CN109848666A - A kind of production method of microchannel cold plates - Google Patents
A kind of production method of microchannel cold plates Download PDFInfo
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- CN109848666A CN109848666A CN201910136170.5A CN201910136170A CN109848666A CN 109848666 A CN109848666 A CN 109848666A CN 201910136170 A CN201910136170 A CN 201910136170A CN 109848666 A CN109848666 A CN 109848666A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 238000005192 partition Methods 0.000 claims abstract description 66
- 238000005520 cutting process Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 8
- 239000011148 porous material Substances 0.000 claims description 7
- 230000005587 bubbling Effects 0.000 claims description 4
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- 229910052802 copper Inorganic materials 0.000 description 9
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- 230000017525 heat dissipation Effects 0.000 description 7
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- 230000008569 process Effects 0.000 description 5
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the invention provides a kind of production methods of microchannel cold plates, comprising: selects multiple plates as multiple microchannel motherboards, makes at least two microchannels on each of the multiple microchannel motherboard plate；Select multiple plates as multiple microchannel partition motherboards；Multiple microchannel motherboards and multiple microchannel partition motherboards are staggered；The multiple microchannel motherboards being staggered and multiple microchannel partition motherboards are welded together；In a manner of making single microchannel cold plates include a microchannel on each microchannel motherboard, the multiple microchannel motherboards and multiple microchannel partition motherboards that weld together are cut, form multiple independent single microchannel cold plates.The production method of the microchannel cold plates can produce that depth is big, microchannel cold plates with high accuracy.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a manufacturing method of a micro-channel cold plate.
Background
With the miniaturization and complicated development of products in high and new technical fields such as electronics and information technology, aerospace technology, biotechnology and the like on the spatial scale, the integration level of components such as electronic chips and the like used in the products is increased, the power consumption is increased, the size is reduced, the power density is sharply increased, and the traditional cooling mode cannot meet the cooling requirement of integrated electronic equipment.
The reliability of electronic devices and components is rapidly reduced and even damaged due to the over-high temperature of the electronic devices and components, so that the heat dissipation problem of the high-heat-flow-density electronic components needs to be solved urgently, and a very urgent need is brought to the heat dissipation technology of the miniature electronic devices.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a method for manufacturing a micro-channel cold plate, which has the advantages of large processing depth and high precision.
The embodiment of the invention provides a manufacturing method of a micro-channel cold plate, which comprises the following steps: selecting a plurality of plates as a plurality of microchannel motherboards, and manufacturing at least two microchannels on each plate in the plurality of microchannel motherboards; selecting a plurality of plates as mother plates of the partition walls of the plurality of microchannels; arranging a plurality of microchannel motherboards and a plurality of microchannel partition mother boards in a staggered way; welding a plurality of micro-channel mother boards and a plurality of micro-channel partition mother boards which are arranged in a staggered mode; cutting the plurality of microchannel motherboards and the plurality of microchannel partition motherboards welded together to form a plurality of individual said single microchannel cold plates in a manner such that the single microchannel cold plate comprises one microchannel on each microchannel motherboard.
In some embodiments of the invention, fabricating at least two microchannels on each of the plurality of microchannel motherboards comprises: performing a wire cutting process on each microchannel mother board to form at least two microchannels on each microchannel mother board in a manner of removing materials; or bending each microchannel mother board to form at least two recessed microchannels on each microchannel mother board.
In some embodiments of the present invention, a plurality of microchannel partition mother plates are formed on each of the plurality of plates; when a plurality of microchannel motherboards and a plurality of microchannel partition mother boards are staggered, each microchannel is opposite to the bubbling structure corresponding to the microchannel.
In some embodiments of the present invention, an open pore structure corresponding to the at least two microchannels is formed on each of the plurality of partition mother plates of the microchannels; when a plurality of micro-channel mother boards and a plurality of micro-channel partition mother boards are arranged in a staggered mode, each micro-channel is opposite to the corresponding open pore structure.
In some embodiments of the present invention, at least two positioning holes are formed on each of the microchannel mother plates and each of the microchannel partition mother plates, and each of the microchannel mother plates and each of the microchannel partition mother plates are regularly and alternately arranged together by means of the positioning holes.
In some embodiments of the invention, the plurality of microchannel motherboards and the plurality of microchannel partition motherboards are welded together using vacuum diffusion welding.
In some embodiments of the invention, the plurality of microchannel motherboards and the plurality of inter-microchannel cold plates welded together are cut using electric spark cutting to form a plurality of individual said individual microchannel cold plates.
In some embodiments of the present invention, one or two plates are selected as a cover plate, and the cover plate is positioned at the outermost side of the plurality of microchannel mother plates and the plurality of microchannel partition mother plates which are staggered when the plurality of microchannel mother plates and the plurality of microchannel partition mother plates are staggered.
In the method for manufacturing the micro-channel cold plate provided by the embodiment of the invention, the micro-channel is directly cut on the micro-channel mother plate according to the length and depth of the micro-channel, the cutting precision is reduced from micron level to millimeter level, the dimension processing of the micro-channel in the length direction and the depth direction is completed at one time with high precision, the processing difficulty is reduced, and the manufacturing of the micro-channel can be completed with high efficiency and high precision. And then, the machining of the micro-channel cold plate can be completed only by welding and cutting the welded whole. Therefore, the manufacturing method of the micro-channel cold plate can manufacture the micro-channel cold plate with large depth and high precision.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a micro-channel cold plate according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural diagram of a microchannel mother plate, a microchannel partition mother plate, and a cover plate used in a method for manufacturing a microchannel cold plate according to an embodiment of the present invention;
FIG. 3 is a schematic illustration of the fabrication of microchannels of different length by depth dimensions in the microchannel motherboard shown in FIG. 2;
FIG. 4 is a schematic view of a bubble structure or an opening structure formed in a mother plate of a partition wall of the microchannel shown in FIG. 2;
FIG. 5 is a schematic structural view showing a structure in which the microchannel mother plate, the partition mother plate of the microchannel, and the cover plate shown in FIG. 2 are stacked;
FIG. 6 is a schematic view showing a structure in which the mother plate of the microchannel, the mother plate of the partition wall of the microchannel, and the cover plate shown in FIG. 2 are welded together;
FIG. 7 is a schematic illustration of a process for cutting the welded-together structures shown in FIG. 6;
fig. 8 is a schematic structural view of the resulting microchannel cold plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
The micro-channel cold plate is used as a novel heat dissipation device for heat transfer of fluid and solid, can realize heat transfer with large heat flux density, and has large phase change heat transfer coefficient and high heat exchange efficiency. Typically, the equivalent diameter of the microchannel structure is less than 1mm, and the heat transfer and flow characteristics of the fluid in the microchannel relate to the complex mixing mechanisms of heating and evaporation, boiling and bubble generation, single-phase/gas-liquid two-phase flow, pressure drop, capillary flow and the like of the fluid, which all affect the heat transfer characteristics of the cold plate of the microchannel. Experiments and theoretical researches in recent years prove that the microchannel cold plate has the heat transfer characteristic of high heat flow density, and compared with the traditional cooling mode, the microchannel cold plate has obvious technical advantages, can be widely applied to cooling of electronic equipment with high heat flow density, and shows great application prospects.
The micro-channel has a sub-millimeter structure, which puts higher requirements on the processing and manufacturing technology and the processing precision. The inventor finds that wire cut electrical discharge machining, laser cutting, precision milling and chemical etching are all used for machining and manufacturing of micro-channels, but all have certain limitations.
The wire cut electrical discharge machining efficiency is high, the cost is low, the machining process is flexible, but the diameter of the wire electrode is generally in the range of 0.03-0.25mm, and the machining precision is difficult to meet the requirement when the width of the micro-channel (namely the thickness of a single micro-channel plate) is 0.2mm or less.
Precision milling has the same advantages as wire electrical discharge machining, but also has low machining precision and cannot machine microchannels with large depths (i.e., the width of a single microchannel plate).
The laser cutting utilizes the focused high-power-density laser beam to irradiate the workpiece, so that the irradiated material is rapidly melted, gasified and ablated, and the molten substance is blown off by high-speed airflow, and the method has high cutting speed and high quality; however, due to the use of high power laser beams, there is a range of heat affected zones where there is some distortion of the workpiece material, affecting the machining accuracy, and this method also does not allow for a large machining depth (i.e., the width of a single microchannel plate).
The processing precision of the chemical corrosion is related to the processing depth, and as the corrosion deepens, the side wall can also generate a corrosion effect to influence the size and the precision; the side wall protection can form a certain gradient on the side wall, and the shape requirement of the micro-channel cannot be met.
The processing methods all have the problems of small processing depth and low processing precision, so that the processing has larger depth-to-width ratio, the cost is reduced, and the precision and the efficiency are improved, which are the problems to be solved urgently in the processing of the micro-channel at present. By aspect ratio is meant the ratio of the depth to the width of a microchannel on a single microchannel motherboard. For example, in the microchannel cold plate shown in fig. 8, the longitudinal direction, the width direction, and the depth direction of the microchannel cold plate are denoted by L, W, and D, respectively. According to the direction coordinate system, in fig. 2, the length direction L of the microchannel cold plate is consistent with the length direction of each microchannel mother plate 1 or each microchannel partition mother plate 2, the width direction of the microchannel cold plate is consistent with the thickness direction of each microchannel mother plate 1 or each microchannel partition mother plate 2, and the depth direction of the microchannel cold plate is consistent with the width direction of each microchannel mother plate 1 or each microchannel partition mother plate 2. Thus, on a single microchannel motherboard, microchannel depth refers to the dimension in the direction D in fig. 2 and microchannel width refers to the dimension in the direction W in fig. 2.
The embodiment of the invention provides a manufacturing method of a micro-channel cold plate, which can well solve the problems.
As shown in fig. 1, an embodiment of the invention provides a method for manufacturing a micro-channel cold plate. The manufacturing method of the micro-channel cold plate comprises the following steps of 1-8:
step 1: selecting a plurality of plates as a plurality of microchannel motherboards, and manufacturing at least two microchannels on each plate of the plurality of microchannel motherboards.
A metal plate such as aluminum alloy, red copper, etc., may be selected as the microchannel mother plate, and red copper may be selected from the viewpoint of cost. But not limited thereto, other materials suitable for heat dissipation may be selected, such as thermally conductive plastics (e.g., PA46TC series of DSM, high temperature resistant nylon series of disembarks, the netherlands), the thermal conductivity of which has been successful in replacing aluminum alloys or copper.
The dimensions of the microchannel mother plate are determined according to the desired parameters of the microchannel. For example, as shown in fig. 2, when the width of the microchannel 11 is w, a metal plate having a thickness w is selected as the microchannel mother plate 1. The length and width of the microchannel mother plate 1 are determined according to the length l, the depth d and the number n (n is more than or equal to 2) of the microchannels 11. The metal plate with the right size can be selected as the micro-channel mother plate, and the large metal plate can be selected and cut to form the micro-channel mother plate with the right size. The number of the plurality of microchannel motherboards 1 is generally determined by the total width W of the microchannel cold plate shown in fig. 8.
The n microchannels are machined on each microchannel master in a material removing manner using wire cutting, such as wire electrical discharge machining. On the microchannel mother plate 1, microchannels with the same length × depth (l × d) can be processed (as shown in fig. 2), and microchannels with different lengths × depths (l × d) can be processed (as shown in fig. 3). Alternatively, each microchannel motherboard is bent using a bending process to form n microchannels in a recessed shape on each microchannel motherboard.
The linear cutting method has the advantages of high processing speed, high production efficiency, short processing period, low cost and the like, when the method is selected for processing the whole microchannel mother board, the cutting precision is reduced from micron level to millimeter level, the processing difficulty is reduced, and the cutting can be completed with high efficiency and high precision. In the step, a planar linear cutting process is adopted, so that the micro-channel can be directly cut out on the micro-channel motherboard with the thickness of the width of the micro-channel at one time according to the length and the depth of the micro-channel, and the processing of the length, the width and the depth of the micro-channel is finished at high precision.
Step 2: a plurality of plates are selected as a plurality of microchannel partition motherboards.
A metal plate such as aluminum alloy, red copper, etc., may be selected as the mother plate of the partition walls of the microchannels, and red copper may be selected from the viewpoint of cost. But not limited thereto, other materials suitable for heat dissipation may be selected, such as thermally conductive plastics (e.g., PA46TC series of DSM, high temperature resistant nylon series of disembarks, the netherlands), the thermal conductivity of which has been successful in replacing aluminum alloys or copper.
The length, width and thickness of the mother plate of the partition wall of the corresponding microchannel can be selected according to the length, width and thickness of the mother plate of the microchannel. For example, as shown in fig. 2, when a metal plate having a thickness w is selected as the microchannel mother plate 1, a metal plate having a thickness w may be selected as the microchannel partition mother plate 2. The length and width of the partition mother substrate 2 of the microchannel may be the same as those of the microchannel mother substrate 1. The metal plate with proper size can be selected as the mother plate of the partition wall of the micro-channel, or the large metal plate can be selected and cut into the mother plate of the partition wall of the micro-channel with proper size. The number of the mother plates 2 among the partitions of the plurality of microchannels is generally determined by the total width W of the microchannel cold plate shown in fig. 8.
A bubble structure corresponding to n number of microchannels is formed on part or all of the microchannel partition mother substrate 2, and the bubble structure is shown in fig. 4 (a). Compared with a linear micro-channel without the bubbling structure, the bubbling structure increases the heat exchange area of the micro-channel cold plate, increases the disturbance to the fluid in the micro-channel 11, and strengthens the heat convection effect and the heat dispersion of the micro-channel cold plate.
Alternatively, an opening structure corresponding to n number of microchannels is formed on part or all of the partition mother substrate 2 of the microchannel, as shown in fig. 4 (b). Compared with the microchannel inter-wall plate 2 without the open pore structure, the open pore structure can enable bubbles to permeate into other microchannels when fluid in the microchannels carries out boiling heat exchange, so that the overall distribution of the bubbles in the microchannel cold plate is improved, the axial expansion of the bubbles (namely the length direction L of the microchannel cold plate) is weakened, and the instability of flow is inhibited.
Alternatively, a blind plate is used as the partition mother plate of the microchannel without providing any structure on the partition mother plate 2 of the microchannel.
And step 3: one or two plates are selected as cover plates.
A metal plate may be selected as the cover plate, for example, an aluminum alloy, red copper, etc., and red copper may be selected from the viewpoint of cost. But not limited thereto, other materials suitable for heat dissipation may be selected, such as thermally conductive plastics (e.g., PA46TC series of DSM, high temperature resistant nylon series of disembarks, the netherlands), the thermal conductivity of which has been successful in replacing aluminum alloys or copper.
A metal plate with the thickness of w 'is selected as the cover plate 3, and w' is more than or equal to w. The length and width of the cover plate 3 may be the same as those of the microchannel mother plate 1. The cover plate can be made of a metal plate with a proper size, or a large metal plate can be cut to form the cover plate with a proper size. Two cover plates are typically used to protect the structure inside the microchannel cold plate.
And 4, step 4: at least two positioning holes 4 are formed on each microchannel mother plate, each microchannel partition mother plate, and each cover plate.
And 5: a plurality of microchannel mother plates on which at least two microchannels are previously formed and a plurality of microchannel partition mother plates are alternately arranged.
It is known that the interval between the plurality of microchannel mother plates 1 and the plurality of microchannel partition mother plates 2 is very small, almost in the order of micrometers, after they are alternately arranged, and thus it is very difficult to process the microchannels 11 on the arranged microchannel mother plates 1. Therefore, it is selected that a plurality of microchannels 11 are formed in advance on the microchannel mother substrate 1 before this step.
In the case where a bubble structure or an open pore structure is formed on a part or all of the mother plates of the partition walls of the microchannels, when a plurality of mother plates of the microchannels and a plurality of mother plates of the partition walls of the microchannels are arranged alternately, each of the microchannels 11 is opposed to a position of the bubble structure corresponding thereto, or each of the microchannels 11 is opposed to a position of the open pore structure corresponding thereto.
As shown in fig. 5, after a plurality of microchannel mother plates 1 and a plurality of microchannel partition plates 2 (the number of the microchannel mother plates 1 and the microchannel partition mother plates 2 is N in total) are arranged alternately, pins are used to penetrate positioning holes of each microchannel mother plate 1 and each microchannel partition mother plate 2 so as to be arranged alternately and neatly.
Step 6: and arranging the cover plates on the outermost sides of the plurality of micro-channel motherboards and the plurality of micro-channel partition mother boards which are arranged in a staggered mode.
When the plurality of microchannel mother boards 1 and the plurality of microchannel partition mother boards 2 are staggered, the cover plate may be arranged on the outermost side, and the cover plate, the plurality of microchannel mother boards and the plurality of microchannel partition mother boards may be fixed by fitting pins and positioning holes.
And 7: and welding the plurality of micro-channel mother plates and the plurality of micro-channel partition mother plates which are arranged in a staggered mode.
The staggered multiple microchannel mother plates 1 and the multiple microchannel partition mother plates 2 may be welded together using vacuum diffusion welding. In addition, while the plurality of microchannel mother plates 1 and the plurality of microchannel partition mother plates 2 arranged in a staggered manner are welded together, the outermost cover plate 3 may also be welded together to protect the microchannel mother plates 1 and the microchannel partition mother plates 2 therein, and the welded structure is as shown in fig. 6.
Vacuum diffusion welding refers to the process of closely attaching the surfaces to be connected under certain temperature, pressure and vacuum state, expanding the physical contact of the connection surfaces by locally generating microscopic plastic deformation or generating microscopic liquid phase on the connection surfaces, and then mutually diffusing atoms of the bonding layers to form reliable joint surfaces.
And 8: cutting the plurality of microchannel motherboards and the plurality of microchannel partition motherboards welded together to form a plurality of individual said single microchannel cold plates in a manner such that the single microchannel cold plate comprises one microchannel on each microchannel motherboard.
The plurality of microchannel mother plates 1 and the plurality of partition mother plates 2 welded together may be cut using electric spark cutting. According to the process shown in fig. 7, the n micro-channel cold plates can be processed by cutting the plates along the dotted line for a plurality of times. In fig. 7, a cover plate at the front thereof is omitted in order to clearly show the internal structure of the plurality of microchannel mother plates 1 and the plurality of partition mother plates 2 welded together.
Cutting the plate in the dotted line shown in fig. 7, a microchannel cold plate having a closed microchannel structure can be obtained, as shown in fig. 8 (a). Alternatively, when the boundary in the depth direction of the microchannel is cut in fig. 7, a microchannel cold plate having an open microchannel structure may also be obtained, as shown in (b) of fig. 8.
As some variations on the method of fabrication of the microchannel cold plate shown in FIG. 1, the method of fabrication may not be performed exactly in the steps and/or order shown in FIG. 1. In other embodiments of the present invention, some steps may be omitted, or the order of execution of some steps may be changed. For example, the manufacturing method of the microchannel cold plate may not comprise the steps 3 and 6, or the step 4 may not comprise the operation of machining positioning holes on the cover plate; as another example, the order between steps 1, 2, 3, 4 may be switched as desired.
In summary, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims (8)
1. A method for manufacturing a micro-channel cold plate is characterized by comprising the following steps:
selecting a plurality of plates as a plurality of microchannel motherboards, and manufacturing at least two microchannels on each plate in the plurality of microchannel motherboards;
selecting a plurality of plates as mother plates of the partition walls of the plurality of microchannels;
arranging a plurality of microchannel motherboards and a plurality of microchannel partition mother boards in a staggered way;
welding a plurality of micro-channel mother boards and a plurality of micro-channel partition mother boards which are arranged in a staggered mode;
cutting the plurality of microchannel motherboards and the plurality of microchannel partition motherboards welded together to form a plurality of individual said single microchannel cold plates in a manner such that the single microchannel cold plate comprises one microchannel on each microchannel motherboard.
2. The method of making a micro-channel cold plate according to claim 1,
performing a wire cutting process on each microchannel mother board to form at least two microchannels on each microchannel mother board in a manner of removing materials; or,
and bending each micro-channel mother board to form at least two concave micro-channels on each micro-channel mother board.
3. The method of claim 1, wherein each of the plurality of mother plates with partition walls of the micro-channels has a bubble structure corresponding to the at least two micro-channels;
when a plurality of microchannel motherboards and a plurality of microchannel partition mother boards are staggered, each microchannel is opposite to the bubbling structure corresponding to the microchannel.
4. The method of claim 1, wherein an opening structure corresponding to the at least two microchannels is formed on each of the plurality of mother plates of partition walls of the microchannels;
when a plurality of micro-channel mother boards and a plurality of micro-channel partition mother boards are arranged in a staggered mode, each micro-channel is opposite to the corresponding open pore structure.
5. The method of making a microchannel cold plate as set forth in any one of claims 1-4, further comprising:
at least two positioning holes are formed on each micro-channel mother board and each micro-channel partition mother board, and each micro-channel mother board and each micro-channel partition mother board are regularly and alternately arranged together through the positioning holes.
6. The method of making a microchannel cold plate as set forth in any one of claims 1 to 4, wherein the plurality of microchannel motherplates and the plurality of interchannel motherplates are welded together using vacuum diffusion welding.
7. The method of making a microchannel cold plate as set forth in any one of claims 1 to 4 wherein the plurality of microchannel motherboards and the plurality of inter-microchannel motherboards welded together are cut using spark cutting to form a plurality of individual said individual microchannel cold plates.
8. The method of making a microchannel cold plate as set forth in any one of claims 1 to 4, wherein one or two plates are selected as the cover plate, and when the plurality of microchannel motherboards and the plurality of microchannel partition motherboards are staggered, the cover plate is positioned at the outermost side of the staggered plurality of microchannel motherboards and the plurality of microchannel partition mother boards.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111372422A (en) * | 2020-01-09 | 2020-07-03 | 西安交通大学 | Manufacturing method of array micro-channel cold plate |
| CN117001289A (en) * | 2023-08-25 | 2023-11-07 | 西安交通大学 | Composite process and system for preparing special-shaped micro-channel plate heat exchanger |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100437135B1 (en) * | 2004-02-24 | 2004-07-03 | 주식회사 스펙 | Micro Heat Exchanger And Manufacuring Method Thereof |
| CN201897410U (en) * | 2010-12-01 | 2011-07-13 | 杭州沈氏换热器有限公司 | Micro-channel heat exchanger |
| CN103722345A (en) * | 2013-12-08 | 2014-04-16 | 合肥天鹅制冷科技有限公司 | Cold plate and machining method thereof |
| US20160282059A1 (en) * | 2013-03-18 | 2016-09-29 | Mahle International Gmbh | Layered heat transfer device and method for producing a layered heat transfer device |
| CN107731767A (en) * | 2017-10-09 | 2018-02-23 | 上海工程技术大学 | A kind of microchannel heat sink with horizontal direction and vertical direction turbulence structure |
| CN108133916A (en) * | 2017-12-25 | 2018-06-08 | 中国电子科技集团公司第五十四研究所 | A kind of microchannel heat sink welding structure and technique |
| CN108759533A (en) * | 2018-05-29 | 2018-11-06 | 电子科技大学 | A kind of microchannel cold plates, radiator and device based on 3D bulk prints |
| CN109104844A (en) * | 2018-08-03 | 2018-12-28 | 中国航空工业集团公司雷华电子技术研究所 | A kind of microchannel cold plates |
-
2019
- 2019-02-21 CN CN201910136170.5A patent/CN109848666B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100437135B1 (en) * | 2004-02-24 | 2004-07-03 | 주식회사 스펙 | Micro Heat Exchanger And Manufacuring Method Thereof |
| CN201897410U (en) * | 2010-12-01 | 2011-07-13 | 杭州沈氏换热器有限公司 | Micro-channel heat exchanger |
| US20160282059A1 (en) * | 2013-03-18 | 2016-09-29 | Mahle International Gmbh | Layered heat transfer device and method for producing a layered heat transfer device |
| CN103722345A (en) * | 2013-12-08 | 2014-04-16 | 合肥天鹅制冷科技有限公司 | Cold plate and machining method thereof |
| CN107731767A (en) * | 2017-10-09 | 2018-02-23 | 上海工程技术大学 | A kind of microchannel heat sink with horizontal direction and vertical direction turbulence structure |
| CN108133916A (en) * | 2017-12-25 | 2018-06-08 | 中国电子科技集团公司第五十四研究所 | A kind of microchannel heat sink welding structure and technique |
| CN108759533A (en) * | 2018-05-29 | 2018-11-06 | 电子科技大学 | A kind of microchannel cold plates, radiator and device based on 3D bulk prints |
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| CN111372422B (en) * | 2020-01-09 | 2021-07-06 | 西安交通大学 | Manufacturing method of array micro-channel cold plate |
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| CN117001289B (en) * | 2023-08-25 | 2024-05-03 | 西安交通大学 | Composite process and system for preparing special-shaped micro-channel plate heat exchanger |
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