CN109778098A - A method of avoid difference of thermal expansion coefficients between high melting point metal film and substrate big - Google Patents

A method of avoid difference of thermal expansion coefficients between high melting point metal film and substrate big Download PDF

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Publication number
CN109778098A
CN109778098A CN201711117573.2A CN201711117573A CN109778098A CN 109778098 A CN109778098 A CN 109778098A CN 201711117573 A CN201711117573 A CN 201711117573A CN 109778098 A CN109778098 A CN 109778098A
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substrate
melting point
high melting
metal film
point metal
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CN201711117573.2A
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张端雅
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Individual
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Abstract

The method that difference of thermal expansion coefficients is big between high melting point metal film and substrate is avoided the invention discloses a kind of, the high melting point metal film includes basal layer, middle layer and metal layer, described method includes following steps: (1) surface treatment of base material, (2) acetylene-oxygen flame sprays middle layer, (3) interlayer surfaces grinding process, (4) electric arc spraying hot metal solid-state continuous film.The solid-state continuous film prepared through the above way is with a thickness of 2~5mm.The present invention is a kind of to avoid the method that difference of thermal expansion coefficients is big between high melting point metal film and substrate, its preparation section is reasonable, it is simple to operate, it can effectively avoid the big problem of difference of thermal expansion coefficients between refractory metal and substrate, the defects of prepared high melting point metal film surface compact, is firmly combined between middle layer and substrate, no warpage, cracking, and its thickness is larger, has a wide range of application.

Description

A method of avoid difference of thermal expansion coefficients between high melting point metal film and substrate big
Technical field
The present invention relates to the continuous technical field of membrane of metal solid-state, avoid high melting point metal film and substrate more particularly to one kind Between the big method of difference of thermal expansion coefficients.
Background technique
The continuous film raw material of solid-state used in high melting point metal film is rare metal class, this metalloid has hardness big, heat-resisting The advantages that property is good, corrosion-resistant, is industrially widely used.Electric arc spraying, which prepares metal solid-state continuous film, has simple side Just, the advantages that shaping efficiency is high is the method being widely used in metal solid-state continuous film preparation technical field.But it is sprayed using electric arc Technique is applied directly when substrate material surface spraying prepares high melting point metal film, due to difference of thermal expansion coefficients between the two compared with Greatly, and refractory metal is difficult to melt, and running parameter is made to be difficult to grasp, and then makes the contraction of the metal solid-state continuous film of preparation Rate, thermal stress and porosity are all bigger, and solid-state continuous film is easily-deformable, and warpage, cracking and stripping occurs in substrate material surface The defects of falling.
Summary of the invention
It avoids thermally expanding system between high melting point metal film and substrate the invention mainly solves the technical problem of providing one kind The big method of number difference, can effectively solve the problem that electric arc spraying prepares the above problem existing for high-melting-point solid-state continuous film.
In order to solve the above technical problems, one technical scheme adopted by the invention is that: one kind is provided and avoids refractory metal The big method of difference of thermal expansion coefficients between film and substrate, the high melting point metal film include basal layer, middle layer and metal layer, Described method includes following steps:
(1) surface treatment of base material: substrate material surface is subjected to sandblasting grinding process, is then sequentially placed into It fills and is cleaned by ultrasonic 5~10min in the ultrasonator of ether and clear water respectively, it is spare to dry moisture after taking-up;
(2) acetylene-oxygen flame sprays middle layer: the linear thermoplastic's plastics for being 5~15mm using diameter are adopted as sprayed on material One layer of thermoplastic interlayer is sprayed in the substrate surface that handles through step (1) with acetylene-oxygen spraying process;
(3) interlayer surfaces grinding process: after the 6~12h of thermoplastic interlayer room temperature curing prepared in step (2), Its surface is polished flat with abrasive band, is then cleaned and is dried with clear water;
(4) electric arc spraying hot metal solid-state continuous film: electric arc spraying is carried out in surface treated interlayer surfaces High melting point metal film, the spraying parameter are as follows: 30~50V of spray voltage, 100~150A of spraying current, spray distance 250 ~280mm, 45~90 ° of spray angle.
In a preferred embodiment of the present invention, the thermoplastic is polyethylene or polypropylene.
In a preferred embodiment of the present invention, in the step (2), the acetylene-oxygen thermal spraying temperature be 150~ 180℃。
In a preferred embodiment of the present invention, in the step (3), the polishing rate in the abrasive band is 8~10m/s, Middle layer with a thickness of 1.5~3mm after the polishing.
In a preferred embodiment of the present invention, the high melting point metal film with a thickness of 2~5mm.
The beneficial effects of the present invention are: the continuous preparation process of high-melting-point semi-solid-state metal film of the present invention, preparation section is closed Reason, it is simple to operate, it can effectively avoid the big problem of difference of thermal expansion coefficients between refractory metal and substrate, it is prepared High melting point metal film surface compact, is firmly combined between middle layer and substrate, no warpage, cracking the defects of, and its thickness compared with Greatly, have a wide range of application.
Specific embodiment
The preferred embodiments of the present invention will be described in detail below so that advantages and features of the invention can be easier to by It will be appreciated by those skilled in the art that so as to make a clearer definition of the protection scope of the present invention.The embodiment of the present invention Include:
Embodiment 1
(1) surface treatment of base material: using stainless steel as base material, and use partial size for 100 μm of diamond dust pair Its surface carries out sandblasting grinding process, the blasting craft are as follows: blasting pressure 0.4MPa, sandblasting distance 10mm, sandblasting angle It 90 °, is then sequentially placed into the ultrasonator for filling ether and clear water and is cleaned by ultrasonic 10min and 5min respectively, taken out After to dry moisture spare;
(2) acetylene-oxygen flame spray middle layer: using diameter for 5mm linear vinyon as sprayed on material, using second Alkynes-oxygen spraying process sprays layer of polyethylene middle layer to treated stainless steel surface at 150 DEG C;
(3) interlayer surfaces grinding process: above-mentioned polyethylene middle layer is placed in after solidifying 6~12h at room temperature, uses abrasive band Its surface is polished flat with the revolving speed of 8m/s, is cleaned and is dried with clear water, is obtained in the thermoplastic polyethylene with a thickness of 1.5mm Interbed;
(4) electric arc spraying hot metal solid-state continuous film: in surface treated interlayer surfaces electric arc spraying Gao Rong Point molybdenum solid-state continuous film, the spraying parameter are as follows: spray voltage 30V, spraying current 150A, spray distance 250mm, spraying 45~90 ° of angle, obtain the metal solid-state continuous film for the surface compact that a layer thickness is 2.
Embodiment 2
(1) surface treatment of base material: using cast iron as base material, and using partial size is 80 μm of diamond dust to its table Face carries out sandblasting grinding process, the blasting craft are as follows: blasting pressure 0.45MPa, sandblasting distance 10mm, 90 ° of sandblasting angle, so It is sequentially placed into the ultrasonator for filling ether and clear water afterwards and is cleaned by ultrasonic 10min and 5min respectively, dried after taking-up Moisture is spare;
(2) acetylene-oxygen flame spray middle layer: the linear polypropylene plastics for being 10~15mm using diameter as sprayed on material, One layer polypropylene middle layer is sprayed to treated Cast Iron Surface at 160~180 DEG C using acetylene-oxygen spraying process;
(3) interlayer surfaces grinding process: above-mentioned polyethylene middle layer is placed in after solidifying 6~12h at room temperature, uses abrasive band Its surface is polished flat with the revolving speed of 10m/s, is cleaned and is dried with clear water, is obtained in the thermoplastic polypropylene with a thickness of 3mm Interbed;
(4) electric arc spraying hot metal solid-state continuous film: in surface treated interlayer surfaces electric arc spraying Gao Rong Point Cr-Zr alloy solid-state continuous film, the spraying parameter are as follows: spray voltage 50V, spraying current 100A, spray distance 280mm, obtains the metal solid-state continuous film for the surface compact that a layer thickness is 5 by 45~90 ° of spray angle.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair Equivalent structure or equivalent flow shift made by bright description is applied directly or indirectly in other relevant technology necks Domain is included within the scope of the present invention.

Claims (1)

1. a kind of avoid the method that difference of thermal expansion coefficients is big between high melting point metal film and substrate, which is characterized in that the side Method includes the following steps:
(1) surface treatment of base material: substrate material surface is subjected to sandblasting grinding process, is then sequentially placed into and is filled It is cleaned by ultrasonic 5~10min in the ultrasonator of ether and clear water respectively, it is spare to dry moisture after taking-up;
(2) acetylene-oxygen flame sprays middle layer: the linear thermoplastic's plastics for being 5~15mm using diameter is sprayed on material, using second Alkynes-oxygen spraying process sprays one layer of thermoplastic interlayer in the substrate surface handled through step (1);
(3) interlayer surfaces grinding process: after the 6~12h of thermoplastic interlayer room temperature curing prepared in step (2), sand is used Band polishes flat its surface, is then cleaned and is dried with clear water;
(4) electric arc spraying hot metal solid-state continuous film: electric arc spraying Gao Rong is carried out in surface treated interlayer surfaces Point metal film, the spraying parameter are as follows: 30~50V of spray voltage, 100~150A of spraying current, spray distance 250~ 280mm, 45~90 ° of spray angle.
CN201711117573.2A 2017-11-13 2017-11-13 A method of avoid difference of thermal expansion coefficients between high melting point metal film and substrate big Pending CN109778098A (en)

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CN201711117573.2A CN109778098A (en) 2017-11-13 2017-11-13 A method of avoid difference of thermal expansion coefficients between high melting point metal film and substrate big

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Application Number Priority Date Filing Date Title
CN201711117573.2A CN109778098A (en) 2017-11-13 2017-11-13 A method of avoid difference of thermal expansion coefficients between high melting point metal film and substrate big

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110563483A (en) * 2019-10-11 2019-12-13 南京工业大学 Low dielectric fused quartz microwave dielectric ceramic surface metallization method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110563483A (en) * 2019-10-11 2019-12-13 南京工业大学 Low dielectric fused quartz microwave dielectric ceramic surface metallization method

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