CN109743852A - It is a kind of improve soldering tin amount SMT attachment use steel mesh - Google Patents
It is a kind of improve soldering tin amount SMT attachment use steel mesh Download PDFInfo
- Publication number
- CN109743852A CN109743852A CN201910135087.6A CN201910135087A CN109743852A CN 109743852 A CN109743852 A CN 109743852A CN 201910135087 A CN201910135087 A CN 201910135087A CN 109743852 A CN109743852 A CN 109743852A
- Authority
- CN
- China
- Prior art keywords
- baffle
- steel mesh
- scolding tin
- hole
- tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 86
- 229910000831 Steel Inorganic materials 0.000 title claims abstract description 36
- 239000010959 steel Substances 0.000 title claims abstract description 36
- 238000005476 soldering Methods 0.000 title claims abstract description 24
- 239000011159 matrix material Substances 0.000 claims abstract description 24
- 238000009434 installation Methods 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
The present invention provides a kind of SMT attachment steel meshes for improving soldering tin amount, it includes steel mesh substrate, multiple scolding tin holes are offered on steel mesh substrate, scolding tin hole is placed on the electronic component of circuit board, multiple scolding tin deflectors are provided on the hole wall in scolding tin hole, scolding tin deflector includes the installation matrix being fixedly installed on the hole wall in scolding tin hole, the opposite sides of installation matrix is elasticly connected with the first baffle and the second baffle respectively, the end of first baffle extends to the top-portion apertures edge in scolding tin hole, and the end of the second baffle extends to the direction of circuit board.The present invention can effectively improve soldering tin amount compared to the prior art, and the purpose of tin 100% is climbed after realization furnace.
Description
Technical field
The present invention relates to SMT to mount manufacture field, in particular to a kind of SMT attachment steel mesh for improving soldering tin amount.
Background technique
In current SMT manufacturing process, steel mesh is a kind of controlling in the preceding print tin cream on circuit board of SMT factory assembling
Tool, the solder mask window layer of the main corresponding circuits plate of the aperture of steel mesh usually need the circuit board of patch that can just hold net window, steel mesh
Substrate entirety size then corresponding circuits plate size.
Current some circuit boards climb tin after requiring furnace to the patch of the castle type pad above mainboard when scolding tin is processed
100%, and current upper tin amount is unable to satisfy this requirement for climbing tin.
Summary of the invention
In consideration of it, the present invention provides a kind of SMT attachment steel of raising soldering tin amount that may be implemented to climb tin 100% after furnace
Net.
For this purpose, the present invention provides a kind of SMT attachment steel meshes for improving soldering tin amount comprising steel mesh substrate, steel mesh base
Multiple scolding tin holes are offered on plate, scolding tin hole is placed on the electronic component of circuit board, and multiple welderings are provided on the hole wall in scolding tin hole
Tin deflector, scolding tin deflector include the installation matrix being fixedly installed on the hole wall in scolding tin hole, install the opposite of matrix
Two sides are elasticly connected with the first baffle and the second baffle respectively, and the end of the first baffle is prolonged to the top-portion apertures edge in scolding tin hole
It stretches, the end of the second baffle extends to the direction of circuit board.
Further, the first mounting groove is offered on the end face of above-mentioned first baffle, the end insertion the of matrix is installed
In one mounting groove, the first spring is installed in the first mounting groove.
Further, the second mounting groove is offered on the end face of above-mentioned second baffle, the end insertion the of matrix is installed
In two mounting grooves, second spring is installed in the second mounting groove.
Further, the third baffle that the direction of oriented circuit board extends is connected on the end of above-mentioned second baffle.
Further, above-mentioned third baffle is rectangular guiding block.
Further, limited block is additionally provided between above-mentioned first baffle and the second baffle.
Further, above-mentioned limited block is slidably connected to the surface of installation matrix.
Further, above-mentioned limited block include two limit module units, between connected by third spring.
