CN109732910A - Holographic 3D printing device and holographic 3D printing method - Google Patents
Holographic 3D printing device and holographic 3D printing method Download PDFInfo
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- CN109732910A CN109732910A CN201910103987.2A CN201910103987A CN109732910A CN 109732910 A CN109732910 A CN 109732910A CN 201910103987 A CN201910103987 A CN 201910103987A CN 109732910 A CN109732910 A CN 109732910A
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Abstract
The present invention relates to 3D field shaping techniques, disclose holographic 3D printing device and holographic 3D printing method.The device includes low adherency slot and holographic light-source system, wherein, the low adherency slot is used to issue hologram image and projects and irradiate the light-cured resin progress photocuring in the low adherency slot for loading light-cured resin, the holography light-source system, forms 3D printing structure.It is fast with print speed by that printed material can be made to be integrally formed using face array holographic light source using holographic 3D printing device provided by the invention and holographic 3D printing method, good forming effect, the high advantage of printing precision.
Description
Technical field
The present invention relates to 3D field shaping techniques, and in particular to holographic 3D printing device and holographic 3D printing method.
Background technique
3D printing is also known as increases material manufacturing technology, is one kind of rapid shaping technique, it based on digital model file,
It is point-by-point or successively print by way of construct three-dimension object.It up to the present, can be by 3D according to three-dimensionally shaped principle
Printing technique is divided into melting extrusion rapid shaping, stereolithograghy, digital light processing, foil laminated forming, ink-jet 3D are beaten
Print, selective laser sintering and electron-beam melting molding etc..They are compared with traditional manufacture without mold manufacture or machinery
Processing avoids the waste that tradition subtracts the material and the energy of manufacture process.
But 3D printing technique existing at present is to be all made of layer-by-layer or point-by-point printing type, is not reached really with body
The manufacture of three-dimensional structure is carried out for unit, therefore print speed is greatly limited.Meanwhile by it is point-by-point and by face at
When type mode prints hanging structure, due to print point or face sequencing, it is necessary to support construction be added, printing
When at rear removal support construction, the techniques such as physics flushing and polishing are generally required, printing precision is caused to reduce, especially printing is high
The structure of precision.The holographic 3D printing technique proposed at present can only print simple structure, and molding effect and precision are poor,
For realizing really holographic 3D printing, there are also very remote distances, so that its application receives great limitation with popularization.
Summary of the invention
The purpose of the invention is to overcome print speed of the existing technology is slow, prints hanging structure to need that branch is added
The low problem of support structure, printing precision provides holographic 3D printing device and holographic 3D printing method, using provided by the invention complete
3D printing device and holographic 3D printing method are ceased, by utilizing face array holographic light source, printed material can be made to be integrally formed, have and beat
Print-out rate is fast, good forming effect, the high advantage of printing precision.
To achieve the goals above, first aspect present invention provides a kind of holographic 3D printing device, which includes low
Adhere to slot and holographic light-source system, wherein the low adherency slot is used for for loading light-cured resin, the holography light-source system
It issues hologram image and projects and irradiate the light-cured resin progress photocuring in the low adherency slot, form 3D printing structure.
Preferably, the holographic light-source system includes area array light source, beam splitter, the first beam expander, reflecting mirror and the second expansion
Beam device, wherein
The area array light source is for emitting light beam；
The beam splitter is used to receive the light beam that the area array light source issues, and the light beam is divided into the first light beam and the
Two light beams；
First beam expander converts parallel cylinder light wave for first light beam for receiving first light beam
And expose to the light-cured resin in the low adherency slot；
The reflecting mirror is for reflecting second light beam to the second beam expander；
Second beam expander is for converting parallel cylinder light wave for second light beam and exposing to the low adherency
Light-cured resin in slot；
Wherein, the first light beam turns to interfere with each other and formed hologram image projection in the low adherency slot with the second light beam.
Preferably, the light transmittance of the low adherency slot is not less than 90%.
