CN109735285A - A kind of high-accuracy electronics PUR hot melt adhesive and preparation method thereof - Google Patents
A kind of high-accuracy electronics PUR hot melt adhesive and preparation method thereof Download PDFInfo
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- CN109735285A CN109735285A CN201910010770.7A CN201910010770A CN109735285A CN 109735285 A CN109735285 A CN 109735285A CN 201910010770 A CN201910010770 A CN 201910010770A CN 109735285 A CN109735285 A CN 109735285A
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- melt adhesive
- hot melt
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Abstract
The invention proposes a kind of high-accuracy electronics PUR hot melt adhesive, raw material includes isocyanates, synthetic resin and catalyst；By polyalcohol and long-chain biatomic acid under the action of chain extender, 140 DEG C of -240 DEG C of reaction time 3-18 hour are made the synthetic resin, and the polyalcohol and binary acid mass ratio are 100:75 to 100:225.PUR hot melt adhesive prepared by the present invention and most of low polar plastic basis material such as ABS, PA, PET etc. have good bonding force, product flexibility is good, resistance to low temperature is prominent, it is solvent-free, fusing point is low, more environment-friendly and safer, processing performance is good, low in cost, moderate cost has broad application prospects.
Description
Technical field
The present invention relates to technical field of polymer materials, and in particular to a kind of high-accuracy electronics PUR hot melt adhesive and its system
Preparation Method.
Background technique
Reactive polyurethane hot melt (PUR) be under conditions of inhibiting chemical reaction, heating melting at fluid, in order to
Coating；Bonding effect is played in glue-line cohesion after two kinds of clung body fittings；Later by means of depositing in air or clung body surface
The moisture of attachment reacts, chain extension, generates the high molecular polymer with Gao Juli, mentions bonding force, heat resistance etc. significantly
It is high.Its existing hot melt the solvent-free of class adhesive, tack be high, assembly when the positioning characteristics such as rapidly, and reactive pattern adhesive
The performances such as water-fast, heatproof, creep resistance, moisture-proof and media-resistant.
Reaction type polyurethane hot-melt adhesive on domestic market, generally have it is highly polar, to the materials such as metal, glass have
There is good bonding force, but to the lower material of polarity, as the bonding force of the materials such as plastics.Electronics industry is especially high-precision
Cipher telegram sub-industry is higher to the bonding requirements of PUR and plastic part, and home products easily occurs under high temperature or other critical conditions
Plastic shell or wiring board degumming phenomenon, and imported product is expensive, and single variety, universality is poor.
Summary of the invention
In order to solve the above technical problems, the present invention provides a kind of high-accuracy electronics PUR hot melt adhesive and its preparation side
Method, it is intended that a kind of high-accuracy electronics PUR hot melt adhesive is provided, by independently synthesizing a low polar resin, as anti-
The main resin for answering type hot melt adhesive using the low polarity and flexibility of synthetic resin, and cooperates its chain extender, is prepared for plastics base
Material has the reaction type polyurethane hot-melt adhesive of good cementability, while by MOLECULE DESIGN, product being made to have suitable use
Craftsmanship.
The present invention provides a kind of high-accuracy electronics PUR hot melt adhesive, and raw material includes isocyanates, synthetic resin and catalysis
Agent；
The synthetic resin by polyalcohol and long-chain biatomic acid under the action of chain extender, 140 DEG C of -240 DEG C of reaction time
It is made within 3-18 hours, the polyalcohol and binary acid mass ratio are 100:75 to 100:225.
As further improvement of the invention, the molecular weight of the synthetic resin is 1000-5000.
As further improvement of the invention, the degree of functionality of the synthetic resin is 1.5-4.
As further improvement of the invention, the chain extender is binary or ternary alcohol.
As further improvement of the invention, the dosage of the chain extender is the 0%-10% of total hydroxyl moles.
