CN109810895A - Open three dimensional cell cultivation chip and its technology of preparing based on contour microtrabeculae - Google Patents

Open three dimensional cell cultivation chip and its technology of preparing based on contour microtrabeculae Download PDF

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Publication number
CN109810895A
CN109810895A CN201910147892.0A CN201910147892A CN109810895A CN 109810895 A CN109810895 A CN 109810895A CN 201910147892 A CN201910147892 A CN 201910147892A CN 109810895 A CN109810895 A CN 109810895A
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template
micro
chip
pdms
contour
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CN109810895B (en
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叶芳
梁浩彬
撒成花
闫志强
王健
谢丽
常洪龙
苑伟政
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Northwestern Polytechnical University
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Northwestern Polytechnical University
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Abstract

The invention discloses a kind of chip that can be used for Three-dimensional cell culture and its technologies of preparing.The chip is mainly made of contour micro-pillar array 2 and recess 4, and the top end face of contour micro-pillar array 2 forms recess 4.The chip is prepared using MEMS (Micro-Electro-Mechanical System) technology and duplicating molded technology.Beneficial effects of the present invention: 1) three-dimensional structure that chip includes can provide the three dimensional growth condition of functionalization for cell, simultaneously because the presence of contour micro-pillar array 2, which can sticking and sprawling and provide hardness uniform substrate for cell;2) three-dimensional structure that chip is included is a kind of open three-dimensional structure, compatible with common micro-observation technology;3) using high hardness material as template substrate 6 when prepared by chip, the problem of flexible material is easily damaged is overcome;4) pit is prepared on template substrate through isotropism micro-processing technology, process controllability is high;4) prepare micro-pillar array through inductively coupled plasma precursor reactant (ICP), microtrabeculae height is easy to control, avoid microtrabeculae depth-to-width ratio it is excessive when the defects of lodging.

Description

Open three dimensional cell cultivation chip and its technology of preparing based on contour microtrabeculae
Technical field
The present invention relates to a kind of cell cultivation chip and technology of preparing with open three dimensional structure.
Background technique
Traditional cell culture technology can only provide a flat two-dimensional surface and sprawl and grow for cell, but this two Dimension table face greatly differs from each other with the growing environment of cell in vivo, cause cell form and in terms of change, such as: Osteoblast is in vivo without proliferative capacity, but if osteoblast is separated, using conventional two-dimensional method culture, then has and increases Grow ability.
In view of limitation existing for above-mentioned two-dimentional cell culture technology, there has been proposed Three-dimensional cell culture technologies: utilizing The biologic bracket material of three-dimensional structure cultivates cell, enables cell in three-dimensional space growth, proliferation and migration, constitutes three-dimensional Cell-ECM or cell-vector compound.Compared with two dimension culture, dimensional culture can make iuntercellular have certain space Spread pattern, the interaction between cell and timbering material are more nearly the true environment that cell is grown in vivo.
The research of majority Three-dimensional cell culture all uses class in the enclosed construction of " jujube cake " at present, is then implanted into cell Inside configuration, it is expected that simulating cell in body microenvironment.However this enclosed construction cannot be compatible with conventional microscopic observation Technology.Then the Three-dimensional cell culture chip with Open architecture comes into being, and [Zhang Ying, Fang Ye, Wang Jianguo have variable The cell cultivation chip of surface shape: CN 2011.].The open three dimensional structure of this chip can be compatible with conventional aobvious Microtechnology is disadvantageous in that: 1) chip is made of not contour microtrabeculae, the microtrabeculae height that will lead to three-dimensional structure edge is higher, Rigidity is lower, and enough supports can not be provided for cell, is unfavorable for sticking and sprawling for cell;2) three-dimensional structure in chip is adopted It is prepared with photoresist reflux technique, this method is led to poor controllability by the factors coupling influence such as temperature, material surface tension, is unfavorable for Prepare the good three-dimensional structure of consistency;3) microtrabeculae of the chip standby on photoresist, the microtrabeculae height that directly passes through optical graving With line width by photoresist and the coupling influence of gluing photoetching process, cannot control well, and prepare chip every time all and need through Photoetching process is gone through, this all brings biggish negative effect to the complexity and differences between batches of technique;4) although plating can be passed through Technique obtains the template for large scale preparation, but the template is made of flexible material, and rear micro-column structure is used for multiple times and is easy damage It is bad;
Summary of the invention:
Inhomogenous, the preparation method for surface hardness existing for the existing Three-dimensional cell culture chip based on Open architecture The problems such as complicated and poor controllability, the invention proposes a kind of open three dimensional cell cultivation chip based on contour microtrabeculae and its Technology of preparing.
Three-dimensional cell culture chip is made of the biocompatible materials of moulded by casting, such as material is poly dimethyl silicon Oxygen alkane (PDMS), chip include substrate 1, contour micro-pillar array 2, the recess 4 in micro- hole 3 and the formation of 2 upper surface of contour micro-pillar array. Recess 4 is semielliptical shape, and for realizing Three-dimensional cell culture, the major diameter R and depth r of semielliptical should be suitable at one In range, so as to the variation of cells perception to surface shape, in the present invention, major diameter R should in the range of 20-200 μm, Depth r should be in the range of 5-50 μm;The arrangement in micro- hole 3 can be in regular quadrangle, regular hexagon or circumferential arrangement, to reduce The area in region 5, enters cell in recess 4 as much as possible, cell is promoted to grow in three-dimensional environment between each micro- hole 3.Fig. 1 In show the recess 4 of multiple and different parameters, but in practical preparation in a single cell cultivation chip, be recessed 4 length Shaft diameter R and depth r should numerical value having the same.There are multiple micro- holes 3 on 1 surface of substrate, this cheats 3 and 4 complete phases of recess slightly Together, it repeats no more.In Fig. 2 for convenience of description, region 5 and recess 4 between each micro- hole 3 shade of gray processing has been subjected to, simultaneously It is not present in actual chips.
The upper surface of contour micro-pillar array 2 forms recess 4, micro post diameter L between 1-10 μm, height H 1-50 μm it Between, the height H of each microtrabeculae is identical, and to provide for cell growth, a hardness is uniform, is suitable for sticking the substrate sprawled.Phase The distance d of adjacent microtrabeculae so as to cell culture fluid entrance, while should be unlikely to that cell is made to fall into microtrabeculae gap between 1-10 μm It is interior.Microtrabeculae height H should be in the range of 1-50 μm, to prevent microtrabeculae height H is excessively high from leading to malformation or microtrabeculae height H mistake It is low to cannot achieve Three-dimensional cell culture.
The present invention prepares above-mentioned cell cultivation chip template using MEMS technology, then using duplicating molded technology system twice Standby cell cultivation chip.Specific step is as follows for template preparation:
Step 1: the first exposure mask 7 for being used to prepare the micro- hole 9 of template is formed on template substrate 6 by photoetching process.
Step 2: under the auxiliary of the first exposure mask 7, the micro- hole of template is prepared on template substrate 6 using wet etching technique 9。
Step 3: it is formed on the template substrate 6 in hole 9 micro- comprising template by photoetching process and is used to prepare template microtrabeculae battle array Second exposure mask 10 of column 11.
Step 4: under the auxiliary of the second exposure mask 10, using inductively coupled plasma etching technology (ICP) by the micro- hole of template 9 are transferred to 11 surface of template micro-pillar array, form template recess 12.
After obtaining template, PDMS Three-dimensional cell culture chip can be prepared in batches by duplicating molded technology, every time only It need to carry out replica.Specific step is as follows for duplicating molded technology twice:
Step 1: PDMS prepolymer and crosslinking agent are mixed in accordance with the appropriate ratio, are put into vacuum drying after mixing evenly It is deaerated in case until the bubble generated in whipping process excludes completely.
Step 2: PDMS prepolymer is cast on template substrate 6, is heated after standing a period of time, keeps PDMS pre- Polymers crosslinks reaction and solidifies.After PDMS is cooling, removing obtains PDMS template 13, PDMS template from template substrate 6 13 have and the antipodal structure of template substrate 6.
Step 3: PDMS prepolymer is cast in PDMS template 13, is heated after standing a period of time, makes PDMS Prepolymer crosslinks reaction and solidifies.After PDMS is cooling, removing obtains PDMS tri- of the present invention from PDMS template 13 Cell cultivation chip is tieed up, chip has and the identical structure of template substrate 6.
The beneficial effects of the present invention are:
Open three dimensional structure proposed by the present invention is compatible with conventional micro-observation technology;In the present invention three-dimensional structure by etc. High micro-pillar array 2 forms, and microtrabeculae rigidity is uniform and convenient for control, can advantageously promote cell adhesion and sprawl.
The present invention overcomes the problem of flexible material is easily damaged using the material of high rigidity as template substrate, high-volume Template will not be damaged when preparing chip;Dimple structure is prepared using wet etching technique, processing step is simple and controllability is high, system Standby obtained dimple structure consistency is good;Micro-pillar array is prepared using ICP lithographic technique, the height and photoetching process of microtrabeculae without Close, microtrabeculae height be easy to control, avoid microtrabeculae depth-to-width ratio it is excessive when generate lodging and fracture the defects of.
Detailed description of the invention
Figures described below illustrates exemplary embodiment of the invention, but this is not the limit to the scope of the invention System, because the present invention allows other equally valid embodiments.Attached drawing is not necessarily proportional to material object, and for clarity With it is succinct, the scale of view of specific feature and attached drawing particularly may be amplified or be simplified signal.
Fig. 1 is the open three dimensional cell cultivation chip schematic diagram based on contour microtrabeculae.
Fig. 2 is the top view of Three-dimensional cell culture chip.
Fig. 3 is the sectional view of Three-dimensional cell culture chip.
Fig. 4 is to pass through the process schematic for being lithographically derived the micro- hole of template for the first time in embodiment during template construct.
Fig. 4 A, which is described, forms the process of the first exposure mask 7 on 6 surface of template substrate by photoetching.
Fig. 4 B is the result in template substrate 6 upper first time photoetching.
Fig. 4 C describes the result in the micro- hole 9 of wet etching technique preparation template.
Fig. 5 is the process schematic for passing through second of photoetching in embodiment during template construct.
Fig. 5 A, which is described, forms the process of the second exposure mask 10 on 6 surface of template substrate by photoetching.
Fig. 5 B is the result of second of photoetching on template substrate 6.
Fig. 5 C describes the result of ICP lithographic technique preparation micro-pillar array 11.
Fig. 6 is to prepare cell cultivation chip process schematic using duplicating molded technology twice in embodiment.
Fig. 6 A describes the process that PDMS prepolymer is cast in 6 surface of template substrate.
Fig. 6 B is the result in 6 upper PDMS prepolymer of template substrate.
Fig. 6 C is the PDMS template 13 stripped down from template substrate 6.
Fig. 6 D is the open three dimensional cell cultivation chip with contour microtrabeculae stripped down from PDMS template 13.
In attached drawing: 1- substrate, the high micro-pillar array such as 2-, the micro- hole 3-, 4- recess, 5- two dimension void area, 6- template substrate, The first exposure mask of 7-, 8- etching window, the micro- hole of 9- template, the second exposure mask of 10-, 11- template micro-pillar array, 12- template recess, 13- PDMS template
Specific embodiment
In order to which cell cultivation chip described in this patent is explained in more detail, cell training is described with an example below Support the manufacturing method of chip.
Chip in the present embodiment is for cultivating SD rat bone marrow mesenchymal stem cells (rBMSCs).
As shown in Figure 1 to Figure 3, Three-dimensional cell culture chip is made of PDMS material, includes substrate 1, contour micro-pillar array 2, the recess 4 that micro- hole 3 and micro-pillar array upper surface are formed.Micro post diameter L is 3 μm, and micro- hole 3 and 4 diameter R of recess are 20 μm, deep Spending r is 5 μm, and adjacent recessed distance D is 12 μm, and microtrabeculae spacing d is 4 μm.Recess 4 be in arranged in regular hexagon shape, i.e., it is any recess 4 with The centre distance of adjacent recessed 4 is same fixed value D, and the center of circle of the recess 4 of any row or column should be in adjacent row or column recess 4 On the perpendicular bisector of circle center line connecting.
As shown in Figures 4 to 6, this example prepares cell cultivation chip template using wet etching and ICP lithographic technique, with Cell cultivation chip is prepared using duplicating molded technology twice afterwards.
The step of preparing template is as follows:
Step 1: as illustrated in figures 4 a and 4b, photoresist is formed into 4 μ on 6 surface of template substrate by way of rotary coating The thin layer of m, subsequent photoresist form the first mask 7 comprising etching window 8 on 6 surface of template substrate by exposure and imaging; Template substrate 6 is the single-sided polishing silicon wafer of 500 μ m-thicks, and 8 diameter of etching window is 10 μm.
Step 2: as shown in Figure 4 C, the micro- hole 9 of template is obtained by wet etching (HNA solution) template substrate 6.
Step 3: as shown in Figure 5 A and 5B, photoresist is formed 4 μm on 6 surface of template substrate by way of spraying Thin layer, subsequent photoresist form the second exposure mask 10 on 6 surface of template substrate by exposure and imaging.
Step 4: the micro- hole 9 of template is transferred to by 11 surface of template micro-pillar array by ICP lithographic technique, it is recessed to form template Fall into 12.
It is as follows using the step of duplicating molded technology prepares cell cultivation chip twice:
Step 1: as shown in Figure 6 A and 6B, PDMS prepolymer and crosslinking agent is mixed according to the ratio of 10:1, stirred evenly It is put into vacuum oven and is deaerated until the bubble generated in whipping process is excluded completely afterwards.PDMS is then cast in template In substrate 6, standing heats 1h at 90 DEG C after five minutes, and PDMS prepolymer is made to crosslink reaction and solidify.It is cooling to PDMS Afterwards, removing obtains PDMS template 13 from template substrate 6, as shown in Figure 6 C.
Step 2: PDMS is cast in PDMS template 13, and standing heats 1h at 90 DEG C after five minutes, makes PDMS pre-polymerization Object crosslinks reaction and solidifies.After PDMS is cooling, removing obtains three-dimensional cell core of the present invention from PDMS template 13 Piece, as shown in Figure 6 D.

