CN109766829A - Fingerprint identification device and fingerprint recognition panel - Google Patents

Fingerprint identification device and fingerprint recognition panel Download PDF

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Publication number
CN109766829A
CN109766829A CN201910019420.7A CN201910019420A CN109766829A CN 109766829 A CN109766829 A CN 109766829A CN 201910019420 A CN201910019420 A CN 201910019420A CN 109766829 A CN109766829 A CN 109766829A
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layer
buckling
fingerprint identification
fingerprint
receiving layer
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CN201910019420.7A
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CN109766829B (en
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俞芳
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Guangzhou Guoxian Technology Co Ltd
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Kunshan Guoxian Photoelectric Co Ltd
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Abstract

The present invention provides a kind of fingerprint identification device and fingerprint recognition panel, is related to fingerprint identification technology, is able to solve the existing optical finger print mould group problem more demanding to screen body thickness.The present invention includes: buckling layer, sensing receiving layer and fingerprint identification module;Wherein, the buckling layer is made by having elasticity and capableing of the material of conduction;The sensing receiving layer and the buckling layer are oppositely arranged and have between the sensing receiving layer and the buckling layer buckling gap, and the buckling gap is used to accommodate the buckling layer when depressed toward the deformation in the sensing receiving layer direction;The sensing receiving layer and the buckling layer are electrically connected with the fingerprint identification module, and the deformation that the fingerprint identification module is used for according to the buckling layer when depressed determines the field distribution between sensing receiving layer and the buckling layer.

Description

Fingerprint identification device and fingerprint recognition panel
Technical field
The present invention relates to fingerprint identification technology more particularly to a kind of fingerprint identification devices and fingerprint recognition panel.
Background technique
It is at present the information security of protection user, use of the fingerprint identification function on the intelligent terminals such as mobile phone is more and more general Time, for example for intelligent terminal unlock and mobile payment etc., this is brought while protecting user information safety to user Great convenience.
In the prior art, optical finger print mould is arranged by the back side in intelligent terminal screen body namely the surface away from user Group is shielded the light that the organic light-emitting units in body issue and is shielded after the reflection of the different-energy of the Wave crest and wave trough of finger print The optical finger print mould group at the body back side receives, and by the capacity volume variance of Wave crest and wave trough, distinguishes Wave crest and wave trough and form fingerprint image Picture realizes screen body fingerprint identification function eventually by algorithm.
However, since the light intensity of the organic light-emitting units transmitting in screen body itself has certain limitation, organic light emission list The transparent thickness of light of member transmitting is typically small, therefore higher to the thickness requirement of screen body, and the setting of optical finger print identification Also have an impact to the pixel distribution in screen body, is unfavorable for realizing the high-resolution of screen body.
Summary of the invention
In view of the above-mentioned drawbacks in the prior art, the present invention provides a kind of fingerprint identification device and fingerprint recognition panel, energy Enough overcome the problems, such as more in the prior art.
First aspect of the present invention is to provide a kind of fingerprint identification device, comprising: buckling layer, sensing receiving layer and fingerprint are known Other module;Wherein, the buckling layer is made by having elasticity and capableing of the material of conduction;The sensing receiving layer and the buckling Layer is oppositely arranged and has buckling gap between the sensing receiving layer and the buckling layer, and the buckling gap is for accommodating institute Buckling layer is stated when depressed toward the deformation in the sensing receiving layer direction;The sensing receiving layer and the buckling layer with The fingerprint identification module electrical connection, the fingerprint identification module are used for the deformation according to the buckling layer when depressed and determine Sense the field distribution between receiving layer and the buckling layer.
In a kind of wherein possible implementation, the buckling layer is made of graphene aerogel, so that buckling layer has Good elasticity and sensitivity, can be improved the accuracy of fingerprint recognition, and fingerprint identification device is made to have longer use Service life.
In a kind of wherein possible implementation, the sensing receiving layer has the first surface towards the buckling layer; The orthographic projection of the buckling layer on the first surface is located in the first surface, to improve the accuracy of fingerprint recognition.
Initial buckling gap in a kind of wherein possible implementation, between the buckling layer and the sensing receiving layer Greater than the maximum distance in fingerprint between fingerprint peaks and fingerprint valley, in order to avoid buckling layer is contacted with sensing receiving layer, guarantee that fingerprint is known Other accuracy.
In a kind of wherein possible implementation, the sensing receiving layer includes matrix, is provided in described matrix multiple Equally distributed acquisition unit, each acquisition unit are used to acquire the electric signal of respective corresponding region, the fingerprint recognition mould Block is used to be determined between the sensing receiving layer and the buckling layer according to the electric signal of the multiple acquisition units received The field distribution, to guarantee the accuracy of fingerprint recognition.
In a kind of wherein possible implementation, the fingerprint identification device further includes setting in the buckling layer and described The interconnecting piece that is made of insulating material between sensing receiving layer, the buckling gap be located at the interconnecting piece, the buckling layer with And in the region that surrounds of sensing receiving layer.In this way, be not only able to achieve to sensing receiving layer fixation, but also can guarantee buckling layer with Sense the buckling gap between receiving layer.
In a kind of wherein possible implementation, the interconnecting piece is positioned close to the marginal position of the buckling layer, and The interconnecting piece forms the annular of closure, in case the deformation of interconnecting piece interference buckling layer, guarantees the accuracy of fingerprint recognition, this Outside, additionally it is possible to guarantee the support reliability of interconnecting piece.
In a kind of wherein possible implementation, the interconnecting piece is Nian Jie with the buckling layer, to simplify assembly technology simultaneously Guarantee connection reliability.
In a kind of wherein possible implementation, the interconnecting piece is Nian Jie with the sensing receiving layer, to simplify assembler Skill simultaneously guarantees connection reliability.
In a kind of wherein possible implementation, the fingerprint identification module is also used to the field distribution and in advance The field distribution of storage is matched, and determines whether the fingerprint currently recognized is authorization fingerprint according to the matching result.
In a kind of wherein possible implementation, the electricity for the fingerprint that the fingerprint identification module is also used to currently to recognize Field distribution is stored.
The second aspect of the present invention is to provide a kind of fingerprint recognition panel, including screen body and as aforementioned described in any item Fingerprint identification device, the fingerprint identification device are arranged on the screen body.
In a kind of wherein possible implementation, the screen body is provided with fingerprint identification region, the fingerprint identification device It is bonded in the fingerprint identification region, to simplify assembly technology and guarantee connection reliability.
Fingerprint identification device provided by the invention and fingerprint recognition panel, by being arranged by there is elasticity and be capable of conduction Buckling layer made of material, by the way that sensing receiving layer opposite and spaced with buckling layer is arranged, so that buckling layer and sensing Have between receiving layer for accommodating the buckling layer when depressed toward the buckling of the deformation for sensing receiving layer direction Gap, and by setting and the fingerprint identification module that senses receiving layer and buckling layer and be electrically connected, enables fingerprint identification module Enough deformations according to buckling layer when depressed determine the field distribution between sensing receiving layer and the buckling layer, and then basis Determining field distribution realizes the identification or acquisition to current finger print.In this way, the present invention is without using light through fingerprint wave crest Capacity volume variance after trough reflection identifies fingerprint, does not require to the light translucency of screen body, is not influenced by screen body thickness, It can guarantee the accuracy of fingerprint recognition, and will not influence pixel distribution in screen body, conducive to the resolution ratio for improving screen body.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows and meets implementation of the invention Example, and be used to explain the principle of the present invention together with specification.
Fig. 1 is the structural schematic diagram one of fingerprint recognition panel provided in this embodiment;
Fig. 2 is the deformation schematic diagram of buckling layer during fingerprint pressing;
Fig. 3 is the structural schematic diagram that fingerprint recognition panel provided in this embodiment senses receiving layer;
Fig. 4 is the structural schematic diagram two of fingerprint recognition panel provided in this embodiment.
Description of symbols:
100- fingerprint recognition panel;
110- screen body;110a- fingerprint identification region;
120- fingerprint identification device;121- buckling layer;122- senses receiving layer;122a- matrix;122b- acquisition unit; 123- interconnecting piece;
201- fingerprint peaks;202- fingerprint valley.
Through the above attached drawings, it has been shown that the specific embodiment of the present invention will be hereinafter described in more detail.These attached drawings It is not intended to limit the scope of the inventive concept in any manner with verbal description, but is by referring to specific embodiments Those skilled in the art illustrate idea of the invention.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is A part of the embodiment of the present invention, instead of all the embodiments.
Based on the embodiments of the present invention, those of ordinary skill in the art are obtained without making creative work The every other embodiment obtained, shall fall within the protection scope of the present invention.In the absence of conflict, following embodiment and implementation Feature in example can be combined with each other.
Wherein, the term of "upper", "lower" etc. is for describing the relative positional relationship of each structure in the accompanying drawings, only Convenient for being illustrated for narration, rather than to limit the scope of the invention, relativeness is altered or modified, in no essence It changes under technology contents, when being also considered as the enforceable scope of the present invention.
Fig. 1 is the structural schematic diagram one of fingerprint recognition panel provided in this embodiment;Fig. 2 is during fingerprint presses, to refer to The structural schematic diagram of line identification device;Fig. 3 is the structural schematic diagram that fingerprint recognition panel provided in this embodiment senses receiving layer; Fig. 4 is the structural schematic diagram two of fingerprint recognition panel provided in this embodiment.Wherein, in Fig. 1, L1Indicate initial buckling gap; In Fig. 2, L2Indicate the maximum distance between fingerprint peaks and fingerprint valley.
Fig. 1-Fig. 4 is please referred to, the present embodiment provides a kind of fingerprint recognition panels 100, including screen body 110 and setting to shield Fingerprint identification device 120 on body 110.Wherein, fingerprint identification device 120 can include: buckling layer 121, sensing receiving layer 122 and Fingerprint identification module.Buckling layer 121 is made by having elasticity and capableing of the material of conduction;Sense receiving layer 122 and buckling layer 121 Being oppositely arranged and sensing has buckling gap between receiving layer 122 and buckling layer 121, buckling gap is for accommodating buckling layer 121 Toward the deformation in sensing 122 direction of receiving layer when depressed;Sense receiving layer 122 and buckling layer 121 and fingerprint recognition mould Block electrical connection, fingerprint identification module are used for the deformation according to buckling layer 121 when depressed and determine sensing receiving layer 122 and buckling Field distribution between layer 121.
Illustratively, screen body can be OLED (Organic Light-Emitting Devices, Organic Light Emitting Diode) Shield body.Such as: screen body 110 may include substrate and encapsulated layer, and substrate and encapsulated layer can be formed with confined space, set in confined space Organic light-emitting units are equipped with, organic light-emitting units include the film layers such as anode, organic luminous layer, cathode, and anode, cathode are non-luminescent Zone position is drawn by lead, carries out bonding with integrated circuit (IC) or flexible circuit board (FPC).In some instances, encapsulated layer On be also provided with touch control layer, touch control layer executes input for finger, stylus etc., to realize human-computer interaction.
Screen body 110 may be provided with fingerprint identification device 120 away from the surface of user.The buckling layer of fingerprint identification device 120 121 can be made by having elasticity and capableing of the material of conduction, in this way, the pressure that user applies can when fingerprint presses screen body 110 Shielded body 110 and pass to buckling layer 121, buckling layer 121 occurs to deform accordingly.Wherein, (referred to as due to different fingerprint lines For fingerprint) in, fingerprint peaks 201, the distribution of fingerprint valley 202 are different;That is, in different fingerprints, the distributed area of fingerprint peaks 201 Domain, the distributed areas of fingerprint valley 202 are different.When buckling layer 121 is pressurized, different fingerprints also result in buckling layer 121 and shape occur Become different.
