CN109817451B - Double-ceramic-chip coupling ceramic capacitor - Google Patents
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- CN109817451B CN109817451B CN201910275220.8A CN201910275220A CN109817451B CN 109817451 B CN109817451 B CN 109817451B CN 201910275220 A CN201910275220 A CN 201910275220A CN 109817451 B CN109817451 B CN 109817451B
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 31
- 230000008878 coupling Effects 0.000 title claims abstract description 23
- 238000010168 coupling process Methods 0.000 title claims abstract description 23
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 23
- 239000000919 ceramic Substances 0.000 claims abstract description 72
- 229910052709 silver Inorganic materials 0.000 claims abstract description 29
- 239000004332 silver Substances 0.000 claims abstract description 29
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 229910001369 Brass Inorganic materials 0.000 claims description 3
- 239000010951 brass Substances 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 abstract description 25
- 239000003822 epoxy resin Substances 0.000 abstract description 22
- 229920000647 polyepoxide Polymers 0.000 abstract description 22
- 238000003466 welding Methods 0.000 description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000004927 fusion Effects 0.000 description 8
- 238000005476 soldering Methods 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 239000012528 membrane Substances 0.000 description 5
- 238000001514 detection method Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 244000304337 Cuminum cyminum Species 0.000 description 1
- 235000007129 Cuminum cyminum Nutrition 0.000 description 1
- 244000082204 Phyllostachys viridis Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Abstract
The invention provides a coupling ceramic capacitor, which comprises two ceramic chips, silver film electrodes, an electrode connecting piece and electrode terminals, wherein the two ceramic chips are parallel to each other and are arranged in pairs, the silver film electrodes are coated on the upper surface and the lower surface of each ceramic chip, the electrode connecting piece is arranged between the two ceramic chips, and the electrode terminals are arranged on the outer sides of the two ceramic chips. The electrode connecting piece is a cylinder which is coaxially arranged with the ceramic chips and is used for electrically connecting the silver film electrodes of the two ceramic chips. The diameter of the cylinder is D, the diameter of the ceramic chip is D, wherein 2/3D is more than D and less than D. The electrode connecting piece of the coupling ceramic capacitor is of a large-diameter cylinder structure, and the problem of poor shrinkage stress of epoxy resin on the outer edges of the central connecting piece and the ceramic chip of the conventional capacitor is solved due to the large diameter of the cylinder.
Description
Technical Field
The invention relates to a coupling ceramic capacitor, in particular to a double-ceramic-chip coupling ceramic capacitor.
Background
The coupling ceramic capacitor is a device applied to high-voltage electrical equipment, and can provide a detection signal source for instruments such as a caller identification instrument, a capacitive voltage divider, a partial discharge sensor and the like. When the coupling ceramic capacitor is connected to a high-voltage conductor, it will be directly subjected to high voltage, with the risk of insulation breakdown. The instrument such as the electricity generation display instrument, the capacitive voltage divider, the partial discharge sensor and the like belongs to the accessory equipment of high-voltage electrical equipment. The user requires that the auxiliary equipment cannot affect the safe operation of the main equipment, so that the indexes of alternating current withstand voltage, partial discharge and the like of the coupling ceramic capacitor and a final product packaged by the coupling ceramic capacitor are required to be higher than those of the main equipment so as to ensure that the insulation is not broken down and ensure the normal operation of the system.
Fig. 1 is a single-chip coupled ceramic capacitor including chips as a medium, silver film electrodes plated on both end planes of the chips, and electrode terminals connected to both ends of the silver film electrodes. The tiles are the primary insulators for coupling the ceramic capacitors. In general, a single-chip coupled ceramic capacitor can meet the ac withstand voltage and partial discharge requirements required by the standards, but once the chip or the epoxy resin for encapsulation around the chip is broken down by overvoltage, the capacitor becomes a fault source, and a short-circuit accident is caused.
Two ceramic chips are connected in series, so that the electric resistance of the capacitor can be improved. Fig. 2 to 6 are schematic structural diagrams of a conventional double-ceramic-chip coupled ceramic capacitor. Specifically, the electrode connection mode of the double-ceramic-chip coupling ceramic capacitor includes: integral type, two ceramic sheets are directly welded (figure 2); a copper wire is welded between the two ceramic electrodes in a flexible connection mode (figure 3); barbell type (fig. 4); the shaded pole/copper column type-ceramic pieces are embedded in the shallow pits of the shaded pole type electrodes, and the shaded pole type electrodes of the two ceramic pieces are connected by a central copper column (figure 5); the shaded pole/cylinder-ceramic pieces are embedded in the shallow pits of the shaded pole, and the shaded pole electrodes of the two ceramic pieces are connected by the outer diameter (fig. 6).
The sensor is a product packaged by a capacitor. Specifically, the sensor is formed by fixing a capacitor and a high-frequency detection part at both ends of a hollow mold and then injecting a molten epoxy resin into the mold. The epoxy resin can shrink in the curing process, the thickness of the epoxy resin outside the electrode connecting piece (flexible connection type, barbell type, shaded pole/copper column type) is far thicker than that of the edge of the ceramic chip, the shrinkage is greatly different, and the stress difference can cause the epoxy resin at the edge of the ceramic chip to generate tiny cracks. The tile edges are areas where the lines of electric force are dense and sharp twists and cracks can cause partial discharges.
The high-low voltage electrode distance of the integrated capacitor is too close, the creepage distance of the high-low voltage two ends of the electric field outside the umbrella skirt of the sensor is also close, and flashover is easy to occur.
The soft connection type capacitor needs to fix the ceramic chips at two ends of a sensor die respectively, and for a sensor with limited height and diameter, a high-frequency detection unit needs to be fixed at the bottom of the die, so that the ceramic chips cannot be fixed at the bottom; meanwhile, the difference between the shrinkage stress of the copper wire and the epoxy resin at the edge of the ceramic chip is the largest, so that partial discharge is easy to occur.
The difference between the shrinkage stress of the epoxy resin at the central copper column of the barbell type capacitor and the shrinkage stress of the epoxy resin at the edge of the ceramic chip is large, and partial discharge is easy to occur.
The outer edge of the shaded pole electrode of the shaded pole/copper column type capacitor and the central copper column thereof are equipotential, and the epoxy resin shrinkage stress difference between the two parts is large, but partial discharge cannot be generated. The defects are that if the motor is out of service and the temperature of the environment where the sensor is located is reduced to-20 ℃ or below, the epoxy resin is partially torn by the linear expansion coefficient difference of the epoxy resin, the copper and the ceramic chip, and partial discharge is generated when the motor is electrified.
The connection part (straight cylinder) of the shaded pole/straight cylinder type capacitor can be a solid body, and can also be partially hollow and connected by a screw. The problem that epoxy is too thick around no flexible coupling formula, barbell formula and cover utmost point/copper column formula connecting piece of cover utmost point/straight barrel condenser, still solved the problem of ceramic chip fringe electric field distortion, but welding area is big, straight section of thick bamboo blocks when welding plus high temperature and evenly transmits whole face of weld (has the inhomogeneous problem of high temperature transmission), leads to some position soldering tin and silver membrane to fuse the degree too high, and some position is low excessively, drops easily between ceramic chip and the electrode.
Therefore, a coupling ceramic capacitor with a novel structure is needed to solve the problems of large shrinkage stress difference of epoxy resin on the outer edges of the central connecting piece and the ceramic chip, partial discharge on the edge of the ceramic chip and uneven external high-temperature transmission during welding, and improve the electrical resistance and weather resistance of the coupling ceramic capacitor.
Disclosure of Invention
In order to solve the technical problem, the invention provides a coupling ceramic capacitor, which comprises two ceramic tiles which are parallel to each other and are arranged in pairs, silver film electrodes coated on the upper and lower surfaces of the ceramic tiles, an electrode connecting piece arranged between the two ceramic tiles and electrode terminals arranged on the outer sides of the two ceramic tiles; the electrode connecting piece is a cylinder which is coaxially arranged with the ceramic pieces and is used for electrically connecting the silver membrane electrodes of the two ceramic pieces, the diameter of the cylinder is D, the diameter of the ceramic pieces is D, and 2/3D is more than D and less than D.
Preferably, the distance L from the outer wall of the cylinder to the outer edges of the tiles is 2mm to 4mm, more preferably 3 mm.
