CN109711084A - The inspection method and relevant apparatus of Tandem devices in a kind of PCB - Google Patents
The inspection method and relevant apparatus of Tandem devices in a kind of PCB Download PDFInfo
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- CN109711084A CN109711084A CN201910020268.4A CN201910020268A CN109711084A CN 109711084 A CN109711084 A CN 109711084A CN 201910020268 A CN201910020268 A CN 201910020268A CN 109711084 A CN109711084 A CN 109711084A
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Abstract
This application discloses the inspection methods and relevant apparatus of Tandem devices in a kind of PCB, this method comprises: determining signal wire to be checked according to the inspection information received；Judge signal wire to be checked with the presence or absence of Tandem devices；If so, obtaining the first pin coordinate and the 2nd pin coordinate of Tandem devices；Judge the distance between the first pin coordinate and the 2nd pin coordinate whether in the first preset range；If so, obtaining the first difference pin coordinate and the second difference pin coordinate of the differential series device of corresponding position in differential lines；Judge the distance between the first difference pin coordinate and the second difference pin coordinate whether in the second preset range；If so, judging whether Tandem devices are symmetrical with differential series device according to the first pin coordinate, the 2nd pin coordinate, the first difference pin coordinate and the second difference pin coordinate；When Tandem devices and differential series device are symmetrical, then determine that Tandem devices inspection passes through.
Description
Technical field
This application involves PCB design technical field, in particular to the inspection method of Tandem devices, inspection system in a kind of PCB
System, PCB check device and computer readable storage medium.
Background technique
With the continuous development of information technology, the HW High Way on various boards in computer hardware is required to go here and there
Join coupled capacitor, different generations can be compatible with while guaranteeing signal normal transmission using the logical characteristic for handing over blocking of coupled capacitor
Border voltage.Further, if needing to carry out signal exchange between the different chip of all DC offset voltages, it is necessary to add
One coupled capacitor.
When the series AC coupled capacitor in HW High Way, it is necessary to which serial coupling capacitor is symmetrically placed.If
It is asymmetrically placed, Partial Differential signal can be made to be converted to common-mode signal, and common-mode signal can be in PCB (Printed Circuit
Board printed circuit board) in cause serious electromagnetic interference problem, influence the functionality of PCB and the integrality of signal transmission.
Therefore, it is necessary to check coupled capacitor concatenated in pcb board, to exclude not symmetrically placed problem.
In the prior art, the problem of typically manually being checked, symmetrically put with the coupled capacitor excluded in pcb board manually.But
It is manually to check that the inspection of not only pcb board is inefficient, is also easy to the case where missing inspection occur, influences the basic training of board
Can, lead to the normal use of board.
Therefore, the emphasis that the inspection efficiency of serial coupling capacitor in PCB is those skilled in the art's concern how is improved to ask
Topic.
Summary of the invention
The purpose of the application be to provide the inspection method, inspection system, PCB check device of Tandem devices in a kind of PCB with
And computer readable storage medium, by being carried out after inspection to Tandem devices automatically, then by the Tandem devices and difference
Tandem devices carry out symmetry judgement, realize and automaticly inspect to Tandem devices, improve inspection efficiency.
In order to solve the above technical problems, the application provides a kind of inspection method of Tandem devices in PCB, comprising:
Signal wire to be checked is determined according to the inspection information received；
Judge the signal wire to be checked with the presence or absence of Tandem devices；
When there are the first pin coordinates and second for when Tandem devices, obtaining the Tandem devices for the signal wire to be checked
Pin coordinate；
Judge the distance between the first pin coordinate and described 2nd pin coordinate whether in the first preset range；
When the distance between the first pin coordinate and the 2nd pin coordinate are in first preset range, obtain
Take the first difference pin coordinate and of the differential series device of corresponding position in differential lines corresponding with the signal wire to be checked
Two difference pin coordinates；
Judge whether the distance between the first difference pin coordinate and the second difference pin coordinate are default second
In range；
When the distance between the first difference pin coordinate and the second difference pin coordinate are in the described second default model
When enclosing interior, according to the first pin coordinate, the 2nd pin coordinate, the first difference pin coordinate and described second poor
Divide pin coordinate, judges whether the Tandem devices and the differential series device are symmetrical；
When the Tandem devices and the differential series device are symmetrical, then determine that the Tandem devices inspection passes through.
