CN109712528A - Screen mould group and electronic equipment - Google Patents

Screen mould group and electronic equipment Download PDF

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Publication number
CN109712528A
CN109712528A CN201711015835.4A CN201711015835A CN109712528A CN 109712528 A CN109712528 A CN 109712528A CN 201711015835 A CN201711015835 A CN 201711015835A CN 109712528 A CN109712528 A CN 109712528A
Authority
CN
China
Prior art keywords
screen
mould group
substrate
main body
plane domain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711015835.4A
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Chinese (zh)
Inventor
尹浩发
王寰宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Xiaomi Mobile Software Co Ltd
Original Assignee
Beijing Xiaomi Mobile Software Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Xiaomi Mobile Software Co Ltd filed Critical Beijing Xiaomi Mobile Software Co Ltd
Priority to CN201711015835.4A priority Critical patent/CN109712528A/en
Publication of CN109712528A publication Critical patent/CN109712528A/en
Pending legal-status Critical Current

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Abstract

The disclosure is directed to a kind of screen mould group and electronic equipments, wherein screen mould group includes: screen main body;Flexible base board, flexible base board includes: the first substrate plane domain being stacked with screen main body, the first substrate curved surface area that the direction for being connected with first substrate plane domain and being directed away from screen main body extends, the second substrate plane domain being connected with first substrate curved surface area, and at least part of the second substrate plane domain is not covered by screen main body;Chip assembly is attached at the part not covered by screen main body on the second substrate plane domain.Chip assembly in the disclosure is attached to the region not covered by screen main body on the second substrate plane domain of flexible base board, it can be to avoid additionally attaching chip assembly using flip chip, reduce the border width at screen mould group corresponding edge, and, utilize the curved surface effect at flexible base board edge, visually reduce since flexible base board bends increased marginal dimension, realizes the ultra-narrow frame of electronic equipment.

Description

Screen mould group and electronic equipment
Technical field
This disclosure relates to field of terminal technology more particularly to a kind of screen mould group and electronic equipment.
Background technique
Currently, screen accounting is improved by reducing the border width of electronic equipment, increase electronic equipment aesthetic appearance has become Driving chip can be fixed by COG (chip on glass) technology in the related art for the development trend in industry On the glass substrate of screen mould group;Alternatively, core can also will be driven by COF (Chip On Film, flip chip) technology Piece is fixed on the flexible substrate for being attached at screen mould group.
Summary of the invention
The disclosure provides a kind of screen mould group and electronic equipment, to solve deficiency in the related technology.
According to the first aspect of the embodiments of the present disclosure, a kind of screen mould group is provided, comprising:
Screen main body;
Flexible base board, the flexible base board include: the first substrate plane domain being stacked with the screen main body, with The first substrate plane domain be connected and be directed away from the screen main body direction extend first substrate curved surface area, with The connected the second substrate plane domain of the first substrate curved surface area, at least part of the second substrate plane domain is not It is covered by the screen main body;
Chip assembly, the chip assembly, which is attached on the second substrate plane domain, not to be covered by the screen main body Part.
Optionally, the screen main body includes the first screen plane region, and first screen plane region corresponds to institute First substrate plane domain is stated to be stacked.
Optionally, the screen main body includes the second screen plane area corresponding to first substrate plane domain setting Domain, the first screen curved surface area being connected with second screen plane region, described in the first screen curved surface area covering At least part of first substrate curved surface area.
Optionally, the screen main body includes: the third screen plane corresponding to first substrate plane domain setting Region, the second screen curved surface area and the second screen curved surface area being arranged corresponding to the first substrate curved surface area The 4th connected screen plane region, a part of the second substrate plane domain described in the 4th screen plane region overlay.
Optionally, the second substrate plane domain and the first substrate plane domain are substantially vertical.
Optionally, the chip assembly is attached at the inner surface of the second substrate plane domain.
Optionally, the first substrate curved surface area and the second substrate plane domain are located at the side of the screen mould group At side.
Optionally, adhesive layer, institute are equipped between the chip assembly and the corresponding surface of the second substrate plane domain Adhesive layer is stated for the chip assembly to be adhered to the second substrate plane domain.
Optionally, the chip assembly includes the driving chip of the screen mould group.
Optionally, the screen mould group includes OLED screen curtain mould group.
According to the second aspect of an embodiment of the present disclosure, a kind of electronic equipment is provided, including such as any of the above-described embodiment institute The screen mould group stated.
The technical scheme provided by this disclosed embodiment can include the following benefits:
As can be seen from the above embodiments, the chip assembly in the disclosure can be attached to the second substrate plane area of flexible base board The region not covered by screen main body on domain, so as to avoid additionally attaching chip assembly using flip chip, favorably Border width at reduction screen mould group corresponding edge, moreover, visually being subtracted using the curved surface effect at flexible base board edge It is small since flexible base board bends increased marginal dimension, be advantageously implemented the ultra-narrow frame of electronic equipment.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not The disclosure can be limited.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows the implementation for meeting the disclosure Example, and together with specification for explaining the principles of this disclosure.
Fig. 1 is the schematic cross-section of a screen mould group in the related technology.
Fig. 2 is the schematic cross-section of another mould group of screen in the related technology.
Fig. 3 is a kind of structural schematic diagram of screen mould group shown according to an exemplary embodiment.
Fig. 4 is a kind of Section A-A schematic diagram of screen mould group shown according to an exemplary embodiment.
Fig. 5 is the schematic cross-section of another screen mould group shown according to an exemplary embodiment.
Fig. 6 is the schematic cross-section of another screen mould group shown according to an exemplary embodiment.
Fig. 7 is the structural schematic diagram of a kind of electronic equipment shown according to an exemplary embodiment.
Specific embodiment
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment Described in embodiment do not represent all embodiments consistent with the application.On the contrary, they be only with it is such as appended The example of the consistent device and method of some aspects be described in detail in claims, the application.
It is only to be not intended to be limiting the application merely for for the purpose of describing particular embodiments in term used in this application. It is also intended in the application and the "an" of singular used in the attached claims, " described " and "the" including majority Form, unless the context clearly indicates other meaning.It is also understood that term "and/or" used herein refers to and wraps It may be combined containing one or more associated any or all of project listed.
It will be appreciated that though various information, but this may be described using term first, second, third, etc. in the application A little information should not necessarily be limited by these terms.These terms are only used to for same type of information being distinguished from each other out.For example, not departing from In the case where the application range, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as One information.Depending on context, word as used in this " if " can be construed to " ... when " or " when ... When " or " in response to determination ".
Fig. 1 is a kind of schematic cross-section of screen mould group in the related technology.As shown in Figure 1, the screen mould group 100 can wrap Include the first display module 101 and the first driving chip 102, wherein the first driving chip 102 can be attached to the first display module On 101 glass substrate 1011, to be necessarily required to extend glass substrate 1011 to lead for attaching the first driving chip 102 Cause is larger to the area occupied of electronic equipment frame, is unfavorable for realizing the ultra-narrow frame of electronic equipment.
Therefore, in order to reduce the frame of electronic equipment, it is as shown in Figure 2 it is another in the related technology, screen mould group 200 can To include the second display module 201, the second driving chip 202, flexible substrate 203.Wherein, one end connection of flexible substrate 203 On the substrate 2011 of second display module 201, the other end then bends inwards at the edge of the second display module 201 and forms a base Originally it is parallel to the parallel zone 2031 of the second display module 201, the second driving chip 201 is then attached at the parallel zone 2031 On, the area of electronic equipment frame is occupied to be reduced using the frivolous and bent characteristic of flexible substrate 203.But It needs additionally to attach flexible substrate 203 in the related technology at this, the encapsulation technology that on the one hand will lead to screen mould group 200 is complicated Change, another aspect flexible substrate 203 can still occupy the frame of electronic equipment, still be unfavorable for the ultra-narrow of electronic equipment frame Development.
Therefore, the disclosure is improved by the structure of the screen mould group to electronic equipment, to solve to deposit in the related technology Above-mentioned technical problem.
As described in Fig. 3, Fig. 4, which includes screen main body 1, flexible base board 2 and chip assembly 3.It is flexible Substrate 2 may include: the first substrate plane domain 21 being stacked with screen main body 1 and 21 phase of first substrate plane domain Connect and be directed away from the first substrate curved surface area 22 of the direction extension of screen main body 1, be connected with first substrate curved surface area 22 The second substrate plane domain 23, at least part of the second substrate plane domain 23 do not cover by screen main body 1, and Control circuit can be set by the part that screen main body 1 is covered on flexible base board 2, to maintain the normal aobvious of screen mould group 300 Show.
Wherein, the chip assembly 3 for controlling screen mould group 300, which can be attached on the second substrate plane domain 23, not to be shielded The region that curtain main body 1 covers reduces screen mould group 300 so as to avoid additionally attaching chip assembly 3 using flip chip Border width at corresponding edge, moreover, visually being reduced using the curved surface effect at 2 edge of flexible base board due to flexible base Plate 2 bends increased marginal dimension, realizes the ultra-narrow frame of electronic equipment.
In the present embodiment, when screen mould group 300 include OLED (Organic Light-Emitting Diode, it is organic Emitting semiconductor) screen mould group when, screen main body 1 may include cover board, cathode, emission layer, conductive layer and anode etc., flexible Control circuit can be set in the region being stacked on substrate 2 with screen main body 1, with control the liquid crystal molecule of screen main body 1 into Row shines, and realizes that the picture of screen mould group 300 is shown.
In one embodiment, still by taking embodiment illustrated in fig. 4 as an example, screen main body 1 may include the first screen curved surface area 11 and the second screen plane region 12.Wherein, the second screen plane region 12 is arranged corresponding to first substrate plane domain 11, the One screen curved surface area 11 be connected with the second screen plane region 12 and at least part on first substrate curved surface area 22 Stacking arrangement, so that electricity can be set in the region on first substrate curved surface area 22 corresponding to the first screen curved surface area 11 Road carries out luminous, is making the first screen curved surface area 12 can to control the liquid crystal molecule at the first screen curved surface area 12 It is shown for picture, is conducive to the screen accounting for increasing electronic equipment, moreover, because the marginal position of screen mould group 300 is curved surface The form of display improves the visual experience of user.
In another embodiment, as shown in figure 5, screen main body 1 may include the first screen plane region 13, first screen The surface of curtain plane domain 13 is located in same surface;Also, the first screen plane region 13 can correspond to first substrate Plane domain 21 is stacked, thus by the first screen plane of circuit control region 13 on first substrate plane domain 21 Liquid crystal molecule shines, so that the lamination area in first substrate plane domain 21 and the first screen plane region 13 can be used for picture Display.
In another embodiment, as shown in fig. 6, screen main body 1 may include third screen plane region 14, the 4th screen Plane domain 15 and the second screen curved surface area 16.Wherein, third screen plane region 14 corresponds to first substrate plane area Domain 21 is arranged, and the second screen curved surface area 16 is connected with third screen plane region 14 and is matched with first substrate curved surface area 22, the 4th screen plane region 15 is connected with the second screen curved surface area 16 and covers wherein the one of the second substrate plane domain 23 Part, so that realizing comprehensive screen display of Electronic equipment panel side for showing at the respective side of electronic equipment.
In the present embodiment, when first substrate curved surface area 22 and the second screen curved surface area 16 are respectively positioned on screen mould group 300 side edge is (when position as shown by the arrows in Figure 7, i.e. user hold electronic equipment 400 under habit state and electronic equipment 400 contact sides), the 4th screen plane region 15 covering the second substrate plane domain 23 a portion and screen When mould group 300 is built-in with touch component, the correspondence display area of the side edge is configurable to volume increase and decrease region or power supply It is Zone switched etc., to avoid setting physical button, be conducive to the overall aesthetics and waterproof performance that improve electronic equipment.
In above-mentioned each embodiment, chip assembly 3 can be attached at the inner surface of the second substrate plane domain 23.This is interior Surface is arranged when screen mould group 300 is assembled to electronic equipment 400 towards the inner space of electronic equipment, to further decrease The border width of electronic equipment.Wherein, it can be glued by adhesive layer between chip assembly 3 and the second substrate plane domain 23 It connects, chip assembly 3 is fixed on flexible base board 3, avoid slipping, for example, which can be by being applied to core Solidify adhesive curing on piece component 3 or the second substrate plane domain 23 to form.Wherein, flexible base board 3 can be by thermoplasticity material It is made, for example, the high molecular polymers such as polycarbonate, polyester film, the disclosure are limited not to this.
Those skilled in the art will readily occur to its of the disclosure after considering specification and practicing disclosure disclosed herein Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or Person's adaptive change follows the general principles of this disclosure and including the undocumented common knowledge in the art of the disclosure Or conventional techniques.The description and examples are only to be considered as illustrative, and the true scope and spirit of the disclosure are by following Claim is pointed out.
It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and And various modifications and changes may be made without departing from the scope thereof.The scope of the present disclosure is only limited by the accompanying claims.

Claims (11)

1. a kind of screen mould group, which is characterized in that the screen mould group includes:
Screen main body;
Flexible base board, the flexible base board include: the first substrate plane domain being stacked with the screen main body, with it is described First substrate plane domain be connected and be directed away from the screen main body direction extend first substrate curved surface area, with it is described The connected the second substrate plane domain of first substrate curved surface area, at least part of the second substrate plane domain is not by institute State the covering of screen main body;
Chip assembly, the chip assembly are attached at the portion not covered by the screen main body on the second substrate plane domain Point.
2. screen mould group according to claim 1, which is characterized in that the screen main body includes the first screen plane area Domain, first screen plane region correspond to the first substrate plane domain and are stacked.
3. screen mould group according to claim 1, which is characterized in that the screen main body includes corresponding to first base Second screen plane region of plate plane domain setting, the first screen curved regions being connected with second screen plane region Domain, the first screen curved surface area cover at least part of the first substrate curved surface area.
4. screen mould group according to claim 1, which is characterized in that the screen main body includes: corresponding to described first The third screen plane region of base plan region setting, the second screen song corresponding to first substrate curved surface area setting Face region, the 4th screen plane region being connected with the second screen curved surface area, the 4th screen plane region overlay A part of the second substrate plane domain.
5. screen mould group according to claim 1, which is characterized in that the second substrate plane domain and first base Plate plane domain is substantially vertical.
6. screen mould group according to claim 1, which is characterized in that it is flat that the chip assembly is attached at the second substrate The inner surface in face region.
7. screen mould group according to claim 1, which is characterized in that the first substrate curved surface area and second base Plate plane domain is located at the side edge of the screen mould group.
8. screen mould group according to claim 1, which is characterized in that the chip assembly and the second substrate plane area Adhesive layer is equipped between the correspondence surface in domain, the adhesive layer is used to the chip assembly being adhered to the second substrate plane Region.
9. screen mould group according to claim 1, which is characterized in that the chip assembly includes the drive of the screen mould group Dynamic chip.
10. screen mould group according to claim 1, which is characterized in that the screen mould group includes OLED screen curtain mould group.
11. a kind of electronic equipment, which is characterized in that including screen mould group such as of any of claims 1-10.
CN201711015835.4A 2017-10-25 2017-10-25 Screen mould group and electronic equipment Pending CN109712528A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711015835.4A CN109712528A (en) 2017-10-25 2017-10-25 Screen mould group and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711015835.4A CN109712528A (en) 2017-10-25 2017-10-25 Screen mould group and electronic equipment

Publications (1)

Publication Number Publication Date
CN109712528A true CN109712528A (en) 2019-05-03

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110429123A (en) * 2019-08-12 2019-11-08 京东方科技集团股份有限公司 Display panel and its manufacturing method, display device
CN110649058A (en) * 2019-09-27 2020-01-03 京东方科技集团股份有限公司 Flexible display module and flexible display device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140042406A1 (en) * 2012-08-07 2014-02-13 Apple Inc. Flexible Displays
CN104009044A (en) * 2014-05-22 2014-08-27 京东方科技集团股份有限公司 Array substrate, manufacturing method thereof, display substrate and display device
CN104503122A (en) * 2014-12-25 2015-04-08 上海天马微电子有限公司 Display panel, displayer, manufacturing method of display panel and manufacturing method of displayer
CN207282084U (en) * 2017-10-25 2018-04-27 北京小米移动软件有限公司 Screen module and electronic equipment

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140042406A1 (en) * 2012-08-07 2014-02-13 Apple Inc. Flexible Displays
CN104009044A (en) * 2014-05-22 2014-08-27 京东方科技集团股份有限公司 Array substrate, manufacturing method thereof, display substrate and display device
CN104503122A (en) * 2014-12-25 2015-04-08 上海天马微电子有限公司 Display panel, displayer, manufacturing method of display panel and manufacturing method of displayer
CN207282084U (en) * 2017-10-25 2018-04-27 北京小米移动软件有限公司 Screen module and electronic equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110429123A (en) * 2019-08-12 2019-11-08 京东方科技集团股份有限公司 Display panel and its manufacturing method, display device
CN110649058A (en) * 2019-09-27 2020-01-03 京东方科技集团股份有限公司 Flexible display module and flexible display device

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