CN109819085B - Mobile phone shell with automatic human health index recognition function - Google Patents
Mobile phone shell with automatic human health index recognition function Download PDFInfo
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- CN109819085B CN109819085B CN201910020113.0A CN201910020113A CN109819085B CN 109819085 B CN109819085 B CN 109819085B CN 201910020113 A CN201910020113 A CN 201910020113A CN 109819085 B CN109819085 B CN 109819085B
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Abstract
The invention discloses a mobile phone shell with an automatic human health index recognition function, belonging to the field of mobile phone shells, and the mobile phone shell with the automatic human health index recognition function comprises a mobile phone shell body, wherein a semi-closed mounting groove is formed in the upper end of the mobile phone shell body, a semi-closed cover is fixedly connected to a groove on the upper side of the semi-closed mounting groove and matched with the semi-closed mounting groove, an integrated circuit board can be taken out of the semi-closed mounting groove through the arrangement of the semi-closed mounting groove when the mobile phone shell needs to be replaced, the taken-out integrated circuit board can be installed in a new mobile phone shell again, so that the effect of replacing the mobile phone shell without replacing the integrated circuit board is realized, the use efficiency of the integrated circuit board is effectively improved, the waste of resources is reduced, and meanwhile, the heat generated by the mobile phone and the integrated circuit board can be effectively conducted outwards through the use of a fibrous extended heat dissipation, the service life of the integrated circuit board is prolonged.
Description
Technical Field
The invention relates to the field of mobile phone shells, in particular to a mobile phone shell with a function of automatically identifying human health indexes.
Background
The existing products for automatically identifying the human health index generally comprise a bracelet and the like, and the main functions of the bracelet comprise checking the amount of exercise, monitoring the sleep quality, awakening an intelligent alarm clock and the like. Can look over the amount of exercise in real time through the cell-phone application, the monitoring effect of walking and running can also be through the more motion items of high in the clouds discernment, can judge automatically whether get into the sleep state, take notes deep sleep and light sleep respectively and summarize the sleep time, help the user to monitor the sleep quality of oneself, inside low-power consumption bluetooth chip and the acceleration sensor of having equipped with simultaneously, the standby can reach 30 days. In addition, the waterproof and dustproof structure supports IP67 level water resistance and dust resistance, which means that the waterproof and dustproof structure does not need to be taken off in daily life and even for bathing.
Its internally mounted has the circuit board, can electric connection have the chip and the electronic component that sensor etc. were used for discerning the human health index on the circuit board, it is exactly right that can discern the biggest a bit of bracelet of the healthy index of difficult problem of people to the cell-phone shell, the cell-phone shell is the product that a manufacturing cost is lower relatively, therefore the consumer is shorter to the life cycle of cell-phone shell, after the cell-phone shell is installed into with the circuit board inside, when changing the cell-phone shell, its inside integrated circuit board also can be changed thereupon, this can cause a large amount of wastes of resource, simultaneously when cell-phone shell cover uses on the cell-phone, cell-phone and integrated circuit board all can generate heat, too high heat can lead to integrated circuit board to damage, lead to its life to reduce.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems in the prior art, the invention aims to provide a mobile phone shell with an automatic human health index recognition function, the integrated circuit board can be taken out from the semi-closed mounting groove through the arrangement of the semi-closed mounting groove when the mobile phone shell needs to be replaced, and the taken-off integrated circuit board can be installed in a new mobile phone shell again, so that the effect of replacing the mobile phone shell without replacing the integrated circuit board is realized, the use efficiency of the integrated circuit board is effectively improved, the waste of resources is reduced, meanwhile, through the use of a tree-whisker-shaped extending and radiating mechanism, the heat generated by the mobile phone and the integrated circuit board can be effectively conducted outwards, and the service life of the integrated circuit board is prolonged.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
A mobile phone shell with an automatic human health index recognition function comprises a mobile phone shell body, wherein a semi-closed installation groove is formed in the upper end of the mobile phone shell body, a semi-closed cover is fixedly connected to a groove opening in the upper portion of the semi-closed installation groove and matched with the semi-closed installation groove, an arc-shaped groove is formed in the upper end of the mobile phone shell body and is located on the right side of the semi-closed installation groove and communicated with the semi-closed installation groove, an arc-shaped pressing cover is bonded on the surface of the arc-shaped groove, an integrated circuit board is installed at the bottom end in the semi-closed installation groove, the lower end of the semi-closed cover is contacted with the upper surface of the integrated circuit board, a tree-whisker-shaped extending heat dissipation mechanism is arranged in the mobile phone shell body and comprises staggered heat conduction plates, communicated heat dissipation rods and heat conduction wires, and the staggered heat conduction plates, the interlaced heat conducting plate is positioned under the semi-closed mounting groove, one end of the communicated heat radiating rod is positioned on the upper surface of the mobile phone shell body and is flush with the upper surface of the mobile phone shell body, the other end of the communicated heat radiating rod is positioned on the inner wall of the semi-closed mounting groove and is flush with the inner wall of the semi-closed mounting groove, the interlaced heat conducting plate and the plurality of communicated heat radiating rods are connected through the heat conducting wires, the integrated circuit board can be taken out from the semi-closed mounting groove when the mobile phone shell needs to be replaced through the arrangement of the semi-closed mounting groove, the taken-out integrated circuit board can be installed into a new mobile phone shell again, the effect that only the mobile phone shell is replaced without replacing the integrated circuit board is realized, the use efficiency of the integrated circuit board is effectively improved, the waste of resources is reduced, and meanwhile, the heat generated by the mobile phone and the integrated circuit board can, the service life of the integrated circuit board is prolonged;
the heat absorption plate is adhered to the inner wall of the semi-closed type mounting groove and covers the surfaces of the other ends of the plurality of communicated heat dissipation rods, the heat absorption plate can absorb heat generated by the integrated circuit board in the using process on the side surface and conduct the heat to the communicated heat dissipation rods, the heat is dissipated outwards through the communicated heat dissipation rods, and compared with the mode that the heat is conducted outwards directly through the communicated heat dissipation rods, the heat absorption plate is large in surface area, can absorb the heat quickly, quickens dissipation of the heat on the integrated circuit board, and protects electronic elements on the integrated circuit board from being damaged easily;
the cambered surface pressing cover is made of high-resilience memory sponge, when the integrated circuit board needs to be taken out, the cambered surface pressing cover is manually pressed downwards at first to expose the edge of the elastic cover, then the elastic cover is manually opened, namely the semi-closed cover is opened, and the integrated circuit board can be detached at the moment;
the semi-closed cover comprises a shaping cover and an elastic cover, the shaping cover is fixedly connected with the edge of the semi-closed mounting groove, and the elastic cover is contacted with the edge of the notch of the semi-closed mounting groove;
the fixing cover is made of hard materials, so that the fixing cover is fixed with the semi-closed mounting groove more tightly, the elastic cover is made of soft rubber materials, the elastic cover can be lifted, and meanwhile, the fixed arrangement of the fixing cover, the soft materials of the elastic cover and the contact arrangement can effectively reduce the span of a seam between the semi-closed cover and the semi-closed mounting groove, so that the passage of dust entering the semi-closed mounting groove is reduced, and the heat dissipation of the integrated circuit board is effectively protected from being influenced by the dust;
the inner part of the cambered surface pressing cover and one end, close to the cambered surface pressing cover, of the elastic cover are fixedly connected with magnetic materials, when the semi-closed cover is arranged on the semi-closed type mounting groove, the elastic cover and the cambered surface pressing cover can be mutually adsorbed, so that the semi-closed cover is fixed, the semi-closed cover on the mobile phone shell body is not prone to being accidentally opened in the process of using the mobile phone, and an integrated circuit board in the semi-closed type mounting groove can be protected from being damaged by being exposed in the air;
the staggered heat conducting plates are woven by criss-cross metal wires, the interval between the staggered heat conducting plates and the integrated circuit board is 2-5mm, the too thin interval can cause the low strength of the interval part between the integrated circuit board and the staggered heat conducting plates to be easy to break, and the too thick interval can influence the heat generated by the integrated circuit board in the using process to pass through the interval and be conducted onto the staggered heat conducting plates;
the material of the communicating heat dissipation rod and the heat conducting wire is copper wire, the heat wiping property of the copper material is good, the heat conductivity of the tree-whisker-shaped extending heat dissipation mechanism can be accelerated, the heat dissipation of the integrated circuit board can be effectively assisted, and the service life of the integrated circuit board can be prolonged;
the edge of semi-closed cover and semi-closed mounting groove is scribbled and is equipped with synthetic polymer waterproof coating, can effectively reduce the span of the seam between semi-closed cover and the semi-closed mounting groove to reduce the dust and can get into the inside passageway of semi-closed mounting groove, effectively protect integrated circuit board's heat dissipation and be difficult for receiving the influence of dust.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) this scheme can be through the setting of semi-enclosed mounting groove, when the cell-phone shell is changed to needs, integrated circuit board can be followed in the semi-enclosed mounting groove, integrated circuit board taken off can install once more into new cell-phone shell, thereby realize only changing the cell-phone shell and not changing integrated circuit board's effect, thereby integrated circuit board's availability factor has effectively been improved, the waste to the resource has been reduced simultaneously, must describe the use that extends heat dissipation mechanism through the tree simultaneously, can effectively outwards conduct the heat that cell-phone and integrated circuit board produced, integrated circuit board's life is improved.
(2) The inner wall of semi-enclosed mounting groove glues and is equipped with the absorber plate, the absorber plate covers the surface at a plurality of intercommunication heat dissipation pole other ends, the absorber plate can be in the heat that the side absorption integrated circuit board produced in the use, and give the intercommunication heat dissipation pole with the heat conduction, outwards distribute away through the intercommunication heat dissipation pole, compare in direct outwards conduction heat through the intercommunication heat dissipation pole, the absorber plate surface area is great, can be very fast adsorb the heat, accelerate the thermal giving off on the integrated circuit board, protect the electronic component on the integrated circuit board not easily damaged.
(3) Cambered surface is according to the gland material and is high resilience memory sponge, when integrated circuit board is taken out to needs, at first manual cambered surface is pressed down according to the gland, make the edge of elasticity lid expose, then manually open the elasticity lid, half closing cap has been opened promptly, integrated circuit board can be dismantled this moment, at this in-process, the cambered surface is according to the gland and is used for the space that communicates with each other between sealed semi-enclosed mounting groove and the half closing cap, make the dust difficult to enter into semi-enclosed mounting groove through this space, thereby it influences its heat dissipation because of the dust to protect integrated circuit board is difficult, synthetic polymer waterproof coating is scribbled on high resilience memory sponge surface, make external steam and the manual sweat of user difficult press the gland entering semi-enclosed mounting groove through the cambered surface, can effectively protect integrated circuit board difficult the corrosion that receives.
(4) Semi-closed lid is including design lid and elasticity lid, design lid and elasticity lid fixed connection, design lid and semi-enclosed mounting groove edge fixed connection, elasticity lid contacts with the edge of semi-enclosed mounting groove notch, the design lid is hard material, it is inseparabler to make it fixed with semi-enclosed mounting groove, the elasticity lid is soft rubber materials, make the elasticity lid can be lifted, the fixed soft material and the contact setting of setting and elasticity lid of design lid simultaneously, can effectively reduce the span of the seam between semi-closed lid and the semi-enclosed mounting groove, thereby reduce the dust and can get into the inside passageway of semi-enclosed mounting groove, effectively protect integrated circuit board's heat dissipation and be difficult for receiving the influence of dust.
(5) The cambered surface is inside to be close to the equal fixedly connected with magnetic material of one end of cambered surface press cap with the elasticity lid, when semi-closed lid was established on semi-closed mounting groove, elasticity lid and cambered surface press cap can adsorb each other to fixed semi-closed lid, make in using the cell-phone in-process, semi-closed lid on the cell-phone shell body is difficult for unexpected the opening, can protect the integrated circuit board in the semi-closed mounting groove difficult for exposing and receive the injury in the air.
(6) The staggered heat conducting plates are woven by metal wires which are staggered vertically and horizontally, the interval between the staggered heat conducting plates and the integrated circuit board is 2-5mm, the too-thin interval can cause the strength of the interval part between the integrated circuit board and the staggered heat conducting plates to be too low and easy to break, and the too-thick interval can influence the heat generated by the integrated circuit board in the using process to be conducted onto the staggered heat conducting plates through the interval.
(7) The material of intercommunication heat dissipation pole and heat conduction silk is the copper wire, and the hot wiping of copper product matter is thoughtlessly arrived the nature fine, can accelerate the tree fibrous heat conductivity that extends heat dissipation mechanism, can effectively assist the heat dissipation of integrated circuit board, can prolong integrated circuit board's life.
(8) The edge of semi-closed cover and semi-closed mounting groove is scribbled and is equipped with synthetic polymer waterproof coating, can effectively reduce the span of the seam between semi-closed cover and the semi-closed mounting groove to reduce the dust and can get into the inside passageway of semi-closed mounting groove, effectively protect integrated circuit board's heat dissipation and be difficult for receiving the influence of dust.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of the semi-enclosed cover of the present invention in an open configuration;
FIG. 3 is a partial schematic structural view of the front side of the present invention;
FIG. 4 is a schematic view of the structure at A in FIG. 3;
fig. 5 is a schematic structural view of the front half-section of the present invention.
The reference numbers in the figures illustrate:
1 cell-phone shell body, 2 semi-closed covers, 201 design lid, 202 elastic cover, 3 cambered surface press cap, 4 semi-closed mounting grooves, 5 integrated circuit boards, 6 crisscross heat-conducting plates, 7 absorber plates, 8 intercommunication radiating rods, 9 heat-conducting wires.
Detailed Description
The drawings in the embodiments of the invention will be combined; the technical scheme in the embodiment of the invention is clearly and completely described; obviously; the described embodiments are only some of the embodiments of the invention; but not all embodiments, are based on the embodiments of the invention; all other embodiments obtained by a person skilled in the art without making any inventive step; all fall within the scope of protection of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
referring to fig. 1-2, a mobile phone case with automatic human health index recognition function comprises a mobile phone case body 1, a semi-enclosed installation groove 4 is chiseled at the upper end of the mobile phone case body 1, a semi-enclosed cover 2 is fixedly connected to a notch above the semi-enclosed installation groove 4, the semi-enclosed cover 2 comprises a design cover 201 and an elastic cover 202, the design cover 201 is fixedly connected with the edge of the semi-enclosed installation groove 4, the elastic cover 202 is in contact with the edge of the notch of the semi-enclosed installation groove 4, the design cover 201 is made of hard material to be more tightly fixed with the semi-enclosed installation groove 4, the elastic cover 202 is made of soft rubber material to enable the elastic cover 202 to be lifted, meanwhile, the fixed arrangement of the design cover 201 and the soft material and contact arrangement of the elastic cover 202 can effectively reduce the span of the seam between the semi-enclosed cover, thereby reduce the dust and can get into the inside passageway of semi-enclosed mounting groove 4, effectively protect integrated circuit board 5's heat dissipation and be difficult for receiving the influence of dust, semi-enclosed cover 2 and the 4 phase-matchs of semi-enclosed mounting groove, the arc wall has been dug to 1 upper end of cell-phone shell body, and the arc wall is located the 4 right sides of semi-enclosed mounting groove and communicates with each other with semi-enclosed mounting groove 4.
The cambered surface pressing cover 3 is adhered to the surface of the cambered surface groove, the inner part of the cambered surface pressing cover 3 and one end of the elastic cover 202 close to the cambered surface pressing cover 3 are fixedly connected with magnetic materials, when the semi-closed cover 2 is covered on the semi-closed installation groove 4, the elastic cover 202 and the cambered surface pressing cover 3 can be mutually adsorbed, so that the semi-closed cover 2 is fixed, the semi-closed cover 2 on the mobile phone shell body 1 is not easy to be accidentally opened in the process of using the mobile phone, the integrated circuit board 5 in the semi-closed installation groove 4 can be protected from being easily exposed and damaged in the air, the cambered surface pressing cover 3 is made of high-resilience memory sponge, when the integrated circuit board 5 needs to be taken out, the cambered surface pressing cover 3 is manually pressed downwards at first, the edge of the elastic cover 202 is exposed, then the elastic cover 202 is manually lifted, namely the semi-closed cover 2 is opened, the integrated circuit board, cambered surface press cap 3 is used for the space of communicating department between sealed semi-enclosed mounting groove 4 and the semi-enclosed cover 2, make the dust difficult to enter into semi-enclosed mounting groove 4 through this space in, thereby protection integrated circuit board 5 is difficult to influence its heat dissipation because of the dust, high resilience memory sponge surface and semi-enclosed cover 2 and semi-enclosed mounting groove 4's edge all scribble and are equipped with synthetic polymer waterproof coating, make external steam and user's hand sweat difficult to get into semi-enclosed mounting groove 4 through cambered surface press cap 3 in, can effectively protect integrated circuit board 5 not easily receive the corrosion.
Referring to fig. 3-4, an integrated circuit board 5 is installed at the bottom end of a semi-enclosed installation groove 4, the lower end of a semi-enclosed cover 2 contacts with the upper surface of the integrated circuit board 5, a chip and various sensors are installed in the integrated circuit board 5 and can be used for identifying the health index of a human body, meanwhile, the chip and the various sensors in the integrated circuit board 5 are connected with a mobile phone through wireless signals, the health index of the human body identified on the integrated circuit board 5 can be directly sent to the mobile phone through the wireless signals, and various index data are displayed through collection.
Referring to fig. 4, a tree-whisker-shaped extending heat dissipation mechanism is disposed in the mobile phone case body 1, the tree-whisker-shaped extending heat dissipation mechanism includes interlaced heat conduction plates 6, communicated heat dissipation rods 8 and heat conduction wires 9, the interlaced heat conduction plates 6, the communicated heat dissipation rods 8 and the heat conduction wires 9 are all embedded in the mobile phone case body 1, the interlaced heat conduction plates 6 are located under the semi-enclosed mounting groove 4, referring to fig. 5, one end of each communicated heat dissipation rod 8 is located on the upper surface of the mobile phone case body 1 and is flush with the upper surface of the mobile phone case body 1, the other end of each communicated heat dissipation rod 8 is located on the inner wall of the semi-enclosed mounting groove 4 and is flush with the inner wall of the semi-enclosed mounting groove 4, the interlaced heat conduction plates 6 and the plurality of communicated heat dissipation rods 8 are all connected by the heat conduction wires 9, the interlaced heat conduction plates 6 are woven by criss-crossed wires, and the interval between the interlaced heat conduction plates 6 and the integrated, the heat generated by the integrated circuit board 5 in the using process is conducted to the staggered heat conducting plates 6 through the intervals due to the excessively thick intervals, the heat absorbing plate 7 is adhered to the inner wall of the semi-closed type mounting groove 4, the heat absorbing plate 7 covers the surfaces of the other ends of the plurality of communicated heat radiating rods 8, the heat absorbing plate 7 can absorb the heat generated by the integrated circuit board 5 in the using process on the side surface and conduct the heat to the communicated heat radiating rods 8, the heat is radiated outwards through the communicated heat radiating rods 8, compared with the mode that the heat is conducted outwards through the communicated heat radiating rods 8 directly, the surface area of the heat absorbing plate 7 is large, the heat can be absorbed quickly, the radiation of the heat on the integrated circuit board 5 is accelerated, electronic elements on the integrated circuit board 5 are protected from being damaged easily, the materials of the communicated heat radiating rods 8 and the heat conducting wires 9 are copper wires, the heat rubbing and mixing performance of the copper material is good, and, the heat dissipation of the integrated circuit board 5 can be effectively assisted, and the service life of the integrated circuit board 5 can be prolonged.
Can be through the setting of semi-enclosed mounting groove 4, when needing to change the mobile phone shell, can take out integrated circuit board 5 from semi-enclosed mounting groove 4, integrated circuit board 5 taken off can be installed into new mobile phone shell again, thereby realize the effect of only changing the mobile phone shell but not changing integrated circuit board 5, thereby effectively improving the use efficiency of integrated circuit board 5, simultaneously reduce the waste to the resource, simultaneously through the use of the tree whisker-shaped extending heat dissipation mechanism, absorb the heat of the side and bottom of integrated circuit board 5 through staggered heat conduction plate 6 and heat absorption plate 7, simultaneously staggered heat conduction plate 6 can also absorb the heat produced by the mobile phone in the use process, and then directly conduct the absorbed heat or conduct the heat to the communicating heat dissipation rod 8 through heat conduction wire 9, through communicating heat dissipation rod 8 can effectively conduct the heat produced by the mobile phone and integrated circuit board 5 outwards, the service life of the integrated circuit board 5 is improved.
The above; but are merely preferred embodiments of the invention; the scope of the invention is not limited thereto; any person skilled in the art is within the technical scope of the present disclosure; the technical scheme and the improved concept of the invention are equally replaced or changed; are intended to be covered by the scope of the present invention.
Claims (1)
1. The utility model provides a take cell-phone shell of automatic identification human health index, includes cell-phone shell body (1), its characterized in that: the upper end of the mobile phone shell body (1) is provided with a semi-closed mounting groove (4), a semi-closed cover (2) is fixedly connected to a notch above the semi-closed mounting groove (4), the semi-closed cover (2) is matched with the semi-closed mounting groove (4), the upper end of the mobile phone shell body (1) is provided with an arc-shaped groove, the arc-shaped groove is positioned on the right side of the semi-closed mounting groove (4) and communicated with the semi-closed mounting groove (4), the surface of the arc-shaped groove is adhered with an arc-shaped pressing cover (3), an integrated circuit board (5) is installed at the inner bottom end of the semi-closed mounting groove (4), the lower end of the semi-closed cover (2) is contacted with the upper surface of the integrated circuit board (5), a tree-whisker-shaped extending heat dissipation mechanism is arranged in the mobile phone shell body (1), and the tree-whisker-shaped extending heat dissipation, the staggered heat-conducting plates (6), the communicated heat-radiating rods (8) and the heat-conducting wires (9) are all embedded inside the mobile phone shell body (1), the staggered heat-conducting plates (6) are located under the semi-closed mounting groove (4), one end of each communicated heat-radiating rod (8) is located on the upper surface of the mobile phone shell body (1) and is flush with the upper surface of the mobile phone shell body (1), the other end of each communicated heat-radiating rod (8) is located on the inner wall of the semi-closed mounting groove (4) and is flush with the inner wall of the semi-closed mounting groove (4), and the staggered heat-conducting plates (6) and the plurality of communicated heat-radiating rods (8) are all connected through the heat-conducting wires;
the inner wall of the semi-closed type mounting groove (4) is adhered with a heat absorbing plate (7), and the heat absorbing plate (7) covers the surfaces of the other ends of the plurality of heat dissipation rods (8);
the cambered surface pressing cover (3) is made of high-resilience memory sponge, and a waterproof layer is coated on the surface of the high-resilience memory sponge;
the semi-closed cover (2) comprises a shaping cover (201) and an elastic cover (202), the shaping cover (201) is fixedly connected with the edge of a notch of the semi-closed mounting groove (4), and the elastic cover (202) is contacted with the edge of the semi-closed mounting groove (4);
the shaping cover (201) is made of a hard material, and the elastic cover (202) is made of a soft rubber material;
the magnetic material is fixedly connected to the inner part of the cambered surface pressing cover (3) and one end, close to the cambered surface pressing cover (3), of the elastic cover (202);
the staggered heat conducting plates (6) are formed by weaving criss-cross metal wires, and the interval between the staggered heat conducting plates (6) and the integrated circuit board (5) is 2-5 mm;
the material of the heat dissipation rod (8) and the heat conducting wire (9) is copper wire;
and synthetic polymer waterproof paint coatings are coated at the edges of the semi-closed cover (2) and the semi-closed mounting groove (4).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910020113.0A CN109819085B (en) | 2019-01-09 | 2019-01-09 | Mobile phone shell with automatic human health index recognition function |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910020113.0A CN109819085B (en) | 2019-01-09 | 2019-01-09 | Mobile phone shell with automatic human health index recognition function |
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| CN109819085B true CN109819085B (en) | 2020-12-08 |
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| CN113395379B (en) * | 2021-07-15 | 2023-03-10 | 深圳鑫宏力精密工业有限公司 | Mobile phone shell with automatic human health index recognition function |
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| CN205596167U (en) * | 2016-04-06 | 2016-09-21 | 宋富标 | Interchangeable formula cell -phone protective housing |
| CN107026927A (en) * | 2017-05-24 | 2017-08-08 | 王金锁 | One kind can monitor health mobile phone shell |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US8832323B2 (en) * | 2011-07-06 | 2014-09-09 | Koamtac, Inc. | Connectivity sled for electronic pairing and physical cooperation between a mobile device and associated peripheral devices |
| CN206195892U (en) * | 2016-12-01 | 2017-05-24 | 蒋凌锋 | Shell type health detection input/output expanding unit |
| CN206302444U (en) * | 2016-12-28 | 2017-07-04 | 东莞市亚京五金制品有限公司 | High efficiency and heat radiation mobile phone shell |
| CN207218825U (en) * | 2017-09-19 | 2018-04-10 | 深圳市盛大林科技有限公司 | A kind of high efficiency and heat radiation composite phone housing |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205596167U (en) * | 2016-04-06 | 2016-09-21 | 宋富标 | Interchangeable formula cell -phone protective housing |
| CN107026927A (en) * | 2017-05-24 | 2017-08-08 | 王金锁 | One kind can monitor health mobile phone shell |
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