CN109845423B - System with carrier and electronic device - Google Patents
System with carrier and electronic device Download PDFInfo
- Publication number
- CN109845423B CN109845423B CN201780062540.4A CN201780062540A CN109845423B CN 109845423 B CN109845423 B CN 109845423B CN 201780062540 A CN201780062540 A CN 201780062540A CN 109845423 B CN109845423 B CN 109845423B
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- China
- Prior art keywords
- carrier
- cooling
- cooling line
- electronic device
- cooled
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20872—Liquid coolant without phase change
Abstract
The invention relates to a system having a carrier (2.1) and an electronic device (4), in particular a power electronic device (4), which is fastened to the carrier (2.1) in a heat-conducting manner and has a printed circuit board (4.1) and a plurality of first electronic components (4.2) which are arranged on a mounting surface (4.1.1) of the printed circuit board (4.1) and are to be cooled, wherein a cooling line (6) for a cooling medium is arranged on the carrier (2.1) in a heat-conducting manner for cooling the electronic device (4). In order to design the cooling of electronic devices, in particular power electronic devices, arranged on a carrier more efficiently, it is provided that the cooling circuit (6) is designed as a separate component (6), the spatial arrangement of which is coordinated with the spatial position of the first electronic component (4.2) to be cooled in such a way that the cooling circuit (6) and the plurality of first electronic components (4.2) to be cooled lie in a common plane (8) perpendicular to the mounting plane (4.1.1) of the printed circuit board (4.1). The invention further relates to a method for producing a carrier (2.1).
Description
Technical Field
The invention relates to a system having a carrier and an electronic device which is thermally secured to the carrier.
Background
Systems and production methods of this type are known from the prior art in a large number of embodiment variants.
Known systems having a carrier and an electronic device (in particular a power electronic device) which is fastened to the carrier in a heat-conducting manner and which comprises a printed circuit board and a plurality of first electronic components which are arranged on a mounting surface of the printed circuit board and are to be cooled have passive cooling, for example by means of cooling ribs, on the one hand. On the other hand, active cooling is also known, for example ventilation devices, which blow cooling air onto the surface to be cooled. For applications in which a higher cooling power has to be achieved, for example in the case of power electronics for electric vehicles or the like, the cooling solution is no longer sufficient. In these cases, water cooling is then used, in which case the cooling water is conducted through cooling lines formed in the carrier of the electronic device. For this purpose, sliding parts are used when producing the carrier (for example in a metal die casting method), which are pulled out of the carrier produced in this way after the casting has been completed.
Disclosure of Invention
The present invention is therefore based on this finding.
The object of the invention is to more efficiently design the cooling of electronic devices, in particular power electronic devices, arranged on a carrier.
The object is achieved by a system having a carrier and an electronic device which is thermally secured to the carrier.
An important advantage of the invention is, in particular, that cooling of electronic devices, in particular of power electronics, can be effected efficiently and at the same time with little effort. The invention makes it possible to make the objects which conflict with each other to a large extent compatible. By the coordination of the spatial arrangement of the cooling line according to the invention with the spatial position of the first electronic component to be cooled, an effective cooling of the electronic device is achieved, for example, with a simultaneous reduction in the length of the cooling line. The cooling line is located precisely at the location where the first electronic component to be cooled is located. The path of the heat flow from the first electronic component to be cooled to the cooling line is minimized with regard to the heat conduction in the carrier material. Thereby a very efficient cooling is achieved. This applies in particular if the first electronic component group to be cooled comprises components having a high cooling requirement. By forming the cooling lines as separate components, the arrangement of the cooling lines and thus of the cooling lines on the carrier can be adapted more flexibly to the individual circumstances. The arrangement of the cooling lines of the system according to the invention is not subject to technical restrictions (for example the possibility of using slides in the casting mould or the like), unlike the cooling lines formed in the carrier.
In principle, the cooling circuit can be freely selected within wide and suitable limits depending on the type, material, shape, size and arrangement. A particularly advantageous embodiment of the system according to the invention provides that the material of the cooling line has a higher melting temperature than the material for the carrier and is at least partially (preferably completely) encapsulated by the material of the carrier. The cooling line can thereby be arranged in close contact with the carrier, so that the heat transfer connection from the first electronic component to be cooled to the cooling line is further improved. Furthermore, the cooling lines can be used in this way in a common casting method (for example a metal casting method) for producing a carrier (for example a housing part) for an electronic device, without the technical limitations caused by the construction of the cooling lines by using slides or similar devices in the casting method. It is particularly advantageous if the cooling line is completely enveloped by the material of the carrier. In this way, the cooling circuit is better protected from undesirable environmental influences.
A further advantageous embodiment of the system according to the invention provides that the carrier part is formed as a metal injection-molded part, in particular as an injection-molded aluminum part. Metal die casting is a proven and cost-effective method for producing a carrier for an electronic device (for example, a carrier designed as a housing part). Aluminum has a weight advantage compared to other metals, which is particularly important in the case of applications in vehicle technology (for example in the case of electric vehicles).
A particularly advantageous embodiment of the system according to the invention provides that the plurality of first electronic components to be cooled are in direct thermally conductive connection with the cooling line by means of the printed circuit board and the carrier. In this way a higher cooling capacity can be achieved compared to, for example, a heat transfer connection with, for example, a heat convection section.
A further advantageous embodiment of the system according to the invention provides that a thermally conductive agent is arranged between the carrier and the electronic device and/or between the carrier and the cooling line. The thermally conductive connection between the carrier and the electronic device and/or between the carrier and the cooling line is thereby further improved. It is particularly advantageous if the cooling line is not partially or completely enveloped by the material of the carrier, but is arranged on the surface of the carrier.
A particularly advantageous development of the aforementioned embodiment provides that the thermally conductive agent is simultaneously formed as an adhesive. In this way, no additional adhesive is required for fastening the electronic device and/or the cooling line to the carrier.
Although the system according to the invention has a high degree of flexibility with regard to the spatial arrangement of the cooling lines, it is conceivable in certain applications that not all electronic components to be cooled belong to the first group of electronic components to be cooled. This is the case, for example, with systems having a complex spatial extent, in which the electronic components to be cooled are arranged on the printed circuit board of the electronic device at a position of the carrier which is peripheral with respect to the cooling line. In an advantageous embodiment of the system according to the invention, it is therefore provided that at least one cooling rib is formed on the carrier part, which cooling rib extends from the location of the cooling line to the location of at least one second electronic component to be cooled. It is thereby possible to efficiently cool also electronic components which are in a less favorable position in terms of spatial position relative to the cooling line by means of the cooling line.
In principle, the system can be freely selected within wide and suitable limits depending on the type, shape, material, dimensions and relative arrangement of the components of the system with respect to each other. The carrier is advantageously designed as a housing part of the housing and the electronic device is arranged in the interior of the housing in the assembled position of the system. In this way, the electronic device is protected against undesired operation and against undesired ambient conditions.
A particularly advantageous embodiment of the system according to the invention provides that the cooling line is designed as a flexible hose. Thereby further simplifying the spatial arrangement of the cooling lines.
Drawings
The invention is explained in more detail below on the basis of a roughly schematic drawing. In the drawings:
figure 1 shows a partial view of one embodiment of a system according to the invention in a perspective view,
figure 2 shows a partial view of this embodiment in top view without the electronics,
FIG. 3 shows a partial view of this embodiment in a bottom view, an
Fig. 4 shows this embodiment in a sectional view.
Detailed Description
The invention is explained in more detail below with reference to fig. 1 to 4. Structural elements that are identical or functionally identical are denoted by the same reference numerals.
