CN109795199A - A kind of composite buffering packing board and its complex method - Google Patents

A kind of composite buffering packing board and its complex method Download PDF

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Publication number
CN109795199A
CN109795199A CN201910184018.4A CN201910184018A CN109795199A CN 109795199 A CN109795199 A CN 109795199A CN 201910184018 A CN201910184018 A CN 201910184018A CN 109795199 A CN109795199 A CN 109795199A
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CN
China
Prior art keywords
substrate
adhesive
buffer layer
packing board
composite buffering
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910184018.4A
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Chinese (zh)
Inventor
陈毫
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Individual
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Individual
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Publication date
Application filed by Individual filed Critical Individual
Priority to CN201910184018.4A priority Critical patent/CN109795199A/en
Publication of CN109795199A publication Critical patent/CN109795199A/en
Pending legal-status Critical Current

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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W90/00Enabling technologies or technologies with a potential or indirect contribution to greenhouse gas [GHG] emissions mitigation
    • Y02W90/10Bio-packaging, e.g. packing containers made from renewable resources or bio-plastics

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  • Buffer Packaging (AREA)

Abstract

The present invention discloses a kind of composite buffering packing board and its complex method, including substrate, buffer layer and adhesive, the substrate is connected with buffer layer by adhesive, the substrate is hardboard, The present invention reduces the uses of foam in Traditional Packing and bubble film, the cost of transport foam is decreased simultaneously, is decreased the pollution of foam and bubble film to environment, has been saved packaging space and cardboard.

Description

A kind of composite buffering packing board and its complex method
Technical field
The invention belongs to packaging field, in particular to a kind of composite buffering packing board and its complex method.
Background technique
In the epoch of logistic industry fast development, transport and packing problem are all suffered from per the same product, such as wine and electronics The fragile articles such as product.But current packing box only on the market and to-go box are most common corrugated cases, and are being transported It is putting it into carton, will use among the packaging process to carton a large amount of after all first being packed to product in journey Foam and bubble film.There are several big problems, (1) for such cartons at present;Foam in carton uses it in customer After be not easily recycled, and it is big to the harm of environment.(2);Foam can not compress during transportation, considerably increase the fortune of material Defeated cost.(3);Product is packed when preparing transport, which again increases costs of labor.(4);Reach using foam The big quantity space of carton is alsied occupy while buffer function, this wastes carton space significantly.(5);Using bubble film After being packed, bubble film can not be recycled comprehensively, this can be such that bubble film pollutes the environment.
Environment is vital for our mankind, so just tightly needing a kind of novel material in face of problem above To replace this not environmentally also not convenient carton.
Summary of the invention
In view of this, being solved existing the embodiment of the invention provides a kind of composite buffering packing board and its complex method The problems of wrapping paper.
The present invention discloses a kind of composite buffering packing board, including substrate, buffer layer and adhesive, the substrate and buffering Layer is connected by adhesive, and the substrate is hardboard.
Further, the substrate is one of corrugated board, white board, paper jam, full chipboard, copper cardboard.
Further, the buffer layer is bubble film, foam, pearl cotton, air bag, air column bag, air-cushion film, EVA bubble One of cotton.
Further, described adhesive includes following raw material: PVA20-30%, vac emulsion 10%, cornstarch 20-30%, soda ash 5-10%, pure water 30-40%.
Further, described adhesive optimum weight part raw material are as follows: 25%PVA, 10% vac emulsion, 25% cornstarch, 5% Soda ash, 35% pure water.
A kind of complex method of composite buffering packing board, comprising the following steps:
Suitable adhesive is smeared in the one side of substrate, buffer layer is compound on the adhesive, it is dried at room temperature for, adhesive will Substrate and buffer layer bonding, obtain composite buffering packing board.
Bonding force test is carried out to substrate and buffer layer.Composite buffering packing board is cut into 1 centimetre of wide paper strip Plate distinguishes chucking substrate and buffer layer using collet, then applies tearing, until substrate and buffer layer tearing, and records and tears Tearing value of thrust when splitting, the value are substrate and buffer layer bonding force per cm.
The present invention reduces the uses of foam in Traditional Packing, while decreasing the cost of transport foam, decrease The pollution of foam and bubble film to environment, has saved packaging space and cardboard.
Detailed description of the invention
Fig. 1 is one embodiment of the invention schematic diagram.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that the described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Based on this Embodiment in invention, every other reality obtained by those of ordinary skill in the art without making creative efforts Example is applied, shall fall within the protection scope of the present invention.
As shown in Figure 1, the present invention discloses a kind of composite buffering packing board, including substrate 1, buffer layer 2 and adhesive 3, The substrate 1 and buffer layer 2 are connected by adhesive 3, and the substrate 1 is hardboard.
Wherein, the substrate is one of corrugated board, white board, paper jam, full chipboard, copper cardboard, iron plate.Substrate There is harder surface, extraneous pressure can be resisted.
The buffer layer is bubble film, foam, pearl cotton, air bag, air column bag, air-cushion film, one in EVA foam Kind.The above material has cushion performance.
Described adhesive includes following raw material: PVA20-30%, vac emulsion 10%, cornstarch 20-30%, pure Alkali 5-10%, pure water 30-40%.
Wherein, described adhesive optimum weight part raw material are as follows: 25%PVA, 10% vac emulsion, 25% cornstarch, 5% pure Alkali, 35% pure water.
Bonding force test is carried out to substrate and buffer layer.Composite buffering packing board is cut into 1 centimetre of wide paper strip Plate distinguishes chucking substrate and buffer layer using collet, then applies tearing, until substrate and buffer layer tearing, and records and tears Tearing value of thrust when splitting, the value are substrate and buffer layer bonding force per cm.
Through overtesting, adhesive pulling force corresponding to different component raw material is as follows:
As seen from the above table: when binder wt part raw material are as follows: 25%PVA, 10% vac emulsion, 25% cornstarch, 5% soda ash, 35% When pure water, adhesive pulling force is maximum, therefore is optimum weight ratio.
The present invention discloses a kind of complex method of composite buffering packing board, comprising the following steps:
Suitable adhesive is smeared in the one side of substrate, buffer layer is compound on the adhesive, it is dried at room temperature for, adhesive will Substrate and buffer layer bonding.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention Within mind and principle, made any modification, equivalent replacement etc. be should all be included in the protection scope of the present invention.

Claims (6)

1. a kind of composite buffering packing board, which is characterized in that including substrate, buffer layer and adhesive, the substrate and buffering Layer is connected by adhesive, and the substrate is hardboard.
2. a kind of composite buffering packing board as described in claim 1, which is characterized in that the substrate is corrugated board, white One of cardboard, paper jam, full chipboard, copper cardboard.
3. a kind of composite buffering packing board as described in claim 1, which is characterized in that the buffer layer be bubble film, One of foam, pearl cotton, air bag, air column bag, air-cushion film, EVA foam.
4. a kind of composite buffering packing board as described in claim 1, which is characterized in that described adhesive includes following weight Part raw material: PVA20-30%, vac emulsion 10%, cornstarch 20-30%, soda ash 5-10%, pure water 30-40%.
5. a kind of composite buffering packing board as claimed in claim 4, which is characterized in that described adhesive optimum weight part is former Material are as follows: 25%PVA, 10% vac emulsion, 25% cornstarch, 5% soda ash, 35% pure water.
6. a kind of complex method of composite buffering packing board, which comprises the following steps:
Suitable adhesive is smeared in the one side of substrate, buffer layer is compound on the adhesive, it is dried at room temperature for, adhesive will Substrate and buffer layer bonding.
CN201910184018.4A 2019-03-12 2019-03-12 A kind of composite buffering packing board and its complex method Pending CN109795199A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910184018.4A CN109795199A (en) 2019-03-12 2019-03-12 A kind of composite buffering packing board and its complex method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910184018.4A CN109795199A (en) 2019-03-12 2019-03-12 A kind of composite buffering packing board and its complex method

Publications (1)

Publication Number Publication Date
CN109795199A true CN109795199A (en) 2019-05-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910184018.4A Pending CN109795199A (en) 2019-03-12 2019-03-12 A kind of composite buffering packing board and its complex method

Country Status (1)

Country Link
CN (1) CN109795199A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1267697A (en) * 2000-04-21 2000-09-27 吴占魁 Powerful water-resisting white latex
CN101402835A (en) * 2008-01-25 2009-04-08 盐城华贸包装有限公司 White latex adhesive agent for packaging paper product and method of producing the same
CN102786897A (en) * 2012-08-03 2012-11-21 祁高标 High-standard formaldehyde-free glue and preparation method thereof
CN203046408U (en) * 2012-12-29 2013-07-10 广州莲旺纸品有限公司 Shockproof corrugated board carton
CN103642425A (en) * 2013-09-29 2014-03-19 桐城市福润包装材料有限公司 Production technology for starch adhesive
CN104476826A (en) * 2014-11-05 2015-04-01 新乡市成林纸品包装有限公司 High-intensity offset print color plate manufacturing method
CN108084920A (en) * 2016-11-21 2018-05-29 上海金桢纸业有限公司 A kind of adhesive for corrugated paperboard and preparation method thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1267697A (en) * 2000-04-21 2000-09-27 吴占魁 Powerful water-resisting white latex
CN101402835A (en) * 2008-01-25 2009-04-08 盐城华贸包装有限公司 White latex adhesive agent for packaging paper product and method of producing the same
CN102786897A (en) * 2012-08-03 2012-11-21 祁高标 High-standard formaldehyde-free glue and preparation method thereof
CN203046408U (en) * 2012-12-29 2013-07-10 广州莲旺纸品有限公司 Shockproof corrugated board carton
CN103642425A (en) * 2013-09-29 2014-03-19 桐城市福润包装材料有限公司 Production technology for starch adhesive
CN104476826A (en) * 2014-11-05 2015-04-01 新乡市成林纸品包装有限公司 High-intensity offset print color plate manufacturing method
CN108084920A (en) * 2016-11-21 2018-05-29 上海金桢纸业有限公司 A kind of adhesive for corrugated paperboard and preparation method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
张公正: "一种新型玉米淀粉粘合剂", 《粘接》 *

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Application publication date: 20190524