Preferably, the low adherency slot includes low adhesion layer, and the material of the low adhesion layer includes silicon rubber and surface
Activating agent.
Second aspect of the present invention provides a kind of above-mentioned holographic 3D printing method of device progress, and this method includes following step
It is rapid:
(a) light-cured resin is loaded into low adherency slot, wherein the adhesion strength of light-cured resin and low adherency slot is less than
10kPa；
(b) the identifiable map data mining platform of area array light source is converted by target three-dimensional, and exported to light source control software,
It controls area array light source and emits light beam；
(c) light beam is divided into the first light beam and the second light beam by beam splitter, the first light beam passes through the first beam expander
It is converted into parallel cylinder light wave and irradiates the light-cured resin in the low adherency slot, the second light beam reflexes to the by reflecting mirror
Two beam expanders, and the light-cured resin being converted into low adherency slot described in parallel cylinder light-wave irradiation, wherein first light beam
It is interfered with each other in the low adherency slot with the second light beam and forms hologram image projection；
(d) light-cured resin described in the hologram image projection illumination carries out photocuring, forms the 3D of target three-dimensional
Print structure.
Preferably, the photosensitive wavelength of the light-cured resin is 200nm-900nm, preferably 300-450nm, it is preferable that
The light-cured resin is selected from polymethyl methacrylate, polyacrylic resin, epoxy acrylic resin, polyurethane acroleic acid tree
Rouge, polyester acrylate resin, polyoxyalkylene acrylate resin, phenolic resin, acrylonitrile-butadiene-styrene copolymer performed polymer,
One of allyl resin and vinylite are a variety of.
Preferably, the acceptable light beam light intensity of the light-cured resin is 0-100mW/cm2, preferably 3-20mW/cm2。
The present invention passes through holographic light-source system formation hologram image and projects and expose to the light-cured resin in low adherency slot
Photocuring is carried out, and the adhesion strength of light-cured resin and low adherency slot is less than 10kPa, adjusts the light intensity and light of hologram image projection
Solidified resin cause solidify required light intensity it is consistent when can be solidified, to realize holographic 3D printing, printed material one
It is body formed.Holographic 3D printing method of the invention has print speed fast, may be implemented the print speed of second-time, and due to
Without using support construction when printing hanging structure, to improve printing precision, and good forming effect.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of 3D printing device of the invention.
Description of symbols
It 1, can three-dimensional mobile micro-displacement platform 2, area array light source
3, beam splitter 4, reflecting mirror
5, the first beam expander 6, the second beam expander
7, low adherency slot 8, light-cured resin
9, hologram image projects
Specific embodiment
The endpoint of disclosed range and any value are not limited to the accurate range or value herein, these ranges or
Value should be understood as comprising the value close to these ranges or value.For numberical range, between the endpoint value of each range, respectively
It can be combined with each other between the endpoint value of a range and individual point value, and individually between point value and obtain one or more
New numberical range, these numberical ranges should be considered as specific open herein.
First aspect present invention provides a kind of holographic 3D printing device, which includes low adherency slot and holographic light source system
System, wherein the low adherency slot is for loading light-cured resin, and the holography light-source system is for issuing hologram image projection simultaneously
The light-cured resin irradiated in the low adherency slot carries out photocuring, forms 3D printing structure.
In the present invention, term " area array light source " refer at least one side projection light source or by point light source groups at array,
Also referred to as holographic light source.
In the present invention, as shown in Figure 1, the holography light-source system may include area array light source 2, the expansion of beam splitter 3, first
Beam device 5, reflecting mirror 4 and the second beam expander 6, wherein the area array light source 2 is for emitting light beam；The beam splitter 3 is for receiving
The light beam that the area array light source issues, and the light beam is divided into the first light beam and the second light beam；First beam expander 5 is used for
First light beam is received, and converts parallel cylinder light wave for first light beam and exposes to the light in the low adherency slot
Solidified resin；The reflecting mirror 4 is for reflecting second light beam to the second beam expander；Second beam expander 6 is used for institute
The second light beam is stated to be converted into parallel cylinder light wave and expose to the light-cured resin in the low adherency slot；Wherein, the first light beam
Turn to interfere with each other and formed hologram image projection 9 in the low adherency slot with the second light beam.
In the present invention, as shown in Figure 1, the holography light-source system can also include can three-dimensional mobile micro-displacement platform
1, it is described can three-dimensional mobile micro-displacement platform 1 connect with area array light source 2, for adjusting the position of area array light source 2.
In the present invention, the holographic light-source system can also include being electrically connected with the area array light source 2 and micro-displacement platform 1
The computer connect for converting the identifiable map data mining platform of the area array light source for target three-dimensional, and is exported to light source
Software is controlled, the area array light source transmitting light beam is controlled.
In the present invention, the light beam wavelength of the area array light source transmitting can be 200nm-900nm, preferably 300-
450nm；Light beam light intensity can be 0-100mW/cm2, preferably 3-20mW/cm2.Preferably, the area array light source is sent out selected from laser
One of optical diode, light emitting diode with quantum dots, inorganic light-emitting diode and Organic Light Emitting Diode are a variety of.
Light emitting diode be can a kind of electric energy be converted to the device of luminous energy.
Wherein, term " laser luminescence diode " refers to using the hair that the luminous laser active material of stimulated radiation can be achieved
Optical diode.
Term " light emitting diode with quantum dots " refers to that addition quantum dot is the light emitting diode of active material.
Term " inorganic light-emitting diode " refers to the light emitting diode using inorganic material for active material.
Term " Organic Light Emitting Diode " refers to the light emitting diode using organic material for active material.
In the present invention, the area array light source can be plane projection light source, curved surface projection light source, monochromatic light source, more
One of coloured light light source and dot matrix area source are a variety of.
Wherein, term " plane projection light source " refers to that perspective plane is the projection light source of plane.
Term " curved surface projection light source " refers to that perspective plane is the projection light source of curved surface.
Term " monochromatic light source " refers to the light source that can only emit the light of fixed single wavelength.
Term " polychrome radiant " refers to the light source that can emit the light of multiple wavelength.
Term " dot matrix area source " refers to the area source being made of the array of point light source.
In the present invention, the beam splitter can be adjustable selected from fiber optic splitter, fixed splitting ratio beam splitter and splitting ratio
One of beam splitter is a variety of.In the art, splitting ratio refers to that the optical power of the one of output end output of optical splitter accounts for
The ratio of total Output optical power.Term " fixed splitting ratio beam splitter " refers to that splitting ratio is the beam splitter of fixed value.Term " light splitting
Than adjustable beam splitter " refer to the adjustable beam splitter of the numerical value of splitting ratio.
In the present invention, the low adherency slot can be open, be also possible to closed.The low adherency slot can wrap
Include slot bottom, side wall and optional top cover, it is preferable that the light transmittance of the low adherency slot is not less than 90%, such as light transmittance can be with
It is any in 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98%, 99%, 100% and these numerical value
Arbitrary value in two ranges constituted.
In a preferred embodiment, the low adherency slot includes low adhesion layer, and the material of the low adhesion layer includes
Silicon rubber and surfactant.Wherein, the silicon rubber is limited without special.The surfactant can be floride-free or fluorine-containing
Surfactant.Specifically, the fluorine-containing surfactant can be for using carbon fluorine as the compound of main chain or side-chain structure, fluorine-containing
One of liquid and fluorine-containing solid are a variety of, such as can be the long chain alkane etc. that side chain is replaced by fluorine atoms, more specifically,
The fluorine-containing surfactant can be 17 fluorine ruthenium trimethoxysilanes, (trifluoromethyl) trimethyl silane, triethyl group fluorine
Silane and 1,1,1,2,2,4,5,5,5- nine fluoro- 4- (trifluoromethyl)-propione etc..The non-fluorinated surfactant can for
Carbochain is the one or more of the compound of main chain or side-chain structure, organic liquid or solid, for example, can for long chain alkane, just
Hexadecane or n-eicosane etc..The proportionate relationship of silicon rubber and surfactant is limited without special, such as can be 1:1, and 10:
1,100:1 etc..