Preferably, the cylinder is made of brass. Of course, the material of the cylinder may be other conductive materials.
Preferably, the wall thickness D2 of the cylinder is 1mm to 3 mm. More preferably, the wall thickness D2 of the cylinder is 2 mm. Under the condition, the cylinder wall is thin, the welding position is completely exposed outside, the cylinder wall is uniformly heated when being welded in the temperature regulating box, the welding quality is better than other connection modes, and the qualification rate is obviously improved.
Preferably, the outer side of the end face of the cylinder is formed with a fillet or a chamfer of 45 °.
Preferably, the radius R of the fillet or 45 ° chamfer is 0.5mm to 1.5 mm. More preferably, the radius R of the fillet or 45 ° chamfer is 1 mm. In this case, the cylinder can contact with the silver film electrode on the ceramic chip by a ring with the end face width of 1mm, thereby reducing the welding area and easily controlling the tin-silver fusion degree.
Preferably, the side wall of the cylinder is formed with a plurality of uniformly arranged holes. The opening of the cylinder wall can avoid the crack of the welding line between the cylinder and the ceramic chip, and the vacuum pouring process can be used for encapsulating the epoxy resin. And even if the epoxy resin can not completely fill the space in the cylinder to generate bubbles or cavities, the partial discharge can not occur because of the equipotential in the cylinder. The cylinder can be selected to be a closed cylinder or a perforated transparent cylinder according to the requirements of the installation mode (landing, hanging and cantilever) of the partial discharge sensor on the weight, the shearing force and the vibration of the sensor and the mastery degree of two epoxy resin encapsulation processes.
Preferably, the shape of the hole is one of a triangle, a square, a diamond, a polygon, an ellipse, and a circle. The pore diameter, position and density of the opening need to avoid generating bubbles or cavities when the epoxy is encapsulated, and leave a gap layer when the epoxy liquid level rises to the upper end of the cylinder, so as to avoid the penetration of macropores.
Preferably, the axes of the holes at the two sides are not coincident, and the holes at the upper end and the lower end are tangent to the end face.
Preferably, the cylinder is soldered to the silver film electrode using M-T20 solder paste.
In addition, an annular groove is formed on the side wall of the ceramic chip. The groove is used for increasing the creepage distance from the silver film on the upper surface of the ceramic chip to the silver film on the lower surface of the ceramic chip. Under the condition that other parameters are equal, the larger the creepage distance is, the higher the partial discharge and voltage resistance indexes are.
The double-ceramic-chip coupling ceramic capacitor can be applied to a partial discharge sensor with the voltage level of 10 kV. Three effects are achieved: firstly, the breakthrough in safety is made. The single-piece ceramic is changed into the double-piece ceramic, once breakdown failure occurs to any one piece of ceramic, the safe and stable operation of the main equipment cannot be influenced, and the n-1 safety criterion for cumin in the power industry is realized. And secondly, the electrical resistance of the sensor is improved. And thirdly, the weather resistance of the sensor is improved. For example, the temperature in winter in northeast and northwest areas in China can be reduced to-30 ℃, and the partial discharge sensor packaged by the capacitor can tolerate high and low temperature circulation of-30 ℃ to +85 ℃, so that the partial discharge sensor is suitable for the severe environment of low temperature when the motor is shut down in winter and temperature rise when the motor is operated in summer.
Drawings
The invention will be described in more detail hereinafter on the basis of embodiments and with reference to the accompanying drawings. Wherein:
FIG. 1 is a schematic diagram of a prior art single-tile capacitor;
FIG. 2 is a schematic diagram of a prior art integrated capacitor;
FIG. 3 is a schematic diagram of a prior art soft-connect capacitor;
FIG. 4 is a schematic diagram of a prior art barbell-type connecting capacitor;
FIG. 5 is a schematic diagram of a prior art shaded pole/copper pillar connected capacitor;
FIG. 6 is a schematic diagram of a prior art shaded-pole/straight-barrel connected capacitor;
FIG. 7 is a schematic structural diagram of a large-diameter closed-tube capacitor according to the present invention;
FIG. 8 is a schematic structural view of a large-diameter through-can capacitor of the present invention;
fig. 9 is a perspective exploded view of the large-diameter cylindrical connection capacitor of the present invention.
In the drawings, like parts are provided with like reference numerals. The drawings are not to scale. Description of reference numerals: 100-ceramic tile; 101-a groove; 200-silver film electrode; 300-an electrode connection; 301-hole; 400-electrode terminals; r-chamfering the end of the cylinder; d1-weld width between cylinder and tile; d2-wall thickness of cylinder; l-the distance from the outer wall of the cylinder to the outer edge of the ceramic chip; d-the diameter of the cylinder; d-the diameter of the tile.
Detailed Description
The invention will be further explained with reference to the drawings.
As shown in fig. 7 and 9, the present invention provides a dual ceramic chip-coupled ceramic capacitor including two ceramic chips 100 arranged in parallel and in pairs, silver film electrodes 200 coated on the upper and lower surfaces of the ceramic chips 100, electrode connecting members 300 disposed between the two ceramic chips 100, and electrode terminals 400 disposed at the outer sides of the two ceramic chips 100. The electrode connector 300 is a cylinder disposed coaxially with the tiles 100 and used to electrically connect the silver electrodes 200 of the two tiles 100, the cylinder having a diameter D and the tiles 100 having a diameter D, wherein 2/3D < D < D. Under the condition, the electrode connecting piece is of a large-diameter cylinder type structure and is only provided with one silver film type electrode, so that the problem that the ceramic chip and the shaded pole type copper electrode are easy to fall off is solved. Meanwhile, the diameter of the cylinder is larger, so that the problem of poor shrinkage stress of epoxy resin on the outer edges of the central connecting piece and the ceramic chip is solved.
The distance L between the outer wall of the cylinder and the outer edge of the ceramic sheet is 2mm-4 mm. Therefore, certain encapsulation positions are reserved on the cylinder wall and the edge of the ceramic chip, and the problems of epoxy resin shrinkage, partial discharge and high-low temperature circulation can be solved after encapsulation is successful.
In one embodiment of the invention, shown in FIG. 7, the wall thickness D2 of the cylinder is 2mm and the cylinder height is determined by the sensor height minus the insert height. The radius of the outer wall of the cylinder is smaller than that of the ceramic chip by 3mm, namely L is 3 mm. The outside of the end surface (cylinder mouth) of the cylinder is turned into a fillet with the R being 1mm or a chamfer angle of 45 degrees, and the height is 1 mm. The cylinder was contacted with the silver film electrode on the tile by a ring having an end face width D1 of 1 mm.
As shown in figure 8, the wall of the cylinder is provided with a round hole 301 with the size of phi 5 mm-phi 7mm, the center distance of the holes is 2-2.5 times of the diameter of the round hole, the axes of the two side holes of the cylinder are prevented from overlapping, and the holes at the upper end and the lower end are tangent to the end face. The two tiles are identical. The tile is 50mm in size and 10mm in thickness, and an annular groove 101 is formed in the side wall of the tile.
The following is a brief description of the design process and principle of the dual ceramic chip coupled ceramic capacitor of the present invention.
The single-piece ceramic is changed into double-piece ceramic, and n-1 safety criterion is applied. The monolithic ceramic is changed into double sheets, and the principle that the dielectric thickness is not changed, the compressive strength is increased in the same ratio is applied. The two planes of the ceramic chip are plated with silver films with the thickness of tens of microns as electrodes. The electrode connector made of brass adopts special solder paste, such as M-T20 welded on a silver film electrode, wherein the component of M-T20 is Sn63Pb37. Since the fusion degree between the soldering tin and the silver film electrode is related to the welding quality, the soldering tin and the silver film electrode with low fusion degree are easy to separate, the silver film electrode with high fusion degree is easy to separate from the ceramic chip, so the welding temperature and duration need to be accurately grasped, and in a preferred embodiment, the welding process is as follows: the temperature is raised to 190 ℃ at the temperature raising speed of 5 ℃/min, the temperature is preserved for 10min, and then the temperature is raised continuously at the temperature raising speed of 5 ℃/min. In the second stage of heating process, the melting degree of the soldering paste in the welding line is observed through the observation window, so that the heating peak can be flexibly mastered, but the highest temperature is not more than 210 ℃. When the soldering paste is completely melted, quickly closing the heating switch, starting air blowing, and quickly reducing the temperature of the oven to 185 ℃; then slowly and naturally cooling to below 60 ℃.