A kind of SMT attachment steel mesh improving soldering tin amount provided by the present invention, is provided with steel mesh substrate, on steel mesh substrate
Multiple scolding tin holes are offered, scolding tin hole is placed on the electronic component (specific such as chip) of circuit board, is arranged on the hole wall in scolding tin hole
There are multiple scolding tin deflectors, scolding tin deflector includes the installation matrix being fixedly installed on the hole wall in scolding tin hole, installs base
The opposite sides of block is elasticly connected with the first baffle and the second baffle respectively, the top of the end of the first baffle to scolding tin hole
Along extending, the end of the second baffle extends to the direction of circuit board in portion hole；By the setting of above structure, utilized in scolding tin
The effect of scolding tin deflector increases the upper tin amount of electronic component side edge, specially installation matrix, the first baffle and second
Baffle is by force to be accumulated scolding tin to the side of electronic component using barrier properties, while utilizing the first baffle first
Can be towards close installation matrix or far from the installation movable characteristic of matrix with the second baffle, and utilize arranged up and down
Gravity allows scolding tin to carry out heap to the side of electronic component and the junction of electronic component and circuit board as far as possible
Product, it can climb the pin of full electronic component, so that soldering tin amount can be effectively improved compared to the prior art, climbed after realizing furnace
The purpose of tin 100%.
Detailed description of the invention
By reading the following detailed description of the preferred embodiment, various other advantages and benefits are common for this field
Technical staff will become clear.The drawings are only for the purpose of illustrating a preferred embodiment, and is not considered as to the present invention
Limitation.And throughout the drawings, the same reference numbers will be used to refer to the same parts.In the accompanying drawings:
Fig. 1 is a kind of structural schematic diagram of SMT attachment steel mesh for improving soldering tin amount provided in an embodiment of the present invention:
Fig. 2 is the enlarged drawing in the portion A in Fig. 1.
Specific embodiment
Exemplary embodiments of the present disclosure are described in more detail below with reference to accompanying drawings.Although showing the disclosure in attached drawing
Exemplary embodiment, it being understood, however, that may be realized in various forms the disclosure without should be by embodiments set forth here
It is limited.On the contrary, these embodiments are provided to facilitate a more thoroughly understanding of the present invention, and can be by the scope of the present disclosure
It is fully disclosed to those skilled in the art.
Embodiment one:
Referring to Fig. 1 to Fig. 2, the SMT attachment that a kind of raising soldering tin amount of the offer of the embodiment of the present invention one is shown in figure is used
Steel mesh comprising steel mesh substrate 1 offers multiple scolding tin holes 11 on steel mesh substrate 1, and scolding tin hole 11 is placed on the electronics of circuit board 2
On element 21, multiple scolding tin deflectors 12 are provided on the hole wall in scolding tin hole 11, scolding tin deflector 12 includes being fixedly mounted
In the installation matrix 121 on the hole wall in scolding tin hole 11, the opposite sides for installing matrix 121 is elasticly connected with the first baffle respectively
122 and second baffle 123, top-portion apertures from the end of the first baffle 122 to scolding tin hole 11 along extending, the second baffle 123
End to the direction of circuit board 2 extend.
A kind of SMT attachment steel mesh for improving soldering tin amount, is provided with steel mesh substrate, steel mesh substrate provided by the present embodiment
On offer multiple scolding tin holes, scolding tin hole is placed on the electronic component (specific such as chip) of circuit board, is set on the hole wall in scolding tin hole
Multiple scolding tin deflectors are equipped with, scolding tin deflector includes the installation matrix being fixedly installed on the hole wall in scolding tin hole, installation
The opposite sides of matrix is elasticly connected with the first baffle and the second baffle respectively, and the end of the first baffle is to scolding tin hole
Along extending, the end of the second baffle extends top-portion apertures to the direction of circuit board；It is sharp in scolding tin by the setting of above structure
Increase the upper tin amount of electronic component side edge with the effect of scolding tin deflector, specially installation matrix, the first baffle and the
Two baffles are by force to be accumulated scolding tin to the side of electronic component using barrier properties, while utilizing the first water conservancy diversion first
Block and the second baffle can be towards close installation matrixs or far from the installation movable characteristic of matrix, and utilize upper and lower arrangement
Gravity, allow scolding tin to carry out heap to the side of electronic component and the junction of electronic component and circuit board as far as possible
Product, it can climb the pin of full electronic component, so that soldering tin amount can be effectively improved compared to the prior art, climbed after realizing furnace
The purpose of tin 100%.
