present invention
Embodiment, the flexibility organic light emitting display panel include: the first protective layer；Flexible substrate, the flexible substrate are arranged described
The side of first protective layer；Second protective layer, the second protective layer setting is in the flexible substrate far from first protection
The side of layer；And Organic Light Emitting Diode, the Organic Light Emitting Diode are arranged in second protective layer far from described soft
The side of property substrate.The flexibility organic light emitting display panel lower production costs as a result, and service performance is good.
Detailed description of the invention
Above-mentioned and/or additional aspect of the invention and advantage will become from the description of the embodiment in conjunction with the following figures
Obviously and it is readily appreciated that, in which:
Fig. 1 shows the method flow diagram according to an embodiment of the invention for making flexible organic light emitting display panel；
Fig. 2 shows the method flow in accordance with another embodiment of the present invention for making flexible organic light emitting display panel
Figure；
Fig. 3 shows the method flow of the flexible organic light emitting display panel of the production of another embodiment according to the present invention
Figure；
Fig. 4 shows the method flow of the flexible organic light emitting display panel of the production of another embodiment according to the present invention
Figure；
Fig. 5 shows the method flow of the flexible organic light emitting display panel of the production of another embodiment according to the present invention
Figure；
Fig. 6 shows the method flow of the flexible organic light emitting display panel of the production of another embodiment according to the present invention
Figure；And
Fig. 7 shows the structural schematic diagram of flexible organic light emitting display panel according to an embodiment of the invention.
Description of symbols:
100: hard substrate；200: photoresist layer；210: the first protective layers；220: the second protective layers；300: flexible substrate；
410: driving function layer；420: Organic Light Emitting Diode；430: encapsulated layer；1000: flexible organic light emitting display panel.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.The present invention is
Based on inventor couple on the fact that and problem discovery and understanding make:
It is pre- usually on hard substrate (such as glass substrate) in the method for making flexible organic light emitting display panel at present
One layer of sacrificial layer (i.e. subsequent needs removing removal) is first made, is then coated with polyimides (PI) solution, shape on the sacrificial layer
At flexible substrate, subsequent preparation process (production Organic Light Emitting Diode) is then completed in the flexible substrate, is finally passed through again
Laser lift-off technique separates flexible substrate and hard substrate, and flexibility organic light emitting display panel is made.Due to current sacrificial
The selection of domestic animal layer material can only be removed, higher cost than relatively limited by laser irradiation, and when laser irradiation removing, laser
The uniformity of the Energy distribution of irradiation will affect the quality of flexible substrate (PI layers).For example, laser irradiation can be too strong, PI can be caused
Coke charge；Laser irradiation is excessively weak, then has residual after sacrificial layer removing, will lead to PI layers of residual particles etc..Also, due to laser
Energy distribution, energy size when removing are not easily controlled, and therefore, this method has seriously affected the good of flexible substrate (PI layers)
Rate, and then influence the production yield of entire flexible organic light emitting display panel.Therefore, if can propose that a kind of new production is flexible
The method of organic light emitting display panel easily removes flexible substrate and hard substrate, and cost is relatively low, and will not influence soft
Property substrate and flexible organic light emitting display panel service performance, will largely solve the above problems.
The present invention is directed to alleviate or solve the problems, such as at least one in above-mentioned refer at least to some extent.
In one aspect of the invention, the invention proposes a kind of methods for making flexible organic light emitting display panel.It should
Method forms " sacrificial layer " between hard substrate and flexible substrate using photoresist, after completing subsequent manufacturing processes, using aobvious
Shadow liquid, which develops the photoresist layer, to be removed, so as to easily separate flexible substrate and hard substrate, and during this
Production cost it is relatively low, and the product yield of the flexible substrate and flexible organic light emitting display panel after removing is higher,
Service performance is good.
According to an embodiment of the invention, with reference to Fig. 1 and Fig. 5, this method comprises:
S100: hard substrate is provided
In this step, hard substrate is provided.According to an embodiment of the invention, with reference to (a) in Fig. 5, hard substrate 100
Specific type be not particularly limited, as long as its intensity with higher, be conducive to subsequently through vapor deposition, deposition the methods of production
Organic light emitting display panel of good performance.Specifically, hard substrate 100 may include glass, acrylic board and gold
Belong at least one of plate.The hard substrate 100 that the material is formed as a result, is cheap and service performance is good.