In a particular embodiment, the low adherency slot can for quartz, glass, polymethyl formicester, polyethylene,
Acrylic, polypropylene etc. are used as skeleton structure, and modify low adhesion layer in the slot bottom of low adherency slot and/or side wall.
In a preferred embodiment, slot bottom, side wall and the optional top cover of the low adherency slot can be the knot of plane
Structure.Since curved-surface structure is possible to cause the deformation of light beam, to increase the hologram projection to form required 3D threedimensional model
Difficulty, in the case where not considering to be formed the difficulty of hologram projection, slot bottom, side wall and the optional top cover of low adherency slot
It may be curved surface.
Second aspect of the present invention provides a kind of above-mentioned holographic 3D printing method of device progress, and this method includes following step
It is rapid:
(a) light-cured resin is loaded into low adherency slot, wherein the adhesion strength of light-cured resin and low adherency slot is less than
10kPa；
(b) the identifiable map data mining platform of area array light source is converted by target three-dimensional, and exported to light source control software,
It controls area array light source and emits light beam；
(c) light beam is divided into the first light beam and the second light beam by beam splitter, the first light beam passes through the first beam expander
It is converted into parallel cylinder light wave and irradiates the light-cured resin in the low adherency slot, the second light beam reflexes to the by reflecting mirror
Two beam expanders, and the light-cured resin being converted into low adherency slot described in parallel cylinder light-wave irradiation, wherein first light beam
It is interfered with each other in the low adherency slot with the second light beam and forms hologram image projection；
(d) light-cured resin described in the hologram image projection illumination carries out photocuring, forms the 3D of target three-dimensional
Print structure.
According to the method for the present invention, the photosensitive wavelength of the light-cured resin can be 200nm-900nm, preferably 300-
450nm.Preferably, the light-cured resin be selected from polymethyl methacrylate, polyacrylic resin, epoxy acrylic resin,
Polyurethane acrylic resin, polyester acrylate resin, polyoxyalkylene acrylate resin, phenolic resin, acrylonitrile-butadiene-styrene (ABS)
One of performed polymer, allyl resin and vinylite of copolymer are a variety of.
According to the method for the present invention, the acceptable light beam light intensity of the light-cured resin can be 0-100mW/cm2, preferably
For 3-20mW/cm2.The light intensity of hologram image projection cause with light-cured resin solidify required light intensity it is consistent when can be into
Row solidification.For example, the light intensity of hologram image projection is 3mW/cm2, the light intensity that light-cured resin causes needed for solidifying also is 3mW/
cm2；The light intensity of hologram image projection is 10mW/cm2, the light intensity that light-cured resin causes needed for solidifying also is 10mW/cm2；It is holographic
The light intensity of image projection is 20mW/cm2, the light intensity that light-cured resin causes needed for solidifying also is 20mW/cm2。
According to the method for the present invention, the volume of the hologram image projection is less than the volume of the light-cured resin, so that
Hologram image, which is projected on light-cured resin, forms effectively projection.
The adhesion strength of preferred embodiment according to the present invention, light-cured resin and low adherency slot is 0.01-5kPa, such as
It can be any two in 0.01kPa, 0.1kPa, 0.5kPa, 1kPa, 2kPa, 3kPa, 4kPa, 5kPa and these numerical value
The arbitrary value in range constituted.Preferably, the adhesion strength of light-cured resin and low viscous slot.
The present invention will be described in detail by way of examples below.
