CN109755418B - Display panel manufacturing process - Google Patents
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- CN109755418B CN109755418B CN201910024032.8A CN201910024032A CN109755418B CN 109755418 B CN109755418 B CN 109755418B CN 201910024032 A CN201910024032 A CN 201910024032A CN 109755418 B CN109755418 B CN 109755418B
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Abstract
The invention relates to the technical field of display, and discloses a display panel manufacturing process, which comprises the following steps: attaching a first hard substrate with a flexible substrate formed on one side to a second hard substrate with a spacer, wherein the flexible substrate is positioned on the side surface of the first hard substrate, which is far away from the second hard substrate, the flexible substrate is provided with a hollowed through hole, the first hard substrate is provided with a hole corresponding to the hollowed through hole, the spacer sequentially penetrates through the hole and the hollowed through hole, the side surface of the flexible substrate, which is far away from the first hard substrate, is provided with a pixel defining layer, and the tail end of the spacer, which is far away from the second hard substrate, is flush with the end part, which is far away from the flexible substrate, of the pixel defining layer; attaching a fine metal mask plate to the surface of the pixel defining layer, wherein the end part of the spacer, which is far away from the second hard substrate, is abutted against the fine metal mask plate; and (5) evaporation. According to the manufacturing process of the display panel, the fine metal mask plate is propped against the spacer, and the color mixing phenomenon caused by dislocation of the evaporation through hole and the pixel opening can be prevented.
Description
Technical Field
The invention relates to the technical field of display, in particular to a manufacturing process of a display panel.
Background
As a new generation display technology, the OLED (Organic Light-Emitting Diode) display technology has the characteristics of fast response, high contrast and flexibility, and especially, the flexibility of the OLED display technology lays a foundation for the flexible display technology; as one of the important development directions of the flexible display technology, the OLED stretchable display device may be widely applied to wearable devices and clothes.
As shown in fig. 1, in order to smoothly bend and normally display, a flexible substrate 1 of an OLED is divided into a plurality of display units, hollow through holes 2 are formed between the display units, when an evaporation process is performed, a fine metal mask plate 3 covers a pixel defining layer 5, and evaporation through holes 4 of the fine metal mask plate 3 are aligned with pixel openings one by one, but in the prior art, the evaporation through holes 4 are easily misaligned with the pixel openings, which results in color mixing.
Disclosure of Invention
The invention discloses a manufacturing process of a display panel, which is used for preventing a color mixing phenomenon caused by dislocation of an evaporation through hole and a pixel opening.
In order to achieve the purpose, the invention provides the following technical scheme:
a manufacturing process of a display panel comprises the following steps:
attaching a first hard substrate with a flexible substrate formed on one side to a second hard substrate with a spacer, wherein the flexible substrate is positioned on the side surface of the first hard substrate, which is far away from the second hard substrate, the flexible substrate is provided with a hollowed through hole, the first hard substrate is provided with a hole corresponding to the hollowed through hole, the spacer sequentially penetrates through the hole and the hollowed through hole, the side surface of the flexible substrate, which is far away from the first hard substrate, is provided with a pixel defining layer, and the tail end of the spacer, which is far away from the second hard substrate, is flush with the end part, which is far away from the flexible substrate, of the pixel defining layer;
attaching a fine metal mask plate to the surface of the pixel defining layer, wherein the end part of the spacer, which is far away from the second hard substrate, is abutted against the fine metal mask plate;
and performing evaporation, and forming a device pattern on the surface of the flexible substrate, which is far away from the first hard substrate.
In the manufacturing process of the display panel, when the second hard substrate is attached to the first hard substrate, the spacer sequentially penetrates through the holes and the hollowed-out through holes, and finally the tail end of the spacer, which is far away from the second hard substrate, is flush with the end part of the pixel defining layer, which is far away from the flexible substrate; when laminating meticulous metal mask board at pixel definition layer surface, meticulous metal mask board can have the trend that removes to first stereoplasm base plate direction under the effect of magnetic attraction, because second stereoplasm base plate self hardness is great, after fixed with first stereoplasm base plate, can provide powerful support for the shock insulator and not take place to warp, the region that meticulous metal mask board and fretwork through-hole department are relative is lived to the shock insulator, avoid this region of meticulous metal mask board to produce sunkenly, thereby, the part around the region that meticulous metal mask board and fretwork through-hole correspond is difficult for removing and taking place to this department and remove, the coating by vaporization through-hole and the pixel opening that ensure meticulous metal mask board can accurately align, and do not take place the colour mixture phenomenon.
Preferably, before the first hard substrate having the flexible substrate formed on one side thereof is bonded to the second hard substrate having the spacer, the method further includes:
forming the hole on a first hard substrate;
forming a sacrificial layer in the hole;
forming the flexible substrate on the surface of a first hard substrate;
manufacturing a thin film transistor device layer on the surface of the flexible substrate;
and removing the sacrificial layer.
Preferably, the forming of the sacrificial layer in the hole specifically includes:
filling photoresist in the hole;
and (4) heating and curing.
Preferably, the removing the sacrificial layer specifically includes:
the sacrificial layer is etched using a laser.
Preferably, the forming process of the flexible substrate specifically includes:
spin-coating polyimide liquid on the surface of the first hard substrate;
and (4) heating and curing.
Preferably, after the evaporation step, the method further comprises:
and separating the first hard substrate and the second hard substrate.
Preferably, the attaching of the first hard substrate having the flexible substrate formed on one side thereof to the second hard substrate having the spacer specifically includes:
forming a thermosensitive adhesive layer on the surface of the second hard substrate with the spacer;
bonding a second hard substrate with the first hard substrate through the thermosensitive adhesive layer;
the separating of the first hard substrate and the second hard substrate specifically includes:
heating the thermosensitive adhesive layer until the viscosity is lost;
and removing the second hard substrate from the first hard substrate.
Preferably, a pressure sensitive adhesive layer is further formed between the thermosensitive adhesive layer and the second hard substrate.
Preferably, the orthographic projection of the hollowed-out through holes on the first hard substrate covers the corresponding holes on the first hard substrate.
Preferably, the holes on the first hard substrate are circular, and the diameter of the holes is 40-180 μm.
Drawings
FIG. 1 is a schematic diagram of a structure of a fine metal mask plate and a flexible substrate in the prior art;
fig. 2 is a schematic structural diagram of a fine metal mask plate, a flexible substrate, a first hard substrate, a spacer, and a second hard substrate in a display panel manufacturing process according to an embodiment of the present invention.
Icon: 1-a flexible substrate; 2-hollowing out the through hole; 3-fine metal mask plate; 4-evaporating through holes; 5-a pixel defining layer; 6-spacer; 7-a first hard substrate; 8-a second hard substrate; 9-holes; 10-a thermosensitive adhesive layer; 11-pressure sensitive adhesive layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 2, the manufacturing process of the display panel provided by the embodiment of the invention includes the following steps:
s100: attaching a first hard substrate 7 with a flexible substrate 1 formed on one side to a second hard substrate 8 with a spacer 6, wherein the flexible substrate 1 is positioned on the side of the first hard substrate 7 departing from the second hard substrate 8, the flexible substrate 1 is provided with a hollowed through hole 2, the first hard substrate 7 is provided with a hole 9 corresponding to the hollowed through hole 2, the spacer 6 sequentially penetrates through the hole 9 and the hollowed through hole 2, a pixel defining layer 5 is arranged on the side of the flexible substrate 1 departing from the first hard substrate 7, and the tail end of the spacer 6, far away from the second hard substrate 8, is flush with the end of the pixel defining layer 5 departing from the flexible substrate 1;
s200: attaching the fine metal mask plate 3 to the surface of the pixel defining layer 5, wherein the end part of the spacer 6 far away from the second hard substrate 8 is abutted on the fine metal mask plate 3;
s300: evaporation, a device pattern is formed on the surface of the flexible substrate 1 facing away from the first hard substrate 7, i.e. the evaporation material passes through.
The first hard substrate 7 and the second hard substrate 8 include, but are not limited to, those made of glass, hard plastic, or the like; the spacer 6 includes but is not limited to being made of photoresist.
In the manufacturing process of the display panel, when the second hard substrate 8 is attached to the first hard substrate 7, the spacer 6 sequentially penetrates through the hole 9 and the hollowed through hole 2, and finally the tail end of the spacer 6, which is far away from the second hard substrate 8, is flush with the end part of the pixel defining layer 5, which is far away from the flexible substrate 1, so that the fine metal mask plate 3 can be flatly unfolded when being covered on the pixel defining layer 5, and the protrusion or the depression is not easy to occur; when the fine metal mask plate 3 is attached to the surface of the pixel defining layer 5, the fine metal mask plate 3 tends to move towards the first hard substrate 7 under the action of magnetic attraction, the second hard substrate 8 has high hardness, and after the second hard substrate is fixed with the first hard substrate 7, the spacer 6 can be provided with powerful support without deformation, the spacer 6 supports the region of the fine metal mask plate 3 opposite to the hollowed-out through hole 2, and the region of the fine metal mask plate 3 is prevented from being sunken, so that the part of the fine metal mask plate 3 around the region corresponding to the hollowed-out through hole 2 is not easy to move towards the region and move, and the evaporation through hole 4 of the fine metal mask plate 3 can be accurately aligned with the pixel opening without color mixing.
The first specific way of forming the holes 9 for the spacers 6 to pass through is as follows:
before the step of S100, the method also comprises the following steps:
s010: forming a hole 9 on the first hard substrate 7;
s020: forming a sacrificial layer in the hole 9;
s030: forming a flexible substrate 1 on a surface of a first hard substrate 7;
s040: manufacturing a thin film transistor device layer on the surface of the flexible substrate 1;
s050: and removing the sacrificial layer.
In the step S020, the purpose of forming the sacrificial layer in the hole 9 is: preventing the material for forming the flexible substrate 1 in the step S030 from entering the hole 9, and preventing the material for forming the thin film transistor device layer in the step S040 from entering the hole 9, wherein the hole 9 is blocked and difficult to clean, and the spacer 6 is prevented from passing through the hole 9;
it should be noted that after the flexible substrate 1 is formed in the step S030, a plurality of display units are divided on the flexible substrate 1, hollow through holes 2 are formed between the display units, and the manner of forming the hollow through holes 2 may be plasma etching or photolithography;
wherein, the step S030 specifically includes:
s031: filling photoresist in the hole 9;
s032: and (4) heating and curing.
However, the S030 step is not limited to the above form, and a paste that has already been cured may be filled into the holes 9, for example, a cured photoresist may be filled into the holes 9.
Wherein the step S050 specifically comprises the following steps:
the sacrificial layer is etched using a laser.
However, the S050 step is not limited to the above form, and may be, for example, poking the sacrificial layer out of the hole 9 with hardened fibers or etching away the sacrificial layer with a corrosive liquid.
Preferably, the forming process of the flexible substrate 1 in the step S100 is specifically:
s111: the polyimide solution is coated on the surface of the first hard substrate 7 in a spin coating mode, and the first hard substrate 7 plays a supporting role in the flexible substrate 1;
s112: and (4) heating and curing.
The forming process of the flexible substrate 1 in the step S100 is not limited to the above method, and the surface of the first hard substrate 7 may be sprayed with the polyimide solution and then cured by heat, and the material used for manufacturing the flexible substrate 1 is not limited to the polyimide solution.
Preferably, after the step S300, the method further comprises:
s400: separating the first hard substrate 7 and the second hard substrate 8;
in the step S400, the first hard substrate 7 and the second hard substrate 8 are separated, so that the subsequent process of the flexible substrate 1 is more flexible, and the spacer 6 is prevented from causing obstacles to the subsequent processes such as film encapsulation and cutting.
Specifically, the separation of the first hard substrate 7 and the second hard substrate 8 in the step S400 may be in the form of:
in step S100, a first hard substrate 7 having a flexible substrate 1 formed on one side thereof is bonded to a second hard substrate 8 having a spacer 6, and the method specifically includes:
s121: forming a thermosensitive adhesive layer 10 on the surface of the second hard substrate 8 with the spacer 6;
s122: bonding the second hard substrate 8 with the first hard substrate 7 through the thermosensitive adhesive layer 10;
in step S400, separating the first hard substrate 7 and the second hard substrate 8 specifically includes:
s410: heating the thermosensitive adhesive layer 10 until the viscosity is lost;
s420: removing the second hard substrate 8 from the first hard substrate 7;
in the process of separating the first hard substrate 7 from the second hard substrate 8, the thermosensitive adhesive layer 10 is sensitive to temperature, the higher the temperature is, the poorer the viscosity is, the two substrates do not need to be separated by using an instrument and the like, and only by heating, the two substrates can be automatically separated.
Preferably, a pressure sensitive adhesive layer 11 is further formed between the thermal sensitive adhesive layer 10 and the second hard substrate 8, the pressure sensitive adhesive layer 11 is sensitive to pressure, and has the characteristic that the bonding is tighter when the pressure is larger, so that the second hard substrate 8 and the first hard substrate 7 can be conveniently combined, and meanwhile, after the thermal sensitive adhesive layer 10 is heated and loses viscosity, and the first hard substrate 7 and the second hard substrate 8 are separated, the thermal sensitive adhesive layer 10 is bonded on the second hard substrate 8 through the pressure sensitive adhesive layer 11, so that the situation that the thermal sensitive adhesive layer 10 falls in processing equipment and is difficult to clean is avoided.
A second specific way of forming the holes 9 for the spacers 6 to pass through is as follows:
the method comprises the steps of firstly forming a flexible substrate 1 on the surface of a first hard substrate 7, then manufacturing a thin film transistor device layer on the surface of the flexible substrate 1, and manufacturing a hollow through hole 2 and a hole 9 between adjacent display units of the flexible substrate 1, wherein the hollow through hole 2 and the hole 9 can be manufactured separately in sequence or simultaneously.
Preferably, the orthographic projection of the hollow through hole 2 on the first hard substrate 7 covers the corresponding hole 9 on the first hard substrate 7, namely the hole 9 is arranged opposite to the hollow through hole 2, and the orthographic projection area of the hollow through hole 2 on the first hard substrate 7 is larger than the area of the hole 9;
so as to ensure that the area of the hollowed-out through hole 2 is not smaller than the hole 9, and the two are not overlapped, namely when the hollowed-out through hole 2 is manufactured, the hole 9 can be always aligned with a partial area of the hollowed-out through hole 2, so that the shock insulator 6 can pass through the hole 9, and the opening area of the hole 9 is fully utilized.
Preferably, the holes 9 on the first rigid substrate 7 are circular, and the diameter of the holes 9 is 40 μm-180 μm, for example, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, 160 μm, 170 μm or 180 μm. The holes 9 can also be rectangular, triangular, oval or other shapes as long as the spacers 6 can pass through the holes 9, and in order to ensure that the spacers 6 can stably and accurately pass through the holes 9, the cross section of the spacers 6 can be consistent with the shape of the holes 9, and the cross section area of the spacers 6 is slightly smaller than the holes 9.
Preferably, the shape of the hollow through-hole 2 includes, but is not limited to, a rectangle, when the hollow through-hole 2 is rectangular, its width is 50 μm-200 μm, for example, it may be 50 μm, 70 μm, 90 μm, 110 μm, 130 μm, 145 μm, 150 μm, 165 μm, 180 μm, 192 μm or 200 μm, and its length is 0.2mm, 0.3mm, 0.5mm, 0.7mm, 0.9mm or 1.0 mm.
It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A manufacturing process of a display panel is characterized by comprising the following steps:
attaching a first hard substrate with a flexible substrate formed on one side to a second hard substrate with a spacer, wherein the flexible substrate is positioned on the side surface of the first hard substrate, which is far away from the second hard substrate, the flexible substrate is provided with a hollowed through hole, the first hard substrate is provided with a hole corresponding to the hollowed through hole, the spacer sequentially penetrates through the hole and the hollowed through hole, the side surface of the flexible substrate, which is far away from the first hard substrate, is provided with a pixel defining layer, and the tail end of the spacer, which is far away from the second hard substrate, is flush with the end part, which is far away from the flexible substrate, of the pixel defining layer;
attaching a fine metal mask plate to the surface of the pixel defining layer, wherein the end part of the spacer, which is far away from the second hard substrate, is abutted against the fine metal mask plate;
and performing evaporation, and forming a device pattern on the surface of the flexible substrate, which is far away from the first hard substrate.
2. The manufacturing process of a display panel according to claim 1, wherein before the first hard substrate having the flexible substrate formed on one side thereof is bonded to the second hard substrate having the spacer, the manufacturing process further comprises the following steps:
forming the hole on a first hard substrate;
forming a sacrificial layer in the hole;
forming the flexible substrate on the surface of a first hard substrate;
manufacturing a thin film transistor device layer on the surface of the flexible substrate;
and removing the sacrificial layer.
3. The manufacturing process of the display panel according to claim 2, wherein the forming of the sacrificial layer in the hole specifically comprises:
filling photoresist in the hole;
and (4) heating and curing.
4. The display panel manufacturing process according to claim 2, wherein the removing the sacrificial layer specifically comprises:
the sacrificial layer is etched using a laser.
5. The manufacturing process of the display panel according to claim 1, wherein the flexible substrate is formed by a process specifically including:
spin-coating polyimide liquid on the surface of the first hard substrate;
and (4) heating and curing.
6. The process for manufacturing a display panel according to claim 1, further comprising, after the evaporation step:
and separating the first hard substrate and the second hard substrate.
7. The manufacturing process of the display panel according to claim 6, wherein the attaching of the first hard substrate having the flexible substrate formed on one side thereof to the second hard substrate having the spacer specifically comprises:
forming a thermosensitive adhesive layer on the surface of the second hard substrate with the spacer;
bonding a second hard substrate with the first hard substrate through the thermosensitive adhesive layer;
the separating of the first hard substrate and the second hard substrate specifically includes:
heating the thermosensitive adhesive layer until the viscosity is lost;
and removing the second hard substrate from the first hard substrate.
8. The manufacturing process of the display panel according to claim 7, wherein a pressure sensitive adhesive layer is further formed between the thermal sensitive adhesive layer and the second hard substrate.
9. The manufacturing process of the display panel according to claim 1, wherein the orthographic projection of the hollowed-out through holes on the first hard substrate covers the corresponding holes on the first hard substrate.
10. The process of claim 1, wherein the holes of the first rigid substrate are circular and have a diameter of 40 μm to 180 μm.
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| CN201910024032.8A CN109755418B (en) | 2019-01-10 | 2019-01-10 | Display panel manufacturing process |
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| CN201910024032.8A CN109755418B (en) | 2019-01-10 | 2019-01-10 | Display panel manufacturing process |
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| CN109755418B true CN109755418B (en) | 2021-01-22 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110137238A (en) * | 2019-06-21 | 2019-08-16 | 京东方科技集团股份有限公司 | Oled display substrate and preparation method thereof, display device |
| CN110428733A (en) * | 2019-07-22 | 2019-11-08 | 深圳市华星光电半导体显示技术有限公司 | Collapsible display panel |
| CN112309257B (en) * | 2020-10-30 | 2022-07-12 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel and flexible display device |
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