CN109763151A - Can one-pass molding micropore copper foil copper foil manufacturing device - Google Patents
Can one-pass molding micropore copper foil copper foil manufacturing device Download PDFInfo
- Publication number
- CN109763151A CN109763151A CN201910144943.4A CN201910144943A CN109763151A CN 109763151 A CN109763151 A CN 109763151A CN 201910144943 A CN201910144943 A CN 201910144943A CN 109763151 A CN109763151 A CN 109763151A
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- China
- Prior art keywords
- copper foil
- micropore
- counterbore
- cathode
- roll
- Prior art date
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 60
- 239000011889 copper foil Substances 0.000 title claims abstract description 59
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 238000000465 moulding Methods 0.000 title claims abstract description 16
- 239000011888 foil Substances 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims description 12
- 238000005553 drilling Methods 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000004677 Nylon Substances 0.000 claims description 2
- 238000009826 distribution Methods 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920001778 nylon Polymers 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 16
- 230000008569 process Effects 0.000 abstract description 13
- 238000009413 insulation Methods 0.000 abstract description 7
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000001053 micromoulding Methods 0.000 abstract description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 5
- 229910001416 lithium ion Inorganic materials 0.000 description 5
- 239000003792 electrolyte Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Electrolytic Production Of Metals (AREA)
Abstract
The invention belongs to electrolytic copper foil manufacture fields, and in particular to it is a kind of can one-pass molding micropore copper foil copper foil manufacturing device.The present apparatus includes the electrolytic cell being arranged in foil rack, there is the anode plate of the connection positive pole of arc plate in the electrolytic cell, and the vallecular cavity of anode plate forms anode slot；It is coaxially provided with cathode roll connect with power cathode above anode slot, cathode roll and anode slot coaxial cooperation are formed by fit clearance and constitute forming gap for forming copper foil；It is characterized by: at the cathode roll roll surface the recessed micropore shape of array-like counterbore, the counterbore hole it is intracavitary it is coaxial insulated column has been plugged and fixed, insulation column diameter is equal to counterbore aperture, and insulated column top end face is flushed with cathode roll roll surface.The present invention can one-pass molding high density, micron-sized micropore copper foil, and synchronize the advantage for having that process flow is short, micro molding quality is high, production cost is low.
Description
Technical field
The invention belongs to electrolytic copper foil manufacture fields, and in particular to it is a kind of can the copper foil of one-pass molding micropore copper foil manufacture dress
It sets.
Background technique
Currently, lithium ion battery because self-energy density is high, have extended cycle life, self discharge is small the advantages that, be widely used in
The fields such as consumer, IT, communication, energy storage, electric tool, electric car.With the worry and environmental pollution of fossil energy exhaustion
Dual-pressure.The electric vehicle of Green Travel has become state basic policy.Electrical vehicular power is Vehicular accumulator cell, and lithium ion battery is then electricity
The first choice of motor-car, the lithium ion battery of production high-quality, low cost have specific and reality meaning for energy-saving and emission-reduction.
Lithium ion battery is made of materials such as cathode, anode, diaphragm and electrolyte；And cathode, anode collector are copper foils
And aluminium foil.Japan, South Korea compare with China instantly in lithium ion battery manufacture view, still first further than Chinese, wherein
In terms of critical material, there is its unique one side.Such as: collector used in Japan and Korea S widely uses micropore copper foil and copper foil.
Using high density, micron order micropore foil, the contact area between positive and negative pole material and foil, the adhesive force meeting of material can be increased
Enhancing, thus the phenomenon that preferably preventing shedding, drop off, and electrode contact internal resistance can be reduced, power density is improved, bonding is reduced
The dosage of agent promotes surface density to improve specific energy.Due to the pore characteristics of micro-porous electrode foil, so that the electricity of electrode material
Chemical reaction front and back sides are able to gain a thorough understanding of through mastery of all relevant material, are balanced consistent.Pole piece becomes more flexible, in electric core winding technique, more favorably
It is wound in roundlet angular distortion.The perforation feature of micropore foil, so that battery, in the technological process of production, the solvent of binder more holds
Easily balanced volatilization, so that electrolyte is easier quickly balanced infiltration.
The process flow of its production of microporous barrier currently on the market, is substantially on original copper foil base material and carries out secondary beat
Hole, as shown in figure 1.It is the precision machined concave-convex roller a being engaged each other in the middle part of Fig. 1, left side and right side are then respectively
Unwinding equipment and winding device, smooth foil after unreeling again via the pairing roll-in of concave-convex roller a, to form microporous barrier,
Until winding.However, there is following disadvantages for above-mentioned processing method: on the one hand, concave-convex roller roll surface needs Precision Machining, this is obviously
It is related to accurate process equipment, the pillar processing of especially concave-convex roller roll surface is even more extremely complex and high, at present state-owned enterprise, state
Industry even can not autonomous production, the import from developed country can only be relied on, this increases the micropore foil cost produced sharply
Height leverages the popularization and application of micropore foil.On the other hand, due to being secondary perforation processing mode, so that concave-convex roller
The aperture that the pillar of roll surface impacts and squeeze the micropore formed after copper foil is difficult uniformly to reduce the quality of micropore copper foil, finally
It brings inconvenience to the subsequent use of copper foil.
Summary of the invention
The purpose of the present invention is overcoming above-mentioned the deficiencies in the prior art, provide it is a kind of can one-pass molding micropore copper foil copper foil
Manufacturing device, can one-pass molding high density, micron-sized micropore copper foil, and synchronize and have that process flow is short, micro molding product
The advantage that matter is high, production cost is low.
To achieve the above object, the invention adopts the following technical scheme:
It is a kind of can one-pass molding micropore copper foil copper foil manufacturing device, including the electrolytic cell being arranged in foil rack, institute
The anode plate for having the connection positive pole of arc plate in electrolytic cell is stated, the vallecular cavity of anode plate forms anode slot；It is same above anode slot
Axis is equipped with the cathode roll that connect with power cathode, cathode roll and anode slot coaxial cooperation be formed by fit clearance composition at
The forming gap of type copper foil；It is characterized by: at the cathode roll roll surface the recessed micropore shape of array-like counterbore, the counterbore
Hole it is intracavitary it is coaxial insulated column has been plugged and fixed, insulation column diameter is equal to counterbore aperture, and insulated column top end face and cathode roll roller
Face flushes.
Preferably, the counterbore is 10~5000 hole/cm in the Density Distribution of cathode roller surface2；Counterbore aperture is 1
~500um.
Preferably, drilling processing is carried out to cathode roller surface with laser-beam drilling machine or precision drilling machine, to be formed
State counterbore.
Preferably, material used in the insulated column is epoxide resin material or nylon material.
The beneficial effects of the present invention are:
1), from traditional by forcing the intrinsic process of punch pattern secondary operation copper foil different.The present invention is in cathode copper
It is the high density that is formed by laser-beam drilling machine or accurate punch device, micro- both in cathode roller surface before foil production process
Meter level micropore, then insulation processing namely fill insulation material are carried out to form insulated column, finally in cathode roller surface to micropore
Constitute the insulating point of the consistent several array-likes consistent with hole density in aperture.In this way, electrolytic copper foil is during production, due to yin
For the micropore to insulate on the roller of pole without plating effect condition, copper foil meeting nature during electrolysis production avoids above-mentioned each insulation
Point, and then naturally form the smooth micropore copper foil in high density, micron order and surface that one-pass molding is met the requirements.Furthermore
, due to being shrinkage pool processing, processing cost is lower, and process obviously also becomes and simplifies, and is conducive to production domesticization, helps to beat
Break the equipment importation monopolization phenomenon of current developed country.After counterbore fill insulation column, even if cathode roller surface is after being used for a long time
Abrasion is generated, nor affects on normally forming for micropore, service life is also had been further upgraded.The present invention will be by original
Copper foil secondary operation could micropore copper foil, shorten to a step and directly form high density, the smooth micropore copper foil of micron order and surface,
The manufacture efficiency for substantially increasing micropore copper foil, reduces process flow, reduces energy consumption, has saved cost, answers conducive to market
With.
Detailed description of the invention
Fig. 1 is the secondary operation state diagram of traditional copper foil；
Fig. 2 is working state structure schematic diagram of the invention；
Fig. 3 is the schematic cross-sectional view of the partial structurtes of cathode roll；
Fig. 4-5 is the schematic diagram of the micropore copper foil after one-pass molding of the present invention.
The practical corresponding relationship of each label of the present invention and component names is as follows:
A- bumps roller b- micropore copper foil
10- electrolytic cell 11- anode plate
20- cathode roll 21- counterbore 22- insulated column
30- deflecting roller
Specific embodiment
For ease of understanding, here in connection with Fig. 1-5, specific structure and working method of the invention are retouched further below
It states:
As the technical process of electrolytic copper foil manufacture, electrolyte preparation is generally comprised, former foil generates, surface treatment, cutting
The processes such as packaging, detection control and associated satellite outfit.In the processing flow by electrolytically generated copper foil of electrolysis special machine,
Process equipment it is as shown in Figure 2 include: cathode roll 20, anode semicircle pb-ag alloy plate (namely anode plate 11) and electrolytic cell 10
Equal main components.Under the action of direct current, the bivalent cupric ion in copper sulfate electrolyte in electrolytic cell 10 shifts to cathode roll
At 20 surfaces, and copper ion is generated through reduction reaction, and focused crystallization is on the surface of the smooth cathode roll 20 constantly rotated, i.e.,
Plastic smooth copper foil.Copper foil becomes via deflecting roller 30 back into wind-up roll, that is, completes the processing flow of copper foil.
The present invention passes through the roller as shown in Figure 3 in cathode roll 20 in electrolytic copper foil identical with above structure preparation
Cylinder surface is processed by laser-beam drilling machine or accurate punch device by design requirement, to form the counterbore of micropore shape
21.Counterbore 21 completes insulation processing by fill insulation column 22 again, and then high density, surface are formed at each 21 position of counterbore
Smooth micron-sized insulating point.In electrolytic copper foil during production, due on cathode roll 20 each insulating point without electricity
Effect is plated, also just the smooth micropore of self-assembling formation uniform pore diameter namely molding copper foil can at insulating point for copper foil after molding
With one-time formed formation high density as illustrated in figures 4-5, micron order and the smooth micropore copper foil b in surface.The present invention will be to original
There are copper foil secondary processes to handle the micropore copper foil that could be formed, shorten to a step and directly form high density, micron order and surface light
Sliding micropore copper foil b, substantially increases the manufacture efficiency of micropore copper foil b, reduces process flow, reduce energy consumption, saves
Cost is conducive to market and applies.
Claims (4)
1. one kind can one-pass molding micropore copper foil copper foil manufacturing device, including the electrolytic cell (10) being arranged in foil rack,
There is the anode plate (11) of the connection positive pole of arc plate in the electrolytic cell (10), the vallecular cavity of anode plate (11) forms anode
Slot；The cathode roll (20) connecting with power cathode, cathode roll (20) and anode slot coaxial cooperation institute are coaxially provided with above anode slot
The fit clearance of formation constitutes the forming gap for forming copper foil；It is characterized by: array at cathode roll (20) roll surface
The counterbore (21) of the recessed micropore shape of shape, counterbore (21) hole is intracavitary coaxial to be plugged and fixed insulated column (22), insulated column
(22) diameter is equal to counterbore (21) aperture, and insulated column (22) top end face is flushed with cathode roll (21) roll surface.
2. it is according to claim 1 can one-pass molding micropore copper foil copper foil manufacturing device, it is characterised in that: it is described heavy
Density Distribution of the hole (21) on cathode roll (20) surface is 10~5000 hole/cm2；Counterbore (21) aperture is 1~500um.
3. it is according to claim 2 can one-pass molding micropore copper foil copper foil manufacturing device, it is characterised in that: beaten with laser
Hole machine or precision drilling machine carry out drilling processing to cathode roller surface, to form the counterbore (21).
4. it is according to claim 1 or 2 or 3 can one-pass molding micropore copper foil copper foil manufacturing device, it is characterised in that: institute
Stating material used in insulated column (22) is epoxide resin material or nylon material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910144943.4A CN109763151A (en) | 2019-02-27 | 2019-02-27 | Can one-pass molding micropore copper foil copper foil manufacturing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910144943.4A CN109763151A (en) | 2019-02-27 | 2019-02-27 | Can one-pass molding micropore copper foil copper foil manufacturing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109763151A true CN109763151A (en) | 2019-05-17 |
Family
ID=66457384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910144943.4A Pending CN109763151A (en) | 2019-02-27 | 2019-02-27 | Can one-pass molding micropore copper foil copper foil manufacturing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109763151A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112626570A (en) * | 2020-12-08 | 2021-04-09 | 长沙锂安能电子科技有限公司 | Electrolytic preparation equipment for metal foil and electrolytic preparation process for metal foil |
| CN114695842A (en) * | 2022-04-12 | 2022-07-01 | 广东嘉元科技股份有限公司 | Copper foil manufacturing device for microporous copper foil |
| CN114990644A (en) * | 2022-06-29 | 2022-09-02 | 九江德福科技股份有限公司 | Electrolytic foil generation method with variable width |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104993153A (en) * | 2015-07-13 | 2015-10-21 | 深圳市信宇人科技有限公司 | Production method of microporous copper foil, microporous copper foil and production device thereof |
| CN108893761A (en) * | 2018-07-20 | 2018-11-27 | 山东理工大学 | A kind of preparation method of lithium ion battery micropore copper foil |
| CN209957911U (en) * | 2019-02-27 | 2020-01-17 | 于新生 | Copper foil manufacturing device capable of forming microporous copper foil in one step |
-
2019
- 2019-02-27 CN CN201910144943.4A patent/CN109763151A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104993153A (en) * | 2015-07-13 | 2015-10-21 | 深圳市信宇人科技有限公司 | Production method of microporous copper foil, microporous copper foil and production device thereof |
| CN108893761A (en) * | 2018-07-20 | 2018-11-27 | 山东理工大学 | A kind of preparation method of lithium ion battery micropore copper foil |
| CN209957911U (en) * | 2019-02-27 | 2020-01-17 | 于新生 | Copper foil manufacturing device capable of forming microporous copper foil in one step |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112626570A (en) * | 2020-12-08 | 2021-04-09 | 长沙锂安能电子科技有限公司 | Electrolytic preparation equipment for metal foil and electrolytic preparation process for metal foil |
| CN114695842A (en) * | 2022-04-12 | 2022-07-01 | 广东嘉元科技股份有限公司 | Copper foil manufacturing device for microporous copper foil |
| CN114695842B (en) * | 2022-04-12 | 2023-04-07 | 广东嘉元科技股份有限公司 | Copper foil manufacturing device for microporous copper foil |
| CN114990644A (en) * | 2022-06-29 | 2022-09-02 | 九江德福科技股份有限公司 | Electrolytic foil generation method with variable width |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
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Application publication date: 20190517 |