CN109720622B

CN109720622B - Diode arrangement device

Info

Publication number: CN109720622B
Application number: CN201811638427.9A
Authority: CN
Inventors: 罗云红
Original assignee: Anhui Longxin Microtechnology Co ltd
Current assignee: Anhui Longxin Microtechnology Co ltd
Priority date: 2018-12-29
Filing date: 2018-12-29
Publication date: 2020-08-21
Anticipated expiration: 2038-12-29
Also published as: CN109720622A

Abstract

The invention discloses a diode arranging device in the field of diode processing, which comprises two conveying chains, wherein a groove used for clamping a diode pin is arranged on a chain link of each conveying chain, two centering bars which are arranged side by side are arranged between the two conveying chains, two ends of each centering bar are bent towards the conveying chains, the distance between the middle parts of the two centering bars is equal to the length of a diode tube body, and the top surfaces of the centering bars are flush with the arc bottoms of the grooves; the upper and lower sides to the median strip distribute with centering strip place plane symmetry has bonding mechanism, and bonding mechanism includes the bonding wheel, and the wheel face of bonding wheel includes the torus at middle part and is located the conical surface of torus both sides, and the big footpath end and the torus of conical surface are connected, and the axial length of torus equals the body length of diode, and the outside of bonding wheel is equipped with the glue spreader with torus rolling contact, and the bonding wheel is close to the one end to the median strip and offsets with the body of diode. The invention can solve the problem of untidy diode arrangement when braiding in the existing diode production.

Description

Diode arrangement device

Technical Field

The invention relates to the field of diode production, in particular to a diode arrangement device.

Background

With the development and progress of science and technology, more and more activities of human beings are developed towards intellectualization and automation, the development of the electronic industry is indispensable in the process, the demand of semiconductor parts such as diodes, triodes and the like in the electronic industry is increasingly increased, and higher requirements are continuously put forward on the productivity of the semiconductor parts. In the production process of the diode, the diode after welding and polarization is still in a single bulk state, and the diode is usually arranged in a uniform direction and then bonded into a belt shape by using an adhesive tape or a gummed film so as to be stored orderly, which is generally called a taping process. In the prior art, because the diodes are subjected to a plurality of processes such as welding, sorting and the like in front, the conditions that the lengths of pins on two sides of a tube body are inconsistent and the like exist in partial diodes, and the prior art adopts a pin alignment mode in the taping process, so that the arrangement of the diodes after final taping is irregular, and the subsequent processing quality of the diodes is influenced.

Disclosure of Invention

The invention aims to provide a diode arrangement device to solve the problem of uneven diode arrangement in the process of braiding in the existing diode production.

In order to achieve the purpose, the basic technical scheme of the invention is as follows: the diode arrangement device comprises two conveying chains which are arranged in parallel, a groove used for clamping a diode pin is arranged on a chain link of each conveying chain, two centering bars which are arranged side by side are arranged between the two conveying chains, two ends of each centering bar are bent towards the conveying chains, the distance between the middle parts of the two centering bars is equal to the length of a diode tube body, and the top surfaces of the centering bars are flush with the arc bottoms of the grooves; the upper and lower sides to the median strip have bonding mechanism with centering strip place plane symmetric distribution, bonding mechanism includes the bonding wheel of drum form, the wheel face of bonding wheel includes the torus at middle part and is located the conical surface of torus both sides, the big footpath end and the torus of conical surface are connected, the axial length of torus equals the body length of diode, the outside of bonding wheel be equipped with torus rolling contact's glue spreader, the bonding wheel is close to the one end to the median strip and offsets with the body of diode.

The principle of the scheme is as follows: during the practical application, the transfer chain is used for the conveying of diode, two pins that recess on two transfer chains is used for the joint diode and then drives the diode and follow the transfer chain and remove, the centering strip is used for lining up the body of diode and arranges, the position of buckling at centering strip both ends is used for leading to the body of diode, two distances between the middle part of centering strip just hold the body of diode and pass through, the pin of diode is supported to the top surface of centering strip, the body is arranged as holistic one row and follows the transfer chain and remove under the guide of centering strip and spacing when the diode passes through. The bonding mechanisms symmetrically arranged on the upper side and the lower side of the middle strip are used for synchronously bonding and fixing the film from the upper side and the lower side of the diode, the drum-shaped bonding wheel with the wheel surface divided into three parts can bond the middle part of the film to the tube body of the diode in a corresponding extruding manner, and the ring surface is used as a pressing surface for bonding the film to the tube body in an extruding manner and a driving part for driving the film to move to a certain extent. The conical surface is used for exposing the contact part of the film and the diode body, so that observation is convenient, and the film below can be supported to avoid being polluted by the shaft end of the bonding wheel. The glue spreader is used for brushing glue tapes with the width consistent with the length of the diode tube body on the middle part of the film, so that the diode tube body can be conveniently bonded, and the bonding wheels are abutted against the diode tube body to enable the film to be bonded on the diode tube body in a forced pressing mode.

The scheme has the advantages that: 1. the diode bodies are positioned and aligned firstly in the conveying process, and then are bonded and fixed firstly, so that the diode bodies can be ensured to be arranged regularly in the braiding process, and the subsequent diode processing is more convenient; 2. synchronous alignment and tube body bonding in the conveying process are adopted, continuous processing can be carried out, the braiding process of the diode can be continuously and efficiently carried out, the diode can be combined to the front end machining procedure and the rear end machining procedure of the diode to form a continuous machining process, and the production efficiency is favorably improved.

Furthermore, the upper and lower sides in the middle of the centering strip are respectively provided with a film guide plate which is obliquely arranged, the distance between the film guide plate and the centering strip is larger than or equal to the diameter of a pin of the diode, and the included angle between the film guide plate and the end face of the centering strip is equal to half of the cone angle of the conical surface. The parts of the two sides of the film gluing part can be turned upwards and attached to the conical surface of the gluing wheel through the film guide plate preferably, the film is synchronously driven to move uniformly in the rotation process of the gluing wheel, and the phenomenon that the diode is inclined due to the fact that the film contacts with pins of the diode in the process of gluing the diode body is avoided.

Furthermore, the centering strip is located the bending part's of conveying chain ejection of compact side upper and lower all is equipped with fixed connection and leads the diaphragm plate on the diaphragm plate, puts the diaphragm plate for the set-square that the upper edge set up towards the conveying chain slope. Put the diaphragm plate as preferred and be used for continuing the direction and transfer the film both sides to the tiling state gradually to leading the film that diaphragm plate department passed through, be convenient for follow-up also fixed then formation braid with the pin of diode through the film.

Further, the conveying chain discharge end outside is equipped with two vertical pressfitting rollers that distribute side by side, and the surface cladding of pressfitting roller has the sponge layer. Preferably, the film can be stably and flatly covered on the surface of the diode through the pressing roller to form a stable braid, the sponge layer can fully extrude the film to enable the two films to completely cover the surface of the diode from the upper side and the lower side, and the orderly arrangement and fixation of the diodes into the braid are completed.

Further, the glue spreader is arranged at the top end of one side of the film guide plate facing the feeding end of the conveying chain. The film guide plate is used for supporting the glue spreader as an optimal selection, and meanwhile, the film can be conveniently guided to enable the middle of the film to be glued, and then the two sides of the film can be folded in time to avoid the gluing position from being interfered to affect the bonding of the diode tube body.

Further, a glue coating pad is fixed on the side face, facing the bonding wheel, of the membrane placing plate, and the glue coating pad is a spongy pad soaked with glue solution. Preferably, supplementary gluing is carried out on the part, which is not glued with glue, of the film through the gluing pad, so that the film positioned on the pin part of the diode can be stably glued, the pin of the diode is fixed after the tube body of the diode is glued and positioned, and the orderly arrangement braid of the diode is realized.

Furthermore, the rotating linear speeds of the bonding wheel, the conveying chain and the pressing roller are consistent. Preferably, the individual steps of the braiding process are synchronized in such a way that a smooth and wrinkle-free braiding is ensured.

Drawings

FIG. 1 is a top view of an embodiment of the present invention;

fig. 2 is a view from a-a in fig. 1.

Detailed Description

The following is further detailed by way of specific embodiments:

reference numerals in the drawings of the specification include: conveying chain 1, recess 2, pin 3, centering 4, glue spreader 5, torus 6, conical surface 7, lead the lamina membranacea 8, put lamina membranacea 9, pressfitting roller 10, body 11, bonding wheel 12, sponge layer 13, film 14.

The embodiment is basically as shown in the attached figures 1 and 2: diode collating unit, including frame (not shown in the figure) and fix two mutual parallel arrangement's in the frame conveying chain 1, be equipped with the recess 2 that is used for joint diode pin 3 on the chain link of conveying chain 1, be equipped with two centering strips 4 that set up side by side between two conveying chains 1, the both ends of centering strip 4 all buckle towards conveying chain 1, two distances between the middle part of centering strip 4 equal the length of body 11 of diode, the top surface of centering strip 4 flushes with the interior bottom surface of recess 2. On to the median 4, the downside has bonding mechanism with the plane symmetric distribution of centering 4 place, bonding mechanism is including rotating the bonding wheel 12 of connecting the drum form in the frame, bonding wheel 12's driving motor passes through the bolt fastening in the frame, bonding wheel 12's wheel face includes the torus 6 at middle part and is located the circular conical surface 7 of torus 6 both sides, the big footpath end and the torus 6 of circular conical surface 7 are connected, the axial length of torus 6 equals the body 11 length of diode, bonding wheel 12 is equipped with the glue spreader 5 with torus 6 rolling contact towards the outside of 1 feed end of conveying chain, bonding wheel 12's torus 6 and the 11 intermittent offsets of the body of a plurality of diodes between centering 4. To the top at middle part of middle stripe 4, the below all is equipped with the diaphragm guide 8 that the slope set up, it is tangent with circular conical surface 7 to lead diaphragm guide 8, lead diaphragm guide 8 and the diameter of centering 4 distance more than or equal to diode pin 3 between the stripe, lead diaphragm guide 8 screwed connection in the frame, lead the diaphragm guide 8 and the centering 4 contained angle between the terminal surface equal to circular conical surface 7 cone half of angle, guarantee to lead diaphragm guide 8 pinpoint and with circular conical surface 7 tangent setting, glue spreader 5 is installed and is being led the top of diaphragm guide 8 towards 1 feed end one side of transfer chain.

The upper and lower of the bending part that is located the discharge side of conveying chain 1 to median 4 all is equipped with and leads 8 integrated into one piece's of diaphragm plates to put diaphragm plate 9, puts diaphragm plate 9 for the set-square that the top edge set up towards conveying chain 1 slope, puts the lower limb of diaphragm plate 9 and aligns with the bending section of median 4. A rubber coating pad is fixed on the side surface of the membrane placing plate 9 facing the bonding wheel 12, and the rubber coating pad is a spongy pad soaked with glue solution.

Two vertical pressing rollers 10 which are distributed in parallel are arranged on the outer side of the discharge end of the conveying chain 1, and a sponge layer 13 is coated on the surface of each pressing roller 10.

The linear rotating speeds of the bonding wheel 12, the conveying chain 1 and the pressing roller 10 are consistent.

The specific implementation process is as follows: the diode after being welded and polarized is placed between the two transmission chains 1, two pins 3 of the diode are respectively placed in the grooves 2 on one transmission chain 1, and the diode is supported and transmitted through the two transmission chains 1. Two films 14 for forming a braid respectively pass through the space between the glue coating roller 5 and the bonding wheel 12, then pass through the space between the bonding wheel 12 and the diode tube body 11, pass through the space between the film guide plate 8 and the conical surface 7 of the bonding wheel 12 on two sides of the films 14, and then stretch the films 14 into the space between the pressing rollers 10 along the film placing plate 9. When the glue spreading machine is used, glue solution is firstly drained to the glue spreading roller 5 and the glue spreading pad through the guide pipe, and then the conveying chain 1, the pressing roller 10 and the bonding wheel 12 are started to enable the three to rotate at the same linear speed. At the moment, the diodes are driven by the grooves 2 on the conveying chain 1 to move towards the bonding wheels 12, and the two ends of the tube bodies 11 are gradually arranged in a regular row under the guidance of the bending parts of the centering plates in the diode moving process, so that the tube bodies 11 of the diodes are aligned. The bonding wheel 12 and the pressing roller 10 can drive the film 14 to move synchronously in the rotation process, the gluing roller 5 can glue the middle of the film 14 and form a strip-shaped glue solution belt in the moving process of the film 14, the width of the glue solution belt is the same as the length of the diode tube body 11, the film 14 on the two sides of the glue solution belt is folded by the film guide plate 8 and the conical surface 7 on the bonding wheel 12, and thus the circular surfaces 6 of the two bonding wheels 12 can synchronously extrude the film 14 where the glue solution belt is located oppositely from the upper side and the lower side. And the diode body 11 continues to enter between the upper and lower two bonding wheels 12 gradually in the process of moving between the two centering plates, and then the diode body 11 is wrapped and clamped by the films 14 with the glue tapes on the upper and lower sides, and is rolled and extruded by the two bonding wheels 12, so that the part with the glue tapes in the middle of the film 14 is bonded on the diode body 11, and then the diode bodies 11 which are positioned and arranged orderly are connected through the film 14.

Then the diode and the film 14 synchronously move along the conveying chain 1, the parts of the film 14 positioned at the two sides of the gummed tape are separated from the space between the film guide plate 8 and the conical surface 7 of the bonding wheel 12 along the film guide plate 8, then laying the film on the film placing plate 9, dipping the part of the film 14 contacted with the film placing plate 9 with glue solution through a glue coating pad, gradually laying the side edge part of the film 14 dipped with the glue solution on the upper side and the lower side of the diode pin 3 under the guiding of the film placing plate 9 and the traction of the pressing roller 10, then the upper and lower films 14 gradually enter between the press rollers 10 and are pressed and stuck together by the press rollers 10, and simultaneously the pins 3 of the diode are coated, and then the diodes which are discharged from the pressing roller 10 and are coated into a strip-shaped arrangement through the film 14, the taping operation of the diodes is completed, and the tube bodies 11 of the plurality of diodes of the braid are uniformly and orderly arranged, which is more beneficial to the subsequent further processing of the diodes.

Claims

1. Diode arranging device, its characterized in that: the diode tube body bending machine comprises two conveying chains which are arranged in parallel, wherein a groove used for clamping a diode pin is formed in a chain link of each conveying chain, two centering bars which are arranged side by side are arranged between the two conveying chains, two ends of each centering bar are bent towards the conveying chains, the distance between the middle parts of the two centering bars is equal to the length of a diode tube body, and the top surfaces of the centering bars are flush with the arc bottoms of the grooves; the upper side and the lower side of the centering strip are symmetrically provided with bonding mechanisms according to the plane where the centering strip is located, each bonding mechanism comprises a drum-shaped bonding wheel, the wheel surface of each bonding wheel comprises a circular ring surface in the middle and conical surfaces located on two sides of the circular ring surface, the large-diameter end of each conical surface is connected with the circular ring surface, the axial length of each circular ring surface is equal to the length of the diode body, the outer side of each bonding wheel is provided with a glue coating roller in rolling contact with the circular ring surface, and one end, close to the centering strip, of each bonding wheel abuts against the diode body; the upper and lower sides of the middle part of the centering strip are respectively provided with a film guide plate which is obliquely arranged, the distance between the film guide plate and the centering strip is more than or equal to the diameter of a pin of the diode, and the included angle between the film guide plate and the end surface of the centering strip is equal to half of the cone angle of the conical surface.

2. The diode arrangement of claim 1, wherein: the centering strip is located the upper and lower side of the bending part of conveying chain discharge side and all is equipped with the membrane board of putting of fixed connection on leading the membrane board, puts the membrane board for the set-square that the upper edge set up towards the conveying chain slope.

3. The diode arrangement of claim 2, wherein: two vertical pressing rollers which are distributed in parallel are arranged outside the discharge end of the conveying chain, and a sponge layer is coated on the surfaces of the pressing rollers.

4. A diode arrangement according to claim 3, wherein: the glue spreader is arranged at the top end of one side of the film guide plate, which faces to the feeding end of the conveying chain.

5. A diode arrangement according to claim 4, wherein: and a rubber coating pad is fixed on the side surface of the membrane placing plate facing the bonding wheel, and is a spongy cushion soaked with glue solution.

6. A diode arrangement according to claim 5, wherein: and the rotating linear speeds of the bonding wheel, the conveying chain and the pressing roller are consistent.