S200: photoresist layer is formed
In this step, the side of hard substrate described in step forms photoresist layer in front.It is according to the present invention
Embodiment can be in the surface coating photoresist of hard substrate 100 with reference to (b) in Fig. 5, and is solidified, to form light
Photoresist layer 200.It according to an embodiment of the invention, the type of photoresist is not limited by spy, such as can be positive photoresist, it can be with
For negative photoresist.Specifically, can be polystyrene (PS) photoresist.
S300: flexible substrate is formed
In this step, in front photoresist layer described in step far from hard substrate side formed flexible substrate.
According to an embodiment of the invention, the material for forming flexible substrate may include the high molecular material of acid and alkali-resistance, the high molecular material
It may include at least one of polyimides, polyethylene, polypropylene, polystyrene, polyethylene terephthalate.As a result,
The chemical property of the flexible substrate is stablized, and is not easy developed corrosion, it is organic to further improve flexibility made by this method
The service performance of light emitting display panel.It according to a particular embodiment of the invention, can be in photoresist layer with reference to (c) in Fig. 5
200 sides far from hard substrate 100 are coated with polyimide solution, to form flexible substrate 300.
S400: Organic Light Emitting Diode is formed
In this step, side of the flexible substrate described in step far from photoresist layer in front forms organic light emission
Diode.According to an embodiment of the invention, with reference to Fig. 4, after forming flexible substrate, formed Organic Light Emitting Diode it
Before, this method further comprises:
S410: driving function layer is formed
In this step, side of the flexible substrate described in step far from photoresist layer in front forms driving function
Layer.According to an embodiment of the invention, driving function layer 410 is formed in flexible substrate 300 far from photoresist with reference to (d) in Fig. 5
The side of layer 200.According to an embodiment of the invention, the preparation method of driving function layer is not particularly limited, those skilled in the art
Member, which can according to need, to be selected.Specifically, driving function layer may include each layer structure to form thin film transistor (TFT) (TFT)
Deng.
According to an embodiment of the invention, being formed after driving function layer, with reference to (d) in Fig. 5, in driving function layer 410
Side far from flexible substrate 300 forms Organic Light Emitting Diode 420.Specifically, Organic Light Emitting Diode 420 may include two
A electrode layer and setting the luminescent layer (not shown) between two electrode layers, specifically, luminescent layer may include difference
The luminescent material of color, such as may include red emitting material, green light luminescent material and blue light emitting material etc..According to this
The preparation method of the embodiment of invention, Organic Light Emitting Diode is not particularly limited, and those skilled in the art can according to need
It is selected.
According to an embodiment of the invention, with reference to Fig. 4, after forming Organic Light Emitting Diode, by flexible substrate and firmly
Before matter substrate desquamation, this method further comprises:
S430: encapsulated layer is formed
In this step, Organic Light Emitting Diode described in step is sealed far from the side formation of driving function layer in front
Fill layer.According to an embodiment of the invention, with reference to (d) in Fig. 5, in Organic Light Emitting Diode 420 far from driving function layer 410
Side forms encapsulated layer 430.Specifically, thin-film encapsulation layer 430 (TFE layers) can be formed by the method for vapor deposition.Film envelope
Dress layer 430 (TFE layers) can effectively obstruct the inside that water and oxygen etc. enter the organic light emitting display panel, and subsequent aobvious
During shadow removes photoresist layer 200, it is organic into this which can effectively obstruct developer solution
The inside of light emitting display panel further improves the service performance of the flexible organic light emitting display panel of production.
S500: flexible substrate and hard substrate are removed using developer solution
In this step, driving function layer, Organic Light Emitting Diode have been made in step in front, and has been encapsulated
After good, photoresist layer is removed using developing liquid developing, so that the flexible substrate and hard substrate are removed, finally obtained flexibility has
Machine light emitting display panel (flexibility organic light emitting display panel obtained can refer to (e) in Fig. 5).Implementation according to the present invention
Example, can have the panel of encapsulated layer to be placed in developer solution the formation made in preceding step and develop, photoresist layer is molten
Solution, so that flexible substrate and hard substrate removing.According to an embodiment of the invention, the flexible substrate needs to meet to display
The demand that panel is supported and protects, therefore general flexible substrate material (such as polyimides etc.), all have chemistry
Stability is preferable, the characteristic of acid and alkali-resistance, such as insoluble in organic solvent, stablizes to acid, radiation resistance etc., therefore, general to can dissolve
Acid and organic component (such as sulfuric acid, nitric acid, methanol) in the developer solution of photoresist layer will not be to the performances of the flexible substrate
It impacts.This method can easily remove flexible substrate and hard substrate as a result, and charge stripping efficiency is high, and flexible substrate
Upper no remaining photoresist promotes the process rate of flexible organic light emitting display panel, reduces production cost.
According to an embodiment of the invention, in order to further ensure later use developing liquid developing removes photoresist layer and will be soft
Property substrate and hard substrate when separating, developer solution will not cause to corrode to flexible substrate, influence the soft of flexible substrate and production
Property organic light emitting display panel service performance, with reference to Fig. 2 and Fig. 6, after forming photoresist layer, formed flexible substrate
Before, this method further comprises:
S600: the first protective layer is formed
In this step, the photoresist layer forms the first protective layer far from the side of hard substrate in front.According to
The embodiment of the present invention, with reference to Fig. 6, (with reference to (b) in Fig. 6) after foring photoresist layer 200, such as (f) institute in Fig. 6
It shows, the first protective layer 210 can be formed far from the side of hard substrate 100 in photoresist layer 200.Also, with reference in Fig. 6
(c), orthographic projection of the flexible substrate 300 in hard substrate 100, positioned at the first protective layer 210 in hard substrate 100 just
In drop shadow spread.When later use developer solution separates flexible substrate 300 and hard substrate 100 as a result, first protective layer
210 can make flexible substrate 300 and photoresist layer 200 spaced apart, preferably protection flexible substrate 300, avoid flexibility
Developed corrosion of substrate 300 etc. further improves the product yield of prepared flexible organic light emitting display panel and makes
Use performance.According to an embodiment of the invention, the material for forming the first protective layer is not particularly limited, as long as it is rotten to be resistant to developer solution
Erosion, can preferably protect flexible substrate, and will not influence the Flexible Displays of the flexible organic light emitting display panel of preparation
Energy.Specifically, the material for forming the first protective layer may include silica.Specifically, the thickness of the first protective layer can
Think micron order, such as can be 50-300 μm, can be 80 μm, can be 100 μm, can be 150 μm, can be 200 μm,
It can be 250 μm etc..The thinner thickness of first protective layer as a result, can not only protect flexible substrate not by the corruption of developer solution
Erosion, does not influence the Flexible Displays performance of the flexibility organic light emitting display panel also.Specifically, first is protected subsequently through developer solution
After sheath and hard substrate separation, which can also also be removed into removing.
According to an embodiment of the invention, in order to further ensure later use developing liquid developing removes photoresist layer and will be soft
Property substrate and hard substrate when separating, developer solution will not cause to corrode to flexible substrate, and then influence flexible substrate and production
Flexible organic light emitting display panel service performance, with reference to Fig. 3 and Fig. 6, after forming flexible substrate, formed it is organic
Before light emitting diode, this method be may further include:
S700: the second protective layer is formed
In this step, the flexible substrate forms the second protective layer far from the side of the first protective layer in front.Root
According to the embodiment of the present invention, with reference to (g) in Fig. 6, the can be formed far from the side of the first protective layer 210 in flexible substrate 30
Two protective layers 220, also, the upper surface of the second protective layer 220 covering flexible substrate 100 (refers to "upper" side shown in the drawings
To) and side wall.In other words, the first protective layer 210 and the second protective layer 220 can with fully wrapped around flexible substrate 300, by
This, first protective layer 210 and the second protective layer 220 can adequately protect the flexible substrate 300, avoid later use developer solution
When flexible substrate 300 and hard substrate 100 are separated, developed corrosion of flexible substrate 300 etc. is further improved prepared
Flexible organic light emitting display panel product yield and service performance.According to an embodiment of the invention, forming the second protective layer
Material be not particularly limited, as long as be resistant to development corrosion, can preferably protect flexible substrate, and will not influence preparation
Flexible organic light emitting display panel Flexible Displays performance.Specifically, the material for forming the second protective layer may include
Silica.It specifically, the thickness of the second protective layer can be micron order, such as can be 50-300 μm, can be 80 μm, it can
Think 100 μm, can be 150 μm, can be 200 μm, can be 250 μm etc..The thinner thickness of second protective layer as a result,
It can not only protect flexible substrate not by the corrosion of developer solution, not influence the Flexible Displays of the flexibility organic light emitting display panel also
Energy.
