CN109799673A - A kind of mask plate and preparation method thereof - Google Patents
A kind of mask plate and preparation method thereof Download PDFInfo
- Publication number
- CN109799673A CN109799673A CN201910009128.7A CN201910009128A CN109799673A CN 109799673 A CN109799673 A CN 109799673A CN 201910009128 A CN201910009128 A CN 201910009128A CN 109799673 A CN109799673 A CN 109799673A
- Authority
- CN
- China
- Prior art keywords
- mask plate
- open area
- plane
- film layer
- curved surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Optical Elements Other Than Lenses (AREA)
Abstract
This application discloses a kind of mask plates and preparation method thereof, to reduce the area for the gray area that exposure is formed.A kind of mask plate provided by the embodiments of the present application, including at least one opening region, the side of the open area are the inclined-plane for having setting angle with the mask plate upper surface；And the tangent line of first part and the angle of the upper surface at least on the inclined-plane are greater than 90 °, so as to pass through the component for reflecting in-plane where generation is parallel to the mask plate of the first part from the light of the upper surface incidence of the mask plate.
Description
Technical field
This application involves fields of communication technology more particularly to a kind of mask plate and preparation method thereof.
Background technique
The structure of liquid crystal display panel mainly includes thin film transistor (TFT) (TFT) array substrate (Array), colorized optical filtering at present
Piece or color membrane substrates (CF) and the liquid crystal layer (LC) configured between two substrates are constituted.Color membrane substrates include: black square
Battle array, color film, flatness layer and support column process, are to need to be exposed technique in addition to flatness layer.Current coloured silk film mainstream makes
It is proximity printing machine, needs using photomask board (Mask), is usually 100-400 microns between photomask board and substrate
(um) spacing (Gap).For forming color film, Mask structure used in the prior art is as shown in Figure 1, the open area Mask
1 side 2 is the plane perpendicular to Mask 3, in exposure technology ultraviolet light after through the open area Mask 1, it may occur that diffraction
Effect bypasses 1 edge of the open area Mask, and different degrees of curved scattered propagation occurs for light, because of the effect of diffraction, substrate 6 it
On 5 layers of photoresist be additionally present that light is curved to dissipate the region 4 that travels to, referred to as gray area, and the region area is larger.I.e. due to light
Diffraction so that the practical spot area for reaching film layer to be exposed through mask plate opening is bigger, the figure of finally formed coloured silk film
The size of the open area case (Pattern) size ratio Mask 1 is big, is unfavorable for the fining of Pattern, is unfavorable for realizing high pixel
Density (Pixels Per Inch, PPI).Also, as shown in Figure 1, on the other hand, the light of diffracted portion, actual energy is less than
Other regions, it is insufficient so as to cause the color film Pattern edge cure of formation, the angle (taper) is bored being formed, and due to shape
At gray area area it is larger, the angle at the angle taper is smaller, causes the film thickness homogeneity of the Pattern of color film poor, will affect product
Colour saturation, contrast.To sum up, the biggish gray area of area is formed in exposure technology using mask plate in the prior art, is led
The pattern dimension for the film layer that cause is formed is big, thicknesses of layers homogeneity is poor, is unfavorable for improving display product PPI, influences properties of product.
Summary of the invention
The embodiment of the present application provides a kind of mask plate and preparation method thereof, to reduce the face for the gray area that exposure is formed
Product.
A kind of mask plate provided by the embodiments of the present application, including at least one opening region, the side of the open area
To have the inclined-plane of setting angle with the mask plate upper surface；And at least the inclined-plane first part tangent line with it is described
The angle of upper surface is greater than 90 °, so as to produce from the light of the upper surface incidence of the mask plate by the reflection of the first part
The raw component for being parallel to mask plate place in-plane.
Mask plate provided by the embodiments of the present application, since the side of open area is to have to set with the mask plate upper surface
The inclined-plane at clamp angle, and there are the first parts that the angle of tangent line and the upper surface is greater than 90 ° on the inclined-plane, therefore from covering
The light of diaphragm plate upper surface incidence generates point for being parallel to mask plate place in-plane by the reflection of the first part
Amount, so that open region is reflexed to from the light of mask plate upper surface incidence by the first part, so that diffraction occurs
Part light open region is reflexed to by the first part, promote the aggregation of the practical light through mask plate open area,
The scattering of the light as caused by diffraction is reduced, reduces the gray area area as caused by diffraction, enhances the curing degree of pattern, compare
It can reduce the size of the final film pattern formed using mask plate in the prior art, so as to realize small size film layer figure
The fining structure of case, and then the PPI of display product can be improved.And since gray area area reduces, exposure energy is insufficient
Region reduces, and so as to improve the angle at the angle taper, promotes display properties of product.
Optionally, the side of the open area is curved surface.
Optionally, the first part on the inclined-plane is the of the curved surface protruded to the open area or the inclined-plane
A part is the curved surface to the open area indent.
Optionally, the inclined-plane further include: to be parallel to the horizontal plane of the upper surface as symmetry axis, with described first
Divide symmetrical second part；Or, the inclined-plane only includes the first part.
A kind of mask plate preparation method provided by the embodiments of the present application, this method comprises:
The film layer of the mask plate is formed on the substrate；
The film layer is handled using patterning process, forms at least one opening region, wherein the side of the open area
Face be with the mask plate upper surface have setting angle inclined-plane, and at least the inclined-plane first part tangent line and institute
The angle for stating upper surface is greater than 90 °, so as to pass through the reflection of the first part from the light of the upper surface incidence of the mask plate
Generate the component of in-plane where being parallel to the mask plate.
Mask plate preparation method provided by the embodiments of the present application, since the side of the open area of formation is and the mask
Plate upper surface has an inclined-plane of setting angle, and there are the angles of tangent line and the upper surface on the inclined-plane greater than 90 ° the
A part, therefore the mask plate institute is parallel to from the light of mask plate upper surface incidence by the reflection generation of the first part
In the component of in-plane, so that open region is reflexed to from the light of mask plate upper surface incidence by the first part, from
And the part light that diffraction occurs is made to reflex to open region by the first part, it is promoted practical through mask plate open area
Light aggregation, reduce the light as caused by diffraction scattering, reduce the gray area area as caused by diffraction, enhance pattern
Curing degree can reduce the size of the final film pattern formed using mask plate, compared with the prior art so as to reality
The fining structure of existing small size film pattern, and then the PPI of display product can be improved.And since gray area area reduces,
The insufficient region of exposure energy reduces, and so as to improve the angle at the angle taper, promotes display properties of product.In figure chemical industry
It is the open area with the mask plate upper surface with the inclined-plane of setting angle that side is formed in skill, and simple process is easy to real
It is existing, and can realize without increasing additional technique and the side of open area is modified.
Optionally, the film layer is handled using patterning process, forms at least one opening region, specifically includes:
Photoresist is coated in the film layer, and the photoresist is exposed, is developed, and forms the pattern of photoresist；
The corresponding film layer in region being exposed is handled using etching technics, the region for allowing to carry out exposure is corresponding
The etching degree of the film layer weakens with far from the photoresist, forms at least one opening region, the open area
Side is the curved surface protruded to the open area.
A kind of mask plate preparation method provided by the embodiments of the present application, this method comprises:
The film layer of the mask plate is formed on the substrate；
The film layer is handled using patterning process and forms the mask plate at least one opening region；
The inclined-plane that there is setting angle with the mask plate upper surface is formed in the side of the open area, and is at least existed
The tangent line of the first part on the inclined-plane and the angle of the upper surface are greater than 90 °, so as to enter from the upper surface of the mask plate
The light penetrated generates the component for being parallel to mask plate place in-plane by the reflection of the first part.
Mask plate preparation method provided by the embodiments of the present application, modifies the side of mask plate open area, is opening
The side in mouth region domain be with the mask plate upper surface have setting angle inclined-plane, and the inclined-plane there are tangent line with it is described
The angle of upper surface is greater than 90 ° of first part, therefore from the light of mask plate upper surface incidence by the anti-of the first part
Penetrate generate be parallel to the mask plate where in-plane component so that passing through described the from the light of mask plate upper surface incidence
A part reflexes to open region, so that the part light that diffraction occurs reflexes to open region by the first part, mentions
The aggregation for rising the practical light through mask plate open area reduces the scattering of the light as caused by diffraction, reduces due to diffraction
Caused gray area area, enhances the curing degree of pattern, can reduce utilize the final of mask plate formation compared with the prior art
So as to realize the fining structure of small size film pattern, and then display product can be improved in the size of film pattern
PPI.And since gray area area reduces, the insufficient region of exposure energy reduces, and so as to improve the angle at the angle taper, mentions
Rise display properties of product.Also, mask plate preparation method provided by the embodiments of the present application, can be according to actual needs to mask plate
The side of open area is modified, the side of the shape needed.
Optionally, the inclined-plane that there is setting angle with the mask plate upper surface is formed in the side of the open area,
It specifically includes:
The mask plate is removed from the substrate；
The mask plate is placed in the storage tank equipped with electrolyte solution；
Voltage is applied to the top and bottom of the side of the open area, in the side formation of the open area and institute
State the inclined-plane that mask plate upper surface has setting angle.
Optionally, voltage is applied to the top and bottom of the side of the open area, specifically included:
Positive voltage is applied to the top and bottom of the side of the open area, forms the song to the open area indent
Face；
Alternatively, applying opposite polarity voltage respectively to the top and bottom of the side of the open area, formed to institute
State the curved surface of open region protrusion.
Optionally, positive voltage is applied to the top and bottom of the side of the open area, specifically included: to the opening
The top and bottom of the side in region apply the positive voltage of same size, form the curved surface to the open area indent, described
Curved surface is to be parallel to the horizontal plane of the upper surface as symmetry axis.
Detailed description of the invention
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly introduced, it should be apparent that, the drawings in the following description are only some examples of the present application, for this
For the those of ordinary skill in field, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is the schematic diagram that patterned film layer is formed using prior art mask plate；
Fig. 2 is a kind of structural schematic diagram of mask plate provided by the embodiments of the present application；
Fig. 3 is the structural schematic diagram of another mask plate provided by the embodiments of the present application；
Fig. 4 is the structural schematic diagram of another mask plate provided by the embodiments of the present application；
Fig. 5 is the structural schematic diagram of another mask plate provided by the embodiments of the present application；
Fig. 6 is the structural schematic diagram of another mask plate provided by the embodiments of the present application；
Fig. 7 is the structural schematic diagram of another mask plate provided by the embodiments of the present application；
Fig. 8 is the structural schematic diagram of another mask plate provided by the embodiments of the present application；
Fig. 9 is the structural schematic diagram of another mask plate provided by the embodiments of the present application；
Figure 10 is a kind of preparation method flow diagram of mask plate provided by the embodiments of the present application；
Figure 11 is the preparation method flow diagram of another mask plate provided by the embodiments of the present application；
Figure 12 is the preparation method flow diagram of another mask plate provided by the embodiments of the present application.
Specific embodiment
The embodiment of the present application provides a kind of mask plate, as shown in Fig. 2, including at least one opening region 1, the opening
The side 2 in region 1 is the inclined-plane for having setting angle with 3 upper surface 7 of mask plate；And at least at first of the inclined-plane
8 tangent line 9 and the angle 10 of the upper surface is divided to be greater than 90 °, so as to pass through from the incident light 11 in 3 upper surface of mask plate 7
The reflection of the first part 8 generates the component 12 for being parallel to the 3 place in-plane of mask plate.I.e. from mask plate upper surface
Incident light reflexes to open region by the first part.
Mask plate provided by the embodiments of the present application, since the side of open area is to have to set with the mask plate upper surface
The inclined-plane at clamp angle, and there are the first parts that the angle of tangent line and the upper surface is greater than 90 ° on the inclined-plane, therefore from covering
The light of diaphragm plate upper surface incidence generates point for being parallel to mask plate place in-plane by the reflection of the first part
Amount, so that open region is reflexed to from the light of mask plate upper surface incidence by the first part, so that diffraction occurs
Part light open region is reflexed to by the first part, promote the aggregation of the practical light through mask plate open area,
The scattering of the light as caused by diffraction is reduced, reduces the gray area area as caused by diffraction, enhances the curing degree of pattern, compare
It can reduce the size of the final film pattern formed using mask plate in the prior art, so as to realize small size film layer figure
The fining structure of case, and then the PPI of display product can be improved.And since gray area area reduces, exposure energy is insufficient
Region reduces, and so as to improve the angle at the angle taper, promotes display properties of product.
It should be noted that setting angle can be selected according to actual needs, such as can be according to formation side
Technique, the pattern dimension of film layer formed using mask plate etc. are selected.
Optionally, mask plate as shown in Figure 2 provided by the embodiments of the present application, the side 2 of the open area 1 are song
Face.
Certainly, the side of open area is also possible to plane as shown in Figure 3, i.e. inclined-plane is plane, the tangent line on inclined-plane with
The angle of mask plate upper surface is the angle of plane Yu mask plate upper surface, which is greater than 90 °, so that from covering
The light of diaphragm plate upper surface incidence generates point for being parallel to mask plate place in-plane by the reflection of the first part
Amount, so that open region is reflexed to from the light of mask plate upper surface incidence by the first part, so that diffraction occurs
Part light open region is reflexed to by the first part.
Optionally, the first part on the inclined-plane is the of the curved surface protruded to the open area or the inclined-plane
A part is the curved surface to the open area indent.
Mask plate as shown in Figure 2 provided by the embodiments of the present application, the first part 8 on the inclined-plane are to the open region
The curved surface that domain 1 is protruded.Certainly, mask plate provided by the embodiments of the present application is also possible to as shown in figure 4, first of the inclined-plane
Dividing 8 is the curved surface to 1 indent of open area, and the tangent line 9 of first part 8 and the angle 10 of the upper surface are greater than 90 °, with
Make to be parallel to the mask plate 3 from the incident light 11 in 3 upper surface of mask plate 7 by the reflection generation of the first part 8
The component 12 of place in-plane.Open region is reflexed to from the light of mask plate upper surface incidence by the first part,
So that the part light that diffraction occurs reflexes to open region by the first part.
When inclined-plane is curved surface, no matter first part is the curved surface protruded to open area or to open area indent
Curved surface can make from the mask plate as long as the tangent line of first area curved surface and the angle of the upper surface is made to be greater than 90 °
The light of surface incidence generates the component for being parallel to mask plate place in-plane by the reflection of the first part, so that
Open region is reflexed to from the light of mask plate upper surface incidence by the first part, so that the part light of diffraction occurs
Open region is reflexed to by the first part.
Optionally, the inclined-plane further include: to be parallel to the horizontal plane of the upper surface as symmetry axis, with described first
Divide symmetrical second part；Or, the inclined-plane only includes the first part.
When mask plate open area side be curved surface, mask plate as shown in Figure 2,4 provided by the embodiments of the present application, tiltedly
Face, that is, side 2 only includes first part 8.It is of course also possible to be the inclined-plane, that is, side 2 as shown in Fig. 5~7 further include: with flat
Horizontal plane of the row in the upper surface is symmetry axis 13, with the symmetrical second part 14 of the first part 8；In Fig. 5, Fig. 7, the
A part 8 and second part 14 are the curved surface to 1 indent of open area, and second part 14 and first part 8 are along symmetry axis 13
Symmetrically.First area 8 is below symmetry axis 13 in Fig. 5, and first area 8 is above symmetry axis 13 in Fig. 7.In Fig. 6, first part
8 and second part 14 be the curved surface protruded to open area 1, second part 14 and first part 8 are symmetrical along symmetry axis 13, the
A part 8 is located at 13 top of symmetry axis.
For open area inclined-plane be plane mask plate, inclined-plane can be as shown in figure 3, only include first part 8,
It is of course also possible to as shown in Figure 8, Figure 9, the inclined-plane further include: to be parallel to the horizontal plane of the upper surface 7 as symmetry axis
13, with the symmetrical second part 14 of the first part 8.
Certainly, for open area inclined-plane in addition to including the case where that first part further includes other parts, other parts
Can also be asymmetric with first part, such as inclined-plane includes first part and Part III, first part is convex to open area
Curved surface out, Part III are the curved surface to open area indent.As long as inclined-plane includes that tangent line and the angle of the upper surface are big
In 90 ° of first part, that is, it may make from the light of mask plate upper surface incidence by the first part and reflex to open region,
So that the part light that diffraction occurs reflexes to open region by the first part, to reduce gray area caused by diffraction
Area.
Fig. 2~Fig. 9 by taking an open area of mask plate as an example to the structure of mask plate provided by the embodiments of the present application into
Row is for example, mask plate may include multiple open areas in practical application.
Based on the same inventive concept, a kind of mask plate preparation method provided by the embodiments of the present application, as shown in Figure 10, the party
Method includes:
S101, the film layer that the mask plate 3 is formed on substrate 6；
S102, the film layer is handled using patterning process, forms at least one opening region 1, wherein the open region
The side 2 in domain 1 is the inclined-plane for having setting angle with the upper surface of the mask plate 3, and at least at first of the inclined-plane
The angle of the upper surface of the tangent line and the mask plate 3 that divide is greater than 90 °, so that the light of the upper surface incidence from the mask plate 3
The component for being parallel to the 3 place in-plane of mask plate is generated by the reflection of the first part.
Mask plate preparation method provided by the embodiments of the present application, since the side of the open area of formation is and the mask
Plate upper surface has an inclined-plane of setting angle, and there are the angles of tangent line and the upper surface on the inclined-plane greater than 90 ° the
A part, therefore the mask plate institute is parallel to from the light of mask plate upper surface incidence by the reflection generation of the first part
In the component of in-plane, so that open region is reflexed to from the light of mask plate upper surface incidence by the first part, from
And the part light that diffraction occurs is made to reflex to open region by the first part, it is promoted practical through mask plate open area
Light aggregation, reduce the light as caused by diffraction scattering, reduce the gray area area as caused by diffraction, enhance pattern
Curing degree can reduce the size of the final film pattern formed using mask plate, compared with the prior art so as to reality
The fining structure of existing small size film pattern, and then the PPI of display product can be improved.And since gray area area reduces,
The insufficient region of exposure energy reduces, and so as to improve the angle at the angle taper, promotes display properties of product.In figure chemical industry
It is the open area with the mask plate upper surface with the inclined-plane of setting angle that side is formed in skill, and simple process is easy to real
It is existing, and can realize without increasing additional technique and the side of open area is modified.
Optionally, Tu10Zhong, step S102 handle the film layer using patterning process, form at least one opening area
Domain specifically includes:
S1021, photoresist 5 is coated in the film layer, and the photoresist 5 is exposed, is developed, form photoresist
Pattern；
S1022, the corresponding film layer in region 15 being exposed is handled using etching technics, allow to carry out the area of exposure
The etching degree of the corresponding film layer in domain 15 weakens with far from the photoresist 5, forms at least one opening region 1, institute
The side 2 for stating open area 1 is the curved surface protruded to the open area 1.
In Figure 10, with to prepare side only include first part and side is that the mask plate of the curved surface protruded to open area is
Example is illustrated, and the corresponding film layer in region being exposed is handled using etching technics, allows to carry out the area of exposure
The etching degree of the corresponding film layer in domain with far from the photoresist and weaken, such as can by increase etching liquid concentration,
Extend etch period, realizes that the area of the open area of mask reduces with far from the photoresist.
Mask plate preparation method as shown in Figure 10 provided by the embodiments of the present application, further includes:
Step S103, stripping photoresist obtains mask plate 3.
The embodiment of the present application also provides a kind of mask plate preparation methods, as shown in figure 11, this method comprises:
S201, the film layer that the mask plate is formed on the substrate；
S202, the mask plate that the film layer formation has at least one opening region is handled using patterning process；
S203, the inclined-plane that there is setting angle with the mask plate upper surface is formed in the side of the open area, and
The tangent line of first part and the angle of the upper surface at least on the inclined-plane are greater than 90 °, so that from the upper of the mask plate
The light of surface incidence generates the component for being parallel to mask plate place in-plane by the reflection of the first part.
Mask plate preparation method provided by the embodiments of the present application, modifies the side of mask plate open area, is opening
The side in mouth region domain be with the mask plate upper surface have setting angle inclined-plane, and the inclined-plane there are tangent line with it is described
The angle of upper surface is greater than 90 ° of first part, therefore from the light of mask plate upper surface incidence by the anti-of the first part
Penetrate generate be parallel to the mask plate where in-plane component so that passing through described the from the light of mask plate upper surface incidence
A part reflexes to open region, so that the part light that diffraction occurs reflexes to open region by the first part, mentions
The aggregation for rising the practical light through mask plate open area reduces the scattering of the light as caused by diffraction, reduces due to diffraction
Caused gray area area, enhances the curing degree of pattern, can reduce utilize the final of mask plate formation compared with the prior art
So as to realize the fining structure of small size film pattern, and then display product can be improved in the size of film pattern
PPI.And since gray area area reduces, the insufficient region of exposure energy reduces, and so as to improve the angle at the angle taper, mentions
Rise display properties of product.Also, mask plate preparation method provided by the embodiments of the present application, can be according to actual needs to mask plate
The side of open area is modified, the side of the shape needed.
Optionally, step S203 is formed in the side of the open area has setting angle with the mask plate upper surface
Inclined-plane specifically include: using surface micro process technique the open area side formed with the mask plate upper surface have
There is the inclined-plane of setting angle.
Optionally, the inclined-plane packet that there is setting angle with the mask plate upper surface is formed in the side of the open area
It includes: being formed using electroplating technology, anode oxidation process, chemical conversion membrane process or coating process in the side of the open area
There is the inclined-plane of setting angle with the mask plate upper surface.
The inclined-plane is being formed using electroplating technology, anode oxidation process or chemical conversion membrane process, such as can passed through
Anode and cathode redox reaction forms coating in the side of open area.
Optionally, the inclined-plane that there is setting angle with the mask plate upper surface is formed in the side of the open area,
It specifically includes:
The mask plate is removed from the substrate；
The mask plate is placed in the storage tank equipped with electrolyte solution；
Voltage is applied to the top and bottom of the side of the open area, in the side formation of the open area and institute
State the inclined-plane that mask plate upper surface has setting angle.
Optionally, voltage is applied to the top and bottom of the side of the open area, specifically included:
Positive voltage is applied to the top and bottom of the side of the open area, forms the song to the open area indent
Face；
Alternatively, applying opposite polarity voltage respectively to the top and bottom of the side of the open area, formed to institute
State the curved surface of open region protrusion.
Positive voltage is applied to the top and bottom of the side of the open area, the side intermediate region of open area is negative
Pressure area, the i.e. top and bottom of the side of open area are cathode, and open area side intermediate region is anode, the oxygen in solution
For ion to movable cathode, the anion Ghandler motion that faces south is dynamic, first sends out in the side of open area close to the region of top and bottom in this way
Raw redox reaction, so as to obtain with close to open area side upper end or the increased coating of lower end thickness, from
And the curved surface to the open area indent is formed in the side of the open area.
Opposite polarity voltage is applied to the top and bottom of the side of the open area respectively, such as upper end is applied
Negative voltage applies positive voltage to lower end, and the upper end of the side of open area is anode, and lower end is cathode, the oxonium ion in solution
To movable cathode, the anion Ghandler motion that faces south is dynamic, and redox first occurs close to the region of lower end in the side of open area in this way
Reaction, so as to obtain with close to the increased coating of open area side lower end thickness, thus in the open area
Side formed to the open area protrude curved surface.
Optionally, positive voltage is applied to the top and bottom of the side of the open area, specifically included: to the opening
The top and bottom of the side in region apply the positive voltage of same size, form the curved surface to the open area indent, described
Curved surface is to be parallel to the horizontal plane of the upper surface as symmetry axis.Such as mask plate system provided by the embodiments of the present application can be used
Preparation Method forms mask plate as shown in Figure 5.
Certainly, different size of positive voltage is applied to the top and bottom of the side of the open area, it equally can be with shape
At the curved surface to the open area indent, can the top and bottom of the side to the open area according to actual needs apply
The voltage added is configured.
It should be noted that the material in the coating of the side formation of open area can choose the material phase with mask plate
Same material, for example, the material of mask plate is chromium, electrolyte solution can choose the electrolyte including chromium ion, chromium ion hair
Raw redox reaction, deposits to form coating in cathode surface.
Next by taking the top and bottom of the side to the open area apply the positive voltage of same size as an example, to this
The mask plate preparation method that application embodiment provides is illustrated, as shown in figure 12, this method comprises:
S201, the film layer that the mask plate 3 is formed on substrate 6；
S2021, photoresist 5 is coated in the film layer, and the photoresist 5 is exposed, is developed, form photoresist
5 pattern；
S2022, the film layer that the mask plate 3 is handled using etching technics form covering at least one opening region 1
Diaphragm plate；
The mask plate 3 is removed from the substrate 6, and the mask plate 3 is placed in by S2031, stripping photoresist 5
Storage tank 18 equipped with electrolyte solution 17；
S2032, the positive electricity that using lead 16 top and bottom of the side 2 of the open area 1 are applied with same size
Pressure, forms the curved surface to 1 indent of open area, the curved surface is to be parallel to the horizontal plane of the upper surface 7 as symmetry axis
13。
Optionally, being formed using coating process in the side of the open area has setting with the mask plate upper surface
The inclined-plane of angle, specifically includes:
Surround the side coating organic material of the open area in the mask plate using coating process, formed with it is described
Mask plate upper surface has the inclined-plane of setting angle.
Such as it can obtain increasing with close to open area side upper end or lower end thickness in side coating organic material
The film layer added forms the curved surface to the open area indent in the side of the open area.Organic material can for example select
Select have compared with strong reflection effect and with the stronger material of mask plate binding ability.
In conclusion the preparation method of mask plate provided by the embodiments of the present application and mask plate, due to the side of open area
Face is the inclined-plane for having setting angle with the mask plate upper surface, and there are the folders of tangent line and the upper surface on the inclined-plane
Angle is greater than 90 ° of first part, therefore generates in parallel from the light of mask plate upper surface incidence by the reflection of the first part
The component of in-plane where the mask plate, so that from the light of mask plate upper surface incidence by the anti-of the first part
It is incident upon open region, so that the part light that diffraction occurs reflexes to open region by the first part, promotes practical penetrate
The aggregation of the light of mask plate open area reduces the scattering of the light as caused by diffraction, reduces the gray area as caused by diffraction
Area, enhances the curing degree of pattern, can reduce the final film pattern formed using mask plate compared with the prior art
So as to realize the fining structure of small size film pattern, and then the PPI of display product can be improved in size.And by
Reduce in gray area area, the insufficient region of exposure energy reduces, and so as to improve the angle at the angle taper, promotes display product
Performance.
Obviously, those skilled in the art can carry out various modification and variations without departing from the essence of the application to the application
Mind and range.In this way, if these modifications and variations of the application belong to the range of the claim of this application and its equivalent technologies
Within, then the application is also intended to include these modifications and variations.
Claims (10)
1. a kind of mask plate, which is characterized in that including at least one opening region, the side of the open area is to cover with described
Template upper surface has the inclined-plane of setting angle；And at least the inclined-plane first part tangent line and the upper surface folder
Angle is greater than 90 °, so as to be parallel to institute by the reflection generation of the first part from the light of the upper surface incidence of the mask plate
The component of in-plane where stating mask plate.
2. mask plate according to claim 1, which is characterized in that the side of the open area is curved surface.
3. mask plate according to claim 2, which is characterized in that the first part on the inclined-plane is to the open area
The first part on the curved surface of protrusion or the inclined-plane is the curved surface to open area indent.
4. mask plate according to claim 2, which is characterized in that the inclined-plane further include: to be parallel to the upper surface
Horizontal plane be symmetry axis, with the symmetrical second part of the first part；Or, the inclined-plane only includes the first part.
5. a kind of mask plate preparation method, which is characterized in that this method comprises:
The film layer of the mask plate is formed on the substrate；
The film layer is handled using patterning process, forms at least one opening region, wherein the side of the open area is
With the mask plate upper surface have setting angle inclined-plane, and at least the inclined-plane first part tangent line and it is described on
The angle on surface is greater than 90 °, so as to generate from the light of the upper surface incidence of the mask plate by the reflection of the first part
The component of in-plane where being parallel to the mask plate.
6. according to the method described in claim 5, it is characterized in that, handling the film layer using patterning process, formation is at least
One open area, specifically includes:
Photoresist is coated in the film layer, and the photoresist is exposed, is developed, and forms the pattern of photoresist；
The corresponding film layer in region being exposed is handled using etching technics, the region for allowing to carry out exposure is corresponding described
The etching degree of film layer weakens with far from the photoresist, forms at least one opening region, the side of the open area
For the curved surface protruded to the open area.
7. a kind of mask plate preparation method, which is characterized in that this method comprises:
The film layer of the mask plate is formed on the substrate；
The film layer is handled using patterning process and forms the mask plate at least one opening region；
The inclined-plane that there is setting angle with the mask plate upper surface is formed in the side of the open area, and at least described
The tangent line of the first part on inclined-plane and the angle of the upper surface are greater than 90 °, so that incident from the upper surface of the mask plate
Light generates the component for being parallel to mask plate place in-plane by the reflection of the first part.
8. the method according to the description of claim 7 is characterized in that the side in the open area is formed and the mask plate
Upper surface has the inclined-plane of setting angle, specifically includes:
The mask plate is removed from the substrate；
The mask plate is placed in the storage tank equipped with electrolyte solution；
Voltage is applied to the top and bottom of the side of the open area, is formed in the side of the open area and is covered with described
Diaphragm plate upper surface has the inclined-plane of setting angle.
9. according to the method described in claim 8, it is characterized in that, applying to the top and bottom of the side of the open area
Voltage specifically includes:
Positive voltage is applied to the top and bottom of the side of the open area, forms the curved surface to the open area indent；
Alternatively, applying opposite polarity voltage respectively to the top and bottom of the side of the open area, is formed and opened to described
The curved surface of mouth region protrusion.
10. according to the method described in claim 9, it is characterized in that, being applied to the top and bottom of the side of the open area
Add positive voltage, specifically include: the top and bottom of the side of the open area are applied with the positive voltage of same size, formed to
The curved surface of the open area indent, the curved surface is to be parallel to the horizontal plane of the upper surface as symmetry axis.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910009128.7A CN109799673B (en) | 2019-01-04 | 2019-01-04 | Mask plate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910009128.7A CN109799673B (en) | 2019-01-04 | 2019-01-04 | Mask plate and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109799673A true CN109799673A (en) | 2019-05-24 |
| CN109799673B CN109799673B (en) | 2022-09-23 |
Family
ID=66558529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910009128.7A Active CN109799673B (en) | 2019-01-04 | 2019-01-04 | Mask plate and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109799673B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115043375A (en) * | 2022-06-28 | 2022-09-13 | 上海积塔半导体有限公司 | Preparation method of metal microstructure and semiconductor device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09304917A (en) * | 1996-05-14 | 1997-11-28 | Nikon Corp | Exposure method |
| CN202735675U (en) * | 2012-09-07 | 2013-02-13 | 京东方科技集团股份有限公司 | Mask plate |
| CN102955354A (en) * | 2012-11-01 | 2013-03-06 | 合肥京东方光电科技有限公司 | Mask plate and manufacturing method thereof |
| CN103885296A (en) * | 2014-02-21 | 2014-06-25 | 鄂尔多斯市源盛光电有限责任公司 | Mask plate, exposure method and exposure device |
| CN104345544A (en) * | 2013-07-31 | 2015-02-11 | 北京京东方光电科技有限公司 | Mask plate |
| CN108172505A (en) * | 2018-01-04 | 2018-06-15 | 京东方科技集团股份有限公司 | Mask plate and preparation method, film layer preparation method and encapsulating structure |
| CN108628091A (en) * | 2017-03-20 | 2018-10-09 | 昆山国显光电有限公司 | Mask plate and preparation method thereof |
-
2019
- 2019-01-04 CN CN201910009128.7A patent/CN109799673B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09304917A (en) * | 1996-05-14 | 1997-11-28 | Nikon Corp | Exposure method |
| CN202735675U (en) * | 2012-09-07 | 2013-02-13 | 京东方科技集团股份有限公司 | Mask plate |
| CN102955354A (en) * | 2012-11-01 | 2013-03-06 | 合肥京东方光电科技有限公司 | Mask plate and manufacturing method thereof |
| CN104345544A (en) * | 2013-07-31 | 2015-02-11 | 北京京东方光电科技有限公司 | Mask plate |
| CN103885296A (en) * | 2014-02-21 | 2014-06-25 | 鄂尔多斯市源盛光电有限责任公司 | Mask plate, exposure method and exposure device |
| CN108628091A (en) * | 2017-03-20 | 2018-10-09 | 昆山国显光电有限公司 | Mask plate and preparation method thereof |
| CN108172505A (en) * | 2018-01-04 | 2018-06-15 | 京东方科技集团股份有限公司 | Mask plate and preparation method, film layer preparation method and encapsulating structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115043375A (en) * | 2022-06-28 | 2022-09-13 | 上海积塔半导体有限公司 | Preparation method of metal microstructure and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109799673B (en) | 2022-09-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10916602B2 (en) | Base plate, method for manufacturing the same and display panel | |
| CN101512422B (en) | Method of forming electrochromic layer pattern, method of manufacturing electrochromic device using the same, and electrochromic device including electrochromic layer pattern | |
| WO2007013682A1 (en) | Display device, its manufacturing method, and display medium | |
| CN102109714B (en) | Oriented layer and preparation method thereof, comprise the liquid crystal indicator of this oriented layer | |
| TW542934B (en) | LCD and manufacturing method thereof | |
| CN103885246B (en) | Oriented film printing plate and method for manufacturing liquid crystal display device | |
| CN103882375B (en) | A kind of mask plate and preparation method thereof | |
| CN109799673A (en) | A kind of mask plate and preparation method thereof | |
| US20200183236A1 (en) | Black matrix, preparation method therefor, and system thereof, display substrate, and display device | |
| CN106405922A (en) | Display panel, manufacturing method of display panel and display device | |
| CN103698894B (en) | A kind of passive polarization type three-dimensional display apparatus and preparation method thereof | |
| TWI704411B (en) | Photo mask, corresponding spacer structure and liquid crystal panel using the same | |
| US9720248B2 (en) | Liquid crystal lens, fabrication method thereof and display device | |
| CN109212836B (en) | Display panel and display device | |
| US10281774B2 (en) | Display panel, method for producing the same and liquid crystal display screen | |
| US20180196316A1 (en) | Method of performing photo alignment to liquid crystal panel and mask | |
| CN109814298A (en) | Liquid crystal display panel and its manufacturing method, liquid crystal display device | |
| CN104965352A (en) | Transfer printing plate and manufacturing method thereof | |
| US9536819B2 (en) | Transparent substrate having nano pattern and method of manufacturing the same | |
| US20150309352A1 (en) | Display substrate and manufacturing method thereof, and bistable liquid crystal display panel | |
| JPH11221976A (en) | Resin letterpress with excellent film printability or the like | |
| US20210080783A1 (en) | Polarization grating having a light-shielding layer, manufacturing method for the same and display panel for the same | |
| CN109407464A (en) | A kind of nano-imprint stamp and preparation method thereof and ultraviolet nanometer method for stamping | |
| CN102043290B (en) | Liquid crystal display device | |
| CN104765214B (en) | TFT substrate and its manufacturing method, display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |