CN109722209A - A kind of YASI organic imides silica gel and preparation method thereof - Google Patents

A kind of YASI organic imides silica gel and preparation method thereof Download PDF

Info

Publication number
CN109722209A
CN109722209A CN201811569444.1A CN201811569444A CN109722209A CN 109722209 A CN109722209 A CN 109722209A CN 201811569444 A CN201811569444 A CN 201811569444A CN 109722209 A CN109722209 A CN 109722209A
Authority
CN
China
Prior art keywords
bis
amino
benzene
yasi
benzene oxygen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811569444.1A
Other languages
Chinese (zh)
Inventor
虞鑫海
李智杰
董浩
周志伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Donghua University
Shanghai Ruitu Electronic Material Co Ltd
National Dong Hwa University
Original Assignee
Donghua University
Shanghai Ruitu Electronic Material Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Donghua University, Shanghai Ruitu Electronic Material Co Ltd filed Critical Donghua University
Priority to CN201811569444.1A priority Critical patent/CN109722209A/en
Publication of CN109722209A publication Critical patent/CN109722209A/en
Pending legal-status Critical Current

Links

Landscapes

  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

The present invention relates to a kind of YASI organic imides silica gel and preparation method thereof, by 1,3- bis- (2,4- diamino phenoxy) benzene 13BDAPB, both-end aminopropyl polydimethylsiloxone YASI, maleic anhydride, aromatic diamine, aromatic dicarboxylic acid anhydride and 3- aminopropyltrialkoxysilane reaction product and organic solvent composition.Raw material sources of the invention are convenient, and simple process is easy to operate, and product comprehensive performance is good, can be applied to the bonding of glass, ceramics, composite material, extraordinary polarity weaving prepreg and its composite material base, have good market application prospect.

Description

A kind of YASI organic imides silica gel and preparation method thereof
Technical field
The invention belongs to adhesive area, in particular to a kind of YASI organic imides silica gel and preparation method thereof.
Background technique
Adhesive system is widely used in the every field of national economy: either high-technology field or general Its trace can be seen in technical field, either defence and military or civilian industry or even daily life.
Related adhesive system or containing silicone resin system have had many research reports, also there is many patents of invention:
Chinese invention patent CN102786902A discloses a kind of organosilicon Organic fluoride epoxy adhesive and preparation method thereof.
Yan Rui, Yu Xinhai et al. [preparation of novel epoxy adhesive and performance study, insulating materials, 2012,45 (2): 12-14,18] a kind of neo-epoxy resin adhesive and preparation method thereof is disclosed, and systematic research has been carried out to its performance.
Chinese invention patent CN106220851A discloses a kind of siliceous epoxy acid imide matrix resin of YASI type and its system Preparation Method is characterized mainly in that:
(1) by bis- (3- amino-4-hydroxylphenyl) hexafluoropropane of 2,2-, o-cresol, bis- [4- (the 3,4- dicarboxyl benzene of 2,2- Oxygroup) phenyl] propane dianhydride and maleic anhydride be put into reaction kettle, be passed through nitrogen, stir, be heated to 80 DEG C, be added dropwise different Quinoline is heated to 100 DEG C -110 DEG C, after being stirred to react 5-12 hours, is cooled to 60 DEG C, reactant is poured into and fills precipitating agent In precipitating kettle, solids is precipitated in stirring, is filtered, and vacuum drying obtains imide oligomer object;
(2) will be bis- (γ-aminopropyl) polydimethylsiloxone YASI, epoxy resin be put into reaction kettle, in 80 DEG C- After 100 DEG C are stirred reaction 0.5-1 hours, imide oligomer object is added and continues to be stirred to react 1-2 hours, 3- ammonia is then added Propyl trialkoxy silane is stirred to react 5-15 minutes, is cooled to room temperature, is added curing agent, is uniformly mixed.
Yu Xinhai et al. [preparation of organosilicon epoxy system adhesive and performance study, insulating materials, 2012,45 (2): 1-3,11] a kind of adhesive composition of organic siliconresin modified epoxy is disclosed, and its performance is studied, simultaneously The superior adhesive of comprehensive performance is obtained.
Xu Meifang et al. [the cure kinetics research of polyimide-epoxy resin adhesive, chemistry and bonding, 2011,33 (2): 17-20 a kind of polyimide-epoxy resin adhesive] is disclosed, and cure kinetics research has been carried out to it.
Chinese invention patent CN104844801A discloses a kind of Silicone Containing Polyimides copper coated foil plate, it is characterised in that: by Copper foil, alkali-free glass cloth and Silicone Containing Polyimides resin composition;Wherein, it is 1:1-5 that Silicone Containing Polyimides resin, which is by mass ratio, A, B component polymerization reaction and obtain;And component A is reacted with aromatic dianhydride by the organosilicon diamines that molar ratio is 1:2 and is obtained;B Component is by molar ratio are as follows: the aromatic diamine of 2:1.8-1.9:0.1-0.3 is reacted with aromatic dianhydride, maleic anhydride and obtained.
Chinese invention patent CN101397486A discloses a kind of preparation side of bi-component solvent-free epoxy resin adhesive Method is primarily characterized in that: it includes component A and B component, and wherein component A contains novolac epoxy resin, alicyclic type epoxy resin And nbr carboxyl terminal;B component is 4,4 '-bis- (2,4- diamino phenoxy) diphenyl ether aromatic polyvalent amine hardeners.Rouge The additive amount of ring-like epoxy resin and nbr carboxyl terminal is respectively the 20-35% and 12% (quality hundred of novolac epoxy resin Score).The additive amount of 4,4 '-bis- (2,4- diamino phenoxy) diphenyl ether aromatic polyvalent amine hardeners is epoxy novolac
Chinese patent CN101397486A discloses a kind of preparation method of bi-component solvent-free epoxy resin adhesive, Be characterized mainly in that: it includes component A and B component, and wherein component A contains novolac epoxy resin, alicyclic type epoxy resin and end Carboxy nitrile rubber;B component is bis- (2,4- diamino phenoxy) the benzene aromatic polyvalent amine hardeners of 1,4-.Alicyclic ring type asphalt mixtures modified by epoxy resin The additive amount of rouge and nbr carboxyl terminal is respectively the 20-35% and 12% (mass percent) of novolac epoxy resin.1,4- The additive amount of bis- (2,4- diamino phenoxy) benzene aromatic polyvalent amine hardeners is the 15-20% (quality of novolac epoxy resin Percentage), gained adhesive system good manufacturability.But its heat resistance is ideal not enough.
Yu Xinhai et al. [development [J] of high-temperature resistant single-component epoxy adhesive is bonded, 2008,29 (12): 16-19] is public The preparation method for having opened a kind of high-temperature resistant single-component epoxy adhesive, is primarily characterized in that: being sealing end with maleic anhydride (MA) Agent, with bis- [4- (4- amino-benzene oxygen) phenyl] third of bis- (3- amino-4-hydroxylphenyl) hexafluoropropane (BAHPFP) of 2,2-, 2,2- Bis- [4- (3,4- di carboxyl phenyloxy) phenyl] propane dianhydrides (BPADA) of alkane (BAPOPP), 2,2- are that main Material synthesis obtains Phenolic hydroxy group polyetherimide resin (HPEI);With synthesized obtained HPEI for resistant, toughened dose, with N, N, N', N'- tetra- Glycidyl -4,4'- diaminodiphenylmethane (TGDDM), hydrogenated bisphenol A epoxy resin (HBPAE), latent curing agent Deng, preparation obtained the high-temperature resistant single-component epoxy adhesive of excellent combination property.
This method, although containing the polyetherimide resin of active reactive group (hydroxyl, unsaturated double-bond) by synthesis (HPEI), toughening modifying has been carried out to epoxy resin, and has achieved preferable technical effect.But there is also some disadvantages:
(1) reactable group is limited, and the content of especially unsaturated double-bond is relatively low.Because maleic anhydride is as sealing end Agent come using, the dosage of maleic anhydride is seldom.
The monomers such as bis- (3- amino-4-hydroxylphenyl) hexafluoropropane (BAHPFP) of (2) 2,2- are expensive, lead to polyethers acyl The cost of imide resin (HPEI) and adhesive is very high, is unfavorable for large-scale promotion application, can only be confined to certain special dimensions.
Chinese invention patent CN106220047A discloses a kind of YASI type granolith plate and preparation method thereof, main It is characterized in that:
(1) epoxy resin and bis- (γ-aminopropyl) polydimethylsiloxone YASI are put into reaction kettle, stirring is mixed It closes, in 115 DEG C after -125 DEG C of reactions 0.5-1 hours, is cooled to 60 DEG C hereinafter, addition latent curing agent LRC30 and liquid acid Acid anhydride is uniformly mixed, and obtains YASI type resin;
(2) after mixing by YASI type resin and granite powder, it being put into stainless steel flat plate frame, pressing is preforming, Heat-pressure curing molding;Wherein, the temperature range of heating is room temperature to 180 DEG C;The pressure limit of pressurization be 0.5MPa extremely 5MPa;Curing time is 2-5 hours.
Summary of the invention
Technical problem to be solved by the invention is to provide a kind of YASI organic imides silica gel and preparation method thereof, this has Machine silica gel comprehensive performance is good, can be applied to glass, ceramics, composite material, extraordinary polarity weaving prepreg and its composite material The bonding of substrate has good market application prospect.
The present invention provides a kind of YASI organic imides silica gel, the organic silica gel is 1:0.1-0.5:2 by molar ratio: 5-10:6.5-12:1-2 bis- (2,4- diamino phenoxy) the benzene 13BDAPB of 1,3-, both-end aminopropyl polydimethylsiloxone The reaction product of YASI, maleic anhydride, aromatic diamine, aromatic dicarboxylic acid anhydride and 3- aminopropyltrialkoxysilane, and Organic solvent composition.
The aromatic diamine is selected from m-phenylene diamine (MPD), p-phenylenediamine, 2- methylresorcinol diamines, 2,4,6- trimethyl isophthalic Diamines, 3,4 '-diaminodiphenyl ethers, 4,4 '-diaminodiphenyl ethers, 3,3 '-diaminodiphenyl ethers, 4,4 '-benzidines, 3, 3 '-dimethyl -4,4 '-benzidine, 4,4 '-diaminodiphenylmethane, 4,4 '-diamino -4 "-hydroxyl triphenylmenthane, 4, It is 4 '-diaminodiphenylsulfones, 3,3 '-diaminodiphenylsulfones, 3,3 '-dimethyl -4,4 '-diaminodiphenylmethane, 3,3 '-two chloro- 4,4 '-diaminodiphenylmethane, 3,3 ', 5,5 '-tetramethyls -4,4 '-diaminodiphenylmethane, 2,6- bis- (4- amino-benzene oxygens) Bis- (3- amino-benzene oxygen) benzonitriles of benzonitrile, 2,6-, 2- (4- aminophenyl) -5- aminobenzimidazole, 3,3 '-diamino - Bis- (3- amino-4-hydroxylphenyl) propane of 4,4 '-dihydroxybiphenyls, 2,2-, bis- (3- amino-4-hydroxylphenyl) hexafluoros third of 2,2- Bis- (3- amino-benzene oxygen) benzene of alkane, 1,3-, bis- (4- amino-benzene oxygen) benzene of 1,3-, 1,4- bis- (4- amino-benzene oxygen) benzene, 1,3- Bis- (2- trifluoromethyl-4-aminophenoxyl) benzene of bis- (2- trifluoromethyl-4-aminophenoxyl) benzene, 1,4-, bis- (the 4- amino of 2,6- Phenoxy group) toluene, bis- (4- amino-benzene oxygen) toluene of 2,5-, 3,5- bis- (2- trifluoromethyl-4-aminophenoxyl) benzoic acid, 2, Bis- (2- trifluoromethyl-4-aminophenoxyl) toluene of 6-, bis- (2- trifluoromethyl-4-aminophenoxyl) toluene of 2,5-, 2,2- are bis- Bis- [4- (2- trifluoromethyl-4-aminophenoxyl) phenyl] propane of [4- (4- amino-benzene oxygen) phenyl] propane, 2,2-, 2,2- are bis- [4- (3- amino-benzene oxygen) phenyl] propane, 4,4 '-bis- (4- amino-benzene oxygen) diphenyl-methanes, 4,4 '-bis- (3- aminobenzene oxygen Base) diphenyl-methane, 4,4 '-bis- (2- trifluoromethyl-4-aminophenoxyl) diphenyl-methanes, the bis- [4- (4- amino-benzene oxygen) of 2,2- Phenyl] hexafluoropropane, bis- [4- (2- trifluoromethyl-4-aminophenoxyl) phenyl] hexafluoropropane of 2,2-, bis- [4- (the 3- ammonia of 2,2- Phenoxyl) phenyl] hexafluoropropane, 4,4 '-bis- (4- amino-benzene oxygen) diphenyl sulphone (DPS)s, 4,4 '-bis- (3- amino-benzene oxygen) hexichol Sulfone, 4,4 '-bis- (2- trifluoromethyl-4-aminophenoxyl) diphenyl sulphone (DPS)s, 4,4 '-bis- (4- amino-benzene oxygen) diphenyl sulfides, 4,4 '- Bis- (3- amino-benzene oxygen) diphenyl sulfides, 4,4 '-bis- (2- trifluoromethyl-4-aminophenoxyl) diphenyl sulfides, 4,4 '-bis- (4- Amino-benzene oxygen) diphenyl ether, 4,4 '-bis- (3- amino-benzene oxygen) diphenyl ether, 4,4 '-bis- (2- trifluoromethyl -4- aminobenzene oxygen Base) it is diphenyl ether, 4,4 '-bis- (4- amino-benzene oxygen) benzophenone, 4,4 '-bis- (3- amino-benzene oxygen) benzophenone, 4,4 '-bis- (2- trifluoromethyl-4-aminophenoxyl) benzophenone, 4,4 '-bis- (4- amino-benzene oxygen) biphenyl, 4,4 '-bis- (3- aminobenzenes Oxygroup) biphenyl, one or more of 4,4 '-bis- (2- trifluoromethyl-4-aminophenoxyl) biphenyl.
The aromatic dicarboxylic acid anhydride be selected from pyromellitic acid anhydride, 3,3 ', 4,4 '-tetracarboxylic diphenyl ether dianhydrides, 3,3 ', 4, Bis- (3,4- dicarboxyphenyi) hexafluoros third of 4 '-tetracarboxylic diphenyl sulfone dianhydrides, 3,3 ', 4,4 '-tetracarboxylic benzophenone dianhydrides, 2,2- Bis- [4- (3,4- di carboxyl phenyloxy) phenyl] hexafluoropropane dianhydrides of alkane dianhydride, 3,3 ', 4,4 '-tetracarboxylic biphenyl dianhydrides, 2,2-, Bis- [4- (3,4- di carboxyl phenyloxy) phenyl] propane dianhydrides of 2,2-, 1,4- bis- (3,4- di carboxyl phenyloxy) benzene dianhydrides, 1,3- Double-(3,4- di carboxyl phenyloxy) benzene dianhydride, 4,4 '-bis- (3,4- di carboxyl phenyloxy) biphenyl dianhydrides, 4,4 '-bis- (3,4- bis- Carboxyphenoxy) diphenyl sulfone dianhydride, 4,4 '-bis- (3,4- di carboxyl phenyloxy) diphenyl ether dianhydrides, 4,4 '-bis- (3,4- dicarboxyls Phenoxy group) diphenyl ether dianhydride, one or more of 4,4 '-bis- (3,4- di carboxyl phenyloxy) benzophenone dianhydrides.
The 3- aminopropyltrialkoxysilane is selected from 3- aminopropyl trimethoxysilane, 3- aminopropyl triethoxysilane One or both of.
The organic solvent is selected from N, N-dimethylformamide, N, N dimethyl acetamide, tetrahydrofuran, methyl tetrahydro furan It mutters, one or more of n-methyl-2-pyrrolidone, N- ethyl-2-pyrrolidone, dimethyl sulfoxide.
The mass ratio of the organic solvent and reactant is 2.5-9.5:1;Wherein, reactant refers to 1,3- bis- (2,4- bis- Amino-benzene oxygen) benzene 13BDAPB, both-end aminopropyl polydimethylsiloxone YASI, maleic anhydride, aromatic diamine, virtue Fragrant race's dibasic anhydride and 3- aminopropyltrialkoxysilane.
The molecular structural formula of the both-end aminopropyl polydimethylsiloxone YASI are as follows:
Wherein, m is and the natural number less than 15 greater than 1.
The present invention also provides a kind of preparation methods of YASI organic imides silica gel, include the following steps:
According to the ratio, bis- (2,4- diamino phenoxy) the benzene 13BDAPB of 1,3- and organic solvent are put into reaction kettle, room temperature After lower stirring and dissolving, maleic anhydride is added, reacts 15min-30min after stirring and dissolving at room temperature, both-end aminopropyl is then added Polydimethylsiloxone YASI, aromatic diamine after stirring and dissolving, are added aromatic dicarboxylic acid anhydride, are stirred to react at room temperature After -4.0 hours 1.0 hours, be added 3- aminopropyltrialkoxysilane, be stirred to react at room temperature -2 hours 0.5 hour to get YASI organic imides silica gel.
Beneficial effect
(1) present invention has a good hot mechanical performance, and excellent combination property, can be applied to glass, ceramics, compound The bonding of material, extraordinary polarity weaving prepreg and its composite material base, has good market application prospect;
(2) preparation process of the invention is simple, at low cost, easy to operate, reaction raw materials convenient sources, can set general Standby middle completion preparation process, is advantageously implemented industrialized production;
(3) 3- aminopropyltrialkoxysilane, both-end aminopropyl poly two are introduced in adhesive molecular structure of the invention Methylsiloxane YASI provides not only the cured crosslinking reactivity group of adhesive system or silicon oxygen silicon base group is made to enter high score Sub- skeleton structure, and good anchor cooperation use or affinity interaction can be generated with substrate, to improve the interface performance of bonding plane with Adhesive strength is of great benefit to.
Specific embodiment
Present invention will be further explained below with reference to specific examples.It should be understood that these embodiments are merely to illustrate the present invention Rather than it limits the scope of the invention.In addition, it should also be understood that, after reading the content taught by the present invention, those skilled in the art Member can make various changes or modifications the present invention, and such equivalent forms equally fall within the application the appended claims and limited Range.
Embodiment 1
By bis- (2,4- diamino phenoxy) benzene (13BDAPB) of the 1,3- of 32.2 grams (0.1 moles), 420 grams of methyl tetrahydros Furans and 900 grams of n,N dimethylformamide are put into reaction kettle, and at room temperature after stirring and dissolving, 19.6 grams of (0.2 mole) horses are added Carry out acid anhydrides, react 15min after stirring and dissolving at room temperature, 11.3 grams of (0.01 mole) both-end aminopropyl poly dimethyl are then added Siloxanes (YASI, m average value be 13), after stirring and dissolving is complete, be added 40.0 grams of (0.2 mole) 3,4 '-diaminodiphenyl ethers, Bis- (4- amino-benzene oxygen) benzonitriles of 31.7 grams of (0.1 mole) 2,6-, 36.6 grams of bis- (3- amino-4-hydroxies of (0.1 mole) 2,2- Phenyl) hexafluoropropane and 40.0 grams of (0.1 moles) 4,4 '-bis- (4- amino-benzene oxygen) diphenyl sulfides after stirring and dissolving, are added 209.3 grams (0.65 mole) 3,3 ', 4,4 '-tetracarboxylic benzophenone dianhydrides, stirring and dissolving, is stirred to react 1.0 hours at room temperature Afterwards, 22.1 grams of (0.1 mole) 3- aminopropyl triethoxysilanes are added, are stirred to react 2 hours at room temperature to get viscous to 1763 grams Thick YASI organic imides silica gel, is denoted as SA-1.
Embodiment 2
By bis- (2,4- diamino phenoxy) benzene (13BDAPB) of the 1,3- of 32.2 grams (0.1 moles), 1000 grams of tetrahydro furans It mutters, 1000 grams of N, N dimethyl acetamide and 1000 grams of N- ethyl-2-pyrrolidones are put into reaction kettle, at room temperature stirring and dissolving Afterwards, 19.6 grams of (0.2 mole) maleic anhydrides are added, react 30min after stirring and dissolving at room temperature, are then added 20.8 gram (0.03 Mole) (YASI, m average value are 7), after stirring and dissolving is complete, to be added 58.0 grams to both-end aminopropyl polydimethylsiloxone (0.2 mole) 4,4 '-diamino -4 "-hydroxyl triphenylmenthane, 100.0 grams of (0.5 mole) 3,4 '-diaminodiphenyl ethers and 120.0 After stirring and dissolving, 186.0 grams of (0.6 moles) 3,3 ' are added in gram (0.3 mole) 4,4 '-bis- (4- amino-benzene oxygen) diphenyl sulfides, 4,4 '-tetracarboxylic diphenyl ether dianhydrides and 193.2 grams (0.6 mole) 3,3 ', 4,4 '-tetracarboxylic benzophenone dianhydrides, are stirred at room temperature Dissolution is mixed, after being stirred to react 4.0 hours, 44.2 grams of (0.2 mole) 3- aminopropyl triethoxysilanes are added, stirring is anti-at room temperature 0.5 hour is answered to get to 3774 grams of sticky YASI organic imides silica gel, is denoted as SA-2.
Embodiment 3
By bis- (2,4- diamino phenoxy) benzene (13BDAPB) of the 1,3- of 32.2 grams (0.1 moles), 1600 grams of tetrahydro furans It mutters, the organic solvent of 2000 grams of n,N dimethylformamide and 2000 grams of N- ethyl-2-pyrrolidones is put into reaction kettle, room temperature After lower stirring and dissolving, 19.6 grams of (0.2 mole) maleic anhydrides are added, react 20min after stirring and dissolving at room temperature, is then added (YASI, m average value are 4), after stirring and dissolving is complete, to add to 23.5 grams of (0.05 mole) both-end aminopropyl polydimethylsiloxones Enter bis- (4- amino-benzene oxygen) hexichol of 40.0 grams of (0.2 mole) 3,4 '-diaminodiphenyl ethers, 120.0 grams of (0.3 moles) 4,4 '- Thioether and 43.2 grams of (0.2 mole) 3,3 '-diamino -4,4 '-dihydroxybiphenyls, after stirring and dissolving, being added 225.4 grams, (0.7 rubs You) 3,3 ', 4,4 '-tetracarboxylic benzophenone dianhydrides, bis- [4- (3,4- di carboxyl phenyloxy) benzene of 78.0 grams of (0.15 mole) 2,2- Base] propane dianhydride, stirring and dissolving, after being stirred to react 2.0 hours, is added 22.1 grams of three second of (0.1 mole) 3- aminopropyl at room temperature Oxysilane and 17.9 grams of (0.1 mole) 3- aminopropyl trimethoxysilanes, are stirred to react 1.5 hours at room temperature to get arriving 6222 grams of sticky YASI organic imides silica gel, are denoted as SA-3.
Embodiment 4
The YASI organic imides silica gel of suitable 1~embodiment of embodiment 3, i.e. SA-1~SA-3, and difference are taken respectively It is uniformly applied in standard stainless steel test piece, overlaps, clamp, be put into convection oven and solidified: being started to warm up from room temperature To 80 DEG C, after being kept for 1 hour, 150 DEG C are continuously heating to, after being kept for 2 hours, is continuously heating to 200 DEG C, after being kept for 0.5 hour, 260 DEG C are continuously heating to, after being kept for 0.5 hour, cooled to room temperature.Using electronic tensile machine, room temperature is carried out to it respectively Tensile shear strength test under the conditions of (25 DEG C) and high temperature (250 DEG C), the results are shown in Table 1.
The YASI organic imides silica gel of suitable 1~embodiment of embodiment 3, i.e. SA-1~SA-3, and difference are taken respectively It is equably impregnated on glass cloth, is overlapped and clamped with standard stainless steel test piece, be put into convection oven and solidified: being opened from room temperature Beginning is warming up to 80 DEG C, after being kept for 1 hour, is continuously heating to 150 DEG C, after being kept for 2 hours, is continuously heating to 200 DEG C, keeps 0.5 After hour, 260 DEG C are continuously heating to, after being kept for 0.5 hour, cooled to room temperature.Using electronic tensile machine, respectively to its into Tensile shear strength test under the conditions of row room temperature (25 DEG C) and high temperature (250 DEG C), the results are shown in Table 1.
Using Guilin Electro Scientific research institute produce megger test its solidfied material volume resistivity ρ v (1MHz, 25 DEG C), the results are shown in Table 1.
The dielectric loss (D) of its solidfied material is tested using the TH2828S tester of Changzhou Tong Hui Electron equipment Co., Ltd (1MHz, 25 DEG C), the results are shown in Table 1.
Deionized water (25 DEG C) are soaked in after the square coupons weighing (W1) of above-mentioned drying using precision electronic balance In, it after 72 hours, takes out, dries surface with filter paper, weigh (W2), water absorption rate is calculatedData it is as shown in table 1.
Climatic chamber (85 is placed in after the square coupons weighing (G1) of above-mentioned drying using precision electronic balance DEG C, RH85%) in, it after 72 hours, takes out, dries surface with filter paper, weigh (G2), the data of hydroscopicity (ψ) are calculated such as Shown in table 1.
The performance data of table 1YASI organic imides silica gel

Claims (8)

1. a kind of YASI organic imides silica gel, it is characterised in that: the organic silica gel is 1:0.1-0.5:2:5- by molar ratio Bis- (2,4- diamino phenoxy) the benzene 13BDAPB of the 1,3- of 10:6.5-12:1-2, both-end aminopropyl polydimethylsiloxone The reaction product of YASI, maleic anhydride, aromatic diamine, aromatic dicarboxylic acid anhydride and 3- aminopropyltrialkoxysilane, and Organic solvent composition.
2. a kind of YASI organic imides silica gel according to claim 1, it is characterised in that: the aromatic diamine choosing From m-phenylene diamine (MPD), p-phenylenediamine, 2- methylresorcinol diamines, 2,4,6- trimethyl m-phenylene diamine (MPD), 3,4 '-diaminodiphenyl ethers, 4, 4 '-diaminodiphenyl ethers, 3,3 '-diaminodiphenyl ethers, 4,4 '-benzidines, 3,3 '-dimethyl -4,4 '-diamino connection Benzene, 4,4 '-diaminodiphenylmethane, 4,4 '-diamino -4 "-hydroxyl triphenylmenthane, 4,4 '-diaminodiphenylsulfones, 3,3 '-two Aminodiphenyl sulfone, 3,3 '-dimethyl -4,4 '-diaminodiphenylmethane, 3,3 '-two chloro- 4,4 '-diaminodiphenylmethane, 3, Bis- (4- amino-benzene oxygen) benzonitriles of 3 ', 5,5 '-tetramethyls -4,4 '-diaminodiphenylmethane, 2,6-, bis- (the 3- aminobenzenes of 2,6- Oxygroup) benzonitrile, 2- (4- aminophenyl) -5- aminobenzimidazole, 3,3 '-diamino -4,4 '-dihydroxybiphenyl, 2,2- be bis- Bis- (3- amino-4-hydroxylphenyl) hexafluoropropane of (3- amino-4-hydroxylphenyl) propane, 2,2-, bis- (the 3- aminobenzene oxygen of 1,3- Base) benzene, bis- (4- amino-benzene oxygen) benzene of 1,3-, bis- (4- amino-benzene oxygen) benzene of 1,4-, the bis- (2- trifluoromethyl -4- amino of 1,3- Phenoxy group) benzene, bis- (2- trifluoromethyl-4-aminophenoxyl) benzene of 1,4-, bis- (4- amino-benzene oxygen) toluene of 2,6-, 2,5- be bis- Bis- (2- trifluoromethyl-4-aminophenoxyl) benzoic acid of (4- amino-benzene oxygen) toluene, 3,5-, the bis- (2- trifluoromethyl -4- of 2,6- Amino-benzene oxygen) toluene, bis- (2- trifluoromethyl-4-aminophenoxyl) toluene of 2,5-, bis- [4- (4- amino-benzene oxygen) benzene of 2,2- Base] propane, bis- [4- (2- trifluoromethyl-4-aminophenoxyl) phenyl] propane of 2,2-, bis- [4- (3- amino-benzene oxygen) benzene of 2,2- Base] it is propane, 4,4 '-bis- (4- amino-benzene oxygen) diphenyl-methanes, 4,4 '-bis- (3- amino-benzene oxygen) diphenyl-methanes, 4,4 '-bis- Bis- [4- (4- amino-benzene oxygen) phenyl] hexafluoropropane of (2- trifluoromethyl-4-aminophenoxyl) diphenyl-methane, 2,2-, 2,2- are bis- Bis- [4- (3- amino-benzene oxygen) phenyl] hexafluoros third of [4- (2- trifluoromethyl-4-aminophenoxyl) phenyl] hexafluoropropane, 2,2- Alkane, 4,4 '-bis- (4- amino-benzene oxygen) diphenyl sulphone (DPS)s, 4,4 '-bis- (3- amino-benzene oxygen) diphenyl sulphone (DPS)s, 4,4 '-bis- (2- fluoroforms Base -4- amino-benzene oxygen) diphenyl sulphone (DPS), 4,4 '-bis- (4- amino-benzene oxygen) diphenyl sulfides, 4,4 '-bis- (3- amino-benzene oxygens) two Diphenyl sulfide, 4,4 '-bis- (2- trifluoromethyl-4-aminophenoxyl) diphenyl sulfides, 4,4 '-bis- (4- amino-benzene oxygen) diphenyl ether, 4,4 '-bis- (3- amino-benzene oxygen) diphenyl ether, 4,4 '-bis- (2- trifluoromethyl-4-aminophenoxyl) diphenyl ether, 4,4 '-bis- (4- Amino-benzene oxygen) benzophenone, 4,4 '-bis- (3- amino-benzene oxygen) benzophenone, 4,4 '-bis- (2- trifluoromethyl -4- aminobenzenes Oxygroup) benzophenone, 4,4 '-bis- (4- amino-benzene oxygen) biphenyl, 4,4 '-bis- (3- amino-benzene oxygen) biphenyl, 4,4 '-bis- (2- One or more of trifluoromethyl-4-aminophenoxyl) biphenyl.
3. a kind of YASI organic imides silica gel according to claim 1, it is characterised in that: the aromatic dicarboxylic acid anhydride choosing From pyromellitic acid anhydride, 3,3 ', 4,4 '-tetracarboxylic diphenyl ether dianhydrides, 3,3 ', 4,4 '-tetracarboxylic diphenyl sulfone dianhydrides, 3,3 ', 4,4 '-tetracarboxylic benzophenone dianhydrides, 2,2- bis- (3,4- dicarboxyphenyi) hexafluoropropane dianhydrides, 3,3 ', 4,4 '-tetracarboxylics connection Bis- [4- (3,4- di carboxyl phenyloxy) phenyl] hexafluoropropane dianhydrides of benzene dianhydride, 2,2-, bis- [4- (the 3,4- dicarboxyl benzene oxygen of 2,2- Base) phenyl] propane dianhydride, bis- (3,4- di carboxyl phenyloxy) benzene dianhydrides of 1,4-, 1,3- be bis--(3,4- di carboxyl phenyloxy) benzene two Acid anhydride, 4,4 '-bis- (3,4- di carboxyl phenyloxy) biphenyl dianhydrides, 4,4 '-bis- (3,4- di carboxyl phenyloxy) diphenyl sulfone dianhydrides, 4, 4 '-bis- (3,4- di carboxyl phenyloxy) diphenyl ether dianhydrides, 4,4 '-bis- (3,4- di carboxyl phenyloxy) diphenyl ether dianhydrides, 4,4 '- One or more of bis- (3,4- di carboxyl phenyloxy) benzophenone dianhydrides.
4. a kind of YASI organic imides silica gel according to claim 1, it is characterised in that: three alcoxyl of 3- aminopropyl Base silane is selected from one or both of 3- aminopropyl trimethoxysilane, 3- aminopropyl triethoxysilane.
5. a kind of YASI organic imides silica gel according to claim 1, it is characterised in that: the organic solvent is selected from N, N-dimethylformamide, N, N dimethyl acetamide, tetrahydrofuran, methyltetrahydrofuran, n-methyl-2-pyrrolidone, N- ethyl- One or more of 2-Pyrrolidone, dimethyl sulfoxide.
6. a kind of YASI organic imides silica gel according to claim 1, it is characterised in that: the organic solvent with react The mass ratio of object is 2.5-9.5:1;Wherein, reactant refers to bis- (2,4- diamino phenoxy) the benzene 13BDAPB of 1,3-, both-end ammonia Propyl polydimethylsiloxone YASI, maleic anhydride, aromatic diamine, aromatic dicarboxylic acid anhydride and 3- aminopropyl tri-alkoxy Silane.
7. a kind of acid imide organic silica gel according to claim 1, it is characterised in that: the both-end aminopropyl poly diformazan The molecular structural formula of radical siloxane YASI are as follows:
Wherein, m is and the natural number less than 15 greater than 1.
8. a kind of preparation method of YASI organic imides silica gel as described in claim 1, includes the following steps:
According to the ratio, bis- (2,4- diamino phenoxy) the benzene 13BDAPB of 1,3- and organic solvent are put into reaction kettle, are stirred at room temperature After mixing dissolution, maleic anhydride is added, reacts 15min-30min after stirring and dissolving at room temperature, both-end aminopropyl poly is then added Dimethyl siloxane YASI, aromatic diamine after stirring and dissolving, are added aromatic dicarboxylic acid anhydride, it is small to be stirred to react 1.0 at room temperature When -4.0 hours after, be added 3- aminopropyltrialkoxysilane, being stirred to react at room temperature -2 hours 0.5 hour has to get YASI Machine acid imide silica gel.
CN201811569444.1A 2018-12-21 2018-12-21 A kind of YASI organic imides silica gel and preparation method thereof Pending CN109722209A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811569444.1A CN109722209A (en) 2018-12-21 2018-12-21 A kind of YASI organic imides silica gel and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811569444.1A CN109722209A (en) 2018-12-21 2018-12-21 A kind of YASI organic imides silica gel and preparation method thereof

Publications (1)

Publication Number Publication Date
CN109722209A true CN109722209A (en) 2019-05-07

Family

ID=66297005

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811569444.1A Pending CN109722209A (en) 2018-12-21 2018-12-21 A kind of YASI organic imides silica gel and preparation method thereof

Country Status (1)

Country Link
CN (1) CN109722209A (en)

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5473900A (en) * 1977-11-25 1979-06-13 Mitsubishi Gas Chem Co Inc Curable resin composition
JPS61271286A (en) * 1985-05-28 1986-12-01 Mitsui Toatsu Chem Inc Polyimide oligomer, precursor polyamic acid oligomer thereof, and heat-resistant adhesive composed of said oligomer
CN1112584A (en) * 1994-03-08 1995-11-29 住友电木株式会社 Heat resistant resin composition, heat resistant film adhesive and process for producing the same
CN1158607A (en) * 1994-09-02 1997-09-03 量子材料公司 Thermosetting resin compositions containing maleimide and/or vinyl compounds
TW200743658A (en) * 2006-05-25 2007-12-01 Ind Tech Res Inst Thermoplastic polyimide composition and method of making double-sided flexible copper clad laminate using the same
CN101250120A (en) * 2008-04-02 2008-08-27 东华大学 Method for preparing 4,4-di(2,4-diamino phenoxy) diphenylmethane
CN101423609A (en) * 2008-10-21 2009-05-06 东华大学 Method for preparing polyimide powder containing active ethylene group
CN101921482A (en) * 2010-08-18 2010-12-22 东华大学 Thermosetting polyimide resin and preparation method thereof
CN102666658A (en) * 2009-12-22 2012-09-12 新日铁化学株式会社 Polyimide resin, manufacturing method therefor, adhesive resin composition, coverlay film, and circuit board
CN103074028A (en) * 2011-10-25 2013-05-01 上海本诺电子材料有限公司 Organosilicon polyimide insulation adhesive for LED
CN103131370A (en) * 2013-03-11 2013-06-05 东华大学 1,3-bis(2,4-diamidophenoxy)benzene high-temperature-resistant epoxy adhesive and preparation method thereof
CN101717613B (en) * 2009-12-07 2014-04-02 东华大学 High-temperature resistant copper foil glue and preparation and application thereof

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5473900A (en) * 1977-11-25 1979-06-13 Mitsubishi Gas Chem Co Inc Curable resin composition
JPS61271286A (en) * 1985-05-28 1986-12-01 Mitsui Toatsu Chem Inc Polyimide oligomer, precursor polyamic acid oligomer thereof, and heat-resistant adhesive composed of said oligomer
CN1112584A (en) * 1994-03-08 1995-11-29 住友电木株式会社 Heat resistant resin composition, heat resistant film adhesive and process for producing the same
CN1158607A (en) * 1994-09-02 1997-09-03 量子材料公司 Thermosetting resin compositions containing maleimide and/or vinyl compounds
TW200743658A (en) * 2006-05-25 2007-12-01 Ind Tech Res Inst Thermoplastic polyimide composition and method of making double-sided flexible copper clad laminate using the same
CN101250120A (en) * 2008-04-02 2008-08-27 东华大学 Method for preparing 4,4-di(2,4-diamino phenoxy) diphenylmethane
CN101423609A (en) * 2008-10-21 2009-05-06 东华大学 Method for preparing polyimide powder containing active ethylene group
CN101717613B (en) * 2009-12-07 2014-04-02 东华大学 High-temperature resistant copper foil glue and preparation and application thereof
CN102666658A (en) * 2009-12-22 2012-09-12 新日铁化学株式会社 Polyimide resin, manufacturing method therefor, adhesive resin composition, coverlay film, and circuit board
CN101921482A (en) * 2010-08-18 2010-12-22 东华大学 Thermosetting polyimide resin and preparation method thereof
CN103074028A (en) * 2011-10-25 2013-05-01 上海本诺电子材料有限公司 Organosilicon polyimide insulation adhesive for LED
CN103131370A (en) * 2013-03-11 2013-06-05 东华大学 1,3-bis(2,4-diamidophenoxy)benzene high-temperature-resistant epoxy adhesive and preparation method thereof

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
杨俊华: "有机硅改性聚酰亚胺", 《塑料科技》 *
虞鑫海 等: "1, 4一双(2, 4一二氨基苯氧基)苯的 合成及其支化型聚酰亚胺薄膜", 《绝缘材料》 *

Similar Documents

Publication Publication Date Title
CN105111927B (en) A kind of high temperature resistant BAHPFP type wire enamel and preparation method thereof
CN103261278B (en) Polyamic acid resin composition and method of producing the same
CN103119085B (en) Resin combination and manufacture method thereof
CN103013414A (en) Alpha-cyanogroup-beta-ethyl ethoxyacrylate modified epoxy resin adhesive and preparation method thereof
CN112876680A (en) Polyamide acid slurry, preparation method thereof and polyimide film
JPH06136122A (en) Diaminobenzene derivative, polyimide, and liquid crystal orientation film
CN109722212A (en) A kind of acid imide epoxy organic silica gel and preparation method thereof
CN111825884B (en) Silane coupling agent with carbamido and imide structures and preparation method and application thereof
CN109705799A (en) A kind of YASI epoxy organic imides silica gel and preparation method thereof
CN109722214A (en) A kind of DAHTM type silicon-containing adhesive and preparation method thereof
CN109722209A (en) A kind of YASI organic imides silica gel and preparation method thereof
CN109735291A (en) A kind of YASI organic silica gel and preparation method thereof
CN109852340A (en) A kind of YASI-BDAPOFP type Organic fluoride silica gel and preparation method thereof
CN109735295A (en) A kind of acid imide organic silica gel and preparation method thereof
CN109735293A (en) A kind of DAB biphenyl tetramine type silicon-containing adhesive and preparation method thereof
CN109705798A (en) A kind of BDATHQ type silicon-containing adhesive and preparation method thereof
CN109722208A (en) A kind of 12BDAPB type silicon-containing adhesive and preparation method thereof
CN109722213A (en) A kind of BAHPP type silicon-containing adhesive and preparation method thereof
CN109679571A (en) A kind of DADHBP type silicon-containing adhesive and preparation method thereof
CN109628056A (en) A kind of 13BDAPB type silicon-containing adhesive and preparation method thereof
CN109722211A (en) A kind of BDADDM type silicon-containing adhesive and preparation method thereof
CN109628057A (en) A kind of BDABP type silicon-containing adhesive and preparation method thereof
CN109679569A (en) A kind of BDAPOPP type silicon-containing adhesive and preparation method thereof
CN114573811B (en) Imide slurry, synthesis method thereof and composition containing imide slurry
CN109735292A (en) A kind of BDADDS type silicon-containing adhesive and preparation method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20190507

RJ01 Rejection of invention patent application after publication