As further improvement of the invention, the isocyanates is toluene di-isocyanate(TDI) (TDI), diphenyl methane two
One of isocyanates (MDI), isoflurane chalcone diisocyanate (IPDI) and hexamethylene diisocyanate (HDI) are several
Kind, the total mole number of the isocyanates is 1.01-2 times of total hydroxyl moles.
Improved as of the invention further, the catalyst be selected from one of organotin, organo-bismuth and organic zinc or
It is several.
As further improvement of the invention, the additive amount of the catalyst is the 50ppm-1000ppm of system total amount.
The present invention further protects a kind of preparation method of above-mentioned high-accuracy electronics PUR hot melt adhesive, in accordance with the following methods
Preparation:
S1. synthetic resin is placed in prepolymerization reactor, is heated up to 40 DEG C -150 DEG C, reacted 1-12 hours while stirring
Afterwards, cooling, cooling period stirring does not stop, and performed polymer is made；
S2. extruder reactive extrursion is added in performed polymer and catalyst.
As further improvement of the invention, the temperature of the reactive extrursion step is 120 DEG C -150 DEG C, time 1-3
Minute.
The invention has the following beneficial effects: the present invention independently to synthesize a low polar resin, as Reactive hot melt adhesive
Main resin, using the low polarity and flexibility of synthetic resin, and cooperate its chain extender, be prepared for that there is plastic basis material good
The reaction type polyurethane hot-melt adhesive of cementability there is product and suitably use craftsmanship while by MOLECULE DESIGN；
PUR hot melt adhesive prepared by the present invention and most of low polar plastic basis material such as ABS, PA, PET etc. have good
Bonding force, product flexibility is good, and resistance to low temperature is prominent, solvent-free, fusing point is low, and more environment-friendly and safer, processing performance is good, cost
It is cheap, it is moderate, it has broad application prospects.
Specific embodiment
Below in conjunction with the embodiment of the present invention, the technical scheme in the embodiment of the invention is clearly and completely described,
Obviously, the embodiment described is the embodiment of part of representative of the invention, rather than whole embodiments, this field are general
Other all embodiments obtained belong to protection of the invention to logical technical staff without making creative work
Range.
Embodiment 1
A kind of high-accuracy electronics PUR hot melt adhesive, raw material include isocyanates, synthetic resin and catalyst；
By polyalcohol and long-chain biatomic acid, 140 DEG C were made the synthetic resin for the reaction time 3 hours, the polyalcohol with
Binary acid mass ratio is 100:75.The molecular weight of the synthetic resin is 1000-5000, degree of functionality 1.5.The polyalcohol is
1,2 propylene glycol.
The isocyanates is that the total mole number of toluene di-isocyanate(TDI) (TDI) described isocyanates is total hydroxyl moles
1.01 times.
A kind of high-accuracy electronics preparation method of PUR hot melt adhesive, prepares in accordance with the following methods:
S1. synthetic resin and TDI are placed in prepolymerization reactor, are heated up to 40 DEG C, it is cold after reacting 1 hour while stirring
But, cooling period stirring does not stop, and performed polymer is made；The isocyanates is TDI (toluene di-isocyanate(TDI)), isocyanates
Total mole number is 1.01 times of total hydroxyl moles.
S2. extruder reactive extrursion is added in performed polymer, chain extender and catalyst, temperature is 120 DEG C, and the time is 1 minute.
The chain extender is ethylene glycol, and dosage is the 10% of total hydroxyl moles.The catalyst is organo-bismuth, and additive amount is that system is total
The 50ppm. of amount
Embodiment 2
A kind of high-accuracy electronics PUR hot melt adhesive, raw material include isocyanates, synthetic resin and catalyst；
The synthetic resin by polyalcohol and long-chain biatomic acid at 240 DEG C, react 18 hours be made, the polyalcohol with
Binary acid mass ratio is 100:225.The molecular weight of the synthetic resin is 1000-5000, degree of functionality 4.The polyalcohol is
Trimethylolpropane.
The isocyanates is methyl diphenylene diisocyanate (MDI), and the total mole number of the isocyanates is hydroxyl
2 times of total mole number.
