CN109842992A - A kind of production method of no glue single-face flexibility copper-clad board - Google Patents
A kind of production method of no glue single-face flexibility copper-clad board Download PDFInfo
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- CN109842992A CN109842992A CN201910166838.0A CN201910166838A CN109842992A CN 109842992 A CN109842992 A CN 109842992A CN 201910166838 A CN201910166838 A CN 201910166838A CN 109842992 A CN109842992 A CN 109842992A
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- copper
- clad board
- glue single
- face flexibility
- glue
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- 239000003292 glue Substances 0.000 title claims abstract description 104
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 41
- 238000002360 preparation method Methods 0.000 claims abstract description 35
- 239000007787 solid Substances 0.000 claims abstract description 35
- 239000011241 protective layer Substances 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 30
- 230000008569 process Effects 0.000 claims abstract description 25
- 238000004804 winding Methods 0.000 claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 claims abstract description 18
- 239000010949 copper Substances 0.000 claims abstract description 18
- 239000010410 layer Substances 0.000 claims abstract description 17
- 230000035800 maturation Effects 0.000 claims abstract description 17
- 239000002904 solvent Substances 0.000 claims abstract description 11
- 239000011889 copper foil Substances 0.000 claims description 23
- 229920001721 polyimide Polymers 0.000 claims description 18
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 13
- 230000005070 ripening Effects 0.000 claims description 11
- 230000001681 protective effect Effects 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 6
- 239000002362 mulch Substances 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 5
- 238000007689 inspection Methods 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 239000002243 precursor Substances 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 3
- 239000005030 aluminium foil Substances 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims 1
- 238000003780 insertion Methods 0.000 abstract 1
- 230000037431 insertion Effects 0.000 abstract 1
- 239000002552 dosage form Substances 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 239000002253 acid Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 150000003949 imides Chemical class 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000003319 supportive effect Effects 0.000 description 1
Abstract
The invention discloses a kind of production methods of no glue single-face flexibility copper-clad board.The present invention is before maturation process; by covering a protective layer without the surface of glue single-face flexibility copper-clad board in semi-solid preparation; the face PI of no glue single-face flexibility copper-clad board is isolated with layers of copper; then loose winding cures again; it is possible to prevente effectively from the solvent volatilization directly contact layers of copper in the face PI causes to aoxidize in maturing process; the protective layer of insertion has supporting role without glue single-face flexibility copper-clad board to semi-solid preparation simultaneously, can effectively avoid generating fold, so that the finished product yield without glue single-face flexibility copper-clad board is up to 95% or more.
Description
Technical field
The present invention relates to no glue single-face flexibility copper-clad board manufacturing technology fields, and in particular to a kind of no glue single side flexible copper-clad
The production method of plate.
Background technique
Flexibility coat copper plate (Flexible Copper Clad Laminate, FCCL) refers to PI film or polyester film
Equal insulating materials are substrate, surface coated with the copper foil conductor for meeting flexural property requirement laminar composite material, have it is light,
The feature of thin, high-fire resistance and pliability, therefore, the FPCB for using flexibility coat copper plate as baseplate material are widely used in electronics production
In product.Flexibility coat copper plate can be divided into single-face flexibility copper-clad board, double side flexible copper coated board and multi-panel according to the different route numbers of plies and scratch
Property copper-clad plate, two stratotype flexibility coat copper plates of no solid can be divided by the difference of product structure, and comprising copper foil, film and
Three stratotype flexibility coat copper plates of solid.
Currently, there are two types of the mode of curing, one kind is online ripe after the completion of without the coating of then dosage form single-face flexibility copper-clad board
Change, this mode is at high cost due to equipment valuableness；Another kind is exactly web-like curing, and process flow is as shown in Figure 1, will be without then
Dosage form single-face flexibility copper-clad board, which is wrapped in from level to level outside core mechanism, forms scroll-like, direct loose winding post curing, in maturing process, waves
The solvent of hair directly contacts the copper-clad surface without then dosage form single-face flexibility copper-clad board, is easy to produce oxidation；Simultaneously as without then
Dosage form single-face flexibility copper-clad board will appear curling problems, and direct loose winding will lead to whole generation polygon, the Angle Position of polygon
Contact is close between layers, and gas permeability is bad, is also easy to produce oxidation；Without then dosage form single-face flexibility copper-clad board due to copper foil
Relatively thin, its bottom and front are easy to produce broken wrinkle, cause without then dosage form single side flexible copper-clad without other supports when direct loose winding
Board finished product yield is relatively low, and average yield only has 85%.Therefore, it is necessary to the curing work without then dosage form single-face flexibility copper-clad board
It skill and ripening device used improves.
