CN109854467B - Shape memory alloy driving element based on local segmented heating and synaptic heat dissipation form - Google Patents
Shape memory alloy driving element based on local segmented heating and synaptic heat dissipation form Download PDFInfo
- Publication number
- CN109854467B CN109854467B CN201910049845.2A CN201910049845A CN109854467B CN 109854467 B CN109854467 B CN 109854467B CN 201910049845 A CN201910049845 A CN 201910049845A CN 109854467 B CN109854467 B CN 109854467B
- Authority
- CN
- China
- Prior art keywords
- synapse
- heat
- driving
- driving element
- dissipating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The invention discloses a shape memory alloy driving element based on a local segmented heating and synaptic heat dissipation form, which comprises a plurality of driving sections connected end to end in sequence, wherein the free end of the driving section positioned at the free end of the driving element is provided with a driving element connecting end; each driving section or part of the driving sections is provided with at least one heat radiation synapse; the heat-dissipating synapse is provided with a heat-dissipating synapse terminal obtained through topological optimization, and the heat-dissipating synapse terminal is made of a heat-dissipating metal material; the heat radiation synapse is connected with the drive section connected with the heat radiation synapse through insulating heat conduction glue; the drive section and the drive element connecting end are made of a shape memory alloy material. The invention can adjust the local heating position, the number of the heat radiation synapses, the shape of the heat radiation synapse end and the like of the driving element according to the actual requirement, so that the driving element has the optimal response performance. The invention has simple structure, easy manufacture and good and wide application prospect in the fields of aerospace, medical appliances, automobiles and the like.
Description
Technical Field
The invention relates to a shape memory alloy driving element based on a local segmented heating and synaptic heat dissipation mode, and belongs to the technical field of intelligent driving.
Background
With the rapid development of science and technology, intelligent materials are more widely applied. The shape memory alloy is used as one kind of intelligent material, and has the advantages of high energy density, light weight, intelligent sensing and driving, small size, convenient installation, low noise, etc. and may be used widely in aeronautics and astronautics, medical equipment, automobile, etc. However, the response speed of the shape memory alloy driving element is one of the important indexes for measuring the driving performance, and the application and the development of the shape memory alloy driving element are seriously influenced. Therefore, by reasonably optimizing the heating and heat dissipation modes, the improvement of the response speed becomes a hot problem of research. By reasonably optimizing the local heating position of each driving section and designing the heat dissipation structure and the heat dissipation position, the driving response speed of the shape memory alloy driving element can be improved, and the driving performance of the shape memory alloy driving element can be improved.
The traditional heating mode of the shape memory alloy driving element is generally integral heating, and the heat dissipation adopts air cooling heat dissipation. When the shape memory alloy driving element is complicated, the response speed thereof becomes slow. There is therefore a need for a drive element that can be heated quickly and dissipate heat quickly.
Shape memory alloys can change their shape below their transformation temperature and return to their original state prior to the shape change when the temperature exceeds their transformation temperature. The driver made by utilizing the shape memory effect of the shape memory alloy is widely applied to an airplane empennage driving device, a satellite antenna unfolding power device and a steering device of a miniature medical robot.
The existing shape memory alloy driving device adopts the modes of integral heating and self natural cooling, and the heating and heat dissipation are slow, so that the driving response speed is slow, and the wide application of the shape memory alloy driving element is influenced.
Therefore, a need exists for a driving device that can dissipate heat quickly, respond quickly, and is simple in structure, easy to manufacture, and suitable for rapid deformation.
Disclosure of Invention
In order to overcome the defect of slow response of the traditional shape memory alloy driving element, the invention provides the shape memory alloy driving element based on the local segmented heating and synaptic heat dissipation form, the driving response speed of the shape memory alloy driver is improved through the local segmented heating and synaptic heat dissipation form, and the segmented heating structure and the synaptic heat dissipation form are subjected to topological optimization design in order to obtain the optimal response speed. The technical means adopted by the invention are as follows:
a shape memory alloy actuation element based on a form of localized segmented heating and synaptic cooling, characterized by: the driving element free end is provided with a driving element connecting end;
each driving section or part of the driving sections is provided with at least one heat radiation synapse;
the heat-dissipating synapse is provided with a heat-dissipating synapse terminal obtained through topological optimization, the heat-dissipating synapse terminal is made of a heat-dissipating metal material, and the shape of the heat-dissipating synapse terminal is linear, S-shaped or snowflake-shaped;
the driving element connecting end and the driving section connected with the driving element connecting end are of an integrated structure;
the heat radiation synapse is connected with the driving section connected with the heat radiation synapse through insulating heat conduction glue;
the drive section and the drive element connection end are made of a shape memory alloy material.
The drive segment configuration may be one of arcuate, linear, or other similar geometric shapes.