Claims (4)

1. the open three dimensional cell cultivation chip based on contour microtrabeculae, which is characterized in that by the bio-compatible of moulded by casting Property material be made, include substrate 1, contour micro-pillar array 2;There are multiple micro- holes 3 in the substrate 1, meanwhile, it is more in the substrate 1 The form in a micro- hole 3 is transferred to 2 upper surface of contour micro-pillar array and forms multiple recess 4;The recess 4 is semielliptical shape, For realizing Three-dimensional cell culture, the major diameter R of semielliptical is in the range of 20-200 μm, range of the depth r at 5-50 μm It is interior;The micro post diameter L of the contour micro-pillar array 2 is between 1-10 μm, and height H is between 1-50 μm, the distance d of adjacent microtrabeculae Between 1-10 μm.
2. as described in claim 1 based on the open three dimensional cell cultivation chip of contour microtrabeculae, which is characterized in that described micro- The arrangement in hole 3 is in regular quadrangle, regular hexagon or circumferential arrangement.
3. as described in claim 1 based on the open three dimensional cell cultivation chip of contour microtrabeculae, which is characterized in that described to open Putting formula Three-dimensional cell culture chip material is dimethyl silicone polymer (PDMS).
4. the preparation method of the open three dimensional cell cultivation chip based on contour microtrabeculae as described in one of claim 1 or 3, It is characterized in that, first cell cultivation chip template is prepared using MEMS technology when chip material is PDMS, then using twice Duplicating molded technology prepares cell cultivation chip, the specific steps are as follows:
Step 1: preparation template, including following sub-step:
Sub-step one: the first exposure mask 7 for being used to prepare the micro- hole 9 of template is formed on template substrate 6 by photoetching process;
Sub-step two: under the auxiliary of the first exposure mask 7, the micro- hole 9 of template is prepared on template substrate 6 using wet etching technique;
Sub-step three: it is formed on the template substrate 6 in hole 9 micro- comprising template by photoetching process and is used to prepare template micro-pillar array 11 the second exposure mask 10;
Sub-step four: under the auxiliary of the second exposure mask 10, using inductively coupled plasma etching technology (ICP) by template it is micro- hole 9 It is transferred to 11 surface of template micro-pillar array, forms template recess 12;
Step 2: cell cultivation chip, including following sub-step are prepared by duplicating molded technology twice:
Sub-step one: PDMS prepolymer and crosslinking agent are mixed, and are put into degassing in vacuum oven after mixing evenly until stirring The bubble generated in the process excludes completely;
Sub-step two: PDMS prepolymer is cast on template substrate 6, is heated after standing a period of time, makes PDMS pre-polymerization Object crosslinks reaction and solidifies;After PDMS is cooling, removing obtains PDMS template 13, PDMS template 13 from template substrate 6 With with the antipodal structure of template substrate 6;
Sub-step three: PDMS prepolymer is cast in PDMS template 13, is heated after standing a period of time, makes PDMS pre-polymerization Object crosslinks reaction and solidifies;After PDMS is cooling, it is three-dimensional thin to obtain PDMS of the present invention for removing from PDMS template 13 Born of the same parents cultivate chip, and chip has and the identical structure of template substrate 6.
CN201910147892.0A 2019-02-27 2019-02-27 Open type three-dimensional cell culture chip based on contour microcolumn and preparation technology thereof Expired - Fee Related CN109810895B (en)

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