CN109752315B - Device for measuring shrinkage of photo-curing material - Google Patents
Device for measuring shrinkage of photo-curing material Download PDFInfo
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- CN109752315B CN109752315B CN201910103723.7A CN201910103723A CN109752315B CN 109752315 B CN109752315 B CN 109752315B CN 201910103723 A CN201910103723 A CN 201910103723A CN 109752315 B CN109752315 B CN 109752315B
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Abstract
The invention relates to the technical field of photo-curing materials, in particular to a device for measuring shrinkage rate of a photo-curing material. The device for measuring the shrinkage rate of the photo-curing material comprises a material accommodating device, a photo-curing machine, a first displacement sensor and a second displacement sensor; the material containing device is provided with a groove for containing the photo-curing material; the light curing machine is used for irradiating the light curing material so as to cure the light curing material; the first displacement sensor and the second displacement sensor are respectively positioned at two ends of the groove and are used for measuring the shrinkage of the cured light-cured material. The shrinkage of the photocuring material in the groove after curing is measured by using the first displacement sensor and the second displacement sensor, water is not involved in the detection process, the requirement on environmental conditions is low, and the accuracy of a measurement result is high.
Description
Technical Field
The invention relates to the technical field of photo-curing materials, in particular to a device for measuring shrinkage rate of a photo-curing material.
Background
At present, the photo-curing polymer-based composite resin has better wear resistance and optical performance, and is widely applied, especially in the field of tooth filling and repairing. The material is in paste form before curing, can be easily filled into the defect part of teeth, and can be sculptured into the ideal dental restoration shape by doctors. After the material is shaped, photoinitiated polymerization reaction is carried out on the surface and the inside of the material by irradiation of a photocuring machine, so that the material is polymerized and cured to become a hard solid material, and the effect of repairing defective teeth is achieved.
Any polymer-based material undergoes polymerization shrinkage upon curing. However, if the volume shrinkage of the composite resin material during the photo-curing process exceeds a certain limit, adverse effects such as failure of adhesion, occurrence of secondary caries, occurrence of microcracks, deformation of teeth, etc. are caused to the clinical therapeutic effect of dentistry. Thus, accurate quantitative measurement of the cure shrinkage properties, i.e., cure shrinkage dimensions, of such materials is an urgent need to compare, identify the properties of such materials and improve the quality of such products.
Currently, a density method is commonly used for measuring the linear shrinkage of a material. However, the density method has the main disadvantage of being demanding in terms of environmental conditions. For example, when calculating the density, the density of water needs to be substituted, and therefore, the measurement accuracy of the characteristics of water and the experimental temperature is very high. In addition, when measuring the density of the material before and after curing, both bubbles mixed into the material and bubbles adhering to the surface of the sample in water cause a large error in the measurement result.
Disclosure of Invention
The invention aims to provide a device for measuring shrinkage of a photo-curing material, which aims to solve the technical problem of large shrinkage measuring result error in the prior art.
In view of the above-mentioned objects, the present invention provides an apparatus for measuring shrinkage of a photo-curable material, comprising a material accommodating device, a photo-curing machine, a first displacement sensor and a second displacement sensor; the material containing device is provided with a groove for containing the photo-curing material; the light curing machine is used for irradiating the light curing material so as to cure the light curing material; the first displacement sensor and the second displacement sensor are respectively positioned at two ends of the groove and are used for measuring the shrinkage of the cured light-cured material.
Further, in some embodiments, the apparatus for measuring shrinkage of a photo-curable material further comprises a base, and the material accommodating device, the photo-curing machine, the first displacement sensor, and the second displacement sensor are all mounted on an upper surface of the base.
Further, in certain embodiments, the material containment device comprises a first stop, a second stop, a first baffle, and a second baffle;
the first stop block and the second stop block are arranged in a clearance mode so as to form the groove;
the first baffle can block one end of the groove, and the second baffle can block the other end of the groove, so that the photocuring material is filled in the groove.
Further, in some embodiments, the base is provided with a slide rail, and the first stop and the second stop are capable of reciprocating along a length direction of the slide rail to vary a width of the groove.
Further, in some embodiments, the device for measuring shrinkage of the light-cured material further includes a position adjusting device, the position adjusting device is connected to the base, the light-curing machine is connected to the position adjusting device, and the position adjusting device is used for enabling a working distance between an end face of a light source output end of the light-curing machine and an upper surface of the light-cured material to be provided, and enabling the end face of the light source output end of the light-curing machine to be parallel to the upper surface of the light-cured material.
Further, in certain embodiments, the position adjustment device comprises a bracket, a lifting mechanism, and a leveling mechanism; the bracket is hinged with the base; the lifting mechanism is connected with the bracket, the light curing machine is connected with the lifting mechanism, and the lifting mechanism is used for enabling the light curing machine to reciprocate relative to the material accommodating device so as to enable the end face of the light source output end of the light curing machine to be close to or far away from the upper surface of the light curing material; the leveling mechanism is connected with the bracket and is used for enabling the end face of the light source output end of the light curing machine to be parallel to the upper surface of the light curing material.
Further, in some embodiments, the lifting mechanism includes a lifting slide and a screw, the light curing machine is connected to the lifting slide, the lifting slide is in threaded connection with the screw, the screw is connected to the bracket, and the screw is capable of rotating about its own axis to raise or lower the lifting slide relative to the base.
Further, in some embodiments, the leveling mechanism includes an adjusting bolt, the bracket is provided with a threaded hole, the adjusting bolt is matched with the threaded hole, and the tail end of the adjusting bolt can prop against the upper surface of the base.
Further, in some embodiments, the device for measuring shrinkage of a photo-setting material further comprises a rotating rod, one end of the rotating rod is connected to the photo-setting machine, the other end of the rotating rod is connected to the position adjusting device, and the rotating rod is rotatable about its own axis relative to the position adjusting device.
Further, in certain embodiments, the first displacement sensor and the second displacement sensor are both laser displacement sensors.
Compared with the prior art, the invention has the beneficial effects that:
the invention provides a device for measuring shrinkage of a photo-curing material, which comprises a material accommodating device, a photo-curing machine, a first displacement sensor and a second displacement sensor, wherein the material accommodating device is used for accommodating the photo-curing material; the material containing device is provided with a groove for containing the photo-curing material; the light curing machine is used for irradiating the light curing material so as to cure the light curing material; the first displacement sensor and the second displacement sensor are respectively positioned at two ends of the groove and are used for measuring the shrinkage of the cured light-cured material.
Based on the structure, the device for measuring the shrinkage rate of the photo-curing material provided by the invention measures the shrinkage rate of the photo-curing material in the groove by using the first displacement sensor and the second displacement sensor, and has the advantages of no participation of water in the detection process, lower requirement on environmental conditions and higher accuracy of measurement results. When the method is implemented, the photocuring material is filled in the groove, the photocuring machine irradiates the photocuring material and cures the photocuring material, the first displacement sensor and the second displacement sensor acquire the change in the polymerization shrinkage process of the photocuring material in real time, the shrinkage of the photocuring material after curing is measured, and the ratio between the obtained shrinkage and the original length of the photocuring material, namely the length of the groove, is the linear shrinkage of the photocuring material.
In summary, the invention has the advantages and practical values, and similar methods are not disclosed or used in similar products, thus the invention belongs to innovation, has better practical effect and has wide industrial value.
The following will describe in detail with reference to the accompanying drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an apparatus for measuring shrinkage of a photo-cured material according to an embodiment of the present invention (in an inactive state);
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
FIG. 3 is a front view showing an apparatus for measuring shrinkage of a photo-curable material according to an embodiment of the present invention in an operating state;
FIG. 4 is a partial enlarged view at B in FIG. 3;
FIG. 5 is a schematic view of another view angle (in operation) of an apparatus for measuring shrinkage of a photo-curable material according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram (in working state) of a third view angle of an apparatus for measuring shrinkage of a photo-cured material according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a first block and a second block in the device for measuring shrinkage of a photo-cured material according to the second embodiment of the present invention, which are matched with a slide rail;
fig. 8 is a schematic structural view of a material accommodating device in a device for measuring shrinkage of a photo-setting material according to a third embodiment of the present invention.
Icon: 101-a first displacement sensor; 102-a second displacement sensor; 103-a light curing machine; 104-grooves; 105-base; 106-a first stop; 107-a second stop; 108-a first baffle; 109-a second baffle; 110-a lateral portion; 111-vertical section; 112-a stop; 113-a hinge shaft; 114-lifting slide blocks; 115-screw; 116-bump; 117-guide blocks; 118-adjusting bolts; 119-sliding rails; 120-rotating the rod; 121-a connection; 122-floor.
Detailed Description
The following description of the embodiments of the present invention will be made more apparent and fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that, if terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like are used, the indicated azimuth or positional relationship is based on the azimuth or positional relationship shown in the drawings, only for convenience of description and simplification of the description, and does not indicate or imply that the apparatus or element to be referred must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like, as used herein, are used for descriptive purposes only and are not to be construed as indicating or implying any relative importance.
In the description of the present invention, it should be noted that unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
Example 1
Referring to fig. 1 to 6, the present embodiment provides an apparatus for measuring shrinkage of a photo-setting material, comprising a material accommodating device, a photo-setting machine 103, a first displacement sensor 101 and a second displacement sensor 102; the material containing means is provided with a recess 104 for containing the photo-curable material; the photo-curing machine 103 is used for irradiating the photo-curing material to cure the photo-curing material; the first displacement sensor 101 and the second displacement sensor 102 are respectively positioned at two ends of the groove 104 for measuring the shrinkage of the photo-cured material after curing.
Based on this structure, the device for measuring shrinkage of a photo-curing material provided in this embodiment measures the shrinkage of the photo-curing material in the groove 104 after curing by using the first displacement sensor 101 and the second displacement sensor 102, and in the detection process, no water participates, the requirement on environmental conditions is low, and the accuracy of the measurement result is high. In implementation, the groove 104 is filled with the photo-curing material, the photo-curing machine 103 irradiates and cures the photo-curing material, and the first displacement sensor 101 and the second displacement sensor 102 collect the change in the polymerization shrinkage process of the photo-curing material in real time and measure the shrinkage of the photo-curing material after curing, and the ratio between the obtained shrinkage and the original length of the photo-curing material, namely the length of the groove 104, is the linear shrinkage of the photo-curing material.
In practice, the photocurable material is filled and the upper surface of the photocurable material is smoothed so that the thickness of the photocurable material to be measured substantially matches the depth of the grooves 104. Therefore, in this embodiment, the length of the groove 104 can be regarded as the original length of the photo-curing material to be measured.
The first displacement sensor 101 and the second displacement sensor 102 measure the curing shrinkage at both ends of the material, respectively, and the sum thereof is a bus shrinkage.
S＝[(L A2 -L A1 +L B2 -L B1 )/L]×100％
Wherein:
s is the linear curing shrinkage;
L A1 initial data (mm) before curing acquired for the first displacement sensor 101;
L A2 final data (mm) after curing acquired for the first displacement sensor 101;
L B1 initial pre-cure data (mm) acquired for the second displacement sensor 102;
L B2 post-cure final data (mm) acquired for the second displacement sensor 102;
l is the length (mm) of the groove 104.
Further, in some embodiments, the first displacement sensor 101 and the second displacement sensor 102 are both laser displacement sensors. The laser displacement sensor is in the prior art, and the working principle thereof is not repeated.
For example, in practice, the photocurable material is filled and the upper surface of the photocurable material is smoothed with a conventional squeegee so that the thickness of the photocurable material to be measured substantially coincides with the depth of the grooves 104. The laser beams of the first displacement sensor 101 and the second displacement sensor 102 are directed to the center of the end face of the measuring end of the photo-curing material to be measured, that is, the laser beams are directed to both ends of the groove 104 in the length direction to determine the reference position of the measuring end of the photo-curing material to be measured to obtain L A1 And L B1 . The mixture is left to stand for about 5 minutes, and the photo-curing machine 103 is started and irradiated for a period of time (for example, about 40 seconds). The light-cured material was tested for linear shrinkage throughout the curing process. After illumination is finished, the sensor continues to work, data acquisition is carried out for about 5min until the data tends to be stable and does not change any more, and final data L is obtained A2 And L B2 。
It should be noted that, other types of displacement sensors, such as an eddy current displacement sensor, a capacitive displacement sensor, etc., may be used for the first displacement sensor 101 and the second displacement sensor 102.
Alternatively, the grooves 104 are straight grooves, which facilitates faster and more accurate calculation of the linear shrinkage of the photocurable material.
The shape of the groove 104 is not limited to a straight groove, and may be an arc-shaped groove or a groove 104 gradually expanding or gradually shrinking from the middle position of the groove to the two ends of the groove.
