CN109714554A - A kind of preparation method and its TV mould group of backboard - Google Patents
A kind of preparation method and its TV mould group of backboard Download PDFInfo
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- CN109714554A CN109714554A CN201811528483.7A CN201811528483A CN109714554A CN 109714554 A CN109714554 A CN 109714554A CN 201811528483 A CN201811528483 A CN 201811528483A CN 109714554 A CN109714554 A CN 109714554A
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- backboard
- stamping parts
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- board module
- back board
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Abstract
The invention discloses a kind of preparation method of back board module and its TV mould group, preparation method includes: that the preset stamping parts for being used to fix all kinds of diaphragms and light guide plate center is fixed on backboard；Soldering is carried out to the stamping parts using laser welding apparatus, so that the stamping parts is bonded on the backboard；Paint baking is carried out to the backboard after welding, and places all kinds of diaphragms on backboard after backboard is online；Preset light guide plate center is engaged on the stamping parts.The present invention replaces traditional glue technique for sticking using laser welding process to realize the fixation of stamping parts, quality not only can be improved, but also effectively reduce Material Cost and cost of labor, realizes automated production.
Description
Technical field
The present invention relates to TV mould technical group fields, and in particular to a kind of preparation method and its TV mould group of backboard.
Background technique
With making constant progress for television set, in order to meet consumer to product appearance demand (especially ultra-thin television
Machine), using folding edges of back as appearance.In order to solve fixed diaphragm, light guide plate center etc., using AB glue water Binding scheme by aluminium
Item is adhered to above backboard.After aluminum strip bonding, the materials such as diaphragm class are placed, light guide plate center is engaged to above aluminum strip, then is made
It is screwed light guide plate center.
But above scheme is easy to scratch folding edges of back (appearance) during placing jig, and backboard is caused to fall
The problems such as paint scratches, white backboard is difficult to do over again, and has slight color differences after secondary spraying, has an impact to appearance.On further, since
It states using A glue in scheme, AB glue water higher cost, in conjunction with current product cost, single machine at least needs to put into glue 1.8
Member/platform, Material Cost is higher, and because folding edges of back as appearance and combines AB glue water characteristic, can only use and manually put
Pressure maintaining jig is set, cannot achieve automation pressure maintaining, lost labor's cost.
Therefore, the existing technology needs to be improved and developed.
Summary of the invention
The technical problem to be solved in the present invention is that in view of the above drawbacks of the prior art, providing a kind of preparation of backboard
Method and its TV mould group, it is intended to it solves in the scheme that aluminum strip is fixed using glue technique for sticking in the prior art,
The problem of poor product quality, Material Cost are high and cost of labor wastes.
The technical proposal for solving the technical problem of the invention is as follows:
A kind of preparation method of back board module, wherein the preparation method includes:
The preset stamping parts for being used to fix all kinds of diaphragms and light guide plate center is fixed on backboard；
Soldering is carried out to the stamping parts using laser welding apparatus, so that the stamping parts is bonded on the backboard；
Paint baking is carried out to the backboard after welding；
Backboard is online, and preset all kinds of diaphragms and light guide plate center are engaged on the stamping parts.
The preparation method of the back board module, wherein the stamping parts is arranged to bendable, and using SECC or not
Rust Steel material is stamped to form.
The preparation method of the back board module, wherein described to be used to fix in all kinds of diaphragms and light guide plate by preset
The stamping parts of frame is fixed on the step on backboard, specifically includes:
Manually stamping parts is placed on the backboard；
Automation positioning and fixing are carried out to the punching press item using pneumatic smelting tool.
The preparation method of the back board module, wherein described that the stamping parts is welded using laser welding apparatus
Processing is connect, so that the stamping parts is bonded in the step on the backboard, is specifically included:
Using laser welding apparatus with the distance between preset single welding spot size, welding segment length, welding section and welding speed
Degree, the stamping parts is welded on backboard.
The preparation method of the back board module, wherein the list welding spot size is 0.3mm.
The preparation method of the back board module, wherein the welding segment length is 8-10mm.
The preparation method of the back board module, wherein the distance between described welding section 5-10mm.
The preparation method of the back board module, wherein the speed of welding is 3mm/s.
The preparation method of the back board module, wherein the welding current of the laser welding apparatus requires to be 11V-
12V。
A kind of TV mould group, wherein the TV mould group includes back board module, and the back board module uses any of the above-described
The preparation method is made.
Beneficial effects of the present invention: the present invention replaces traditional glue technique for sticking using laser welding process to realize punching
The fixation of casting die not only provides product quality, and due to effectively reducing Material Cost and people without using AB glue water
Work cost realizes automated production.
Detailed description of the invention
Fig. 1 is the flow chart of the preparation method of back board module of the invention preferably implemented.
Fig. 2 is the structural schematic diagram of the weld of back board module of the invention.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer and more explicit, right as follows in conjunction with drawings and embodiments
The present invention is further described.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and do not have to
It is of the invention in limiting.
The present embodiment provides a kind of preparation methods of back board module, and as shown in fig. 1, which specifically includes as follows
Step:
Step S100, the preset stamping parts for being used to fix all kinds of diaphragms and light guide plate center is fixed on backboard；
Step S200, soldering is carried out to the stamping parts using laser welding apparatus, so that the stamping parts is bonded in institute
It states on backboard；
Step S300, paint baking is carried out to the backboard after welding；
Step S400, backboard is online, and preset all kinds of diaphragms and light guide plate center are engaged on the stamping parts.
In existing TV mould group, in order to meet the appearance requirement to product of consumer, using folding edges of back as appearance
Face is provided with the aluminum strip for fixing all kinds of diaphragms and light guide plate center on backboard, forms back board module.In traditional technique
In, typically aluminum strip is fixed on backboard using glue technique for sticking.Process flow is as follows:
One backboard baking vanish of punching press backboard, one AB glue water spot glue one places one pressure maintaining of aluminum strip and fixes the online placement various types of films of a backboard
Piece one engages the fixed center of one screw of center.
In above-mentioned technique, equipment is taken aluminum strip by operator after the completion of dispensing by AB glue water spot to aluminum strip
It is adhered to above backboard, is easy to glue be encountered face on hand in operating process, cause this region glue quantity to reduce, for product
Reliability impacts.And after aluminum strip places, jig pressure maintaining is used, is easy to scratch during placing jig
Folding edges of back (appearance) leads to problems such as backboard fall paint and scratches, and white backboard is difficult to do over again, and has slight color after secondary spraying
Difference has an impact appearance, seriously affects the quality of product.Further, because folding edges of back structure is as appearance and knot
Conjunction AB glue water characteristic, the program can only place pressure maintaining jig using artificial, and aluminum strip generation displacement during placing jig is avoided to ask
Topic, cannot achieve automation pressure maintaining, lost labor's cost.After the completion of backboard is Nian Jie with aluminum strip, because of AB glue water characteristic issues, need
Die-filling group of group can be just assembled after placing 24 hours, had a certain impact for plan scheduled production.In addition to this, due to viscous in glue
Needing to lock screw after connecing the assembly center of scheme, producing line at least needs to put into multiple operators and is just able to satisfy production requirement,
Waste of manpower cost, and AB glue water higher cost, in conjunction with current product cost, single machine at least needs to put into 1.8 yuan/platform of glue,
Material Cost is higher.
Therefore, of the existing technology in order to solve the problems, such as, the present embodiment replaces glue viscous using laser welding process
Connect technique.Specifically, Sheet Metal Forming Technology is advanced in the present embodiment and makes a stamping parts, which is used to fix various types of films
Piece and light guide plate center.Stamping parts is placed on backboard first by operator, and (backboard is made in advance using Sheet Metal Forming Technology
Make) and the stamping parts is fixed.Preferably, had in the present embodiment using pneumatic smelting stamping parts to be fixed, it can
It to realize pneumatic pressure maintaining, saves labour turnover, and the stable gas pressure of pneumatic smelting tool, effectively improves the positioning accuracy of stamping parts,
Improve product quality.
Preferably, the stamping parts in the present embodiment is electrolysed sub- lead galvanized steel plain sheet, a kind of stamping material using SECC(), it can also
To use stainless steel material.The hardness of both materials is higher, be conducive to higher to all kinds of diaphragms and light guide plate center into
Row is fixed, and product quality is improved.Further, in this embodiment stamping parts be arranged to bending type, the stamping parts of bending type can
Preferably to accommodate all kinds of diaphragms and light guide plate center, it is more advantageous to all kinds of diaphragms and the engaging of light guide plate center.
Further, after stamping parts is fixed on backboard, the stamping parts is welded using laser welding apparatus
Connect processing.Specifically, the present embodiment when carrying out soldering can according to the size of the material of stamping parts and stamping parts come pair
Welding parameter is configured and adjusts.Preferably, as shown in Figure 2, single on backboard 10 in specific welding procedure
The size of pad is 0.3mm, and multiple list pads form welding section A, and the length of welding section A is 8-10mm.Due to punching
The size difference of casting die and the quantity of welding section are different, and distance is 5-10cm between welding section.Certainly, before welding section
Distance can also be adjusted according to material product is not had to.
Further, in this embodiment laser welding apparatus electric current have it is specific require, when stamping parts is SECC
When stamping parts, laser welding apparatus needs to be welded using 11.2V, when stamping parts is stainless steel pressing, laser welding
Equipment needs to be welded using 12V.Further, in order to meet productive temp, production efficiency is improved, swashing in the present embodiment
The speed of welding of photocoagulation equipment is 3mm/s.Meanwhile in order to guarantee weld strength, in the present embodiment in welding, it is desirable that each
The push-pull effort of welding section is greater than 20KG.
Preferably, in the present embodiment, the weldering of the present embodiment can be completed using six axis robot combination laser spot welder
The spot welding in technique is connect, operation is more flexible, and can also manage the gap of stamping parts flanging and folding edges of back, improves welding
Efficiency and the quality of welding.
Further, it after stamping parts is welded on backboard, needs to carry out paint baking.Since traditional glue is viscous
Connecing in technique is first to carry out paint baking, and then stamping parts is bonded on backboard again, backboard is easily caused in bonding process
It scratches paint, and considers glue temperature characterisitic, dispensing can only be arranged again after baking vanish completion, this is also easy to baking vanish table
It causes to scratch in face.And be first to be bonded in stamping parts on backboard by welding procedure in the present embodiment, then carry out at baking vanish again
Reason, effectively avoids the problem that backboard scratches.And Material Cost can be saved without using AB glue water in the present embodiment.
Further, after the completion of baking vanish, backboard is online, then preset all kinds of diaphragms and light guide plate center are engaged
On stamping parts.Bending form is arranged to by stamping parts in this present embodiment, specific shape can for " bow " type or "] "
When to diaphragm and light guide plate center only fixation need to can be completed using specific structure in type, without using fixing screws,
Further save Material Cost.
Replace traditional glue technique for sticking that stamping parts is fixed on backboard in the present embodiment using welding procedure,
Reliability is higher, scratches glue without having to worry about operator, so that the overall structure of back board module more is stablized.And
And due to effectively saving Material Cost and cost of labor, being advantageously implemented automated production without using glue.
Based on the above embodiment, the present invention also provides a kind of TV mould group, above-described embodiment is contained in the TV mould group
In back board module, which is made using preparation method provided by above-described embodiment, so that the TV mould group
In back board module have the effect of above-described embodiment.
In conclusion the present invention provides a kind of preparation methods of back board module and its TV mould group, preparation method to include:
The preset stamping parts for being used to fix all kinds of diaphragms and light guide plate center is fixed on backboard；Using laser welding apparatus to institute
It states stamping parts and carries out soldering, so that the stamping parts is bonded on the backboard；Backboard after welding is carried out at baking vanish
Reason, and all kinds of diaphragms are placed on backboard after backboard is online；Preset light guide plate center is engaged on the stamping parts.This
Invention replaces traditional glue technique for sticking using laser welding process to realize the fixation of stamping parts, and matter not only can be improved
Amount, but also Material Cost and cost of labor are effectively reduced, realize automated production.
It should be understood that the application of the present invention is not limited to the above for those of ordinary skills can
With improvement or transformation based on the above description, all these modifications and variations all should belong to the guarantor of appended claims of the present invention
Protect range.
Claims (10)
1. a kind of preparation method of back board module, which is characterized in that the preparation method includes:
The preset stamping parts for being used to fix all kinds of diaphragms and light guide plate center is fixed on backboard；
Soldering is carried out to the stamping parts using laser welding apparatus, so that the stamping parts is bonded on the backboard；
Paint baking is carried out to the backboard after welding；
Backboard is online, and preset all kinds of diaphragms and light guide plate center are engaged on the stamping parts.
2. the preparation method of back board module according to claim 1, which is characterized in that the stamping parts is arranged to bending
Formula, and be stamped to form using SECC or stainless steel material.
3. the preparation method of back board module according to claim 1, which is characterized in that described to be used to fix respectively by preset
The stamping parts of class diaphragm and light guide plate center is fixed on the step on backboard, specifically includes:
Manually stamping parts is placed on the backboard；
Automation positioning and fixing are carried out to the punching press item using pneumatic smelting tool.
4. the preparation method of back board module according to claim 1, which is characterized in that described to use laser welding apparatus pair
The stamping parts carries out soldering and specifically includes so that the stamping parts is bonded in the step on the backboard:
Using laser welding apparatus with the distance between preset single welding spot size, welding segment length, welding section and welding speed
Degree, the stamping parts is welded on backboard.
5. the preparation method of back board module according to claim 4, which is characterized in that the list welding spot size is 0.3mm.
6. the preparation method of back board module according to claim 4, which is characterized in that the welding segment length is 8-
10mm。
7. the preparation method of back board module according to claim 4, which is characterized in that the distance between described welding section 5-
10cm。
8. the preparation method of back board module according to claim 4, which is characterized in that the speed of welding is 3mm/s.
9. the preparation method of back board module according to claim 4, which is characterized in that the welding of the laser welding apparatus
Current requirements are 11V-12V.
10. a kind of TV mould group, which is characterized in that the TV mould group includes back board module, and the back board module is using above-mentioned
The described in any item preparation methods of claim 1-9 are made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811528483.7A CN109714554A (en) | 2018-12-13 | 2018-12-13 | A kind of preparation method and its TV mould group of backboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811528483.7A CN109714554A (en) | 2018-12-13 | 2018-12-13 | A kind of preparation method and its TV mould group of backboard |
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| Publication Number | Publication Date |
|---|---|
| CN109714554A true CN109714554A (en) | 2019-05-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811528483.7A Pending CN109714554A (en) | 2018-12-13 | 2018-12-13 | A kind of preparation method and its TV mould group of backboard |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014026347A1 (en) * | 2012-08-14 | 2014-02-20 | 深圳市华星光电技术有限公司 | Assembly method for backlight module and assembly apparatus therefor |
| CN103912854A (en) * | 2013-01-04 | 2014-07-09 | 友达光电股份有限公司 | Backing plate, backlight module and liquid crystal display module |
| CN203909433U (en) * | 2014-06-27 | 2014-10-29 | 重庆惠科金扬科技有限公司 | LCD (Liquid Crystal Display) module |
-
2018
- 2018-12-13 CN CN201811528483.7A patent/CN109714554A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014026347A1 (en) * | 2012-08-14 | 2014-02-20 | 深圳市华星光电技术有限公司 | Assembly method for backlight module and assembly apparatus therefor |
| CN103912854A (en) * | 2013-01-04 | 2014-07-09 | 友达光电股份有限公司 | Backing plate, backlight module and liquid crystal display module |
| CN203909433U (en) * | 2014-06-27 | 2014-10-29 | 重庆惠科金扬科技有限公司 | LCD (Liquid Crystal Display) module |
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Application publication date: 20190503 |