One embodiment of a system according to the present invention is shown partially in fig. 1. The system has a carrier 2.1 designed as a housing lower part and an electronic device 4 designed as a power electronics device for a motor vehicle. The housing lower part 2.1 is formed as a die-cast aluminum part and is produced by means of a metal die-casting method. The electronic device 4 comprises a plurality of first electronic components 4.2 arranged on a mounting surface 4.1.1 of the printed circuit board 4.1. The first electronic component 4.2 is only indicated in general terms in fig. 1 by the three enclosed regions. The first electronic component 4.2 is an electronic component 4.2 of the electronic device 4 to be cooled, which, during operation of the electronic device 4, generates a large part of the heat to be removed from the electronic device 4.
Fig. 1 also shows the inlet connection 6.1 and the outlet connection 6.2 of the cooling line 6, which is designed as a steel tube. The cooling line 6 is already inserted into the mold during the production of the carrier 2.1 designed as the lower housing part and is completely encapsulated by the material of the lower housing part 2.1 (i.e. aluminum). For this purpose, a material having a higher melting temperature than the material of the housing lower part 2.1 (i.e. aluminum) is selected for the cooling line 6. The cooling line 6 is formed as a component of a water cooling device, not shown in detail. The housing lower part 2.1 is part of the two-part housing 2 shown in fig. 4. The housing lower part 2.1 forms the housing 2 together with the housing cover 2.2. In the installation position of the system shown in fig. 4, the electronic device 4 is arranged in an interior space 2.3 enclosed by the housing 2.
In addition to the first electronic component 4.2 to be cooled, the electronic device 4 also has a second electronic component to be cooled, which is designed in part as a storage choke (Speicherdrop) 4.3. The storage chokes 4.3 are each located laterally to the printed circuit board 4.1 and are electrically conductively connected thereto. Based on the edge position of the storage choke 4.3 (relative to the housing lower part 2.1), the storage choke is located in a peripheral position of the housing lower part 2.1 relative to the cooling line 6.
Fig. 2 shows the housing lower part 2.1 in a top view (i.e. in the view from above in the plane of the illustration of fig. 1), but without the electronics 4 shown in fig. 1. As can be seen clearly from fig. 1 and 2, in a position of the housing lower part 2.1 which, in the assembly position of the system, is opposite the first electronic component 4.2 to be cooled, which is arranged on the printed circuit board 4.1, the housing lower part 2.1 has a correspondingly flat first cooling base 2.1.1. The same applies to the position of the housing lower part 2.1 opposite the storage choke 4.3 arranged laterally to the printed circuit board 4.1 in the assembly position of the system; these positions of the housing lower part 2.1 have a planar second cooling base 2.1.2. The housing lower part 2.1 with its cooling bases 2.1.1 and 2.1.2 is applied with a heat-conducting agent, which is embodied as a heat-conducting paste and is not shown, to the bottom side of the printed circuit board 4.1, which is also not shown in fig. 1, in a position in which the first electronic component 4.2 to be cooled and the storage choke 4.3 to be cooled are arranged on the mounting surface 4.1.1 of the printed circuit board 4.1 shown in fig. 1. Accordingly, the heat transfer resistance between the first electronic component 4.2 to be cooled and the storage choke 4.3 and the housing lower part 2.1 is reduced. In the assembled position of the system, the first electronic component 4.2 is in direct heat-conducting connection with the cooling line 6 by means of the printed circuit board 4.1, a heat-conducting paste, not shown, and the first cooling base 2.2.1 of the housing lower part 2.1; see also fig. 4.