Summary of the invention
It is an object of the invention to a kind of no glue single-face flexibility copper-clad board is provided in place of overcome the deficiencies in the prior art
Production method can be effective to solve the problems, such as to be also easy to produce oxidation, fold in maturing process without glue single-face flexibility copper-clad board at present
Improve the finished product yield without glue single-face flexibility copper-clad board.
To achieve the above object, the technical solution adopted by the present invention is as follows:
A kind of production method of no glue single-face flexibility copper-clad board, comprising the following steps:
(1) it is coated with polyimide precursor glue on copper foil, after dry out solvent, obtains semi-solid preparation and is covered without glue single side flexibility
Copper sheet, winding；
(2) it is wound after semi-solid preparation is without the surface protective mulch of glue single-face flexibility copper-clad board；
(3) by the semi-solid preparation of surface protective mulch without glue single-face flexibility copper-clad board in ripening device used middle loose winding, be placed in nitrogen
Gas high temperature oven carries out maturation process；
(4) it by tightly being rolled up without glue single-face flexibility copper-clad board after maturation process, is respectively obtained web-like and is scratched without glue single side
Property copper-clad plate and protective layer.
Production technology of the present invention is after the completion of coating, before maturation process, by semi-solid preparation without glue single side flexible copper-clad
The surface of plate covers a protective layer, the polyimide film (PI) of no glue single-face flexibility copper-clad board is isolated with layers of copper, then
Loose winding cures again, and protective layer provides isolation supporting role without glue single-face flexibility copper-clad board for semi-solid preparation, in case semi-solid preparation is without glue list
Face flexibility coat copper plate interlayer is in close contact, and gas permeability is bad to cause oxidation fold.
The preferred embodiment of production method as no glue single-face flexibility copper-clad board of the present invention, the method is also
Including recycling to the protective layer after separation, and the step of slitting, inspection and packaging is carried out to no glue single-face flexibility copper-clad board
Suddenly.
The preferred embodiment of production method as no glue single-face flexibility copper-clad board of the present invention, the step
(2) in, in the surface protective mulch of polyimide film of the semi-solid preparation without glue single-face flexibility copper-clad board.
The preferred embodiment of production method as no glue single-face flexibility copper-clad board of the present invention, the protective layer
For copper foil, magnesium foil, aluminium foil, iron foil, nickel foil or stainless steel foil.Consider being easy to get for actual production process material, preferably copper foil conduct
Protective layer.
The preferred embodiment of production method as no glue single-face flexibility copper-clad board of the present invention, the protective layer
With a thickness of 10~350 μm.
The preferred embodiment of production method as no glue single-face flexibility copper-clad board of the present invention, the step
(3) in, the curing temperature of maturation process is 250 DEG C~450 DEG C.
Compared with prior art, the invention has the benefit that
After the completion of coating, the present invention is before maturation process, by covering in semi-solid preparation without the surface of glue single-face flexibility copper-clad board
The face PI of no glue single-face flexibility copper-clad board is isolated with layers of copper in a lid protective layer, and then loose winding cures again, it is possible to prevente effectively from
The protective layer that the solvent volatilization in the face PI directly contact layers of copper is caused to aoxidize, while being inserted into maturing process is to semi-solid preparation without glue list
Face flexibility coat copper plate has supporting role, effectively fold can be avoided to generate, so that the finished product yield without glue single-face flexibility copper-clad board
Up to 95% or more.
Detailed description of the invention
Fig. 1 for no glue single-face flexibility copper-clad board existing production technological process；
Fig. 2 is the production technological process of no glue single-face flexibility copper-clad board of the invention；
Fig. 3 is the ripening device used structural schematic diagram of no glue single-face flexibility copper-clad board of the present invention；
Fig. 4 is the ripening device used structural exploded view of no glue single-face flexibility copper-clad board of the present invention；
In figure, 1- top cover, 2- collet, the axle center 3- pipe, 4- sleeve, 5- roof side is along A, and 6- roof side is along B, 7- collet lateral edge
A, 8- collet lateral edge B, 9- air hole, 10- semi-solid preparation is without glue single-face flexibility copper-clad board, 11- protective layer.
Specific embodiment
Purposes, technical schemes and advantages in order to better illustrate the present invention, below in conjunction with specific embodiment to the present invention
It further illustrates.It will be appreciated by those skilled in the art that described herein, specific examples are only used to explain the present invention, not
For limiting the present invention.
Embodiment 1
A kind of production method of no glue single-face flexibility copper-clad board, as shown in Fig. 2, specifically includes the following steps:
(1) glue, i.e. polyimide precursor glue are prepared using solvent, resin and curing agent, is coated on copper foil poly-
Acid imide presoma glue after dry out solvent, obtains semi-solid preparation without glue single-face flexibility copper-clad board, winding；
(2) covering a layer thickness without the PI layer surface of glue single-face flexibility copper-clad board in semi-solid preparation using slotting protective layer device is
10 μm of copper foil after protective layer as winding；
(3) by surface covering copper foil semi-solid preparation without glue single-face flexibility copper-clad board in ripening device used middle loose winding, be placed in nitrogen
High temperature oven carries out maturation process, and curing temperature is 450 DEG C；
(4) it by tightly being rolled up without glue single-face flexibility copper-clad board after maturation process, is respectively obtained web-like and is scratched without glue single side
Property copper-clad plate and copper foil；
(5) protective layer is recycled；
(6) shipment after slitting, inspection, packaging will be carried out without glue single-face flexibility copper-clad board.
The finished product yield of no glue single-face flexibility copper-clad board manufactured in the present embodiment is 96%.
Embodiment 2
A kind of production method of no glue single-face flexibility copper-clad board, as shown in Fig. 2, specifically includes the following steps:
(1) glue, i.e. polyimide precursor glue are prepared using solvent, resin and curing agent, is coated on copper foil poly-
Acid imide presoma glue after dry out solvent, obtains semi-solid preparation without glue single-face flexibility copper-clad board, winding；
(2) covering a layer thickness without the PI layer surface of glue single-face flexibility copper-clad board in semi-solid preparation using slotting protective layer device is
350 μm of copper foil after protective layer as winding；
(3) by surface covering copper foil semi-solid preparation without glue single-face flexibility copper-clad board in ripening device used middle loose winding, be placed in nitrogen
High temperature oven carries out maturation process, and curing temperature is 250 DEG C；
(4) it by tightly being rolled up without glue single-face flexibility copper-clad board after maturation process, is respectively obtained web-like and is scratched without glue single side
Property copper-clad plate and copper foil；
(5) protective layer is recycled；
(6) shipment after slitting, inspection, packaging will be carried out without glue single-face flexibility copper-clad board.
The finished product yield of no glue single-face flexibility copper-clad board manufactured in the present embodiment is 95%.
Embodiment 3
A kind of production method of no glue single-face flexibility copper-clad board, as shown in Fig. 2, specifically includes the following steps:
(1) glue, i.e. polyimide precursor glue are prepared using solvent, resin and curing agent, is coated on copper foil poly-
Acid imide presoma glue after dry out solvent, obtains semi-solid preparation without glue single-face flexibility copper-clad board, winding；
(2) covering a layer thickness without the PI layer surface of glue single-face flexibility copper-clad board in semi-solid preparation using slotting protective layer device is
150 μm of copper foil after protective layer as winding；
(3) by surface covering copper foil semi-solid preparation without glue single-face flexibility copper-clad board in ripening device used middle loose winding, be placed in nitrogen
High temperature oven carries out maturation process, and curing temperature is 300 DEG C；
(4) it by tightly being rolled up without glue single-face flexibility copper-clad board after maturation process, is respectively obtained web-like and is scratched without glue single side
Property copper-clad plate and copper foil；
(5) protective layer is recycled；
(6) shipment after slitting, inspection, packaging will be carried out without glue single-face flexibility copper-clad board.
The finished product yield of no glue single-face flexibility copper-clad board manufactured in the present embodiment is 98%.
This comparison of comparative example it is substantially the same manner as Example 1 without glue single-face flexibility copper-clad board, the difference is that, this comparison
The semi-solid preparation of example is not covered with copper foil without the PI layer surface of glue single-face flexibility copper-clad board.
The finished product yield without glue single-face flexibility copper-clad board of this comparative example preparation is 85%.
Copper foil can also be replaced with the protective layers such as magnesium foil, aluminium foil, iron foil, nickel foil, stainless steel foil by the present invention.
Production technology of the invention is selected before maturation process, by surface of the semi-solid preparation without glue single-face flexibility copper-clad board
Cover a protective layer, solve in prior art because no glue single-face flexibility copper-clad board the face PI volatilize be easy it is direct with layers of copper
The problem of contacting, copper foil caused to aoxidize, while the protective layer being inserted into without glue single-face flexibility copper-clad board there is support to make semi-solid preparation
With can effectively avoid broken wrinkle from generating, to improve the finished product yield without glue single-face flexibility copper-clad board.It is found through experiment that using this
The finished product yield without glue single-face flexibility copper-clad board of the method production of invention is cured up to 95% or more, with unprotect layer is used
Method is compared, and the finished product yield of the method for the present invention preparation significantly improves.
Ripening device used used by above-mentioned steps (3), structure is as depicted in figs. 1 and 2, including reels mechanism, beamer
The top of structure is equipped with top cover 1, and the bottom of reels mechanism is equipped with collet 2；The reels mechanism includes axle center pipe 3, scratches without glue single side
Property copper-clad plate, protective layer 11 and the sleeve 4 being set in outside no glue single-face flexibility copper-clad board and protective layer, the top cover 1 be circle
The outer diameter of cyclic structure, the annular diameters and axle center pipe 3 of top cover 1 matches, the outer diameter phase of the outer annular diameter and sleeve 4 of top cover 1
Matching, and the inner annular edge of top cover 1 is equipped with roof side vertically upward along A 5, the outer ring edge of top cover 1 is equipped with vertically downward
Roof side is along B6；The collet 2 is annular structure, and the annular diameters of collet 2 are that the outer diameter of axle center pipe 3 matches, collet 2
The outer diameter of outer annular diameter and sleeve 4 matches, and the inner annular edge of collet 2 is equipped with collet lateral edge A 5 vertically downward, collet 2
Outer ring edge be equipped with collet lateral edge B 8 vertically upward；Bar shaped air hole 9, bar shaped are equipped on the top cover 1 and collet 2
Air hole 9 is centrosymmetric using the axle center of axle center pipe 3 as symmetrical centre distribution, and it is logical that hot wind is more advantageous in high temperature oven
Bar shaped air hole is crossed across every layer of semi-solid preparation without glue single-face flexibility copper-clad board 10, so that semi-solid preparation is without glue single-face flexibility copper-clad board 10
The generation for phenomena such as internal/external heating curing is uniform, reduces fold, oxidation.The length of the axle center pipe 3 is longer than the length of sleeve 4；
The roof side is identical along the height of B 6 as roof side along A 5；The height of the collet lateral edge A7 is greater than collet lateral edge B's 8
Highly.
After semi-solid preparation covers a protective layer 11 without the face PI of glue single-face flexibility copper-clad board 10, it is wrapped in outside axle center pipe 3
Winding forms web-like, is arranged sleeve 4 and is placed on collet 2, and in the top top cover 1 of reels mechanism, axle center pipe 3 can be worn
Roof side is crossed along A 5 and collet lateral edge A7, limits the position of sleeve 4 along B 6 and collet lateral edge B 8 by roof side.To being covered with
The semi-solid preparation of protective layer 11 carries out loose winding without glue single-face flexibility copper-clad board 10, is sent into nitrogen high temperature oven and carries out hot setting,
Can be obtained after solidifying without glue single-face flexibility copper-clad board.By the ripening device used carry out maturation process in the present invention, curing
In the process this it is ripening device used can provide support and protective effect without the bottom of glue single-face flexibility copper-clad board for semi-solid preparation, prevent list
Face flexibility coat copper plate deforms broken or is easily polluted by the external foreign matters；And nitrogen hot wind passes through air hole from no glue single-face flexibility copper-clad board
Inside flow through so that uniform without glue single-face flexibility copper-clad board internal/external heating, further increase product yield.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention rather than protects to the present invention
The limitation of range is protected, although the invention is described in detail with reference to the preferred embodiments, those skilled in the art should
Understand, it can be with modification or equivalent replacement of the technical solution of the present invention are made, without departing from the essence of technical solution of the present invention
And range.
Claims (6)
1. a kind of production method of no glue single-face flexibility copper-clad board, which comprises the following steps:
(1) it is coated with polyimide precursor glue on copper foil, after dry out solvent, obtains semi-solid preparation without glue single side flexible copper-clad
Plate, winding；
(2) it is wound after semi-solid preparation is without the surface protective mulch of glue single-face flexibility copper-clad board；
(3) by the semi-solid preparation of surface protective mulch without glue single-face flexibility copper-clad board in ripening device used middle loose winding, be placed in nitrogen height
Warm baking oven carries out maturation process；
(4) it by tightly being rolled up without glue single-face flexibility copper-clad board after maturation process, is respectively obtained web-like and is covered without glue single side flexibility
Copper sheet and protective layer.
2. the production method of no glue single-face flexibility copper-clad board according to claim 1, which is characterized in that further include to separation
Protective layer afterwards is recycled, and the step of carrying out slitting, inspection and packaging to no glue single-face flexibility copper-clad board.
3. the production method of no glue single-face flexibility copper-clad board according to claim 1, which is characterized in that the step (2)
In, in the surface protective mulch of polyimide film of the semi-solid preparation without glue single-face flexibility copper-clad board.
4. the production method of no glue single-face flexibility copper-clad board according to claim 1, which is characterized in that the protective layer is
Copper foil, magnesium foil, aluminium foil, iron foil, nickel foil or stainless steel foil.
5. the production method of no glue single-face flexibility copper-clad board according to claim 1 or 4, which is characterized in that the protection
Layer with a thickness of 10~350 μm.
6. the production method of no glue single-face flexibility copper-clad board according to claim 1, which is characterized in that the step (3)
In, the curing temperature of maturation process is 250 DEG C~450 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910166838.0A CN109842992A (en) | 2019-03-05 | 2019-03-05 | A kind of production method of no glue single-face flexibility copper-clad board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910166838.0A CN109842992A (en) | 2019-03-05 | 2019-03-05 | A kind of production method of no glue single-face flexibility copper-clad board |
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| Publication Number | Publication Date |
|---|---|
| CN109842992A true CN109842992A (en) | 2019-06-04 |
Family
ID=66885372
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910166838.0A Pending CN109842992A (en) | 2019-03-05 | 2019-03-05 | A kind of production method of no glue single-face flexibility copper-clad board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112657810A (en) * | 2020-12-12 | 2021-04-16 | 安徽新辰光学新材料有限公司 | Processing technology of flexible copper clad laminate coiled material |
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| CN210137504U (en) * | 2019-03-05 | 2020-03-10 | 广州联茂电子科技有限公司 | Curing device of adhesive-free single-sided flexible copper-clad plate |
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2019
- 2019-03-05 CN CN201910166838.0A patent/CN109842992A/en active Pending
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| JP2006245286A (en) * | 2005-03-03 | 2006-09-14 | Shin Etsu Chem Co Ltd | Flexible printed circuit board and its manufacturing method |
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| CN104786627A (en) * | 2015-04-17 | 2015-07-22 | 新高电子材料（中山）有限公司 | Polyamideimide double-sided flexible copper-clad plate and manufacture method thereof |
| CN210137504U (en) * | 2019-03-05 | 2020-03-10 | 广州联茂电子科技有限公司 | Curing device of adhesive-free single-sided flexible copper-clad plate |
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| CN112657810A (en) * | 2020-12-12 | 2021-04-16 | 安徽新辰光学新材料有限公司 | Processing technology of flexible copper clad laminate coiled material |
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