The driving section combination shape can be one of a straight line shape, an S shape, a semi-ring shape or a ring shape.
A plurality of driving elements can be connected with each other through the driving element connecting ends to form a whole, and complex functions can be realized through cooperative driving.
The drive element may be heated by integral energisation heating or by separate energisation heating of each of the drive segments.
And bonding is carried out between adjacent driving sections.
The invention can adjust the local heating position of the driving element, the number of the heat radiation synapses, the shape of the heat radiation synapse end and the like according to actual requirements, so that the driving element has optimal response performance. The invention has simple structure, easy manufacture and good and wide application prospect in the fields of aerospace, medical appliances, automobiles and the like.
The invention has the following advantages:
(1) the invention can conveniently adjust the response speed of the invention by adjusting the position of local heating and the size of the heating driving section.
(2) The invention can adjust the position of the radiating synapse and is convenient to adjust the response speed of the invention.
(3) The method can obtain the shape of the radiating synapse terminal by adopting a topological optimization means according to actual requirements, thereby obtaining a better radiating structure, and ensuring quick radiation and quick response.
(4) The invention can obtain driving elements with different shapes by changing forms or combining modes.
Based on the reasons, the invention can be widely popularized in the fields of power driving devices, bionic joints, intelligent variant technologies and the like.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic view (semi-circular) of a shape memory alloy driving element based on local segmented heating and synaptic heat dissipation in accordance with an embodiment of the present invention.
Fig. 2 is a schematic structural diagram (overall solid structure) of an arc-shaped driving section in the embodiment of the invention.
FIG. 3 is a schematic diagram of a structure of a synapse with thermal conductivity (linear end of the synapse with thermal conductivity) in an embodiment of the invention.
FIG. 4 is a schematic diagram of a structure of a cooling synapse in an embodiment of the invention (the cooling synapse end is S-shaped).
FIG. 5 is a schematic diagram of a structure of a synapse in accordance with an embodiment of the present invention (the end of the synapse is snowflake-shaped).
FIG. 6 is a schematic view of a linear driving element structure (all with a heat-dissipating synapse structure) formed by a plurality of linear driving segments according to an embodiment of the present invention.
FIG. 7 is a schematic view of a linear driving element structure (partially with a heat-dissipating synapse structure) formed by a plurality of linear driving segments according to an embodiment of the present invention.
FIG. 8 is a schematic diagram of an S-shaped driving element combined by a plurality of arc-shaped driving segments (all with heat-dissipating synapse structures) according to an embodiment of the present invention.
FIG. 9 is a schematic diagram of an S-shaped driving element combined by a plurality of arc-shaped driving segments (with a heat-dissipating synapse structure in part) according to an embodiment of the present invention.
FIG. 10 is a schematic diagram of a ring-shaped driving element combined by a plurality of arc-shaped driving segments (all with heat-dissipating synapse structures) according to an embodiment of the present invention.
FIG. 11 is a schematic diagram of a structure of a plurality of arc-shaped driving segments combined to form a ring-shaped driving element (with a heat-dissipating synapse structure in part) according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-11, a shape memory alloy driving element based on local segmented heating and synaptic heat dissipation comprises a plurality of driving segments 1 connected end to end in sequence, wherein a free end of the driving segment 1 at a free end of the driving element is provided with a driving element connecting end 2;
each driving section 1 or part of the driving sections 1 is provided with at least one heat radiation synapse 3;
the heat-dissipating synapse 3 is provided with a heat-dissipating synapse terminal 4 obtained by topological optimization, the heat-dissipating synapse terminal 4 is made of a heat-dissipating metal material, and the shape of the heat-dissipating synapse terminal 4 is linear, S-shaped or snowflake-shaped;
the driving element connecting end 2 and the driving section 1 connected with the driving element connecting end are of an integrated structure;
the heat radiation synapse 3 is connected with the driving section 1 connected with the heat radiation synapse through insulating heat conducting glue;
the drive section 1 and the drive element connection end 2 are made of a shape memory alloy material.
The drive section 1 may be one of an arc, a straight line or other similar geometric shape.
The combined shape of the driving section 1 can be one of a straight line shape, an S shape, a semi-ring shape or a ring shape.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (3)
1. A shape memory alloy actuation element based on a form of localized segmented heating and synaptic cooling, characterized by: the free end of the driving section positioned at the free end of the driving element is provided with a driving element connecting end;
each driving section or part of the driving sections is provided with at least one heat radiation synapse;
the heat-dissipating synapse is provided with a heat-dissipating synapse terminal obtained through topological optimization, the heat-dissipating synapse terminal is made of a heat-dissipating metal material, and the shape of the heat-dissipating synapse terminal is linear, S-shaped or snowflake-shaped;
the driving element connecting end and the driving section connected with the driving element connecting end are of an integrated structure;
the heat radiation synapse is connected with the driving section connected with the heat radiation synapse through insulating heat conduction glue;
the driving section and the driving element connecting end are made of shape memory alloy materials;
the drive elements are heated by energizing each of the drive segments separately.