Preparation example 1
By the silastic material liquid of 7.5g (be purchased from Dow Corning company, batch SYLGARD184, initiator with
Curing agent ratio is 10:1), (fluorine-containing surfactant is purchased from Sigma- with the 17 fluorine ruthenium trimethoxysilanes of 0.5g
Aldrich) mechanical stirring mixing, obtain the raw material for preparing the low adhesion layer of low adherency slot.
Having a size of 8cm × 8cm × 10cm cuboid quartz cell, as skeleton structure, the low adherency of low adherency slot will be prepared
The raw material of layer are laid on the bottom of quartz cell, and quartz cell is heated to 80 DEG C later, low adherency slot is obtained after 2h.
Low adherency slot is 92% to the light transmittance of 200nm light.
Preparation example 2
The silastic material of 10g (is purchased from Dow Corning company, batch is SYLGARD 160, initiator and solidification
Agent ratio is 6:1), it is stirred with (trifluoromethyl) trimethyl silane (fluorine-containing surfactant is purchased from Acros company) machinery of 0.1g
Mixing is mixed, the raw material for preparing the low adhesion layer of low adherency slot are obtained.
Having a size of 12cm × 12cm × 12cm square acrylic slot, as skeleton structure, the low of low adherency slot will be prepared
The raw material of adhesion layer are laid on the bottom of acrylic slot, and acrylic slot is heated to 80 DEG C later, and low adherency slot is obtained after 2h.
Low adherency slot is 95% to the light transmittance of 365nm light.
Preparation example 3
The silastic material of 5g (is purchased from Dow Corning company, batch is SYLGARD 170, initiator and curing agent
Ratio is 8:1), triethyl group silicon fluoride (fluorine-containing surfactant is purchased from Accela company) mechanical stirring mixing with 1g obtains
Prepare the raw material of the low adhesion layer of low adherency slot.
Having a size of 5cm × 5cm × 5cm square glass guide channel, as skeleton structure, the low adherency of low adherency slot will be prepared
The raw material of layer are laid on the bottom of glass guide channel, and glass guide channel is heated to 80 DEG C later, low adherency slot is obtained after 2h.
Low adherency slot is 85% to the light transmittance of 900nm light.
Preparation example 4
The silastic material of 15g (is purchased from Dow Corning company, batch is SYLGARD 182, initiator and solidification
Agent ratio is 10:1), 1,1,1,2,2,4,5,5,5- nine fluoro- 4- (trifluoromethyl)-propione (fluorine-containing surfactants with 0.5g
Agent is purchased from TCI company) mechanical stirring mixing, obtain the raw material for preparing the low adhesion layer of low adherency slot.
Having a size of 15cm × 15cm × 15cm square polyethylene slot, as skeleton structure, the low of low adherency slot will be prepared
The raw material of adhesion layer are laid on the bottom of polyethylene slot, and polyethylene slot is heated to 60 DEG C later, and low adherency slot is obtained after 3h.
Low adherency slot is 96% to the light transmittance of 450nm light.
Embodiment 1
It (a) is 512cm by the volume of 481g3Polymethyl methacrylate (light-cured resin, weight average molecular weight are
4000, photosensitive wavelength 200nm, acceptable light beam light intensity are 8mW/cm2) be loaded into low adherency slot (preparation example 1 obtains),
Wherein, the adhesion strength of polymethyl methacrylate and low adherency slot is 0.1kPa；
(b) the identifiable map data mining platform of area array light source is converted by the threedimensional model of tooth, and exported soft to light source control
Part, control area array light source emit light beam, and micro-displacement platform that can be three-dimensional mobile adjusts the position of area array light source, wherein the face
Array light source is the lattice plane light source that laser luminescence diode issues, and light beam wavelength 200nm, light beam light intensity is 8mW/cm2；
(c) light beam is divided into the first light beam and the second light beam by fiber optic splitter, the first light beam expands by first
Beam device is converted into parallel cylinder light wave and irradiates the light-cured resin in the low adherency slot, and the second light beam is reflected by reflecting mirror
To the second beam expander, and the light-cured resin being converted into low adherency slot described in parallel cylinder light-wave irradiation；Wherein, described first
Light beam and the second light beam interfere with each other in the low adherency slot and form hologram image projection, projection volume 125cm3；
(d) light-cured resin described in the hologram image projection illumination carry out photocuring, hologram image projection light intensity with
The light intensity of light-cured resin is consistent, and the 3D printing structure of tooth is formed after 10 seconds.