In some instances, buckling layer 121 can be made of graphene aerogel namely flexible (high least) and Capableing of conductive material may include graphene aerogel so that buckling layer 121 have good ballistic properties, photopermeability and compared with Light quality.
Certainly, the material that buckling layer 121 uses is not limited to this, and flexible and can be conductive material also may include tool Flexible high molecular material and conductive material, in this way, being both able to maintain the good elasticity of high molecular material, while in height rebound material When buckling 121 compression deformation of layer made of expecting, the electric signal between buckling layer 121 and sensing receiving layer 122 can also occur corresponding Variation, namely sensing receiving layer 122 and buckling layer 121 between field distribution can also change.
In some instances, buckling layer 121 can be plate structure, and the buckling layer 121 of plate can pass through optical cement and screen body 110 are adhesively fixed;It is of course also possible to form buckling layer 121 on screen body 110 by other techniques.
In some instances, buckling layer 121 may be provided on at least partly surface of screen body 110;Namely buckling layer 121 can At least partly surface of covering screen body 110;Namely at least partly surface of screen body 110 forms fingerprint identification region 110a, buckling Layer 121 is arranged in fingerprint identification region 110a.The present embodiment does not do specifically the setting position of fingerprint identification region 110a It limits, can specifically be configured according to actual needs;Such as: fingerprint identification region 110a may be provided at the middle part of screen body 110 Or lower part.The present embodiment is not specifically limited the size of fingerprint identification region 110a area, specifically can be according to reality It needs to be configured;Such as: the area of fingerprint identification region 110a can be the half of screen 110 surface area of body.
In the present embodiment, the shape of buckling layer 121 can be adapted with the shape of fingerprint identification region 110a.In some examples In, when fingerprint identification region 110a is round, buckling layer 121 can also be round plate body;Buckling layer 121 can also be with fingerprint recognition Region 110a is arranged concentrically.In other examples, when fingerprint identification region 110a is rectangle, buckling layer 121 can be rectangle Plate body;The center of buckling layer 121 can also be overlapped with the center of fingerprint identification region 110a, to guarantee the accurate of fingerprint recognition Property.Wherein, buckling layer 121 can also be greater than or equal to the face of fingerprint identification region 110a towards the area on the surface of screen body 110 Product.
Buckling layer 121 is provided with sensing receiving layer 122 far from the side of screen body 110.Wherein, buckling layer 121 connects with sensing Receiving layer 122 can connect with fingerprint identification module, and fingerprint identification module can connect to power supply.
Sensing receiving layer 122 is oppositely arranged with buckling layer 121, and the shape for sensing receiving layer 122 can be suitable with 121 phase of buckling layer Match, to guarantee the accuracy of fingerprint recognition.In some instances, buckling layer 121 is rectangle, and sensing receiving layer 122 is also rectangle, And the center for sensing receiving layer 122 is overlapped with the center of buckling layer 121.In other examples, buckling layer 121 is circle, is passed Feeling receiving layer 122 also is circle, and senses receiving layer 122 and be arranged concentrically with buckling layer 121.
Wherein, buckling layer 121 is located at orthographic projection of the sensing receiving layer 122 on screen body 110 in the orthographic projection on screen body 110 In, to improve the accuracy of fingerprint recognition.That is, setting sensing receiving layer 122 towards the surface of buckling layer 121 as first When surface, the orthographic projection on the first surface of buckling layer 121 is located in first surface.
In some instances, sense receiving layer 122 towards the surface of buckling layer 121 area be equal to, 121 direction of buckling layer The area on the surface of receiving layer 122 is sensed, namely sensing receiving layer 122 can be of the same size with buckling layer 121.Another In a little examples, the area on sensing receiving layer 122 towards the surface of buckling layer 121 can be greater than, buckling layer 121 is towards sensing receiving layer The area on 122 surface.
Buckling layer 121 and sensing receiving layer 122 are also spaced setting, so as to have between sensing receiving layer 122 and buckling layer 121 There is certain buckling gap, buckling gap is used to accommodate buckling layer 121 when depressed toward the change in sensing 122 direction of receiving layer Shape.When buckling layer 121 is in depressed deformation, the partial region of buckling layer 121 senses the buckling gap between receiving layer 122 It will change, so that the electric signal between the partial region of buckling layer 121 and sensing receiving layer 122 changes, The field distribution sensed between receiving layer 122 and buckling layer 121 will change.
Since in different fingerprints, distributed areas, the distributed areas of fingerprint valley 202 of fingerprint peaks 201 are different.When buckling layer 121 when being pressurized, and different fingerprints also result in buckling layer 121 deformation occurs different, and then leads to buckling layer 121 and sensing receiving layer The region of change in electric between 122 is different, namely causes to sense the field distribution between receiving layer 122 and buckling layer 121 It is different.It therefore, is corresponding electric signal, subsequent fingerprint identification module by the deformation by detecting the deformation of buckling layer 121 By carrying out processing to electric signal and analyzing the acquisition or identification realized to fingerprint.
Wherein, when buckling layer 121 is not pressurized namely buckling layer 121 does not deform, buckling layer 121 and sensing are received Layer 122 can be arranged in parallel, at this point, the buckling gap between buckling layer 121 and sensing receiving layer 122 can be initial buckling gap L1
In some instances, the initial buckling gap L between buckling layer 121 and sensing receiving layer 1221It can be greater than in fingerprint Maximum distance L between fingerprint peaks 201 and fingerprint valley 2022, sensing can be accurately collected in order to sense receiving layer 122 The variation of electric signal between receiving layer 122 and buckling layer 121, to improve the accuracy of fingerprint recognition.Wherein, receiving layer is sensed 122 can be formed by force-sensing sensor or pressure sensor.
Illustratively, sensing receiving layer 122 may include matrix 122a, and multiple equally distributed adopt is provided on matrix 122a Collect unit 122b, acquisition unit 122b can be made of an electrically conducting material, insulation set between adjacent acquisition unit 122b;Each acquisition Unit 122b is used to acquire the electric signal of respective corresponding region, and fingerprint identification module is according to the multiple acquisition unit 122b received Electric signal determine sensing receiving layer 122 and buckling layer 121 between field distribution.
Such as: when there is fingerprint pressing screen body 110, under the action of fingerprint peaks 201,121 multiple regions of buckling layer can Corresponding deformation occurs, thus the buckling gap between the region that buckling layer 121 deforms and corresponding acquisition unit 122b Also the electric signal between the region that can be changed, and then buckling layer 121 is caused to deform and corresponding acquisition unit 122b It changes, namely the field distribution between sensing receiving layer 122 and buckling layer 121 will change.
Wherein, for different fingerprints, under the action of fingerprint peaks 201, the deformed region of buckling layer 121 not phase Together, so that also the changed region of not identical namely electric signal is not identical the changed region in buckling gap, namely sensing Field distribution between receiving layer 122 and buckling layer 121 is different.Fingerprint identification module can be according to the fingerprint of pressing screen as a result, Field distribution realize acquisition or identification to fingerprint.
It below might as well be for being provided with the mobile phone of the fingerprint recognition panel 100, to the function and reality of fingerprint identification module Existing process is illustrated.
In some instances, when mobile phone needs to acquire and store fingerprint, current finger print is determined in fingerprint identification device 120 After the field distribution of (fingerprint of current press screen body), fingerprint identification module can be used for depositing the field distribution of current finger print Storage.Wherein, stored fingerprint then can be the authorization fingerprint of the mobile phone.
In some instances, in handset identity fingerprint, the field distribution of current finger print is determined in fingerprint identification device 120 Afterwards, fingerprint identification module can be used for by field distribution matched with pre-stored field distribution, and according to matching result Determine whether the fingerprint currently recognized is authorization fingerprint;If it is determined that the fingerprint currently recognized is authorization fingerprint, then allow pair Mobile phone carries out further operating;If the fingerprint currently recognized is not authorization fingerprint, forbid carrying out further operating to mobile phone, Or mobile phone warns.
Certainly, the function of fingerprint identification module is not limited to this, and the present embodiment is merely illustrative herein.
Optionally, fingerprint identification device 120 further includes setting in buckling layer 121 and senses between receiving layer 122 by insulating Interconnecting piece 123 made of material, to be connect buckling layer 121 with sensing receiving layer 122 by interconnecting piece 123;At this time between buckling Gap is located in the region that interconnecting piece 123, buckling layer 121 and sensing receiving layer 122 surround.
In the present embodiment, buckling layer 121 is connect with sensing receiving layer 122 by interconnecting piece 123, then buckling layer 121, biography Sense receiving layer 122 can connect to form an assembling assembly with interconnecting piece 123, then the assembling assembly and screen body 110 are assembled.
Certainly, sensing receiving layer 122 can also be fixed by other components, for example, sensing receiving layer 122 can also pass through Other components are fixedly connected with screen body 110;As long as can be realized the fixation to sensing receiving layer 122, and guarantee sensing receiving layer Initial buckling gap between 122 and buckling layer 121.
In some instances, interconnecting piece 123 is positioned close to the marginal position of buckling layer 121, and the formation of interconnecting piece 123 is closed The annular namely interconnecting piece 123 of conjunction are the outer peripheral circumferentially extending setting namely buckling layer 121, connection along buckling layer 121 Portion 123 and sensing receiving layer 122 surround closed space.Certainly, interconnecting piece 123 can also be between the edge of buckling layer 121 Every and equally distributed multiple connecting plates or connecting column, sensing receiving layer 122 is connect with buckling layer 121 as long as can be realized Purpose, and guarantee sensing receiving layer 122 and buckling layer 121 between initial buckling gap.
In the present embodiment, by the way that interconnecting piece 123 to be arranged in the edge of buckling layer 121, in case interconnecting piece 123 interferes buckling The deformation of layer 121, so as to guarantee the accuracy of fingerprint recognition.
Wherein, interconnecting piece 123 can be Nian Jie with buckling layer 121, alternatively, interconnecting piece 123 can be formed in pressure by other techniques In change layer 121.Interconnecting piece 123 can be Nian Jie with sensing receiving layer 122, alternatively, interconnecting piece 123 can be formed in biography by other techniques Feel on receiving layer 122.
In addition, may be provided between buckling layer 121 and sensing receiving layer 122 when the area of buckling layer 121 is relatively large Multiple support columns, to guarantee that the buckling gap between buckling layer 121 and sensing receiving layer 122 is steady when buckling layer 121 is not pressurized It is fixed.Connection type between support column and buckling layer 121, sensing receiving layer 122 can be similar to interconnecting piece 123, no longer superfluous herein It states.
Fingerprint recognition panel 100 provided in this embodiment is made by being arranged by having elasticity and capableing of the material of conduction Buckling layer 121, by setting with buckling layer 121 opposite and spaced sensing receiving layer 122 so that buckling layer 121 and Have between sensing receiving layer 122 for accommodating buckling layer 121 when depressed toward the deformation for sensing 122 direction of receiving layer Buckling gap, and the fingerprint identification module being electrically connected by setting with sensing receiving layer 122 and buckling layer 121, so that fingerprint Identification module can determine the electricity between sensing receiving layer 122 and buckling layer 121 according to deformation of the buckling layer 121 when depressed Field distribution, and then the identification or acquisition to current finger print are realized according to determining field distribution.In this way, the present invention without using Capacity volume variance after light is reflected through fingerprint Wave crest and wave trough identifies fingerprint, does not require to the light translucency of screen body 110, no It is influenced by screen 110 thickness of body, and will not influence pixel distribution in screen body 110, conducive to the resolution ratio for improving screen body 110.
In addition, the present embodiment also provides a kind of fingerprint identification device 120, structure, function and the reality of fingerprint identification device 120 As hereinbefore, details are not described herein again for existing process.
In the present invention unless specifically defined or limited otherwise, fisrt feature in the second feature " on " or " down " can be with It is that the first and second features directly contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists Second feature " on ", " top " and " above " but fisrt feature be directly above or diagonally above the second feature, or be merely representative of First feature horizontal height is higher than second feature.Fisrt feature can be under the second feature " below ", " below " and " below " One feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
In addition, in the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " Gu It is fixed " etc. terms shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral;It can be It is connected directly, the mutual of connection inside two elements or two elements can also be can be indirectly connected through an intermediary Interactively.For the ordinary skill in the art, it can understand as the case may be above-mentioned term in the present invention Concrete meaning.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations;To the greatest extent Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into Row equivalent replacement;And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution The range of scheme.

Claims (10)

1. a kind of fingerprint identification device characterized by comprising buckling layer, sensing receiving layer and fingerprint identification module;Wherein, The buckling layer is made by having elasticity and capableing of the material of conduction;The sensing receiving layer and the buckling layer be oppositely arranged and Between the sensing receiving layer and the buckling layer have buckling gap, the buckling gap for accommodate the buckling layer by To pressing when toward it is described sensing receiving layer direction deformation;The sensing receiving layer and the buckling layer and the fingerprint recognition Module electrical connection, the fingerprint identification module be used to be determined according to deformation of buckling layer when depressed sensing receiving layer and Field distribution between the buckling layer.
2. fingerprint identification device according to claim 1, which is characterized in that the buckling layer is by graphene aerogel system At.
3. fingerprint identification device according to claim 1, which is characterized in that the sensing receiving layer has towards the pressure The first surface of change layer;The orthographic projection of the buckling layer on the first surface is located in the first surface.
4. fingerprint identification device according to claim 1, which is characterized in that the buckling layer and the sensing receiving layer it Between initial buckling gap be greater than maximum distance between fingerprint peaks and fingerprint valley in fingerprint.
5. fingerprint identification device according to claim 1, which is characterized in that the sensing receiving layer includes matrix, described Multiple equally distributed acquisition units are provided on matrix, each acquisition unit is used to acquire the telecommunications of respective corresponding region Number, the fingerprint identification module is used to determine the sensing receiving layer according to the electric signal of the multiple acquisition units received The field distribution between the buckling layer.
6. fingerprint identification device according to claim 1, which is characterized in that further include setting in the buckling layer and described The interconnecting piece that is made of insulating material between sensing receiving layer, the buckling gap be located at the interconnecting piece, the buckling layer with And in the region that surrounds of sensing receiving layer.
7. fingerprint identification device according to claim 6, which is characterized in that the interconnecting piece is positioned close to the buckling The marginal position of layer, and the interconnecting piece forms the annular of closure.
8. fingerprint identification device according to claim 6, which is characterized in that the interconnecting piece is Nian Jie with the buckling layer; And/or the interconnecting piece is Nian Jie with the sensing receiving layer.
9. fingerprint identification device according to claim 1-8, which is characterized in that the fingerprint identification module is also used Current identification is determined in matching the field distribution with pre-stored field distribution, and according to the matching result To fingerprint whether be authorization fingerprint;Alternatively, the fingerprint identification module is also used to deposit the field distribution of current finger print Storage.
10. a kind of fingerprint recognition panel, which is characterized in that including screen body and such as the described in any item fingerprints of claim 1-9 Identification device, the fingerprint identification device are arranged on the screen body;
Preferably, the screen body is provided with fingerprint identification region, and the fingerprint identification device is bonded in the fingerprint identification region.
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CN112883872B (en) * 2021-02-22 2023-11-07 业泓科技(成都)有限公司 Identification sensing structure, fingerprint identification module and terminal

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