CN109808185A - A kind of production method and flexible glue card using ultrasound production payment flexible glue card - Google Patents
A kind of production method and flexible glue card using ultrasound production payment flexible glue card Download PDFInfo
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- CN109808185A CN109808185A CN201711165563.6A CN201711165563A CN109808185A CN 109808185 A CN109808185 A CN 109808185A CN 201711165563 A CN201711165563 A CN 201711165563A CN 109808185 A CN109808185 A CN 109808185A
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- flexible glue
- ultrasound
- glue card
- lower die
- payment
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Abstract
The invention discloses a kind of production methods and flexible glue card using ultrasound production payment flexible glue card, are related to card technical field, and the production method on the mold of flexible glue card front and back sides the following steps are included: S1, according to design requirement carve corresponding pattern；S2, remain for accommodating the accommodation space of payment mould group installation in advance in the front of flexible glue card or reverse side；S3, it is reserved with the space that ultrasound melts bonding at the flexible glue card obverse and reverse place of combining, avoids ultrasound from melting in adhesion process and bonded position or only position；S4, using ultrasonic welding system by mold the upper die and lower die for being used to constitute flexible glue card and payment mould group by ultrasound melting connect；Since ultrasound melts its upper die and lower die contact surface for predominantly acting on soft rubber material using ultrasonic wave of bonding, localized hyperthermia is generated using the high-frequency vibration of ultrasonic wave, so that the upper die and lower die contact surface of soft rubber material melts rapidly, under certain pressure effect, the two is fused into an entirety.
Description
Technical field
The present invention relates to card technical fields, and in particular to it is a kind of using ultrasound production payment flexible glue card production method and
Flexible glue card.
Background technique
As card is using more and more extensive, it is changed into diversification from original normal smart cards access, payment function
Demand, such as the anisotropic card of lamination, individual character employee access card and student management card, the carrying of these cards and all inconveniences of swiping the card,
Have nothing in one feature, in order to the personalized questions such as solve to carry, swipe the card, has carry out a kind of flexible glue card out in the market, push away in the market
Flexible glue card out mainly includes two kinds of production technologies: a kind of production technology be by the way that mold is paid the injection molding of mould group together,
Existing major defect is that injection time is long, and the high temperature generated in injection moulding process can cause to seriously affect to module life；
Another production technology is to be placed in intermediate gaps position for mould group is paid by match plate pattern, then glued by Double-side brush glue
It is bonded into, existing major defect is since there are the payment module coil that diameter is 25mm -40mm, unlike material material in centre
It is larger that it is bonded difficulty between material, in using glue bonding and dry process, flexible glue card appearance is easy to cause to be affected, it is above-mentioned all
More reasons affect the large-scale development of flexible glue card.
Summary of the invention
In view of the deficiencies in the prior art, that the purpose of the present invention is to provide a kind of production qualities is reliable, appearance is beautiful
The production method using ultrasound production payment flexible glue card seen and can produced in batches.
To achieve the above object, The technical solution adopted by the invention is as follows:
A kind of production method using ultrasound production payment flexible glue card, which comprises the following steps:
S1, corresponding pattern is carved on the mold of flexible glue card front and back sides according to design requirement；
S2, remain for accommodating the accommodation space of payment mould group installation in advance in the front of flexible glue card or reverse side；
S3, it is reserved with the space that ultrasound melts bonding at the flexible glue card obverse and reverse place of combining, avoids ultrasound from melting viscous
Position or only position were bonded during closing；
S4, using ultrasonic welding system by mold the upper die and lower die for being used to constitute flexible glue card and payment mould group lead to
Ultrasound melting is crossed to connect.
Further, corresponding color pattern can be filled in pattern different zones according to design requirement in step sl, with
Just corresponding cartoon stereo pattern is formed.
Further, reserved its hollow out depth dimensions of accommodation space will be deeper than payment mould group thickness in step s 2,
It avoids damaging device in ultrasonic fusion processes.
Further, the flexible glue card single side thickness with payment mould group coil is greater than 3.5mm；Without the flexible glue card list of payment mould group
Face thickness is greater than 2mm.
Further, the reserved ultrasound that is used in the flexible glue card obverse and reverse place of combining melts the space bonded in step s3
The welding edge of 2mm-5mm is remained at ultrasonic welding thereon.
Further, the upper mold face of weld of flexible glue card is designed so as to triangle, the trapezoidal or semicircle that flexible glue material smoothly overflows
One of column cross section structure.
Further, the lower die of flexible glue card is designed to concave structure, outside the inner wall and flexible glue card upper mold of its convex portions of lower die
The spatial transition of 0.15mm is remained between wall is unilateral.
Simultaneously the present invention also provides it is a kind of using it is above-mentioned ultrasound production payment flexible glue card production method be made it is soft
Glue card comprising upper die and lower die and the payment mould group being arranged between the upper die and lower die, wherein the upper die and lower die
It is bonded together by ultrasonic welding, the outer surface of the upper die and lower die has also been separately formed depiction.
Further, the upper mold is additionally provided with the endface that lower die fits avoids bonding in ultrasound melting adhesion process
It crosses position or only the ultrasound of position melts bonding space.
Further, the lower die is designed as concave structure, wherein on the inner wall of its convex portions of lower die and flexible glue card
The spatial transition of 0.15mm is remained between mould outer wall is unilateral.
Compared with prior art, the advantageous effects that this programme has are as follows: this programme is by using ultrasonic welding system
It is connected come the upper die and lower die for realizing flexible glue card and the fixing assembling for paying mould group three, since ultrasound melts bonding, it is main
For the upper die and lower die contact surface for acting on soft rubber material using ultrasonic wave, local height is generated using the high-frequency vibration of ultrasonic wave
Temperature so that the upper die and lower die contact surface of soft rubber material melts rapidly, under certain pressure effect, the two be fused into one it is whole
Body.It can be seen that by using ultrasound melt technique not only can solve module existing for traditional handicraft it is easy to aging, layering and
Appearance problem rambunctious, but also can guarantee the mass production of flexible glue card.
Detailed description of the invention
Fig. 1 is a kind of flow chart of the production method using ultrasound production payment flexible glue card in the embodiment of the present invention.
Fig. 2 is the flexible glue card upper mold overlooking structure diagram in the embodiment of the present invention.
Fig. 3 is the flexible glue card upper mold schematic view of the front view in the embodiment of the present invention.
Fig. 4 is the flexible glue card lower die overlooking structure diagram in the embodiment of the present invention.
Fig. 5 is the flexible glue card lower die schematic view of the front view in the embodiment of the present invention.
Fig. 6 is a kind of attachment structure schematic diagram that upper die and lower die weld at fusion in the embodiment of the present invention.
Fig. 7 is another attachment structure schematic diagram that upper die and lower die weld at fusion in the embodiment of the present invention.
Fig. 8 is another attachment structure schematic diagram that upper die and lower die weld at fusion in the embodiment of the present invention.
Fig. 9 is another attachment structure schematic diagram that upper die and lower die weld at fusion in the embodiment of the present invention.
Figure 10 is flexible glue card cross section structure schematic diagram in the embodiment of the present invention.
Description of symbols in figure:
100- flexible glue card, 1- upper mold, 2- lower die, 3- pay mould group.
Specific embodiment
The present invention is described in further detail with specific embodiment with reference to the accompanying drawings of the specification.
The present invention be directed to existing flexible glues to be stuck in existing manufacture craft, and existing leads to card internal model because making high temperature
Block is easy to aging, have the defects that easily to be layered using glue technique for sticking and appearance is difficult to ensure, and proposes a kind of using ultrasonic
Melt make payment flexible glue card production method, by the production method may be effectively ensured card quality, appearance and
It is able to achieve the purpose of mass production.
Shown in referring to Fig.1, it illustrates the production sides using ultrasound production payment flexible glue card a kind of in the embodiment of the present invention
The flow chart of method, as seen from the figure, the production method the following steps are included:
S1, corresponding pattern is carved on the mold of flexible glue card front and back sides according to design requirement；
In the present embodiment when making the front and back sides of flexible glue card, need to carry out adaptable mold according to user demand to set
Meter, such as can be carved on mold according to market pattern more popular with consumers, character image and other fashion elements
Corresponding pattern buys interest to improve consumer, there is cartoon figure, animal pattern, famous buildings if common pattern
Etc. stereoscopic appearances.
In order to increase the aesthetics of card and rich, corresponding face can also be carried out according to layout in the present embodiment
Color collocation, such as can be according to pattern tone in the corresponding respectively suitable color of not pattern different zones filling, to reach rich and varied
Card three-dimensional pattern effect.
S2, remain for accommodating the accommodation space of payment mould group installation in advance in the front of flexible glue card or reverse side；The present embodiment
In due to also need to install between the obverse and reverse of flexible glue card payment mould group, production flexible glue card obverse and reverse
When will in view of payment mould group installation space.Coil size on flexible glue khaki is generally between 20-40CM, practical soft
During glue blocking is made, coil size can be flexibly determined according to the image on flexible glue card.In order to guarantee subsequent
Coil will not be damaged in manufacturing process, the flexible glue card single side thickness with payment mould group coil is greater than 3.5mm in the present embodiment；No
Flexible glue card single side thickness with payment mould group is greater than 2mm.Likewise, in order to which payment mould will not be damaged in subsequent fabrication process
Group, its depth of above-mentioned accommodation space need to be more than entire payment mould group height 0.5mm or more, i.e. the hollow out depth of accommodation space needs
To be more than coil thickness+thickness of detector+0.5mm or more, guarantee that entire payment mould group has certain activity space.Accommodation space needs
To match with payment mould group shape, to guarantee payment, mould group is convenient and efficient during the installation process.
S3, it is reserved with the space that ultrasound melts bonding at the flexible glue card obverse and reverse place of combining, avoids ultrasound from melting viscous
Position or only position were bonded during closing；
Since the obverse and reverse of flexible glue card needs to weld together by ultrasonic welding system, in order to guarantee flexible glue card just
The effect in fusion process is being welded on anti-two sides, is melted in the present embodiment in the reserved ultrasound in the flexible glue card obverse and reverse place of combining
The space of bonding, avoiding melting in welding process is more than position or not in place, referring to shown in attached drawing 2 to 5, flexible glue in the present embodiment
The lower die of card is designed to concave structure, and mark mark at the A of upper mold and in Fig. 5 is flexible glue at the B of lower die in Fig. 3
The part that the welding fusion of card upper die and lower die contacts with each other.
Present solution provides several pattern handling schemes:
Referring to shown in attached drawing 6, a kind of attachment structure schematic diagram at fusion is welded for flexible glue card upper die and lower die.In the party
It can be seen that upper mold face of weld (end face combined with lower die) its cross sectional shape of flexible glue card is triangle, in order to protect in case
Card welding welding effect, is provided with melting edge at ultrasonic melting, i.e. the place W in Fig. 6, melting edge thickness W is preferably maintained at
Spatial transition is remained between 2mm -5mm, between the inner wall and flexible glue card 1 outer wall of upper mold of 2 its convex portions of lower die are unilateral, i.e.,
At a identified in Fig. 6, spatial transition a width dimensions are 0.15mm.In view of in actual welding fusion process 1 upper mold with
The fitting effect of lower die 2 is reserved with the melting for accommodating overflowed flexible glue material in fusion process between lower die 1 and lower die 2
Height H melts height H in actual set, needs to be configured according to flexible glue ingredient, heterogeneity is matched referring to shown in attached drawing 6
The flexible glue glassware shrinkage ratio of ratio is different, therefore corresponding melting height H is not also identical, and the general height H that melts is arranged in 0.2mm-
Between 0.8mm.
Referring to shown in attached drawing 7, a kind of connection structure signal at fusion is welded for another flexible glue card upper mold 1 and lower die 2
Figure.The program the difference is that only that the spatial transition a width dimensions that Fig. 7 is identified in this scenario are with scheme shown in Fig. 6
0.3mm。
Referring to shown in attached drawing 8, a kind of connection structure signal at fusion is welded for another flexible glue card upper mold 1 and lower die 2
Figure.Scheme shown in scheme shown in Fig. 8 and Fig. 6 the difference is that, its cross sectional shape of upper mold face of weld is in scheme shown in Fig. 8
Zigzag.
Referring to shown in attached drawing 9, a kind of connection structure signal at fusion is welded for another flexible glue card upper mold 1 and lower die 2
Figure.Scheme shown in scheme shown in Fig. 9 and Fig. 6 the difference is that, do not deposited between flexible glue card upper mold 1 and lower die 2 in Fig. 9 scheme
In spatial transition, the lateral surface of upper mold 1 and lower die 2 aligns, and directly fits both when welding is merged.
It should be noted that flexible glue card upper mold, during actual fabrication, the cross sectional shape of face of weld can be designed to
Triangle, trapezoidal, semi-cylindrical prismatic shapes.Therefore during actual welding, flexible glue melts first from triangular in shape, terraced
The upper die tip of shape or semi-cylindrical prismatic shapes starts, and is designed to the upper die structure of this kind of section form, convenient for welding
Flexible glue material is in fusion process convenient for overflowing when fitting (because upper die and lower die there is space therebetween), so guarantee upper mold and
Syncretizing effect between lower die is more preferable.
S4, using ultrasonic welding system by mold the upper die and lower die for being used to constitute flexible glue card and payment mould group lead to
Ultrasound melting is crossed to connect；
In the present embodiment in the welding fusion process to flexible glue card upper die and lower die and payment mould group, used ultrasound
Welding equipment is existing common ultrasonic welding system, is should be noted that in the welding process according to composition flexible glue
The adaptable ultrasonic frequency of the material composition difference selection of card, pressure, time, i.e., in flexible glue card welding fusion process, root
The working frequency, pressure value, time of ultrasonic welding system are adjusted, according to the specific component prescription of flexible glue card to guarantee welding
Make flexible glue card that there is suitable operating temperature, pressure, time in journey, guarantees that flexible glue card upper die and lower die faying face is heated
Melt and be pressurized and is bonded together.Ultrasonic frequency, pressure value, the selection of time can be looked into according to flexible glue card material ingredient is constituted
It looks for corresponding chemical technology handbook or is directly contacted with material manufacturer, to obtain suitable adjusting parameter value,
Just no longer excessive explanation herein.
The production method of corresponding above-mentioned flexible glue card, the present invention also provides a kind of flexible glues being made using the production method
Card 100, referring to shown in attached drawing 10, which includes upper mold 1, lower die 2 and the branch being arranged between upper mold 1 and lower die 2
Mould group 3 is paid, wherein upper mold 1 and lower die 2 are bonded together by ultrasonic welding, and the outer surface of upper mold 1 and lower die 2 is also separately formed
There is depiction.
For the purposes of guaranteeing the welding syncretizing effect between upper mold 1 and lower die 2, the endface that upper mold 1 and lower die 2 fit
It is additionally provided with and avoids bonding position or only the ultrasound melting bonding space of position in ultrasound melting adhesion process.Furthermore lower die 2 can
Decision design is concave structure, wherein the inner wall of 2 its convex portions of lower die and flexible glue card 1 outer wall of upper mold it is unilateral between can be according to need
Remain with the spatial transition of 0.15mm.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
Mind and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technology
Within, then the present invention is also intended to include these modifications and variations.
Claims (10)
1. a kind of production method using ultrasound production payment flexible glue card, which comprises the following steps:
S1, corresponding pattern is carved on the mold of flexible glue card front and back sides according to design requirement；
S2, remain for accommodating the accommodation space of payment mould group installation in advance in the front of flexible glue card or reverse side；
S3, it is reserved with the space that ultrasound melts bonding at the flexible glue card obverse and reverse place of combining, avoids ultrasound from melting and bonded
Position or only position were bonded in journey；
S4, by the upper die and lower die for being used to constitute flexible glue card in mold and mould group is paid by surpassing using ultrasonic welding system
Sound melting connects.
2. a kind of production method using ultrasound production payment flexible glue card according to claim 1, it is characterised in that: in step
Corresponding color pattern can be filled in pattern different zones according to design requirement in rapid S1, to form corresponding cartoon stereo
Pattern.
3. a kind of production method using ultrasound production payment flexible glue card according to claim 1 or 2, it is characterised in that:
Reserved its hollow out depth dimensions of accommodation space will be deeper than payment mould group thickness in step s 2, avoid melting in ultrasound
Device is damaged in journey.
4. a kind of production method using ultrasound production payment flexible glue card according to claim 3, it is characterised in that: band branch
The flexible glue card single side thickness for paying mould group coil is greater than 3.5mm；It is greater than 2mm without the flexible glue card single side thickness of payment mould group.
5. a kind of production method using ultrasound production payment flexible glue card according to claim 1, it is characterised in that: in step
What the flexible glue card obverse and reverse place of combining was reserved in rapid S3 melts the reservation at ultrasonic welding thereon of the space of bonding for ultrasound
There is the welding edge of 2mm-5mm.
6. a kind of production method using ultrasound production payment flexible glue card according to claim 5, it is characterised in that: flexible glue
The upper mold face of weld of card is designed so as to one of the triangle that flexible glue material smoothly overflows, trapezoidal or semi-cylindrical section knot
Structure.
7. a kind of production method using ultrasound production payment flexible glue card according to claim 1 or 6, it is characterised in that:
The lower die of flexible glue card is designed to concave structure, remains between the inner wall and flexible glue card upper mold outer wall of its convex portions of lower die are unilateral
The spatial transition of 0.15mm.
8. a kind of a kind of production method using ultrasound production payment flexible glue card according to claim 1 is made soft
Glue card, it is characterised in that: including upper die and lower die and the payment mould group being arranged between the upper die and lower die, wherein described
Upper die and lower die are bonded together by ultrasonic welding, and the outer surface of the upper die and lower die has also been separately formed depiction.
9. a kind of flexible glue card according to claim 8, it is characterised in that: the endface that the upper mold and lower die fit is also
It is provided with and avoids bonding position or only the ultrasound melting bonding space of position in ultrasound melting adhesion process.
10. a kind of flexible glue card according to claim 8 or claim 9, it is characterised in that: the lower die is designed as concave structure,
Described in lower die its convex portions inner wall and flexible glue card upper mold outer wall it is unilateral between remain with the spatial transition of 0.15mm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711165563.6A CN109808185A (en) | 2017-11-21 | 2017-11-21 | A kind of production method and flexible glue card using ultrasound production payment flexible glue card |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711165563.6A CN109808185A (en) | 2017-11-21 | 2017-11-21 | A kind of production method and flexible glue card using ultrasound production payment flexible glue card |
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| CN201711165563.6A Pending CN109808185A (en) | 2017-11-21 | 2017-11-21 | A kind of production method and flexible glue card using ultrasound production payment flexible glue card |
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| DE10216163A1 (en) * | 2002-04-11 | 2003-11-06 | Orga Kartensysteme Gmbh | Method for producing a chip card has a thermoplastic chip card body made up of two non-detachable parts and an electronic functional element implanted in it |
| JP2004223982A (en) * | 2003-01-27 | 2004-08-12 | Alps Electric Co Ltd | Ultrasonic welding method for electronic circuit unit |
| CN200983172Y (en) * | 2006-12-13 | 2007-11-28 | 以码科技股份有限公司 | Package structure of digital secure storage card |
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| CN102858119A (en) * | 2011-07-01 | 2013-01-02 | 莱尔德电子材料股份有限公司 | Ultrasonic wave welding line structure, welding method, product casing and electronic product |
| CN103229352A (en) * | 2010-12-07 | 2013-07-31 | 哈廷电子有限公司及两合公司 | Rfid transponder |
| US20130328182A1 (en) * | 2009-03-09 | 2013-12-12 | Samsung Electronics Co., Ltd. | Semiconductor memory device and method of fabricating the same |
| CN103886356A (en) * | 2014-04-14 | 2014-06-25 | 公安部第三研究所 | Method for automatically producing double-frequency active tag cards |
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2017
- 2017-11-21 CN CN201711165563.6A patent/CN109808185A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10216163A1 (en) * | 2002-04-11 | 2003-11-06 | Orga Kartensysteme Gmbh | Method for producing a chip card has a thermoplastic chip card body made up of two non-detachable parts and an electronic functional element implanted in it |
| JP2004223982A (en) * | 2003-01-27 | 2004-08-12 | Alps Electric Co Ltd | Ultrasonic welding method for electronic circuit unit |
| CN200983172Y (en) * | 2006-12-13 | 2007-11-28 | 以码科技股份有限公司 | Package structure of digital secure storage card |
| US20130328182A1 (en) * | 2009-03-09 | 2013-12-12 | Samsung Electronics Co., Ltd. | Semiconductor memory device and method of fabricating the same |
| CN101833685A (en) * | 2009-03-10 | 2010-09-15 | 日本压着端子制造株式会社 | Component joining structure, IC-card and connector |
| CN103229352A (en) * | 2010-12-07 | 2013-07-31 | 哈廷电子有限公司及两合公司 | Rfid transponder |
| CN102858119A (en) * | 2011-07-01 | 2013-01-02 | 莱尔德电子材料股份有限公司 | Ultrasonic wave welding line structure, welding method, product casing and electronic product |
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Application publication date: 20190528 |
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