Fig. 3 shows the housing lower part 2.1 in a bottom view (i.e. in the plane of the illustration in fig. 1, viewed from below). As can be seen from the combination of fig. 2 and 3, the spatial arrangement of the cooling lines 6 is coordinated with the spatial position of the first cooling base 2.1.1. The extent of the cooling line 6 is selected such that the cooling line 6 passes through the location of the first cooling base 2.1.1. The spatial arrangement of the cooling circuit 6 is thus matched to the spatial position of the first electronic component 4.2 to be cooled in such a way that the cooling circuit 6 and the plurality of first electronic components 4.2 to be cooled lie in a common plane 8 perpendicular to the mounting surface 4.1.1 of the printed circuit board 4.1; reference is made to fig. 4, in which for the sake of clarity only a section line of the plane 8 and the section of fig. 4 are shown. The common plane 8 extends substantially through the center of mass of the first electronic component 4.2 and of the cooling line 6. In fig. 3, therefore, the plane 8 extends along the cooling line 6 and perpendicular to the illustration plane of fig. 3. The first electronic component 4.2 to be cooled is in a direct heat-conducting connection with the cooling line 6 via the printed circuit board 4.1, the heat-conducting paste and the first cooling base 2.1.1.
In order to improve the heat-conducting connection of the second cooling base 2.1.2 and thus the storage choke 4.3 and further second electronic components 4.3 to be cooled arranged peripherally with respect to the cooling line 6, cooling ribs 2.1.3 are formed on the bottom side of the housing lower part 2.1 visible in fig. 3, which extend from the location of the cooling line 6 as far as the second cooling base 2.1.2 and thus as far as the storage choke 4.3 to be cooled and as far as further second electronic components to be cooled arranged peripherally with respect to the cooling line 6. Furthermore, the storage choke 4.3 to be cooled is in a thermally conductive connection with the cooling rib 2.1.3 and thus with the cooling line 6 via the printed circuit board 4.1, the thermally conductive paste and the second cooling base 2.1.2 in a direct manner. The cross section of the housing lower part 2.1 available for heat conduction is enlarged by the cooling ribs 2.1.3, so that the heat conduction from the second electronic component to be cooled (for example, the storage choke 4.3) to the cooling line 6 is significantly improved. Furthermore, the arrangement of the cooling ribs 2.1.3 on the outer side of the housing lower part 2.1 (i.e. on the bottom side of the housing lower part 2.1 shown in fig. 3) serves at the same time for passive cooling. The increased surface of the housing lower part 2.1 by the cooling ribs 2.1.3 facilitates the dissipation of heat by thermal radiation and convection into the free surroundings.
Due to the technically necessary radius of curvature of the cooling line 6, some edge sections of the first cooling base 2.1.1 also serve as cooling ribs according to the invention.
Fig. 4 shows the exemplary embodiment in a sectional view, wherein the section extends from left to right with respect to the drawing plane of fig. 3; see cut line 10 in fig. 3. The sectional view in fig. 4 shows the system according to the invention according to the present embodiment in a view from above towards the sectional line in fig. 3. In this sectional view, it can be clearly seen that the cooling line 6 is completely enveloped by the material of the housing lower part 2.1, with the exception of the inlet connection 6.1 for the cooling water guided in the cooling line 6 and the outlet connection 6.2, which is not visible in fig. 4.
Furthermore, it is apparent from fig. 4 in conjunction with fig. 2 that the section of the cooling line 6 (in relation to the illustration plane of fig. 2) which is sectioned by the section plane in fig. 4 is arranged shortly behind the first cooling base 2.1.1 which is arranged between the inlet connection 6.1 and the outlet connection 6.2. In the plane of the illustration in fig. 4, this is the first cooling pedestal 2.1.1 which is arranged immediately adjacent to the left side of the cooling line 6 shown in the sectional plane. Accordingly, the heat flow of the first electronic component 4.2 associated with this and arranged on the printed circuit board 4.1 can be conducted via the printed circuit board 4.1, the thermal paste and the cooling base 2.1.1 shown in the sectional plane of fig. 4 to the cooling line 6 and thus to the cooling medium which is guided in the cooling line 6 and is designed as water, by means of thermal conduction in the shortest path.
It can also be seen that the further extent of the cooling line 6 in the plane of the drawing in fig. 4 is directed upwards, and that cooling ribs 2.1.3 are formed on the housing lower part 2.1, which ribs extend from the location of the cooling line 6 and with respect to the cooling line 6 toward a peripheral location of the housing lower part 2.1. The second electronic component to be cooled, which is arranged at this peripheral position of the housing lower part 2.1, is cooled during operation of the electronic device via the cooling ribs 2.1.3 guided at this peripheral position. The cooling base 2.1.2 for the storage choke 4.3 visible in the background of fig. 4 is likewise visible. It can also be seen that the printed circuit board 4.1 rests against the housing lower part 2.1 only via the cooling bases 2.1.1 and 2.1.2 and a heat-conducting paste, not shown, which is arranged between these cooling bases and the printed circuit board 4.1. In addition to this, the printed circuit board 4.1 is spaced apart from the housing lower part 2.1. The intermediate space thus created between the printed circuit board 4.1 and the housing lower part 2.1 serves to receive an adhesive, not shown, which ensures a tight connection between the printed circuit board 4.1 and thus the electronic device 4 and the housing lower part 2.1.
The present invention is not limited to the present embodiment. For example, it is conceivable to form the thermally conductive agent simultaneously as an adhesive. It is also possible to construct the cooling line as a flexible hose instead of a steel tube. In the case of a cooling line which is at least partially enveloped by the material of the carrier, care is only to be taken that the material used for the cooling line has a higher melting temperature than the material of the carrier. However, it is also conceivable for a cooling line (for example, a cooling line designed as a flexible hose) to be in heat-transfer connection with the carrier in other ways known to the person skilled in the art and suitable for this purpose. For example, retaining clips may be provided on the carrier to releasably secure the cooling line to the carrier. It is also possible for the carrier and the cooling line to be made of a metal alloy or a composite material, respectively (for example of plastic with metal fabric or the like integrated therein). Other liquid or gaseous cooling media instead of water are also possible. Furthermore, the cooling circuit may be designed as a Heat Pipe, i.e. as a Heat Pipe (Heat-Pipe). The carrier, which is formed as a housing lower part, for example, does not necessarily have to be produced as a casting.
List of reference numerals
2 casing
2.1 Carrier part of the housing 2
2.1.1 first cooling base of the lower part 2.1 of the housing
2.1.2 second cooling base of the lower part 2.1 of the housing
2.1.3 Cooling Ribs of the lower housing part 2.1
2.2 housing cover of housing 2
2.3 interior space of housing 2
4 electronic device
4.1 printed Circuit Board of electronic device 4
4.1.1 mounting face of printed Circuit Board 4.1
4.2 first electronic component of electronic device 4 to be cooled
4.3 second electronic component of electronic device 4 to be cooled, designed as a storage choke
6 cooling line formed as steel pipe
6.1 Inlet connection pipe of the Cooling line 6
6.2 Outlet connection pipe of Cooling line 6
The common plane of the first structural element 4.2 and the cooling line 6 is perpendicular to the mounting surface 4.1.1 of the printed circuit board 4.1
10 section line in fig. 3, along which the section plane extends is shown in fig. 4
Claims (13)
1. System having a carrier (2.1) and an electronic device (4) which is fastened to the carrier (2.1) in a heat-conducting manner and has a printed circuit board (4.1) and a plurality of first electronic components (4.2) which are arranged on a mounting surface (4.1.1) of the printed circuit board (4.1) and are to be cooled, wherein a cooling line (6) for a cooling medium is arranged on the carrier (2.1) in a heat-conducting manner for cooling the electronic device (4), characterized in that the cooling line (6) is designed as a separate component (6) whose spatial arrangement is matched to the spatial position of the first electronic component (4.2) to be cooled in such a way that the cooling line (6) and the plurality of first electronic components (4.2) to be cooled are in a common plane (8) which is perpendicular to the mounting surface (4.1.1) of the printed circuit board (4.1), wherein the plurality of first electronic components (4.2) to be cooled are in a thermally conductive connection with the cooling line (6) via the printed circuit board (4.1), the thermally conductive agent and the first cooling base (2.1.1) in a direct manner.
2. The system according to claim 1, characterized in that the electronic device (4) is a power electronic device.
3. The system according to claim 1, characterized in that the material of the cooling line (6) has a higher melting temperature than the material for the carrier (2.1) and is at least partially enveloped by the material of the carrier (2.1).
4. The system according to claim 1, characterized in that the material of the cooling line (6) has a higher melting temperature than the material for the carrier (2.1) and is completely enveloped by the material of the carrier (2.1).
5. System according to one of claims 1 to 4, characterized in that the carrier (2.1) is designed as a metal die casting.
6. System according to any one of claims 1 to 4, characterized in that the carrier (2.1) is constructed as a die cast aluminium part.
7. The system of any one of claims 1 to 4, wherein the thermal conductor comprises a thermal paste.
8. System according to any one of claims 1 to 4, characterized in that a heat-conducting agent is provided between the carrier (2.1) and the electronic device (4) and/or between the carrier (2.1) and the cooling line (6).
9. The system of claim 8, wherein the thermal conductor is simultaneously formed as an adhesive.
10. System according to one of claims 1 to 4, characterized in that at least one cooling rib (2.1.3) is configured on the carrier (2.1), which cooling rib extends from the location of a cooling line (6) to the location of at least one second electronic component (4.3) to be cooled.
11. System according to one of claims 1 to 4, characterized in that the carrier (2.1) is designed as a housing part of the housing (2) and the electronic device (4) is arranged in the interior (2.3) of the housing (2) in the assembled position of the system.
12. The system according to any one of claims 1 to 4, wherein the cooling line is configured as a flexible hose.
13. System according to claim 3 or 4, characterized in that the cooling line (6) is enveloped by the material of the carrier (2.1) by means of a metal die casting method.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102016119303.8A DE102016119303A1 (en) | 2016-10-11 | 2016-10-11 | System with a carrier and electronics and method of manufacturing a carrier |
| DE102016119303.8 | 2016-10-11 | ||
| PCT/EP2017/075462 WO2018069174A1 (en) | 2016-10-11 | 2017-10-06 | System having a substrate and an electronics system, and method for producing a substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109845423A CN109845423A (en) | 2019-06-04 |
| CN109845423B true CN109845423B (en) | 2021-03-02 |
Family
ID=60051507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780062540.4A Active CN109845423B (en) | 2016-10-11 | 2017-10-06 | System with carrier and electronic device |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN109845423B (en) |
| DE (1) | DE102016119303A1 (en) |
| WO (1) | WO2018069174A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019134565A1 (en) | 2019-12-16 | 2021-06-17 | HELLA GmbH & Co. KGaA | Housing for a converter and converter, in particular a DC converter with such a housing |
| DE102021104390A1 (en) | 2021-02-24 | 2022-08-25 | Scherdel Innotec Forschungs- Und Entwicklungs-Gmbh | Injection molded housing, power electronic component and thermal management element therewith and method for producing an injection molded housing |
| DE102021213689B4 (en) | 2021-12-02 | 2023-06-22 | Zf Friedrichshafen Ag | Cooling device for cooling a unit to be cooled and method for manufacturing a cooling device |
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2016
- 2016-10-11 DE DE102016119303.8A patent/DE102016119303A1/en active Pending
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- 2017-10-06 CN CN201780062540.4A patent/CN109845423B/en active Active
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| WO2007014801A2 (en) * | 2005-08-02 | 2007-02-08 | Siemens Vdo Automotive Ag | Cooling system for electronics housings |
| CN101147995A (en) * | 2006-09-22 | 2008-03-26 | 浙江新龙实业有限公司 | Method for welding aluminium pipe, method for welding aluminium pipe type heat exchanger and device for welding aluminium pipe |
| EP2179895A1 (en) * | 2008-10-24 | 2010-04-28 | Harman Becker Automotive Systems GmbH | Vehicle electronic system with fluid cooling |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2018069174A1 (en) | 2018-04-19 |
| DE102016119303A1 (en) | 2018-04-12 |
| CN109845423A (en) | 2019-06-04 |
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