A kind of high-accuracy electronics preparation method of PUR hot melt adhesive, prepares in accordance with the following methods:
S1. by synthetic resin and MDI, chain extender is placed in prepolymerization reactor, is heated up to 150 DEG C, is reacted 12 while stirring
Cooling after hour, cooling period stirring does not stop, and performed polymer is made；The chain extender is 1,4 butanediols.The isocyanates
Total mole number for MDI (methyl diphenylene diisocyanate) isocyanates is 2 times of total hydroxyl moles.
S2. extruder reactive extrursion is added in performed polymer and catalyst, temperature is 150 DEG C, and the time is 3 minutes.It is described to urge
Agent is selected from organic zinc, and additive amount is the 1000ppm of system total amount.
Embodiment 3
A kind of high-accuracy electronics PUR hot melt adhesive, raw material include isocyanates, synthetic resin and catalyst；
The synthetic resin reacted at 200 DEG C by polyalcohol and long-chain biatomic acid 10 hours be made, the polyalcohol with
Binary acid mass ratio is 100:125.The molecular weight of the synthetic resin is 1000-5000, degree of functionality 2.5.The polyalcohol
For trimethylolpropane, dosage is the 1% of total hydroxyl moles.
The isocyanates is hexamethylene diisocyanate (HDI), and the total mole number of the isocyanates is that hydroxyl is total
1.5 times of molal quantity.
A kind of high-accuracy electronics preparation method of PUR hot melt adhesive, prepares in accordance with the following methods:
S1. by synthetic resin and HDI, chain extender is placed in prepolymerization reactor, is heated up to 100 DEG C, and it is small to react 6 while stirring
Shi Hou, cooling, cooling period stirring does not stop, and performed polymer is made；The chain extender is Isosorbide-5-Nitrae butanediol, ethylene glycol, a contracting diethyl
One or more of glycol, dosage are the 0-1% of total hydroxyl moles.The isocyanates is TDI (toluene diisocynate
Ester), MDI (methyl diphenylene diisocyanate), IPDI (isoflurane chalcone diisocyanate), HDI (hexa-methylene diisocyanate
One or more of ester), the total mole number of isocyanates is 1.5 times of total hydroxyl moles.
S2. extruder reactive extrursion is added in performed polymer and catalyst, temperature is 135 DEG C, and the time is 2 minutes.It is described to urge
Agent is organic zinc, and organo-bismuth, one or more of organotin, additive amount is the 500ppm of system total amount.
Test case 1
High-accuracy electronics prepared by 1-3 of the embodiment of the present invention is tested for the property with PUR hot melt adhesive, the results are shown in Table 1.
Table 1
Compared with prior art, the present invention independently synthesizes a low polar resin, as the main resin of Reactive hot melt adhesive,
Using the low polarity and flexibility of synthetic resin, and cooperate its chain extender, is prepared for that there is good cementability to plastic basis material
Reaction type polyurethane hot-melt adhesive there is product and suitably use craftsmanship while by MOLECULE DESIGN；It is prepared by the present invention
PUR hot melt adhesive and most of low polar plastic basis material such as ABS, PA, PET etc. have good bonding force, and product flexibility is good,
Resistance to low temperature is prominent, solvent-free, fusing point is low, and more environment-friendly and safer, processing performance is good, low in cost, moderate, has wide
Wealthy application prospect.
Those skilled in the art is not under conditions of departing from the spirit and scope of the present invention that claims determine, also
Various modifications can be carried out to the above content.Therefore the scope of the present invention is not limited in above explanation, but by
The range of claims determines.
Claims (10)
1. a kind of high-accuracy electronics PUR hot melt adhesive, which is characterized in that its raw material includes isocyanates, synthetic resin and catalysis
Agent；
The synthetic resin by polyalcohol and long-chain biatomic acid under the action of chain extender, 140 DEG C of -240 DEG C of reaction time 3-18
Hour is made, and the polyalcohol and binary acid mass ratio are 100:75 to 100:225.
2. a kind of high-accuracy electronics PUR hot melt adhesive according to claim 1, which is characterized in that point of the synthetic resin
Son amount is 1000-5000.
3. a kind of high-accuracy electronics PUR hot melt adhesive according to claim 1, which is characterized in that the official of the synthetic resin
Energy degree is 1.5-4.
4. a kind of high-accuracy electronics PUR hot melt adhesive according to claim 1, which is characterized in that the chain extender is binary
Or trihydroxylic alcohol.
5. a kind of high-accuracy electronics PUR hot melt adhesive according to claim 1, which is characterized in that the isocyanates is selected from
In toluene di-isocyanate(TDI), methyl diphenylene diisocyanate, isoflurane chalcone diisocyanate and hexamethylene diisocyanate
One or more, the total mole number of the isocyanates is 1.01-2 times of total hydroxyl moles.
6. a kind of high-accuracy electronics PUR hot melt adhesive according to claim 1, which is characterized in that the dosage of the chain extender
For the 0%-10% of total hydroxyl moles.
7. a kind of high-accuracy electronics PUR hot melt adhesive according to claim 1, which is characterized in that the catalyst, which is selected from, to be had
One or more of machine tin, organo-bismuth and organic zinc.
8. a kind of high-accuracy electronics PUR hot melt adhesive according to claim 1, which is characterized in that the addition of the catalyst
Amount is the 50ppm-1000ppm of system total amount.
9. a kind of preparation method of high-accuracy electronics PUR hot melt adhesive described in -8 any claims according to claim 1, special
Sign is, prepares in accordance with the following methods:
S1. synthetic resin and isocyanates are placed in prepolymerization reactor, are heated up to 40 DEG C -150 DEG C, react 1-12 while stirring
Cooling after hour, cooling period stirring does not stop, and performed polymer is made；
S2. extruder reactive extrursion is added in performed polymer and catalyst.
10. a kind of preparation method of high-accuracy electronics PUR hot melt adhesive according to claim 8, which is characterized in that described anti-
The temperature for answering extrusion step is 120 DEG C -150 DEG C, and the time is 1-3 minutes.
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| CN201910010770.7A CN109735285A (en) | 2019-01-07 | 2019-01-07 | A kind of high-accuracy electronics PUR hot melt adhesive and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113583612A (en) * | 2021-08-09 | 2021-11-02 | 广东省京极盛新材料科技有限公司 | PUR hot melt adhesive for multilayer solid wood composite floor and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101570676A (en) * | 2009-06-04 | 2009-11-04 | 长兴三伟热熔胶有限公司 | Polyurethane hot melt adhesive for high-grade lining cloth and preparation method thereof |
| CN105906790A (en) * | 2016-05-06 | 2016-08-31 | 浙江枧洋高分子科技有限公司 | Polyester polyol for synthesizing moisture cured polyurethane hot melt adhesives |
| CN109251307A (en) * | 2018-09-04 | 2019-01-22 | 上海金汤塑胶科技有限公司 | Polyester polyol and preparation method thereof and polyurethane hot melt and preparation method thereof |
-
2019
- 2019-01-07 CN CN201910010770.7A patent/CN109735285A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101570676A (en) * | 2009-06-04 | 2009-11-04 | 长兴三伟热熔胶有限公司 | Polyurethane hot melt adhesive for high-grade lining cloth and preparation method thereof |
| CN105906790A (en) * | 2016-05-06 | 2016-08-31 | 浙江枧洋高分子科技有限公司 | Polyester polyol for synthesizing moisture cured polyurethane hot melt adhesives |
| CN109251307A (en) * | 2018-09-04 | 2019-01-22 | 上海金汤塑胶科技有限公司 | Polyester polyol and preparation method thereof and polyurethane hot melt and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113583612A (en) * | 2021-08-09 | 2021-11-02 | 广东省京极盛新材料科技有限公司 | PUR hot melt adhesive for multilayer solid wood composite floor and preparation method thereof |
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Application publication date: 20190510 |