According to an embodiment of the invention, formed after the second protective layer with reference to Fig. 6, it can be in the second protective layer far from soft
The side of property substrate sequentially forms mentioned-above driving function layer, Organic Light Emitting Diode and encapsulated layer (with reference in Fig. 6
(d) shown in).After forming mentioned-above driving function layer, Organic Light Emitting Diode and encapsulated layer, this method can be into
One step includes:
S510: the first protective layer and hard substrate are removed using developer solution
In this step, mentioned-above first protective layer and hard substrate are removed using developer solution.According to the present invention
Embodiment, using the first protective layer and the second protective layer by after flexible substrate " encapsulation " in preceding step, the first protective layer
It is formed in the upper surface of photoresist layer, therefore, the organic illuminated display element made is placed in when being developed in developer solution,
Photoresist layer dissolution, the first protective layer and hard substrate separation, it is final that flexible organic light emitting display panel (flexibility obtained is made
Organic light emitting display panel can refer to (e) in Fig. 6).
According to an embodiment of the invention, can also be incited somebody to action using developer solution by after the first protective layer and hard substrate removing
Mentioned-above first protective layer is also removed with flexible substrate, final that flexible organic light emitting display panel is made.As a result, further
Improve the service performance of the flexibility organic light-emitting display device.
In summary, this method forms " sacrificial layer " between hard substrate and flexible substrate using photoresist, after the completion
After continuous manufacture craft, the photoresist layer is developed using developer solution and is removed, so as to easily by flexible substrate and hard base
Bottom separation, and the production cost during this is relatively low, and flexible substrate and flexible organic light emitting display after removing
The product yield of panel is higher, and service performance is good.
In another aspect of this invention, the invention proposes a kind of flexible organic light emitting display panels.It is according to the present invention
Embodiment, which can be is prepared by mentioned-above method.The flexibility organic light emission as a result,
Display panel has flexible organic light emitting display prepared by the mentioned-above method for preparing flexible organic light emitting display panel
Whole feature and advantage possessed by panel, details are not described herein.According to an embodiment of the invention, the flexibility has with reference to Fig. 7
Machine light emitting display panel 1000 includes: the first protective layer 210, flexible substrate 300, the second protective layer 220 and organic light emission two
Pole pipe 420, wherein the side of the first protective layer 210 is arranged in flexible substrate 300, and the second protective layer 220 is arranged in flexible substrate
300 far from the first protective layer 210 side；Organic Light Emitting Diode 420 is arranged in the second protective layer 220 far from flexible substrate
300 side.According to an embodiment of the invention, first protective layer 210, flexible substrate 300, the second protective layer 220 and having
Machine light emitting diode 420 can be the first protective layer 210 noted earlier, flexible substrate 300, the second protective layer 220 and organic
Light emitting diode 420.For example, orthographic projection of the flexible substrate 300 on the first protective layer 210, is located in the first protective layer 210
Portion, the second protective layer 220 can cover the upper surface (referring to "upper" direction shown in the drawings) and side of flexible substrate 100
Wall.In other words, flexible substrate 300 can be completely covered in the first protective layer 210 and the second protective layer 220；For example, first guarantor
Sheath 210 and the second protective layer 220 can be to be formed by silica.The flexibility organic light emitting display panel is raw as a result,
Cost is relatively low for production, and service performance is good.
In the description of the present invention, the orientation or positional relationship of the instructions such as term " on ", "lower" is based on the figure
Orientation or positional relationship is merely for convenience of the description present invention rather than requires the present invention that must be constructed and be grasped with specific orientation
Make, therefore is not considered as limiting the invention.
In the description of this specification, the description of reference term " one embodiment ", " another embodiment " etc. means to tie
The embodiment particular features, structures, materials, or characteristics described are closed to be included at least one embodiment of the present invention.At this
In specification, the schematic representation of the above terms does not necessarily have to refer to the same embodiment or example.Moreover, the tool of description
Body characteristics, structure, material or feature may be combined in any suitable manner in any one or more of the embodiments or examples.This
Outside, without conflicting with each other, those skilled in the art by different embodiments described in this specification or can show
The feature of example and different embodiments or examples is combined.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant.
Claims (10)
1. a kind of method for making flexible organic light emitting display panel characterized by comprising
Hard substrate is provided；
Photoresist layer is formed in the side of the hard substrate；
Flexible substrate is formed far from the side of the hard substrate in the photoresist layer；
Organic Light Emitting Diode is formed far from the side of the photoresist layer in the flexible substrate；And
The flexible substrate and the hard substrate are removed using developer solution.
2. forming the flexible liner the method according to claim 1, wherein being formed after the photoresist layer
Before bottom, further comprise:
The first protective layer is formed far from the side of the hard substrate in the photoresist layer, wherein the flexible substrate is in institute
The orthographic projection in hard substrate is stated, positioned at first protective layer within the scope of the orthographic projection in the hard substrate.
3. according to the method described in claim 2, it is characterized in that, being formed after the flexible substrate, formation organic hair
Before optical diode, further comprise:
The second protective layer is formed far from the side of first protective layer in the flexible substrate, second protective layer wraps up institute
State upper surface and the side wall of flexible substrate.
4. according to the method described in claim 3, it is characterized in that, forming first protective layer and second protective layer
Material include silica.
5. according to the method described in claim 3, it is characterized in that, the thickness of first protective layer and second protective layer
Degree is 50-300 μm.
6. the method according to claim 1, wherein the material for forming the flexible substrate includes the height of acid and alkali-resistance
Molecular material, the high molecular material include polyimides, polyethylene, polypropylene, polystyrene, polyethylene terephthalate
At least one of ester.
7. the method according to claim 1, wherein
It is formed after the flexible substrate, is formed before the Organic Light Emitting Diode, the method further includes: described
Flexible substrate forms driving function layer far from the side of the photoresist layer.
8. the method according to the description of claim 7 is characterized in that
It is formed after the Organic Light Emitting Diode, before the flexible substrate and hard substrates removing, the method
Further comprise: forming encapsulated layer far from the side of the driving function layer in the Organic Light Emitting Diode.
9. the method according to claim 1, wherein including:
It is coated with polystyrene photoresist in the side of the hard substrate, to form the photoresist layer；
In side steam coating silicon dioxide of the photoresist layer far from the hard substrate, to form the first protective layer；
It is coated with polyimide solution far from the side of the hard substrate in first protective layer, to form the flexible liner
Bottom；
In side steam coating silicon dioxide of the flexible substrate far from the photoresist layer, to form the second protective layer；
Driving function layer is formed far from the side of the flexible substrate in second protective layer；
The Organic Light Emitting Diode is formed far from the side of second protective layer in the driving function layer；
Encapsulated layer is formed far from the side of the driving function layer in the Organic Light Emitting Diode；
The panel for being formed with the encapsulated layer is placed in the developer solution and is developed, dissolves the photoresist layer, described in order
First protective layer and hard substrate removing.
10. a kind of flexibility organic light emitting display panel characterized by comprising
First protective layer；
The side of first protective layer is arranged in flexible substrate, the flexible substrate；
Side of the flexible substrate far from first protective layer is arranged in second protective layer, second protective layer；And
One of second protective layer far from the flexible substrate is arranged in Organic Light Emitting Diode, the Organic Light Emitting Diode
Side.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910100012.4A CN109860437B (en) | 2019-01-31 | 2019-01-31 | Flexible organic light emitting display panel and manufacturing method thereof |
| PCT/CN2019/127955 WO2020155943A1 (en) | 2019-01-31 | 2019-12-24 | Flexible organic light emitting display panel and manufacturing method therefor |
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| CN201910100012.4A CN109860437B (en) | 2019-01-31 | 2019-01-31 | Flexible organic light emitting display panel and manufacturing method thereof |
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Cited By (2)
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| WO2020155943A1 (en) * | 2019-01-31 | 2020-08-06 | 京东方科技集团股份有限公司 | Flexible organic light emitting display panel and manufacturing method therefor |
| WO2023005610A1 (en) * | 2021-07-30 | 2023-02-02 | 京东方科技集团股份有限公司 | Drive substrate and preparation method therefor, and light-emitting apparatus |
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| CN113871521A (en) * | 2021-09-18 | 2021-12-31 | 惠州华星光电显示有限公司 | Substrate packaging method, display panel and display device |
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| Publication number | Publication date |
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| WO2020155943A1 (en) | 2020-08-06 |
| CN109860437B (en) | 2021-12-03 |
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