Optionally, judge the signal wire to be checked with the presence or absence of Tandem devices, comprising:
Judge whether the signal wire to be checked is Xnet according to the id information of the signal wire to be checked.
Optionally, judge the distance between the first pin coordinate and described 2nd pin coordinate whether in the first default model
In enclosing, comprising:
When the Tandem devices are disposed vertically, by the ordinate of the first pin coordinate and the 2nd pin coordinate
Ordinate subtracts each other, and obtains the stitch distance of the Tandem devices；
When the Tandem devices are horizontal positioned, by the abscissa of the first pin coordinate and the 2nd pin coordinate
Abscissa subtracts each other, and obtains the stitch distance of the Tandem devices；
Judge the stitch distance of the Tandem devices whether in first preset range.
Optionally, judge the distance between the first difference pin coordinate and the second difference pin coordinate whether
In two preset ranges, comprising:
When the differential series device is disposed vertically, by the ordinate and described second of the first difference pin coordinate
The ordinate of difference pin coordinate subtracts each other, and obtains the stitch distance of the differential series device；
When the differential series device is horizontal positioned, by the abscissa and described second of the first difference pin coordinate
The abscissa of difference pin coordinate subtracts each other, and obtains the stitch distance of the differential series device；
Judge the stitch distance of the differential series device whether in second preset range.
The application also provides a kind of inspection system of Tandem devices in PCB, comprising:
Data obtaining module is checked, for determining signal wire to be checked according to the inspection information received；
Tandem devices judgment module, for judging the signal wire to be checked with the presence or absence of Tandem devices；
Tandem devices coordinate obtaining module, for obtaining the string when the signal wire to be checked is there are when Tandem devices
Join the first pin coordinate and the 2nd pin coordinate of device；
Tandem devices coordinate judgment module, for judge between the first pin coordinate and the 2nd pin coordinate away from
From whether in the first preset range；
Differential series device coordinate obtains module, between the first pin coordinate and the 2nd pin coordinate
When distance is in first preset range, the difference of corresponding position in differential lines corresponding with the signal wire to be checked is obtained
First difference pin coordinate of Tandem devices and the second difference pin coordinate；
Differential series device coordinate judgment module, for judging the first difference pin coordinate and the second difference pin
Whether the distance between coordinate is in the second preset range；
The symmetrical judgment module of Tandem devices, for when the first difference pin coordinate and the second difference pin coordinate it
Between distance in second preset range when, according to the first pin coordinate, the 2nd pin coordinate, described first poor
Divide pin coordinate and the second difference pin coordinate, judges whether the Tandem devices and the differential series device are symmetrical；
It checks through module, for when the Tandem devices and the differential series device are symmetrical, then determining the string
Connection device inspection passes through.
Optionally, the Tandem devices judgment module, specifically for being judged according to the id information of the signal wire to be checked
Whether the signal wire to be checked is Xnet.
Optionally, the Tandem devices coordinate judgment module, comprising:
Vertical computing unit, for when the Tandem devices are disposed vertically, by the ordinate of the first pin coordinate with
The ordinate of the 2nd pin coordinate subtracts each other, and obtains the stitch distance of the Tandem devices；
Level calculation unit, for when the Tandem devices are horizontal positioned, by the abscissa of the first pin coordinate with
The abscissa of the 2nd pin coordinate subtracts each other, and obtains the stitch distance of the Tandem devices；
First distance judging unit, for judging the stitch distance of the Tandem devices whether in first preset range
It is interior.