Embodiment 2
It (a) is 1500cm by the volume of 1425g3Polyurethane acrylic resin (light-cured resin, weight average molecular weight are
2000, photosensitive wavelength 365nm, acceptable light beam light intensity are 7mW/cm2) be loaded into low adherency slot (preparation example 2 obtains),
Wherein, the adhesion strength of polyurethane acrylic resin and low adherency slot is 1kPa；
(b) the identifiable map data mining platform of area array light source is converted by the threedimensional model of tooth, and exported soft to light source control
Part, control area array light source emit light beam, and micro-displacement platform that can be three-dimensional mobile adjusts the position of area array light source, wherein the face
Array light source is the curved surface projection light source that inorganic light-emitting diode and Organic Light Emitting Diode issue, light beam wavelength 365nm, light beam
Light intensity is 7mW/cm2；
(c) light beam is passed through into fixed splitting ratio beam splitter (beam splitter) and is divided into the first light beam and the second light beam, first
Light beam is converted into parallel cylinder light wave by the first beam expander and irradiates the light-cured resin in the low adherency slot, the second light beam
The photocuring tree for reflexing to the second beam expander by reflecting mirror, and being converted into low adherency slot described in parallel cylinder light-wave irradiation
Rouge；Wherein, first light beam and the second light beam interfere with each other in the low adherency slot and form hologram image projection, projection
Volume is 1000cm3；
(d) the hologram image projection illumination to the light-cured resin carries out photocuring, the light intensity of hologram image projection
It is consistent with the light intensity of light-cured resin, the 3D printing structure of tooth is formed after 20 seconds.
Embodiment 3
It (a) is 75cm by the volume of 68g3Acrylonitrile-butadiene-styrene copolymer performed polymer (light-cured resin,
Weight average molecular weight is 5000, photosensitive wavelength 900nm, and acceptable light beam light intensity is 9mW/cm2) it is loaded into low adherency slot (system
Standby example 3 obtains) in, wherein the performed polymer of acrylonitrile-butadiene-styrene copolymer and the adhesion strength of low adherency slot are
0.5kPa；
(b) the identifiable map data mining platform of area array light source is converted by the threedimensional model of tooth, and exported soft to light source control
Part, control area array light source emit light beam, and micro-displacement platform that can be three-dimensional mobile adjusts the position of area array light source, wherein the face
Array light source is the dot matrix area source that light emitting diode with quantum dots issues, and light beam wavelength 900nm, light beam light intensity is 9mW/cm2；
(c) light beam is passed through into fixed splitting ratio beam splitter (beam splitter) and is divided into the first light beam and the second light beam, first
Light beam is converted into parallel cylinder light wave by the first beam expander and irradiates the light-cured resin in the low adherency slot, the second light beam
The photocuring tree for reflexing to the second beam expander by reflecting mirror, and being converted into low adherency slot described in parallel cylinder light-wave irradiation
Rouge；Wherein, first light beam and the second light beam interfere with each other in the low adherency slot and form hologram image projection, projection
Volume is 9cm3；
(d) the hologram image projection illumination to the light-cured resin carries out photocuring, the light intensity of hologram image projection
It is consistent with the light intensity of light-cured resin, the 3D printing structure of tooth is formed after 5 seconds.
Embodiment 4
It (a) is 2000cm by the volume of 2300g3Polyacrylic resin (light-cured resin, weight average molecular weight 3000,
Photosensitive wavelength is 450nm, and acceptable light beam light intensity is 5mW/cm2) be loaded into low adherency slot (preparation example 4 obtains), wherein
The adhesion strength of polyacrylic resin and low adherency slot is 0.01kPa；
(b) the identifiable map data mining platform of area array light source is converted by the threedimensional model of tooth, and exported soft to light source control
Part, control area array light source emit light beam, and micro-displacement platform that can be three-dimensional mobile adjusts the position of area array light source, wherein the face
Array light source is the dot matrix area source that light emitting diode with quantum dots issues, and light beam wavelength 450nm, light beam light intensity is 5mW/cm2；
(c) light beam is divided into the first light beam and the second light beam by fiber optic splitter, the first light beam expands by first
Beam device is converted into parallel cylinder light wave and irradiates the light-cured resin in the low adherency slot, and the second light beam is reflected by reflecting mirror
To the second beam expander, and the light-cured resin being converted into low adherency slot described in parallel cylinder light-wave irradiation；Wherein, described first
Light beam and the second light beam interfere with each other in the low adherency slot and form hologram image projection, projection volume 1000cm3；
(d) the hologram image projection illumination to the light-cured resin carries out photocuring, the light intensity of hologram image projection
It is consistent with the light intensity of light-cured resin, the 3D printing structure of tooth is formed after 30 seconds.
Comparative example 1
According to the method for embodiment 1, unlike, low adherency slot do not have low adhesion layer, polymethyl methacrylate and
The adhesion strength of low adherency slot is 20kPa, the 3D printing structure existing defects of the tooth of printing.
It is can be seen that with comparative example through the foregoing embodiment using 3D printing device provided by the invention, by utilizing face
Array holographic light source, light intensity and the light-cured resin for adjusting hologram image projection cause solidify required light intensity it is consistent when consolidated
Change, so that printed material is integrally formed.3D printing method of the invention has print speed fast, and the printing of second-time may be implemented
Speed, and due to without carrying out the techniques such as physics flushing and polishing, printing essence to improve without using support construction
Degree, and good forming effect.
The preferred embodiment of the present invention has been described above in detail, and still, the present invention is not limited thereto.In skill of the invention
In art conception range, can with various simple variants of the technical solution of the present invention are made, including each technical characteristic with it is any its
Its suitable method is combined, and it should also be regarded as the disclosure of the present invention for these simple variants and combination, is belonged to
Protection scope of the present invention.
Claims (10)
1. a kind of holography 3D printing device, which is characterized in that the device includes low adherency slot and holographic light-source system, wherein institute
It states low adherency slot and projects and irradiate described low for issuing hologram image for loading light-cured resin, the holography light-source system
The light-cured resin adhered in slot carries out photocuring, forms 3D printing structure.
2. holography 3D printing device according to claim 1, wherein the holography light-source system includes area array light source, divides
Beam device, the first beam expander, reflecting mirror and the second beam expander, wherein
The area array light source is for emitting light beam；
The beam splitter is used to receive the light beam that the area array light source issues, and the light beam is divided into the first light beam and the second light
Beam；
First beam expander converts parallel cylinder light wave for first light beam and shines for receiving first light beam
The light-cured resin being incident upon in the low adherency slot；
The reflecting mirror is for reflecting second light beam to the second beam expander；
Second beam expander is for converting parallel cylinder light wave for second light beam and exposing in the low adherency slot
Light-cured resin；
Wherein, the first light beam turns to interfere with each other and formed hologram image projection in the low adherency slot with the second light beam.
3. holography 3D printing device according to claim 2, wherein the holography light-source system further includes can be three-dimensional mobile
Micro-displacement platform, it is described can three-dimensional mobile micro-displacement platform connect with area array light source, for adjusting the position of area array light source.
4. holography 3D printing device according to claim 2 or 3, wherein the holography light-source system further include with it is described
The computer of area array light source and micro-displacement platform electrical connection, can recognize for converting the area array light source for target three-dimensional
Map data mining platform, and export to light source control software, control the area array light source transmitting light beam.
5. holography 3D printing device according to claim 2 or 3, wherein the light beam wavelength of the area array light source transmitting is
200nm-900nm, preferably 300-450nm；Light beam light intensity is 0-100mW/cm2, preferably 3-20mW/cm2；
Preferably, the area array light source is selected from laser luminescence diode, light emitting diode with quantum dots, inorganic light-emitting diode and has
One of machine light emitting diode is a variety of.
6. holography 3D printing device according to claim 2 or 3, wherein the beam splitter is selected from fiber optic splitter, fixation
One of splitting ratio beam splitter and the adjustable beam splitter of splitting ratio are a variety of.
7. holographic 3D printing device described in any one of -3 according to claim 1, wherein the light transmittance of the low adherency slot
Not less than 90%；
Preferably, the low adherency slot includes low adhesion layer, and the material of the low adhesion layer includes silicon rubber and surface-active
Agent.
8. device described in a kind of any one of claim 1-7 carries out holographic 3D printing method, this method includes following step
It is rapid:
(a) light-cured resin is loaded into low adherency slot, wherein the adhesion strength of light-cured resin and low adherency slot is less than
10kPa；
(b) the identifiable map data mining platform of area array light source is converted by target three-dimensional, and exported to light source control software, control
Area array light source emits light beam；
(c) light beam is divided into the first light beam and the second light beam by beam splitter, the first light beam is converted by the first beam expander
For parallel cylinder light wave and the light-cured resin in the low adherency slot is irradiated, the second light beam reflexes to the second expansion by reflecting mirror
Beam device, and the light-cured resin being converted into low adherency slot described in parallel cylinder light-wave irradiation, wherein first light beam and the
Two light beams interfere with each other in the low adherency slot and form hologram image projection；
(d) light-cured resin described in the hologram image projection illumination carries out photocuring, forms the 3D printing of target three-dimensional
Structure.
9. according to the method described in claim 8, wherein, the photosensitive wavelength of the light-cured resin is 200nm-900nm, preferably
For 300-450nm, the preferably described light-cured resin is selected from polymethyl methacrylate, polyacrylic resin, epoxy acrylic tree
Rouge, polyurethane acrylic resin, polyester acrylate resin, polyoxyalkylene acrylate resin, phenolic resin, acrylonitrile-butadiene-benzene second
One of performed polymer, allyl resin and vinylite of alkene copolymer are a variety of.
10. according to the method described in claim 8, wherein, the acceptable light beam light intensity of light-cured resin is 0-100mW/
cm2, preferably 3-20mW/cm2。
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110239087A (en) * | 2019-06-04 | 2019-09-17 | 浙江大学 | A kind of 3D printing equipment based on image-forming principle |
| CN115052738A (en) * | 2019-09-27 | 2022-09-13 | 普瑞利思生物制品公司 | Three-dimensional printing of organs, devices and substrates |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107972265A (en) * | 2017-11-10 | 2018-05-01 | 中国科学院化学研究所 | A kind of 3D printing system |
| CN108501363A (en) * | 2018-03-21 | 2018-09-07 | 深圳大学 | A kind of 3D printing method and system based on line holographic projections |
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2019
- 2019-02-01 CN CN201910103987.2A patent/CN109732910B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107972265A (en) * | 2017-11-10 | 2018-05-01 | 中国科学院化学研究所 | A kind of 3D printing system |
| CN108501363A (en) * | 2018-03-21 | 2018-09-07 | 深圳大学 | A kind of 3D printing method and system based on line holographic projections |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110239087A (en) * | 2019-06-04 | 2019-09-17 | 浙江大学 | A kind of 3D printing equipment based on image-forming principle |
| CN115052738A (en) * | 2019-09-27 | 2022-09-13 | 普瑞利思生物制品公司 | Three-dimensional printing of organs, devices and substrates |
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