The relation between the welding area of the electrode connecting piece and the welding strength. Generally, the larger the weld area, the higher the weld strength. The electrode is thick, area of contact is big, and temperature distribution is inhomogeneous everywhere, and the degree of fusion of soldering tin and silver membrane electrode is either low or too high, and the degree of fusion is too low then the soldering tin layer breaks away from with the silver membrane electrode easily, and the degree of fusion is too high then the silver membrane electrode breaks away from with the pottery piece easily. Repeated tests prove that: the connecting cylinder contacts the silver film of the ceramic chip by a circular ring with the end face width of 1mm, so that the welding area is reduced, and the tin-silver fusion degree is easy to control.
The relation of the bonding area to the resistance. According to the circular area formula, the shaded-pole welding area is as follows:
in a similar way, the welding area of the cylinder type connection is as follows:
in the above two formulas:
d: the diameter of the shaded pole type welding surface. 50(mm)
d2: the diameter of the outer circle of the welding surface of the connecting cylinder. 42(mm)
d1: the diameter of the inner circle of the welding surface of the connecting cylinder. 40(mm)
Can be substituted in the formula:
shaded-pole welding area Sz＝1962.50(mm2)≈1.96×10-3(m2)
Welding area S is connected to barrelt＝128.74(mm2)≈1.29×10-4(m2)
Ratio of area of shaded pole type to area of cylindrical type welding:
the shaded pole weld area is about 15 times larger than the can. According to the linear inverse law of the conductive area and the resistance, the cylindrical connection is smaller than the shaded pole type welding area by a factor, and the crater resistance is increased by a factor. The decrease in conductivity is not preferable if the use is affected. However, this law, which applies to dc circuits and low frequency ac circuits, does not apply to the coupling capacitor of the partial discharge sensor.
The coupling capacitor for the partial discharge sensor is designed as a high-pass filter, and the impedance formula of the high-frequency pulse flowing through the coupling capacitor is as follows:
note: the inductance of the coupling capacitor is negligible
In the formula:
z: complex impedance, referred to as impedance. (omega)
R: real part of complex impedance, resistance. (omega)
j: sign of imaginary part of complex impedance
Xe: and (4) capacitive reactance. (omega)
ρ: electrical resistivity. The resistivity of the solder is about 0.1 (omega. m)
L: the thickness of the solder layer. About 0.1(mm)
S: and (4) welding area. Shaded pole type 1.96X 10-3(m2) 1.29X 10 cylinder-4(m2)
f: the frequency of the partial discharge pulses. Take 10 MHz.
C: a capacitance value. Take 300 pF.
The following can be obtained:
shaded-pole electrode craters: zz＝5.1×10-3+53.08j(Ω)
The welded junction is connected to the cylinder: zt＝7.77×10-2+53.08j(Ω)
Comparing the real parts of the above impedance values, it is found that the barrel crater resistance is about 15 times greater than the shaded pole, but the impedance value increases very little:
the calculation shows that: the barrel bond crater impedance value is only increased by a negligible amount, about one part per million, over the shaded pole. Therefore, the conductivity is not greatly reduced, the use is not influenced, and the barrel type connection is possible.
The relationship of the electrode connector and the epoxy resin potting process. Ceramic coupling capacitors are typically potted with epoxy using a vacuum process. After the ceramic chips are welded at the two ends of the connecting cylinder, air is sealed in the cylinder, and when the epoxy resin is filled and the vacuum is pumped, the welding seam can crack. In order to avoid the crack of the welding seam, a pressure pouring process needs to be used instead. In addition, the opening of the cylinder wall can avoid the crack of the welding line between the cylinder and the ceramic chip, and the vacuum pouring process can be used for encapsulating the epoxy resin. And even if the epoxy can not completely fill the space in the cylinder to generate bubbles or cavities, the partial discharge can not occur because of the equipotential in the cylinder. The closed cylinder or the transparent cylinder can be selected according to the requirements of the installation mode (landing, hanging and cantilever) of the partial discharge sensor on the weight, the shearing force and the vibration of the sensor and the mastery degree of two epoxy resin encapsulation processes.
While the invention has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the technical features mentioned in the embodiments can be combined in any way as long as there is no structural conflict. It is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (10)
1. A coupling ceramic capacitor comprises two ceramic chips which are parallel to each other and are arranged in pairs, silver film electrodes coated on the upper and lower surfaces of the ceramic chips, an electrode connecting piece arranged between the two ceramic chips and electrode terminals arranged on the outer sides of the two ceramic chips; the electrode connecting piece is a cylinder which is coaxially arranged with the ceramic chips and is used for electrically connecting the silver film electrodes of the two ceramic chips, the diameter of the cylinder is D, the diameter of the ceramic chip is D, and 2/3D is more than D and less than D.
2. The coupled ceramic capacitor of claim 1 wherein the distance L from the outer wall of the cylinder to the outer edge of the ceramic tile is 2mm to 4 mm.
3. The coupled ceramic capacitor of claim 1 wherein the cylinder is brass.
4. The coupled ceramic capacitor of claim 1 wherein the wall thickness D2 of the cylinder is 1mm-3 mm.
5. The coupled ceramic capacitor according to claim 4, wherein the end face of the cylinder is formed with a round corner or a chamfer of 45 ° at the outside.
6. The coupled ceramic capacitor of claim 5 wherein the radius R of the fillet or 45 ° chamfer is 0.5mm-1.5 mm.
7. The coupled ceramic capacitor according to any one of claims 1-6, wherein the cylinder has a plurality of uniformly arranged holes formed in a sidewall thereof.
8. The coupled ceramic capacitor of claim 7 wherein the shape of the hole is one of triangular, square, diamond, polygonal, elliptical, and circular.
9. The coupled ceramic capacitor of claim 8 wherein the axes of the holes on both sides are not coincident, the holes on both upper and lower ends being tangent to the end face.
10. The coupled ceramic capacitor of claim 1 wherein the cylinder is soldered to the silver film electrode using M-T20 solder paste.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202050180U (en) * | 2011-04-28 | 2011-11-23 | 大连丰和电力科技有限公司 | Anti-cracking high-voltage contact box |
| CN102592828A (en) * | 2011-01-11 | 2012-07-18 | 禾伸堂企业股份有限公司 | Ceramic capacitor structure |
| CN107123547A (en) * | 2017-05-25 | 2017-09-01 | 上海方能自动化系统科技有限公司 | Coupling ceramic capacitor with combination electrode |
| CN108155015A (en) * | 2018-01-23 | 2018-06-12 | 北京智罗盘智能电气有限公司 | A kind of NPO high voltage ceramic capacitors with dual redundant, small tolerance |
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- 2019-04-08 CN CN201910275220.8A patent/CN109817451B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102592828A (en) * | 2011-01-11 | 2012-07-18 | 禾伸堂企业股份有限公司 | Ceramic capacitor structure |
| CN202050180U (en) * | 2011-04-28 | 2011-11-23 | 大连丰和电力科技有限公司 | Anti-cracking high-voltage contact box |
| CN107123547A (en) * | 2017-05-25 | 2017-09-01 | 上海方能自动化系统科技有限公司 | Coupling ceramic capacitor with combination electrode |
| CN108155015A (en) * | 2018-01-23 | 2018-06-12 | 北京智罗盘智能电气有限公司 | A kind of NPO high voltage ceramic capacitors with dual redundant, small tolerance |
Non-Patent Citations (1)
| Title |
|---|
| DCF型交流圆片瓷介电容器;章士瀛等;《电子元件与材料》;19981231;第1-4页 * |
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Inventor after: Ding Zhen Inventor after: Xing Meng Inventor after: Chen Zhangsheng Inventor after: Wu Minqing Inventor before: Ding Zhen Inventor before: Chen Zhangsheng Inventor before: Wu Minqing |
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Effective date of registration: 20240402 Address after: Room 101, Building 47, No. 2103 Pingliang Road, Yangpu District, Shanghai, 200090 Patentee after: Shanghai Fangneng Power Engineering Equipment Co.,Ltd. Country or region after: China Address before: 200232, Room 143, Building 27, No. 2577 Longhua Road, Xuhui District, Shanghai Patentee before: SHANGHAI FANGNENG AUTOMATION SYSTEM TECHNOLOGY Co.,Ltd. Country or region before: China |