Further, in some embodiments, the apparatus for measuring shrinkage of a photo-curable material further includes a base 105, and the material accommodating device, the photo-curing machine 103, the first displacement sensor 101, and the second displacement sensor 102 are mounted on an upper surface of the base 105.
Optionally, the upper surface of the base 105 is planar. In order to ensure that the upper surface of the base 105 is level, a bubble level may be provided on the upper surface of the base 105 to improve measurement accuracy.
Further, in some embodiments, as shown in FIG. 2,
because the photo-curing material is pasty before curing, in order to facilitate the photo-curing material to be detected to be filled in the groove 104 smoothly, a first baffle 108 and a second baffle 109 are arranged to assist, when filling, one end of the groove 104 is plugged by the first baffle 108, and the other end of the groove 104 is plugged by the second baffle 109, so that a containing cavity with an opening at the upper end is formed, and the photo-curing material is convenient to fill.
Optionally, the materials of the first baffle 108 and the second baffle 109 are polytetrafluoroethylene.
Polytetrafluoroethylene (Poly tetra fluoroethylene, abbreviated as PTFE), commonly referred to as "non-stick coating" or "easy-to-clean materials". The material has the characteristics of acid resistance, alkali resistance and resistance to various organic solvents, and is almost insoluble in all solvents. Meanwhile, polytetrafluoroethylene has the characteristic of high temperature resistance, and has extremely low friction coefficient, so the polytetrafluoroethylene can be used for lubrication, and also becomes an ideal paint for easily cleaning the inner layer of the water pipe.
The materials of the first baffle 108 and the second baffle 109 are polytetrafluoroethylene, so that the photo-curing material and the first baffle 108 and the second baffle 109 are not adhered, and the photo-curing material is prevented from being carried up when the first baffle 108 and the second baffle 109 are removed.
The material of the first baffle 108 and the second baffle 109 may be metal, such as stainless steel or aluminum sheet, and polytetrafluoroethylene may be coated on the surfaces thereof.
Optionally, the surface of the baffle plate, which is contacted with the light-cured material, is a plane, so that the end surfaces of the two measuring ends of the light-cured material are ensured to be planes, and the measuring precision of the linear shrinkage is improved.
Further, in some embodiments, the first stopper 106 and the second stopper 107 are made of polytetrafluoroethylene on the surface that contacts the photo-curing material.
Further, in some embodiments, the material receiving device is provided with a first slot and a second slot, which are disposed on two sides of the first stop 106 and the second stop 107, respectively, and when in use, the first baffle 108 can be placed in the first slot, and the second baffle 109 can be placed in the second slot, so that the first baffle 108 and the second baffle 109 can be fixed without being held by hands, and the workload of staff is reduced.
Further, in some embodiments, referring to fig. 4, the apparatus for measuring shrinkage of the photo-curable material further includes a position adjusting device connected to the base 105, the photo-curing machine 103 is connected to the position adjusting device, and the position adjusting device is configured to have a working distance D between an end surface of a light source output end of the photo-curing machine 103 and an upper surface of the photo-curable material, and make the end surface of the light source output end of the photo-curing machine 103 parallel to the upper surface of the photo-curable material.
Alternatively, the working distance D may be 0 to 5mm, and may be selected according to the amount of the light source output energy of the photo-curing machine 103, and in general, the light source output energy may be large, and the working distance may be relatively large.
During measurement, the position of the photo-curing machine 103 is adjusted through the position adjusting device, so that the end face of the light source output end of the photo-curing machine 103 is parallel to the upper surface of the photo-curing material, and the light beam can be vertically irradiated on the upper surface of the photo-curing material, so that the curing effect is good.
Further, in certain embodiments, the position adjustment device includes a bracket, a lifting mechanism, and a leveling mechanism; the bracket is hinged with the base 105; the lifting mechanism is connected with the bracket, the light curing machine 103 is connected with the lifting mechanism, and the lifting mechanism is used for enabling the light curing machine 103 to reciprocate relative to the material accommodating device so as to enable the end face of the light source output end of the light curing machine 103 to be close to or far away from the upper surface of the light curing material; the leveling mechanism is connected with the bracket and is used for enabling the end face of the light source output end of the photo-curing machine 103 to be parallel to the upper surface of the photo-curing material.
Alternatively, referring to fig. 1 and 5, the bracket includes a transverse portion 110 and a vertical portion 111, the transverse portion 110 and the vertical portion 111 being fixedly connected, a length direction of the transverse portion 110 being perpendicular to a length direction of the vertical portion 111; the thickness surface of the base 105 is provided with a connecting part 121, the transverse part 110 is hinged with the connecting part 121, and the vertical part 111 is fixedly connected with the upper surface of the transverse part 110; the lifting mechanism is connected to the vertical portion 111 and the leveling mechanism is connected to the lateral portion 110.
Further, on the basis of the above embodiment, the connection portion 121 is provided with a stop portion 112 for preventing damage caused by an excessive overturning angle of the bracket and the photo-curing machine 103.
Specifically, when the measurement process is completed, the holder is rotated about the hinge shaft 113 between the lateral portion 110 and the connection portion 121 to distance the light source output end of the photo-curing machine 103 from the photo-curing material so as to take out the material. In the process of rotating the support, as the center of gravity moves backwards gradually, the rotation angle is easy to be too large, and the light curing machine 103 can be knocked, the embodiment is provided with the stop part 112, and when the support rotates to a certain position, the transverse part 110 can be abutted against the stop part 112, so that the rotation of the support is limited, and the light curing machine 103 is prevented from being knocked.
Further, on the basis of the above-described embodiment, the elevating mechanism includes the elevating slider 114 and the screw 115, the photo-curing machine 103 is connected to the elevating slider 114, the elevating slider 114 is screwed to the screw 115, the screw 115 is connected to the bracket, and the screw 115 can rotate about its own axis to raise or lower the elevating slider 114 with respect to the base 105.
Optionally, the vertical portion 111 has a bump 116, and the screw 115 is connected to the bump 116, and the screw 115 can rotate about its own axis with respect to the bump 116, so that the lifting slider 114 is lifted or lowered with respect to the base 105, thereby adjusting the position of the photo-curing machine 103.
Further, on the basis of the above embodiment, as shown in fig. 6, the vertical portion 111 is provided with a guide block 117, the lifting slider 114 is provided with a guide groove matched with the guide block 117, and the lifting slider 114 can reciprocate along the length direction of the guide block 117, so that the lifting process is ensured to be more stable.
Further, in some embodiments, the leveling mechanism includes an adjustment bolt 118, the bracket is provided with a threaded hole, the adjustment bolt 118 is matched with the threaded hole, and the tail end of the adjustment bolt 118 can abut against the upper surface of the base 105.
The threaded hole is provided on the lateral portion 110. When curing is required, as shown in fig. 3, the light source output end of the light curing machine 103 is aligned to the upper surface of the light curing material, and the position of the light source output end of the light curing machine 103 is finely adjusted by rotating the adjusting bolt 118, so as to ensure that the end face of the light source output end of the light curing machine 103 is parallel to the upper surface of the light curing material.
In actual measurement, the end face of the output end of the light source is generally ensured to be basically parallel to the upper surface of the light-cured material by direct observation of an experimenter.
Further, in some embodiments, referring to fig. 1, the device for measuring shrinkage of the photo-curing material further includes a rotating rod 120, one end of the rotating rod 120 is connected to the photo-curing machine 103, the other end of the rotating rod 120 is connected to the position adjusting device, and the rotating rod 120 is rotatable about its own axis with respect to the position adjusting device.
Alternatively, one end of the rotating rod 120 is fixedly connected with the photo-curing machine 103, the other end of the rotating rod 120 is connected with the lifting slider 114, and the rotating rod 120 can rotate around its own axis relative to the lifting slider 114 to adjust the position of the energy output end of the photo-curing machine 103 so that the end face of the light source output end of the photo-curing machine 103 is parallel to the upper surface of the photo-curing material.
The rotary rod 120 is utilized to adjust the position of the energy output end of the photo-curing machine 103, and the rotary rod 120 can replace a leveling mechanism or can be used together with the leveling mechanism, the rotary rod 120 coarsely adjusts the position of the energy output end of the photo-curing machine 103, and the adjusting bolt 118 finely adjusts the position of the energy output end of the photo-curing machine 103 so as to ensure that the end face of the light source output end of the photo-curing machine 103 is parallel to the upper surface of the photo-curing material.
In this embodiment, the first displacement sensor 101 and the second displacement sensor 102 are of the type LK-G30, and the controller used in cooperation with the type displacement sensor is of the type LK-GD500.
Example two
Referring to fig. 7, the present embodiment also provides an apparatus for measuring shrinkage of a photo-curable material, and the apparatus for measuring shrinkage of a photo-curable material of the present embodiment is an improvement on the basis of the first embodiment, and the technical solution of the first embodiment is not repeated here. The same reference numerals are used for the same components as those of the first embodiment, and reference is made to the description of the first embodiment.
In some embodiments, the base 105 is provided with a slide rail 119, and the first stop 106 and the second stop 107 are capable of reciprocating along the length of the slide rail 119 to vary the width w of the groove 104.
The size of the groove 104 can be determined according to the size of the light source output port of the photo-curing machine 103 at the time of measurement, and generally, the end face of the light source output port should cover the notch of the groove 104 so as to fully irradiate the photo-curing material to be measured.
In the alternative of this embodiment, the upper surface of the base 105 is provided with two sliding rails 119, the number of the sliding rails 119 is two, the two sliding rails 119 are arranged at intervals, and the length directions of the two sliding rails 119 are consistent, alternatively, the distance d between two adjacent ends of the two sliding rails 119 is large enough to satisfy the filling of the photo-curing material, that is, the distance between two adjacent ends of the two sliding rails 119 is larger than the maximum width of the material to be tested, so as to ensure that the photo-curing material cannot be filled on the sliding rails 119. The lower surface of the first stopper 106 and the lower surface of the second stopper 107 are provided with sliding grooves which are matched with the sliding rails 119, so that the lower surface of the first stopper 106 and the lower surface of the second stopper 107 can move along a straight line to change the width w of the groove 104.
Example III
Referring to fig. 8, the present embodiment also provides an apparatus for measuring shrinkage of a photo-curable material, which is an improvement over the first embodiment, and the technical solution of the first embodiment is also the same as that of the first embodiment, and will not be repeated here. The same reference numerals are used for the same components as those of the first embodiment, and reference is made to the description of the first embodiment.
In this embodiment, the material containing device further comprises a bottom plate 122, one side edge of the bottom plate 122 is fixedly connected with the first stop block 106, the other side edge of the bottom plate 122 is fixedly connected with the second stop block 107, and in this alternative, two opposite side surfaces of the first stop block 106 and the second stop block 107 and the upper surface of the bottom plate 122 jointly form two groove walls and a groove bottom of the groove 104.
Optionally, the upper surface of the bottom plate 122 is perpendicular to two opposite sides of the first stop 106 and the second stop 107, and the upper surface of the bottom plate 122 is at a distance from the upper surface of the first stop 106, which is the depth h of the groove 104.
It should be understood that the first stop block 106, the second stop block 107 and the bottom plate 122 are fixedly connected, which is equivalent to a mold provided with the groove 104, and during production, the first stop block 106, the second stop block 107 and the bottom plate 122 with different sizes can be adopted to manufacture molds with different specifications, namely, the grooves 104 with different depths and widths are provided for users so as to meet the material testing requirements of different fields. In use, a user may select a suitable size of the recess 104 based on the measured material properties and the output characteristics of the light curing machine 103.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.
Claims (8)
1. A device for measuring shrinkage of a photo-cured material, comprising a material accommodating device, a photo-curing machine, a first displacement sensor, a second displacement sensor and a base; the material containing device is provided with a groove for containing the photo-curing material; the light curing machine is used for irradiating the light curing material so as to cure the light curing material; the first displacement sensor and the second displacement sensor are respectively positioned at two ends of the groove and are used for measuring the shrinkage of the cured light-cured material;
the material accommodating device, the photo-curing machine, the first displacement sensor and the second displacement sensor are all arranged on the upper surface of the base; the material containing device comprises a first stop block, a second stop block, a first baffle plate and a second baffle plate;
the first stop block and the second stop block are arranged in a clearance mode so as to form the groove;
the first baffle can block one end of the groove, and the second baffle can block the other end of the groove, so that the photocuring material is filled in the groove.
2. The apparatus for measuring shrinkage of a photo-setting material according to claim 1, wherein the base is provided with a slide rail, and the first stopper and the second stopper are reciprocally movable along a length direction of the slide rail to change a width of the groove.
3. The apparatus for measuring shrinkage of a photo-curable material according to claim 1, further comprising a position adjusting device connected to the base, the photo-curing machine being connected to the position adjusting device, the position adjusting device being configured to have a working distance between an end face of a light source output end of the photo-curing machine and an upper surface of the photo-curable material and to make the end face of the light source output end of the photo-curing machine parallel to the upper surface of the photo-curable material.
4. A device for measuring shrinkage of a photocurable material as recited in claim 3, wherein the position adjustment device includes a bracket, a lift mechanism, and a leveling mechanism; the bracket is hinged with the base; the lifting mechanism is connected with the bracket, the light curing machine is connected with the lifting mechanism, and the lifting mechanism is used for enabling the light curing machine to reciprocate relative to the material accommodating device so as to enable the end face of the light source output end of the light curing machine to be close to or far away from the upper surface of the light curing material; the leveling mechanism is connected with the bracket and is used for enabling the end face of the light source output end of the light curing machine to be parallel to the upper surface of the light curing material.
5. The apparatus for measuring shrinkage of a photocurable material as recited in claim 4, wherein the elevating mechanism includes an elevating slider and a screw, the photocuring machine is coupled to the elevating slider, the elevating slider is threadedly coupled to the screw, the screw is coupled to the bracket, and the screw is rotatable about its own axis to raise or lower the elevating slider relative to the base.
6. The apparatus for measuring shrinkage of a photocurable material as recited in claim 4, wherein the leveling mechanism includes an adjustment bolt, the bracket is provided with a threaded hole, the adjustment bolt is mated with the threaded hole, and a tail end of the adjustment bolt is capable of abutting against an upper surface of the base.
7. The apparatus for measuring shrinkage of a photocurable material according to any one of claims 3-6, further comprising a rotating rod, one end of which is connected to the photocuring machine, the other end of which is connected to the position adjusting device, and which is rotatable about its own axis with respect to the position adjusting device.
8. The apparatus for measuring shrinkage of a photocurable material according to any one of claims 1-5, wherein the first displacement sensor and the second displacement sensor are each a laser displacement sensor.
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| CN201910103723.7A CN109752315B (en) | 2019-01-31 | 2019-01-31 | Device for measuring shrinkage of photo-curing material |
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| CN110672823B (en) * | 2019-10-24 | 2022-04-12 | 江苏赛诺格兰医疗科技有限公司 | Method and tool for testing shrinkage rate of silica gel |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009174928A (en) * | 2008-01-23 | 2009-08-06 | Nidec Tosok Corp | Shrink visual inspection method |
| CN202171561U (en) * | 2011-08-01 | 2012-03-21 | 阮丹平 | Device for testing shrinkage percentage of photocuring material in photocuring process |
| KR20160022446A (en) * | 2014-08-19 | 2016-03-02 | 한국기계연구원 | Apparatus for measuring contraction ratio of photocurable resin |
| CN205449982U (en) * | 2016-03-03 | 2016-08-10 | 湖南华曙高科技有限责任公司 | Measure device that photocuring resin line shrinkage is rateed |
| CN209446445U (en) * | 2019-01-31 | 2019-09-27 | 北京大学口腔医学院 | For measuring the device of photo-curing material shrinking percentage |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9763760B2 (en) * | 2008-07-01 | 2017-09-19 | Ivoclar Vivadent Ag | Apparatus for light-curing a dental object |
-
2019
- 2019-01-31 CN CN201910103723.7A patent/CN109752315B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009174928A (en) * | 2008-01-23 | 2009-08-06 | Nidec Tosok Corp | Shrink visual inspection method |
| CN202171561U (en) * | 2011-08-01 | 2012-03-21 | 阮丹平 | Device for testing shrinkage percentage of photocuring material in photocuring process |
| KR20160022446A (en) * | 2014-08-19 | 2016-03-02 | 한국기계연구원 | Apparatus for measuring contraction ratio of photocurable resin |
| CN205449982U (en) * | 2016-03-03 | 2016-08-10 | 湖南华曙高科技有限责任公司 | Measure device that photocuring resin line shrinkage is rateed |
| CN209446445U (en) * | 2019-01-31 | 2019-09-27 | 北京大学口腔医学院 | For measuring the device of photo-curing material shrinking percentage |
Non-Patent Citations (2)
| Title |
|---|
| Characteristic shrinkage evaluation of photocurable materials;Ji-Won Park et al.;《Polymer Testing》;第344-353页 * |
| 紫外光固化收缩率的研究进展;魏善智 等;《化学与黏合》;第38卷(第5期);第373-381页 * |
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