2. The drive element of claim 1, wherein: the drive segment configuration may be one of arcuate, linear, or other similar geometric shapes.
3. The drive element of claim 1, wherein: the driving section combination shape can be one of a straight line shape, an S shape, a semi-ring shape or a ring shape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910049845.2A CN109854467B (en) | 2019-01-18 | 2019-01-18 | Shape memory alloy driving element based on local segmented heating and synaptic heat dissipation form |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910049845.2A CN109854467B (en) | 2019-01-18 | 2019-01-18 | Shape memory alloy driving element based on local segmented heating and synaptic heat dissipation form |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109854467A CN109854467A (en) | 2019-06-07 |
CN109854467B true CN109854467B (en) | 2021-01-15 |
Family
ID=66895337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910049845.2A Active CN109854467B (en) | 2019-01-18 | 2019-01-18 | Shape memory alloy driving element based on local segmented heating and synaptic heat dissipation form |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109854467B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117134539B (en) * | 2023-09-11 | 2024-03-19 | 贝德凯利电气(苏州)有限公司 | Water-cooling heat dissipation structure of high-voltage direct-current fan |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201203086Y (en) * | 2008-05-14 | 2009-03-04 | 杨文章 | High power LED light fitting heat radiator |
ITMI20121988A1 (en) * | 2012-11-22 | 2014-05-23 | Getters Spa | ACTUATOR ELEMENT WITH IMPROVED FATIGUE RESISTANCE MADE OF A FORM MEMORY LEAGUE |
US9581146B2 (en) * | 2013-10-03 | 2017-02-28 | The Boeing Company | Smart susceptor for a shape memory alloy (SMA) actuator inductive heating system |
FR3035938B1 (en) * | 2015-05-06 | 2017-06-02 | Peugeot Citroen Automobiles Sa | SUSPENSION DEVICE FOR A MOTOR VEHICLE, COMPRISING SPRINGS IN COMPOSITE MATERIAL AND SHAPE MEMORY ALLOY |
US10662803B2 (en) * | 2016-04-13 | 2020-05-26 | Rolls-Royce Plc | Aerofoil body |
-
2019
- 2019-01-18 CN CN201910049845.2A patent/CN109854467B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN109854467A (en) | 2019-06-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3252414B1 (en) | Metamaterials-enhanced passive radiative cooling panel | |
JP6232208B2 (en) | Girder with shape memory alloy effective for blade curvature | |
US7939178B2 (en) | Shape-changing structure with superelastic foam material | |
CN109854467B (en) | Shape memory alloy driving element based on local segmented heating and synaptic heat dissipation form | |
Tian et al. | Economy, energy, exergy and mechanical study of co-axial ring shape configuration of legs as a novel structure for cylindrical thermoelectric generator | |
US20150027676A1 (en) | Craft outer skin heat exchanger and method for manufacturing a craft outer skin heat exchanger | |
CN210258812U (en) | Morphing wing based on active deformation negative Poisson ratio honeycomb structure | |
JP6447275B2 (en) | Radiation fins and heat sinks and modules equipped with them | |
CN105346735A (en) | Self-adaptive cooling face area adjusting device | |
CN103474566B (en) | LED radiator | |
CN104202947A (en) | Flexible and light high-efficiency heat conducting cable | |
Rezania et al. | Zero-cooling energy thermoelectric system by phase change material heat sink integrated with porous copper foam | |
US20150240793A1 (en) | Temperature control system for shape-memory alloy | |
CN205168942U (en) | Automatic regulation formula heat insulating board | |
CN110828972B (en) | Deformable and reconfigurable ground antenna connecting part | |
Yang et al. | Performance improvement and thermomechanical analysis of a novel asymmetrical annular thermoelectric generator | |
JPH10106514A (en) | Cylindrical secondary battery and battery pack using this secondary battery | |
Bacciotti et al. | On the use of shape memory alloys for deployable passive heat radiators in space satellites | |
CN207234693U (en) | A kind of ultra-magnetic deformation actuator with semiconductor refrigerating radiator | |
CN204792913U (en) | Thermoelectric subassembly of galvanic couple arm and difference in temperature | |
CN2516934Y (en) | Integral fin-type heat pipe | |
CN219068400U (en) | Special-shaped flexible electric heater | |
CN105790704A (en) | Junction box for solar cell | |
CN206234642U (en) | A kind of high-efficiency LED radiator | |
Romanescu et al. | Performance analysis of an autonomous system used to guide the solar panels |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |