CN109768186A - The preparation method of flexible electronic device substrate and the preparation method of flexible electronic device - Google Patents
The preparation method of flexible electronic device substrate and the preparation method of flexible electronic device Download PDFInfo
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- CN109768186A CN109768186A CN201811622012.2A CN201811622012A CN109768186A CN 109768186 A CN109768186 A CN 109768186A CN 201811622012 A CN201811622012 A CN 201811622012A CN 109768186 A CN109768186 A CN 109768186A
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Abstract
The present invention provides a kind of preparation method of flexible electronic device substrate, comprising: provides the mixed solution of prepolymer and light curing agent；There is provided can graphic programming light source；Light source is set to form light source figure relevant to the functional structure of flexible electronic device；Solidification prepolymer and light curing agent mixed solution are irradiated using light source, the flexible substrate with concave-convex surface position or internal channel is formed, the concave-convex surface position of formation or the shape of internal channel are corresponding with the shape of the functional structure of flexible electronic device to be prepared.The present invention also provides provide a kind of preparation method of flexible electronic device, including after preparing the flexible substrate with concave-convex surface position or internal channel, functional material corresponding with the function of the flexible electronic device is filled in the concave-convex surface position of the flexible substrate or internal channel, obtains required flexible electronic device.Flexible substrate one-pass molding, easy to process in process of the invention, good airproof performance.
Description
Technical field
The present invention relates to flexible apparatus manufacturing fields, a kind of preparation method more particularly to flexible electronic device substrate and
The preparation method of flexible electronic device.
Background technique
In traditional electronic printing field, the preparation of electronic circuit needs very complicated program, during preparation
It is accompanied by the problems such as the wasting of resources and environmental pollution.In flexible electronic field, program is then increasingly complex, needs to pass through quarter
Erosion, which prepares mold, could prepare the electronic device of specific shape.
Current flexible device substrate is all based on formed in mould, and the preparation process of mold is complicated and can not repeat to make
With without editability.For the substrate of labyrinth, manufacture craft is mostly based on multi-part assembling splicing and sandwich knot
Composition type can not accomplish one-pass molding.
The narration of front is to provide general background information, might not constitute the prior art.
Summary of the invention
The purpose of the present invention is to provide a kind of preparation method of flexible electronic device substrate and the systems of flexible electronic device
Preparation Method, the substrate one-pass molding for the flexible electronic device that the above method is prepared are easy to process.
The preparation method of flexible electronic device substrate provided by the invention includes the following steps: to provide prepolymer and light is solid
The mixed solution of agent；There is provided can graphic programming light source；Form light source related to the functional structure of flexible electronic device
Light source figure；Solidification prepolymer and light curing agent mixed solution are irradiated using light source, being formed has concave-convex surface position or interior
The flexible substrate of portion's channel, the concave-convex surface position of formation or the shape of internal channel and flexible electronic device to be prepared
The shape of functional structure is corresponding.
Further, the prepolymer includes the liquid monomer or liquid-state oligomers of photosensitive resin.
Further, the light source irradiates to form the flexibility with concave-convex surface position to mixed solution progress single side
Substrate.
Further, flexible liner is formed when solidifying mixed solution by controlling the curing rate of mixed solution different piece
The concave-convex surface position at bottom.
Further, the light source carries out double-sided illumination to the mixed solution and forms the flexible liner with internal channel
Bottom.
Further, the illumination wavelength of the light source is chosen according to the type of light curing agent.
Further, the intensity of illumination of the light source is chosen according to the three-dimensional appearance of flexible electronic device functional structure.
Further, irradiation duration curing time according to needed for the prepolymer of the light source determines.
Further, the front along light going direction of the light source is equipped with light ray parallel lens, the light ray parallel
Lens are used to the light transmitted being converted into parallel rays, surface of the parallel rays perpendicular to the mixed solution.
Further, the light source is additionally provided with pattern amplifying lens in front of light going direction, and the pattern puts
Big lens are set between the light source and the light ray parallel lens, the pattern irradiated for amplifying the light source.
The preparation method of flexible electronic device provided by the invention, comprising: there is table using above-mentioned preparation method preparation
After face concave and convex part or the flexible substrate of internal channel, filled in the concave-convex surface position of the flexible substrate or internal channel
Functional material corresponding with the function of the flexible electronic device, obtains the flexible electronic device.
Further, the preparation method includes: to remove concave-convex surface position or internal channel before filling functional material
Interior uncured mixed solution.
Further, the functional material is fluent material.
Further, the fluent material includes liquid metal, non-newtonian fluid, conductive metal slurry, carbon nano pulp
With organic conductive liquid.
Further, note is utilized when filling fluent material in the concave-convex surface position of the flexible substrate or internal channel
Emitter injection.
The present invention at least has the advantages that one of them:
1. the present invention forms the flexible substrate with concave-convex surface position or internal channel by the way of illumination curing, obtain
It is infused to the flexible substrate of required flexible electronic device, and in the concave-convex surface position of the flexible substrate of formation or internal channel
Enter functional material, obtain required flexible electronic device, flexible substrate one-pass molding, easy to process in the process, sealing
Property is good.
2. the present invention is graphical by the concave-convex surface position of the graphical realization flexible substrate of light source or internal channel,
Processing method is flexible, can form the flexible substrate with different structure without molding die, and being particularly suitable for processing has again
The flexible substrate of miscellaneous structure.
Detailed description of the invention
Fig. 1 is the flow diagram of the preparation method for the flexible electronic device that first embodiment of the invention provides.
Fig. 2 is the schematic diagram that single side irradiates solidification scheme.
Fig. 3 is the schematic diagram that double-sided illumination solidifies scheme.
Fig. 4 is the schematic diagram of the lens module in light source and its front.
Fig. 5 be using internal channel function of injection material from syringe to flexible substrate schematic diagram.
Fig. 6 (a) and Fig. 6 (b) is the schematic diagram of channel depth in the flexible substrate of light source pattern intensity and formation.
Fig. 7 (a) to Fig. 7 (d) is the schematic diagram of the flexible substrate formed.
Fig. 8 is that the unidirectional of second embodiment of the invention preparation draws the appearance diagram for stretching impact-resistant flexible device.
Specific embodiment
With reference to the accompanying drawings and examples, specific embodiments of the present invention will be described in further detail.Implement below
Example is not intended to limit the scope of the invention for illustrating the present invention.
First embodiment
Referring to FIG. 1, the preparation of the flexible electronic device and flexible electronic device substrate that are provided in one embodiment of the invention
Method, flexible electronic device to be prepared include having the flexible substrate at concave-convex surface position or internal channel and being located at
Functional structure in the concave-convex surface position or internal channel, the preparation method include:
Step S10: the mixed solution of prepolymer and light curing agent is provided；
Step S20: provide can graphic programming light source；
Step S30: light source is made to form light source figure relevant to the functional structure of flexible electronic device；
Step S40: using light source irradiation solidification prepolymer and light curing agent mixed solution, being formed has concave-convex surface position
Or the flexible substrate of internal channel, the shape and flexible electronic device to be prepared of the concave-convex surface position of formation or internal channel
The shape of the functional structure of part is corresponding.
The preparation method of flexible electronic device provided in an embodiment of the present invention, preparation formed have concave-convex surface position or
After the flexible substrate of internal channel, further includes:
Step S50: it is filled in the concave-convex surface position of the flexible substrate or internal channel and flexible electronic device
The corresponding functional material of function；
Step S60: required flexible electronic device is obtained.
It should be noted that in step slo, the mixed solution of the prepolymer and light curing agent that provide, which is placed in, contains vessel
It is interior, and be placed on illumination platform.The vessel that contain in the present embodiment can be ready-made large container (such as rectangle or circle
Beaker, culture dish etc.), or flake contains vessel, such as glass slide, plastic tab etc., is thin when containing vessel
It, can be in the surrounding point higher liquid of note viscosity for containing vessel as wall is intercepted, to prevent container ware when sheet contains vessel
Inside more less viscous liquid flows everywhere, certainly, if the liquid viscosity contained in vessel is larger, can also not have to point note and intercept
Wall.It should be understood that containing vessel is preferably transparent vessel for the ease of light transmission, also, the material for containing vessel can be with
It is selected as needed, such as can be glass, PU (polyurethane), PDMS (dimethyl silicone polymer) etc..It contains in vessel
The height of mixed solution can be designed according to the thickness of flexible substrate to be prepared.
In step slo, the prepolymer of flexible electronic device preparation field is mainly photosensitive resin material, can be certain
The liquid monomer or liquid-state oligomers of kind photosensitive resin, when by the light irradiation Shi Keyu light curing agent reaction generation photosensitive tree
The high polymer of rouge is completed from liquid to solid variation.Prepolymer of the invention may include epoxy resin, acrylate
Class, polyester resin, phenolic resin etc..Epoxy resin material includes bisphenol A type epoxy resin (DGEBA resin), bisphenol S type ring
Oxygen resin (DGEBS resin) etc., acrylate materials include polymethacrylates, urethane acrylate etc..
In step slo, the light curing agent provided is also known as photoinitiator, light curing agent molecule to the light of specific wavelength,
Such as ultraviolet light (wavelength is 250~400nm), visible light (wavelength is 400~800nm), infrared light, laser or chemiluminescence,
With certain absorbing ability, after directly or indirectly absorbing luminous energy, light curing agent molecule can be single from ground state transition to excitation
Line state alters jump to excited triplet state between being；In excited singlet or triplet state after unimolecule or bimolecular chemical action, produce
Life can cause the biologically active fragment of monomer polymerization, these biologically active fragments can be free radical, cation, anion etc..According to drawing
The difference of mechanism is sent out, light curing agent can be divided into free radical polymerization light curing agent and cation photocuring agent.According to design feature, light
Curing agent may include following several classes: 1, benzoin and its derivative (including styrax, benzoin dimethylether, benzoin ethyl ether,
Benzoin isopropyl ether, benzoin isobutyl ether etc.)；2, benzil class (including diphenylethan, α, alpha, alpha-dimethyl oxygroup-α-phenyl benzene second
Ketone)；3, alkylbenzene ketone (including α, α-diethoxy acetophenone, alpha-hydroxyalkyl benzophenone, α-amine alkyl phenones)；4, acyl group phosphorus oxygen
Compound (including aroyl phosphine oxide, bis(benzoylphenyl) phosphine oxide)；5, benzophenone (including benzophenone, 2,4-
Dihydroxy benaophenonel, Michler's keton)；6, thioxanthones (including thio propoxyl group thioxanthone, isopropyl thioxanthone).
In step slo, the material of the prepolymer and light curing agent that provide is according to flexible electronic device to be prepared
Substrate material is selected, and the mass percent (wt%) of prepolymer and light curing agent can be according to flexible electronic device to be prepared
The elasticity modulus (can level of stretch or flexible degree) of part substrate determines, in the present embodiment, prepolymer and photocuring
The mass percent of agent is 94:6~99:1, for example, the mass percent of polyacrylate and 819 light curing agent of Ingacure
For 95:5~99:1, the mass percent of polyacrylate and Irgacure 250 are 94:6~98:2.If more light is added
The flexible substrate of curing agent, formation is harder, is not easy to be stretched or bend, if the light curing agent being added is less, in formation
Flexible substrate is softer, is easier to be stretched or bend.
In step slo, first prepolymer can be uniformly mixed with light curing agent, then by it down to containing on vessel,
First prepolymer and light curing agent can be put into and contain vessel, then be mixed uniformly.
In step slo, molten comprising prepolymer and light curing agent can be made to mix since the wavelength cover of white light is wider
The wave band that liquid is cured, therefore, in order to guarantee that mixed solution is not cured in mixed process, present invention preferably employs in Huang
Mixed solution is prepared in light.
As shown in Figures 2 and 3, in step S20, the light source 11 provided includes single surface light source and two-sided light source, if providing
Light source 11 be single surface light source, then the light source 11 is located at the upside or downside of illumination platform 12, if provide light source 11 be it is two-sided
Light source, then the light source 11 is located at the two sides up and down of illumination platform 12.If the functional structure shape of flexible electronic device to be prepared
At in substrate surface, then the single surface of mixed solution is irradiated using light source 11, pass through consolidating for control mixed solution different piece
Change speed and form the flexible substrate with concave-convex surface position when solidifying mixed solution, such as shown in Fig. 7 (a) to Fig. 7 (c)
Flexible substrate.If the functional structure of flexible electronic device to be prepared is formed in substrate interior, irradiated using light source 11 mixed
Two surfaces for closing solution, the curing depth by controlling mixed solution different piece form the flexible liner with internal channel
Bottom, such as the flexible substrate for referring to capacitor is inserted shown in Fig. 7 (d).
In the present invention, the coverage area for the illumination wavelength that light source 11 is capable of providing is selected according to the type of light curing agent
It selects, the illumination wavelength of light source 11 is made to cover the photocuring wavelength of light curing agent, such as the light that Irgacure819 light curing agent needs
405nm should be covered according to wavelength, the illumination wavelength that Irgacure 250 needs should cover 365nm.
In the present invention, the light source 11 provided can be LED array, laser array, fluorescence, LCD, mercury lamp etc..The present invention
The camera lens of the 11 similar projection machine of light source of offer, the image that programming can be formed (are similar to the files such as PPT, word in computer
The pattern of formation) it is exposed on mixed solution by camera lens, form required light source figure.It is array of source in the light source of offer
Embodiment in, required light source figure can also be formed by the way of the light source for lighting corresponding position.Light source of the invention
11 images that can be provided can be lines, single-point, circuit, electrical part, even one secondary picture.In step s 30, by light
Source 11 is patterned programming, and light source is made to form light source figure relevant to the functional structure of flexible electronic device to be prepared
Shape, specifically, the channel in light source figure correspond to the functional structure of flexible electronic device.As shown in figure 4, light provided by the invention
The front in source 11 is additionally provided with lens module, and the lens module in the present embodiment includes pattern amplifying lens 13 and light ray parallel lens
15, pattern amplifying lens 13 is set to the front of light source 11, the pattern irradiated for amplifying light source 11 along light going direction.Light
Line parallel lens 15 are set to the front of pattern amplifying lens 13 along light going direction, for pattern amplifying lens 13 to be transmitted through
Light be converted into parallel rays, in the present embodiment, these parallel rays perpendicular to mixed solution liquid level, consequently facilitating
The concave-convex surface position of flexible substrate and the formation of internal channel are controlled in subsequent irradiation process.In one embodiment,
The pattern amplifying lens 13 and the light ray parallel lens 15 can penetrate ultraviolet light, and the ultraviolet light of the transmission can be consolidated
Change the mixed solution of prepolymer and light curing agent.
In the present invention, light source 11 also has the characteristics that intensity of illumination is adjustable (i.e. brightness is adjustable), the corresponding part of light source
Intensity of illumination chosen according to the three-dimensional appearance of flexible electronic device functional structure to be prepared, also, the illumination of light source 11
Intensity can be controlled by the gray scale of the light source figure of programming formation, as shown in Fig. 6 (a) and 6 (b), program the pattern of formation
The place of gray scale bigger (i.e. 11 brightness of light source and light intensity are smaller), corresponding curing depth is more shallow, smaller (the i.e. light source of pattern gray scale
11 brightness and light intensity are bigger) place, corresponding curing depth is deeper.
In step s 40, irradiation duration curing time according to needed for prepolymer of light source 11 determines.Needed for prepolymer
Curing time can be according to the light curing agent material and photocuring in the illumination wavelength, intensity of illumination and mixed solution of light source 11
Agent mass percent and required curing depth etc. determine.Light of the illumination wavelength that light source 11 provides closer to light curing agent
Solidify wavelength, the curing rate of prepolymer is faster, and the irradiation duration needed is shorter.The illumination of light source 11 is stronger, and prepolymer is consolidated
Change speed is faster, and the irradiation duration needed is shorter.Light curing agent is more, and the curing rate of prepolymer is faster, when the irradiation needed
Length is shorter.Curing depth is more shallow, and the irradiation duration that prepolymer needs is shorter.
In step s 40, the flexible substrate of formation has surface relief position or internal channel, the concave-convex surface of formation
Salient point (light that each salient point in flexible substrate use intermediate bright both sides dark of the position for example including flexible substrate surface in Fig. 7 (a)
The irradiation of source 11 is formed), (each concave point in flexible substrate is bright using intermediate dark both sides for the concave point on flexible substrate surface in Fig. 7 (b)
Light source 11 irradiation formed) and Fig. 7 (c) in flexible substrate surface runner, the concave-convex surface position of formation with it is to be prepared
The functional structure of flexible electronic device is corresponding, and the internal channel of formation is for example including the channel inside flexible substrate in Fig. 5, shape
At internal channel it is also corresponding with the functional structure of flexible electronic device to be prepared.The concave-convex surface position of flexible substrate
It irradiates to be formed by single side, internal channel is formed by double-sided illumination.
In the present invention, after step S40 (forming the flexible substrate with concave-convex surface position or internal channel) also
It may include: to remove flexible substrate on vessel by containing.Laser can be used when removing flexible substrate on vessel by containing
Cutting, perching knife scrape off, remove manually or smear in advance on containing vessel the modes such as grease (convenient for removing after solidification).
It further, can also include: to remove in concave-convex surface position or internal channel after step S40 of the invention
Uncured mixed solution.It can be using injection when removing uncured mixed solution in concave-convex surface position or internal channel
The mode that device or waterleaf paper are drawn, can also be by the way of drying or evaporation, and according to the mode of evaporation, heating temperature cannot
It is too high, in order to avoid influence the shape of flexible substrate.
As shown in figure 5, in step s 50, function material is filled in the concave-convex surface position of flexible substrate or internal channel
When material, the mode of syringe injection can be used.The functional material of injection is fluent material, which can be liquid gold
Category, non-newtonian fluid (such as blood of human body, lymph, cyst fluid etc.), conductive metal slurry, carbon nano pulp, organic conductive liquid
Body etc., it is specific to need to be selected according to flexible electronic device to be processed, for example, if desired processing flexibility circuit board, can infuse
Enter liquid metal, if desired process impact-resistant flexible device, rubber solutions etc. can be injected.
Second embodiment
Target: it prepares a kind of can unidirectionally draw and stretches impact-resistant flexible substrate and flexible device (flexible device surface structure is such as
Shown in Fig. 8).
Preparation flow: in the yellow light, by bisphenol A epoxy acrylate and light curing agent Irgacure819 (CAS:
It 162881-26-7) is mixed according to the mass percent of 95:5~99:1 (preferably 98:2), mixed solution is placed on culture dish
Interior (solution height is 700 microns in culture dish), and culture dish is placed on illumination platform；
Using mercury lamp as light source (light source covers the photocuring wavelength of 405nm, and mercury lamp power is 100W), light source is compiled
Volume, the light source figure of formation includes the serpentine curve along single direction；
Using light source double-sided illumination mixed solution, when irradiation, is 1 minute a length of；
Light source is closed after 1 minute, obtains the internal flexible substrate with serpentine channels；
By cured flexible substrate by being taken out in culture dish；
The uncured solution in channel is sucked out by syringe, liquid rubber solution is injected into internal channel, is gone forward side by side
Row sealing treatment；
Form the shock resistance with simple tension performance and the flexible device with memory function.
3rd embodiment
Target: it prepares and a kind of slotting refer to that electrode flexible substrate and the liquid metal with it are inserted and refer to that capacitor (is inserted and refers to the outer of capacitor
It sees shown in structure such as Fig. 7 (d))
Preparation flow: in the yellow light, by bisphenol A type epoxy resin and light curing agent Irgacure 250 according to 94:6~
The mass percent (preferably 96:4) of 98:2 mixes, and mixed solution is placed in culture dish to (solution height is in culture dish
500 microns), and culture dish is placed on illumination platform；
Using UVA ultraviolet lamp as light source (light source covers the photocuring wavelength of 365nm, and ultraviolet lamp power is 10W), to light source
It is edited, the light source figure of formation includes the slotting finger electrode of two rows of pectinations；
Using light source double-sided illumination mixed solution, when irradiation, is 30 seconds a length of；
Light source is closed after 30 seconds, obtains inserting the flexible substrate for referring to electrode；
By cured flexible substrate by being taken out in culture dish；
The uncured solution in channel is sucked out by syringe, liquid gallium indium tin liquor state metal alloy is injected into channel
It is interior, and carry out sealing treatment；
Being formed, there is liquid metal to insert the slotting finger capacitor for referring to electrode.
Fourth embodiment
Target: a kind of micro-fluidic detection chip and its flexible substrate (surface structure of micro-fluidic detection chip such as Fig. 7 are prepared
(c) shown in)
Preparation flow: in the yellow light, by bisphenol A type epoxy resin and light curing agent Irgacure 250 according to 94:6~
The mass percent (preferably 96:4) of 98:2 mixes, and mixed solution is placed in culture dish that (solution height is 800 in culture dish
Micron), and culture dish is placed on illumination platform；
Using UVA ultraviolet lamp as light source (light source covers the photocuring wavelength of 365nm, and ultraviolet lamp power is 10W), to light source
It is edited, the light source figure of formation includes figure shown in Fig. 7 (c).
Mixed solution is irradiated from bottom single side using light source, when irradiation is 30 seconds a length of；
Light source is closed after 30 seconds, obtains the flexible substrate with shape shown in Fig. 7 (c)；
By cured flexible substrate by being taken out in culture dish；
The gold nano grain of liver cancer cells antibody is loaded in the injection of the surface indentation position of flexible substrate by syringe, and
It is attached to it in channel；
Form the flexible microfluidic control chip with liver cancer cells screening function.
In conclusion the preparation method of both flexible electronic device substrate of the invention and flexible electronic device is with following
At least one of advantage:
1. the present invention forms the flexible substrate of concave-convex surface position or internal channel by the way of illumination curing, and in shape
At flexible substrate concave-convex surface position or internal channel in function of injecting material, obtain required flexible electronic device, should
Flexible substrate one-pass molding in process, easy to process, good airproof performance.
2. the present invention is graphical by the concave-convex surface position of the graphical realization flexible substrate of light source or internal channel,
Processing method is flexible, can form the flexible substrate with different structure without molding die, and being particularly suitable for processing has again
The flexible substrate of miscellaneous structure；
3. the present invention can and by the intensity of illumination of light source, illumination wavelength and irradiate duration variation, control mixing it is molten
The curing rate and curing depth of liquid, to control the cross sectional shape of the channel of formation.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Herein, the terms "include", "comprise" or any other variant thereof is intended to cover non-exclusive inclusion, are removed
It comprising those of listed element, but also may include other elements that are not explicitly listed.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (15)
1. a kind of preparation method of flexible electronic device substrate, characterized by the following steps:
The mixed solution of prepolymer and light curing agent is provided；
There is provided can graphic programming light source；
Light source is set to form light source figure relevant to the functional structure of flexible electronic device；
Solidification prepolymer and light curing agent mixed solution is irradiated using light source, being formed has concave-convex surface position or internal channel
The functional structure of flexible substrate, the concave-convex surface position of formation or the shape of internal channel and flexible electronic device to be prepared
Shape it is corresponding.
2. the preparation method of flexible electronic device substrate as described in claim 1, which is characterized in that the prepolymer includes light
The liquid monomer or liquid-state oligomers of quick resin.
3. the preparation method of flexible electronic device substrate as described in claim 1, which is characterized in that the light source is to described mixed
Solution progress single side is closed to irradiate to form the flexible substrate with concave-convex surface position.
4. the preparation method of flexible electronic device as claimed in claim 3, which is characterized in that different by control mixed solution
The concave-convex surface position of flexible substrate is formed when partial curing rate solidifies mixed solution.
5. the preparation method of flexible electronic device substrate as described in claim 1, which is characterized in that the light source is to described mixed
It closes solution and carries out the flexible substrate that double-sided illumination formation has internal channel.
6. the preparation method of flexible electronic device substrate as described in claim 1, which is characterized in that the illumination wave of the light source
It is long to be chosen according to the type of light curing agent.
7. the preparation method of flexible electronic device substrate as described in claim 1, which is characterized in that the illumination of the light source is strong
Degree is chosen according to the three-dimensional appearance of flexible electronic device functional structure.
8. the preparation method of flexible electronic device substrate as described in claim 1, which is characterized in that when the irradiation of the light source
The long curing time according to needed for the prepolymer determines.
9. the preparation method of flexible electronic device substrate as described in claim 1, which is characterized in that the light source along light
The front of direction of travel is equipped with light ray parallel lens, and the light ray parallel lens are used to the light transmitted being converted into directional light
Line, surface of the parallel rays perpendicular to the mixed solution.
10. the preparation method of flexible electronic device substrate as claimed in claim 9, which is characterized in that the light source along light
Pattern amplifying lens is additionally provided in front of line direction of travel, the pattern amplifying lens is set to the light source and the light ray parallel
Between lens, the pattern that is irradiated for amplifying the light source.
11. a kind of preparation method of flexible electronic device, which is characterized in that the described method includes: using such as claim 1-10
Any one of described in preparation method preparation there is the flexible substrate of concave-convex surface position or internal channel after, in the flexible liner
Filling functional material corresponding with the function of the flexible electronic device, obtains institute in the concave-convex surface position at bottom or internal channel
State flexible electronic device.
12. the preparation method of flexible electronic device as claimed in claim 11, which is characterized in that the preparation method is being filled
It include: to remove uncured mixed solution in concave-convex surface position or internal channel before functional material.
13. the preparation method of flexible electronic device as claimed in claim 11, which is characterized in that the functional material is fluid
Material.
14. the preparation method of flexible electronic device as claimed in claim 13, which is characterized in that the fluent material includes liquid
State metal, non-newtonian fluid, conductive metal slurry, carbon nano pulp and organic conductive liquid.
15. the preparation method of flexible electronic device as claimed in claim 13, which is characterized in that in the table of the flexible substrate
It is injected when filling fluent material using syringe in face concave and convex part or internal channel.
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| CN109768186B (en) | 2023-04-18 |
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