Embodiment two:
Referring to Fig. 1 to Fig. 2, a kind of SMT attachment for improving soldering tin amount provided by Embodiment 2 of the present invention is shown in figure and is used
Steel mesh, the present embodiment be also further made that on the basis of the above embodiments it is following as an improved technical scheme: first
The first mounting groove 124 is offered on the end face of baffle 122, the end of installation matrix 121 is inserted into the first mounting groove 124, the
First spring 125 is installed in one mounting groove 124；Meanwhile second baffle 123 end face on offer the second mounting groove 126,
The end for installing matrix 121 is inserted into the second mounting groove 126, is equipped with second spring 127 in the second mounting groove 126.
By the setting of above structure, the installation of the first baffle and the second baffle can be made more firm.
Embodiment three:
Referring to Fig. 1 to Fig. 2, the SMT attachment that a kind of raising soldering tin amount of the offer of the embodiment of the present invention three is shown in figure is used
Steel mesh, the present embodiment be also further made that on the basis of the above embodiments it is following as an improved technical scheme: second
The third baffle 128 that the direction of oriented circuit board 2 extends is connected on the end of baffle 123；Third baffle 128 is rectangle
Baffle.By the setting of above structure, further guide functions of the scolding tin to electronic component bottom may be implemented.
Example IV:
Referring to Fig. 1 to Fig. 2, the SMT attachment that a kind of raising soldering tin amount of the offer of the embodiment of the present invention four is shown in figure is used
Steel mesh, the present embodiment be also further made that on the basis of the above embodiments it is following as an improved technical scheme: first
Limited block 13 is additionally provided between baffle 122 and the second baffle 123；Specifically, limited block 13 is slidably connected to installation base
The surface of block 121；Again specifically, limited block 13 include two limit module units 131, between by third spring 132 connect.
By the setting of above structure, may be implemented for the first baffle and the movable position-limiting action of the second baffle.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
Mind and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (8)
1. a kind of SMT attachment steel mesh for improving soldering tin amount, which is characterized in that including steel mesh substrate (1), the steel mesh substrate
(1) multiple scolding tin holes (11) are offered on, the scolding tin hole (11) is placed on the electronic component (21) of circuit board (2), the weldering
Multiple scolding tin deflectors (12) are provided on the hole wall in tin hole (11), the scolding tin deflector (12) includes being fixedly installed in
The opposite sides of installation matrix (121) on the hole wall of the scolding tin hole (11), installation matrix (121) distinguishes elastic connection
There are the first baffle (122) and the second baffle (123), the end of first baffle (122) is to the scolding tin hole (11)
Top-portion apertures along extending, the end of second baffle (123) extends to the direction of the circuit board (2).
2. a kind of SMT attachment steel mesh for improving soldering tin amount according to claim 1, which is characterized in that described first leads
It flows and is offered the first mounting groove (124) on the end face of block (122), the end insertion of installation matrix (121) first peace
In tankage (124), the first spring (125) are installed in first mounting groove (124).
3. a kind of SMT attachment steel mesh for improving soldering tin amount according to claim 1, which is characterized in that described second leads
It flows and is offered the second mounting groove (126) on the end face of block (123), the end insertion of installation matrix (121) second peace
In tankage (126), second spring (127) are installed in second mounting groove (126).
4. a kind of SMT attachment steel mesh for improving soldering tin amount according to claim 1 or 3, which is characterized in that described second
The third baffle (128) that the direction of the oriented circuit board (2) extends is connected on the end of baffle (123).
5. a kind of SMT attachment steel mesh for improving soldering tin amount according to claim 4, which is characterized in that the third is led
Flowing block (128) is rectangular guiding block.
6. a kind of SMT attachment steel mesh for improving soldering tin amount according to claim 1, which is characterized in that described first leads
Limited block (13) are additionally provided between stream block (122) and second baffle (123).
7. a kind of SMT attachment steel mesh for improving soldering tin amount according to claim 6, which is characterized in that the limited block
(13) it is slidably connected to the surface of installation matrix (121).
8. a kind of SMT attachment steel mesh for improving soldering tin amount according to claim 6 or 7, which is characterized in that the limit
Block (13) include two limit module unit (131), between by third spring (132) connect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910135087.6A CN109743852A (en) | 2019-02-20 | 2019-02-20 | It is a kind of improve soldering tin amount SMT attachment use steel mesh |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910135087.6A CN109743852A (en) | 2019-02-20 | 2019-02-20 | It is a kind of improve soldering tin amount SMT attachment use steel mesh |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109743852A true CN109743852A (en) | 2019-05-10 |
Family
ID=66368142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910135087.6A Pending CN109743852A (en) | 2019-02-20 | 2019-02-20 | It is a kind of improve soldering tin amount SMT attachment use steel mesh |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109743852A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5460316A (en) * | 1993-09-15 | 1995-10-24 | At&T Global Information Solutions Company | Stencils having enhanced wear-resistance and methods of manufacturing the same |
| JPH10303248A (en) * | 1997-04-28 | 1998-11-13 | Ngk Spark Plug Co Ltd | Wiring board having solder bump, manufacture of the wiring board and metal mask for forming solder bump |
| US20030222125A1 (en) * | 2002-05-17 | 2003-12-04 | Fleck Ian Mcphee | Solder printing using a stencil having a reverse-tapered aperture |
| KR20040037560A (en) * | 2002-10-29 | 2004-05-07 | 앰코 테크놀로지 코리아 주식회사 | Stencil for manufacturing semiconductor device and manufacturing method thereof |
| CN202103963U (en) * | 2011-05-31 | 2012-01-04 | 昆山元崧电子科技有限公司 | Anti-tin-sweat printing formwork opening structure |
| CN207252042U (en) * | 2017-08-10 | 2018-04-17 | 乐依文半导体(东莞)有限公司 | SMT printed steel mesh and wafer mounting apparatus |
| CN209964406U (en) * | 2019-02-20 | 2020-01-17 | 苏州市吴通智能电子有限公司 | SMT (surface mount technology) mounting steel mesh capable of improving soldering tin amount |
-
2019
- 2019-02-20 CN CN201910135087.6A patent/CN109743852A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5460316A (en) * | 1993-09-15 | 1995-10-24 | At&T Global Information Solutions Company | Stencils having enhanced wear-resistance and methods of manufacturing the same |
| JPH10303248A (en) * | 1997-04-28 | 1998-11-13 | Ngk Spark Plug Co Ltd | Wiring board having solder bump, manufacture of the wiring board and metal mask for forming solder bump |
| US20030222125A1 (en) * | 2002-05-17 | 2003-12-04 | Fleck Ian Mcphee | Solder printing using a stencil having a reverse-tapered aperture |
| KR20040037560A (en) * | 2002-10-29 | 2004-05-07 | 앰코 테크놀로지 코리아 주식회사 | Stencil for manufacturing semiconductor device and manufacturing method thereof |
| CN202103963U (en) * | 2011-05-31 | 2012-01-04 | 昆山元崧电子科技有限公司 | Anti-tin-sweat printing formwork opening structure |
| CN207252042U (en) * | 2017-08-10 | 2018-04-17 | 乐依文半导体(东莞)有限公司 | SMT printed steel mesh and wafer mounting apparatus |
| CN209964406U (en) * | 2019-02-20 | 2020-01-17 | 苏州市吴通智能电子有限公司 | SMT (surface mount technology) mounting steel mesh capable of improving soldering tin amount |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |