CN109860208B - Display panel mother board, display panel and manufacturing method thereof - Google Patents
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Abstract
The invention provides a display panel mother board, a display panel and a manufacturing method thereof. The display panel motherboard includes at least one display unit and a cuttable area connected at an edge of the display unit. The display unit has a display area and a non-display area connected between the display area and the cuttable area. The cleavable region has cleavage sites. The display panel mother board comprises a substrate and a device layer arranged on the substrate, wherein the device layer comprises a TFT device area corresponding to the display area and an inorganic film layer coating the TFT device area. The inorganic film layer covers the non-display area and the cuttable area, hollow patterns are arranged in the non-display area in a vertically penetrating mode along the thickness direction of the non-display area, and grooves which are not arranged in a penetrating mode are formed in the cutting positions, so that the thermal radiation influence of laser cutting is effectively avoided, and the production yield is improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel mother board, a display panel and a manufacturing method of the display panel mother board.
Background
An Organic Light-Emitting Diode (OLED) is considered as a new application technology of a flat panel display because it has excellent characteristics of self-luminescence, no need of a backlight source, high contrast, thin thickness, wide viewing angle, fast reaction speed, applicability to a flexible panel, wide temperature range, simple structure and process, and the like.
The OLED display panel is generally manufactured by an integral process on a mother board, and then cut and separated to form each display panel unit. Laser cutting is mostly adopted at present to ensure smooth and flat cut surfaces. However, the current display panel is limited by high resolution and narrow frames, the distance between the panel display area and the cutting line is short, and the manufacturing failure or yield of the display panel is difficult to improve under the dual effects of laser cutting precision and laser heat radiation.
Disclosure of Invention
The invention aims to provide a novel display panel mother board, a display panel and a manufacturing method thereof, which can effectively improve the production yield of the display panel.
In order to achieve the above object, the present invention provides a display panel motherboard, which includes at least one display unit and a cuttable area connected to an edge of the display unit, wherein the display unit has a display area and a non-display area connected between the display area and the cuttable area, the cuttable area has a cutting bit, the display panel motherboard includes a substrate and a device layer disposed on the substrate, the device layer includes a TFT device area corresponding to the display area and an inorganic film layer covering the TFT device area; the inorganic film layer covers the non-display area and the cuttable area, hollow patterns are arranged in the non-display area in a vertically penetrating mode along the thickness direction of the non-display area, and grooves which are not arranged in a penetrating mode are formed in the cutting positions.
As a further improvement of the invention, the hollow pattern does not extend to the display area and is arranged at an interval with the groove.
As a further improvement of the invention, the hollow-out patterns are filled with organic materials.
As a further improvement of the present invention, the inorganic film layer further has a groove formed between the groove and the hollow pattern, the groove and the hollow pattern are arranged at intervals, and the groove does not extend through the inorganic film layer.
As a further improvement of the present invention, the display panel mother board has a plurality of the display units, and the cuttable areas are provided between adjacent display units. .
In order to achieve the above object, the present invention further provides a display panel, which has a display area and a non-display area located around the display area, wherein the display panel includes a substrate and a device layer disposed on the substrate, the device layer includes a TFT device area corresponding to the display area and an inorganic film layer covering the TFT device area, the inorganic film layer covers the non-display area, and a hollow pattern is vertically disposed in the non-display area along a thickness direction of the non-display area in a penetrating manner, and a groove that does not penetrate through the inorganic film layer is formed at an edge of the non-display area.
As a further improvement of the invention, the hollow pattern does not extend to the display area, and the hollow pattern and the groove are arranged at intervals.
As a further improvement of the invention, the hollow-out patterns are filled with organic materials.
As a further improvement of the invention, a groove is further formed between the hollow pattern and the edge of the display panel on the inorganic film layer, and the groove and the hollow pattern are arranged at intervals.
As a further improvement of the present invention, the trench does not extend through the inorganic film layer.
In order to achieve the above object, the present invention further provides a method for manufacturing the display panel, including the steps of:
providing a substrate comprising at least one functional area and a cuttable area at an edge of the functional area, the functional area having a display area and a non-display area connected between the display area and the cuttable area, the cuttable area having a cutting location;
forming a device layer on the substrate, wherein the device layer comprises a TFT device area formed in the display area and an inorganic film layer covering the TFT device area, and the inorganic film layer covers the non-display area and the cuttable area;
removing part of the inorganic film layer at the non-display area and the cutting position, so that the non-display area penetrates up and down along the thickness direction of the non-display area to form a hollow pattern, and meanwhile, a groove which does not penetrate through the inorganic film layer is formed at the cutting position;
and cutting the cuttable area to form a plurality of display panels.
According to the invention, through the arrangement of the hollow patterns and the cutting grooves which are not penetrated through the cutting positions, the display area and the substrate can be effectively protected, the influence of heat radiation during laser cutting on the display area and the substrate is avoided, and the production yield is improved.
Drawings
Fig. 1 is a schematic top view of a portion of a display panel mother board according to the present invention.
Fig. 2 is a cross-sectional view of a portion of the display panel mother board shown in fig. 1 according to a preferred embodiment.
Fig. 3 is a cross-sectional view of a portion of another preferred embodiment of the display panel mother board shown in fig. 1.
Fig. 4 is a cross-sectional view of a portion of another preferred embodiment of the mother substrate of the display panel shown in fig. 1.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
In order to make the objects, technical solutions and advantages of the present application more clear, the technical solutions of the present application will be clearly and completely described below with reference to the detailed description of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.
The following description of the embodiments refers to the accompanying drawings, which are included to illustrate specific examples that may be implemented by the application. Directional phrases used in this application, such as, for example, top, bottom, upper, lower, front, rear, left, right, inner, outer, side, and the like, are used in a directional sense only with reference to the attached drawings and thus are used for better and clearer illustration and understanding of the present application and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered limiting of the present application. In addition, the drawings of the embodiments of the present invention are exaggerated for convenience of understanding and explaining the general concept of the present invention, and the actual product processing can be adjusted according to the actual situation.
As shown in fig. 1, the display panel mother board according to the embodiment of the present invention is described by taking the display panel mother board having a plurality of display units a as an example, and of course, the display panel mother board according to the present invention may have only a single display unit, in which case, the following cuttable area B is located at the edge of the single display unit.
As shown in fig. 1, the display panel mother board in the present embodiment includes a plurality of display units a and a cuttable area B connected between adjacent display units a and outside the display units a at an edge; as shown in conjunction with fig. 2, each display unit a has a display area a1 and a non-display area a2 connected between the display area a1 and the cuttable area B.
Wherein the cuttable region B refers to a region occupied by a portion that can be cut off; however, it should be noted that, in the cutting process, the cuttable area is not necessarily completely cut off, and the cuttable area may also be adjusted according to actual requirements; for example, in the present embodiment, the cutting positions B1 (i.e., the positions of the cutting lines, as shown by the dotted lines) are disposed at the two ends of the cuttable region B, and during cutting, laser cutting is performed along the cutting positions B1, and at this time, the cuttable region B is completely cut after cutting; of course, in other embodiments, the cutting position B1 may be adjusted toward the middle of the cutting area B, and the object of the present invention can be achieved.
In addition, as shown in fig. 2, the display panel mother board includes a substrate 1 and a device layer 2 disposed on the substrate 1. The device layer 2 includes a TFT device region 21 corresponding to the display region a1 and an inorganic film layer 22 covering the TFT device region 21. The inorganic film layer 22 covers the non-display area a2 and the cuttable area B, and hollow patterns 221 are vertically arranged in the non-display area a2 in a penetrating manner along the thickness direction of the non-display area a 2. Through the arrangement of the hollow patterns 221 at the non-display area a2, when the laser cutting operation is performed on the cuttable area B, on one hand, the hollow patterns 221 are used for generating partition between the cutting position B1 and the display area a1, heat insulation is performed through air, direct transmission of heat is reduced, the influence of heat radiation on the display area a1 during laser cutting is effectively reduced, and the production yield of the display panel is improved. On the other hand, since the inorganic film layer 22 generally has a relatively large compactness and a poor flexibility, and is easy to generate stress concentration, and further, when performing laser cutting, cutting cracks are easy to generate, and the hollow-out pattern 221 of the present invention can also effectively block the cracks generated by laser cutting from propagating to the display area a 1.
Specifically, the substrate may be a rigid transparent substrate made of a light-guiding and non-metallic material having a certain strength, such as glass, quartz, or a transparent resin, or may be a flexible substrate made of a material such as polyimide. In this embodiment, the substrate 1 is formed by multiple layers of organic films and inorganic films alternately stacked and subjected to a cross-linking curing reaction through a heating process, so as to achieve the flexibility and flexibility of the substrate, and simultaneously, the substrate has a good water-oxygen blocking effect.
The TFT device region 21 of the device layer 2 includes a gate, a source and a drain. The inorganic film layer 22 includes a plurality of insulating layers, for example, a gate insulating layer, an interlayer dielectric layer, etc. formed on the TFT device region 21, or may further include a barrier layer, a buffer layer, etc. for blocking water and oxygen, which are generally formed on the substrate 1. The insulating layers are typically deposited using one or a combination of silicon oxide and silicon nitride. In the invention, the hollow pattern 221 penetrates through all the insulating layers to realize a better blocking effect.
As shown in fig. 2, in this embodiment, the hollow-out patterns 221 are not extended to the display area a1, so that a part of the inorganic film layer 22 is still isolated and protected between the display area a1 and the hollow-out patterns 221, so as to achieve better encapsulation and thermal insulation of the display area a 1.
In addition, in the present invention, the groove 222 is formed in the inorganic film layer 22 at the cutting position b1, and the groove 222 is not disposed through the inorganic film layer 22; namely, the inorganic film layer 22 at the cutting position b1 is thinned, so that on one hand, the thickness of the film layer at the cutting position is reduced, and the difficulty of the cutting process can be reduced; on the other hand, the problem of stress concentration in the cutting process can be relieved, the production yield of the display panel is improved, and the formed groove 222 can be used for guiding the cutting line, so that the cutting efficiency is improved; on the other hand, the substrate 1 is formed by the cross-linking curing reaction after the inorganic film and the organic film are alternately deposited, so that the substrate 1 has good flexibility, but is easily influenced by heat radiation during laser cutting, and in the invention, the inorganic film layer 22 is partially reserved at the cutting position b1, so that the substrate 1 can be protected, and the carbonization influence of the heat radiation on the substrate 1 during laser cutting can be reduced.
The hollow patterns 221 and the grooves 222 are arranged at intervals, that is, a part of the inorganic film layer 22 is also arranged between the hollow patterns 221 and the grooves 222 for isolation.
In addition, on the premise that the hollow-out pattern 221 and the groove 222 are disposed at intervals, as another preferred embodiment of the present invention, as shown in fig. 3, the hollow-out pattern 221 may be further filled with an organic material 23; the organic material 23 has the ability to absorb and disperse the stress by itself, so that the stress which is still inevitably generated during cutting can be transmitted to the inside of the organic material 23, and the stress is absorbed and dispersed, thereby avoiding the stress concentration to generate the crack on the film layer, and further propagating the crack into the display area a 1.
In this embodiment, the organic material 23 fills the hollow pattern 221; of course, the organic material 23 may be filled only in the middle of the hollow pattern 221, so that a gap is formed between two sides of the organic material 23 and the edge of the hollow pattern 221, or the organic material 23 is filled in one side of the hollow pattern 221 close to the display area a1 and a gap is formed between the organic material and the cuttable area B.
As shown in fig. 4, when the hollow-out pattern 221 is completely filled with the organic material 23, as another preferred embodiment of the present invention, it is preferable that at least one groove 223 is formed between the cutting position b1 and the hollow-out pattern 221 of the inorganic film layer 22; the grooves 223 can further obstruct thermal radiation conduction during laser cutting, avoid the thermal radiation from generating carbonization or thermal damage and other influences on the filled organic material 23, further reduce the influence on the display area a1, and improve the production yield of the display panel.
In this embodiment, the groove 223 does not extend through the inorganic film layer 22, and is spaced from both the hollow pattern 221 and the groove 222. Of course, the trench 223 can be disposed to penetrate the inorganic film layer 22 to form a hollow pattern, and the object of the present invention can also be achieved.
In summary, the present invention further provides a display panel, which is formed by cutting the mother board of the display panel along the cutting position b1 in the above embodiments, and includes a substrate and a device layer disposed on the substrate, where the device layer includes a TFT device region corresponding to the display region and an inorganic film layer covering the TFT device region, the inorganic film layer covers the non-display region, and the hollow patterns 221 are disposed in the non-display region in a vertical penetrating manner along a thickness direction of the non-display region. The hollow pattern 221 is provided as in the above embodiments, and in addition, as in the above embodiments, the groove 222 for cutting is further formed at the edge of the display panel, and the groove 223 may be further formed between the groove 222 and the hollow pattern 221.
In addition, in combination with the arrangement of the display panel mother board, the invention also provides a manufacturing method of the display panel, which comprises the following steps.
S1, providing the substrate 1, and dividing the substrate 1 into a cuttable area B including a plurality of functional areas A and being located between and at the periphery of the functional areas A, wherein the functional areas A correspond to the display units A and have a display area a1 and a non-display area a2 connected between the display area a1 and the cuttable area B, and the cuttable area B has the cutting position B1; the display area a1 is mainly used for arranging display devices and driving the display devices; the non-display area a2 is located outside the display area a1, does not contain devices and circuits, and is mainly used for isolating and protecting the display area a1 and avoiding the cutting operation of the cuttable area B from affecting the display area a 1. As the demand for a narrow bezel increases, the width of the non-display area a2 gradually decreases. Of course, the substrate 1 may also be divided into only one functional area a and the cuttable area B disposed around the functional area a, i.e. the method is also applicable to the manufacture of only a single display panel formed by one mother board.
S2, forming the device layer 2 on the substrate 1, wherein the device layer 2 comprises a TFT device area 21 formed in the display area a1 and an inorganic film layer 22 covering the TFT device area 21, and the inorganic film layer 22 covers the non-display area a2 and the cuttable area B.
S3, removing a portion of the inorganic film layer 22 at the non-display region a2 and the cutting position b1, so that the hollow pattern 221 is formed by penetrating the non-display region a2 up and down along the thickness direction thereof, and a groove 222 is formed at the cutting position b1, wherein the groove 222 is not disposed through the inorganic film layer 22; .
And S4, cutting the cuttable area B to form a plurality of display panels.
The manufacturing method will be described in detail below with reference to the drawings and various design schemes of the display panel mother board of the present invention.
As described above, the substrate 1 in S1 is generally formed by sequentially stacking an organic film and an inorganic film, and then performing a cross-linking curing reaction by a heating process. The organic film may be made of one or more of Polyurethane (PL), Polylactic Acid (PLA), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), Polyimide (PI), and Parylene. The film forming material of the inorganic film is one or more of silicon nitride (SiN) and silicon oxide (SiO).
The device layer 2 in step S2 is fabricated in a conventional manner, that is, the fabrication of the source and drain electrodes of the TFT device region 21 on the substrate 1, the gate insulating layer, the interlayer dielectric layer, the water-oxygen barrier layer, the buffer layer, and the like formed in the TFT device region 21, and the like are included.
In step S3, when the hollow pattern 221 and the groove 222 are formed by removing a portion of the inorganic film layer 22 in the non-display area a2 and the cutting position b1, a mask exposure, a development and an etching process are performed.
Specifically, the device layer 2 is patterned by coating photoresist on the device layer 2, and removing a portion of the inorganic film layer 22 at the non-display area a2 and the cutting position B1 by using a mask exposure, development and etching process, so as to form a plurality of TFT device areas 21, a cuttable area B, a hollow pattern 221 between the TFT device areas 21 and the cuttable area B, and a groove 222 at the cutting position B1. The TFT device area 21 is used for arranging the TFT devices and the routing lines. The TFT device region 21 is opposite to the display region a1, and the projection of the TFT device region 21 on the substrate 1 coincides with the display region a 1. The hollow pattern 221 faces the non-display area a 2.
The groove 222 in the cuttable area B can be used as a subsequent cutting reference, so that the groove 222 can be accurately positioned during laser cutting to cut along the groove; in addition, a part of the inorganic film layer 22 may be removed between the cutting position b1 and the hollow pattern 221 at the same time to form the groove 223.
Further, as shown in fig. 3, as one of the preferred embodiments of the present invention, after the forming of the hollow-out pattern 221 and before the cutting, the method further includes depositing the organic material 23 at the hollow-out pattern 221.
In summary, the display area a1 and the substrate 1 can be effectively protected by the arrangement of the hollow pattern 221 and the cutting groove 222 which is not penetrated through the cutting position b1, so that the influence of the heat radiation generated during laser cutting on the display area a1 and the substrate 1 can be avoided, and the production yield can be improved.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.
Claims (4)
1. A display panel mother board comprising at least one display unit and a cuttable area connected at an edge of the display unit, the display unit having a display area and a non-display area connected between the display area and the cuttable area, the cuttable area having cutting bits, characterized in that: the display panel mother board comprises a substrate and a device layer arranged on the substrate, wherein the device layer comprises a TFT device area corresponding to the display area and an inorganic film layer coating the TFT device area; the inorganic film layer covers the non-display area and the cuttable area, hollow patterns are arranged in the non-display area in a vertically penetrating mode along the thickness direction of the non-display area, grooves which are not arranged in a penetrating mode are formed in the cutting position, and grooves which do not extend through the inorganic film layer are formed between the grooves and the hollow patterns; the hollow patterns do not extend to the display area, the grooves and the hollow patterns are arranged at intervals, and organic materials are filled in the hollow patterns.
2. The display panel motherboard of claim 1, wherein: the display panel mother board is provided with a plurality of display units, and the cuttable areas are arranged between the adjacent display units.
3. A display panel having a display area and a non-display area located at a periphery of the display area, characterized in that: the display panel comprises a substrate and a device layer arranged on the substrate, wherein the device layer comprises a TFT device area corresponding to the display area and an inorganic film layer coating the TFT device area; the inorganic film layer covers the non-display area, hollow patterns are arranged in the non-display area in a penetrating mode up and down along the thickness direction of the non-display area, grooves which are not arranged in the penetrating mode are formed in the edge of the non-display area, and grooves which do not extend through the inorganic film layer are formed between the grooves and the hollow patterns; the hollow patterns do not extend to the display area, the grooves and the hollow patterns are arranged at intervals, and organic materials are filled in the hollow patterns.
4. The method for manufacturing a display panel according to claim 3, comprising the steps of:
providing a substrate comprising at least one functional area and a cuttable area at an edge of the functional area, the functional area having a display area and a non-display area connected between the display area and the cuttable area, the cuttable area having a cutting location;
forming a device layer on the substrate, wherein the device layer comprises a TFT device area formed in the display area and an inorganic film layer covering the TFT device area, and the inorganic film layer covers the non-display area and the cuttable area;
removing part of the inorganic film layer at the non-display area and the cutting position, enabling the non-display area to penetrate through the non-display area up and down along the thickness direction of the non-display area to form a hollowed-out pattern, forming a groove which does not penetrate through the inorganic film layer at the cutting position, and forming a groove which does not extend through the inorganic film layer between the groove and the hollowed-out pattern; the hollow patterns do not extend to the display area, and the grooves, the grooves and the hollow patterns are arranged at intervals;
filling organic materials in the hollow patterns;
and cutting the cuttable area to form a plurality of display panels.
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| CN110208978B (en) * | 2019-07-04 | 2022-10-25 | 京东方科技集团股份有限公司 | Cutting method of display panel intermediate product and display panel |
| US11143895B2 (en) | 2019-08-22 | 2021-10-12 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Display panel and display module |
| CN110596939B (en) * | 2019-08-22 | 2021-02-26 | 武汉华星光电技术有限公司 | Display panel and display module |
| CN113056822A (en) * | 2019-10-10 | 2021-06-29 | 京东方科技集团股份有限公司 | Manufacturing method of display substrate mother board and display device |
| CN111047970B (en) * | 2019-11-21 | 2022-04-19 | 昆山国显光电有限公司 | Display panel and display panel mother board |
| CN110867471B (en) * | 2019-11-22 | 2022-12-16 | 京东方科技集团股份有限公司 | Display substrate mother board and cutting method thereof |
| CN113763816B (en) * | 2021-09-07 | 2023-08-22 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
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| CN108022878A (en) * | 2017-11-30 | 2018-05-11 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
| CN108231855A (en) * | 2018-01-05 | 2018-06-29 | 武汉华星光电半导体显示技术有限公司 | Manufacturing method, flexible OLED panel and the display of flexible OLED panel |
| CN109032414B (en) * | 2018-08-02 | 2021-11-19 | 广州国显科技有限公司 | Display panel and preparation method thereof |
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