Optionally, the differential series device coordinate judgment module, comprising:
Vertical computing unit, for when the differential series device is disposed vertically, by the first difference pin coordinate
The ordinate of ordinate and the second difference pin coordinate subtracts each other, and obtains the stitch distance of the differential series device；
Level calculation unit is used for when the differential series device is horizontal positioned, by the first difference pin coordinate
The abscissa of abscissa and the second difference pin coordinate subtracts each other, and obtains the stitch distance of the differential series device；
Whether second distance judging unit, the stitch distance for judging the differential series device are default described second
In range.
The application also provides a kind of PCB check device, comprising:
Memory, for storing computer program；
Processor, the step of inspection method as described above is realized when for executing the computer program.
The application also provides a kind of computer readable storage medium, and calculating is stored on the computer readable storage medium
The step of machine program, the computer program realizes inspection method as described above when being executed by processor.
The inspection method of Tandem devices in a kind of PCB provided herein, comprising: true according to the inspection information received
Fixed signal wire to be checked；Judge the signal wire to be checked with the presence or absence of Tandem devices；If so, obtaining the Tandem devices
First pin coordinate and the 2nd pin coordinate；Judge the distance between the first pin coordinate and described 2nd pin coordinate whether
In first preset range；If so, obtaining the differential series of corresponding position in differential lines corresponding with the signal wire to be checked
First difference pin coordinate of device and the second difference pin coordinate；Judge the first difference pin coordinate and second difference
Whether the distance between pin coordinate is in the second preset range；If so, according to the first pin coordinate, the 2nd pin
Coordinate, the first difference pin coordinate and the second difference pin coordinate, judge the Tandem devices and the difference string
Whether symmetrical join device；When the Tandem devices and the differential series device are symmetrical, then the Tandem devices inspection is determined
Pass through.
Inspections information by receiving user's input, which determines, needs the signal wire to be checked that checks, further judgement be somebody's turn to do to
Check whether the stitch distance of the Tandem devices on signal wire meets the corresponding difference in required distance and corresponding differential lines
Whether point Tandem devices stitch distance meets required distance, according to Tandem devices and differential series device after meeting the requirements
Symmetrically whether stitch coordinate judges whether symmetrically, that is, judge between stitch coordinate, to realize and carry out automatically Tandem devices
It checks, avoids and manually Tandem devices are operated, reduce the number of missing inspection, improve the accurate of Tandem devices inspection
Rate, while improving the efficiency checked during series connection.
The application also provides inspection method, inspection system, PCB check device and the calculating of Tandem devices in a kind of PCB
Machine readable storage medium storing program for executing has the above beneficial effect, and this will not be repeated here.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of application for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is the flow chart of the inspection method of Tandem devices in a kind of PCB provided by the embodiment of the present application；
Fig. 2 is the structural schematic diagram of the inspection system of Tandem devices in a kind of PCB provided by the embodiment of the present application.
Specific embodiment
The core of the application be to provide the inspection method, inspection system, PCB check device of Tandem devices in a kind of PCB with
And computer readable storage medium, by being carried out after inspection to Tandem devices automatically, then by the Tandem devices and difference
Tandem devices carry out symmetry judgement, realize and automaticly inspect to Tandem devices, improve inspection efficiency.
To keep the purposes, technical schemes and advantages of the embodiment of the present application clearer, below in conjunction with the embodiment of the present application
In attached drawing, the technical scheme in the embodiment of the application is clearly and completely described, it is clear that described embodiment is
Some embodiments of the present application, instead of all the embodiments.Based on the embodiment in the application, those of ordinary skill in the art
Every other embodiment obtained without making creative work, shall fall in the protection scope of this application.
In the prior art, it is typically manually checked, is symmetrically put with the coupled capacitor excluded in pcb board manually
Problem.But manually check that the inspection of not only pcb board is inefficient, it is also easy to the case where missing inspection occur, influences board
Basic function leads to the normal use of board.
Therefore, the embodiment of the present application provides a kind of inspection method of Tandem devices in PCB, passes through the inspection for receiving user's input
It looks into information and determines the signal wire to be checked for needing to check, further judge the stitch of the Tandem devices on the signal wire to be checked
Distance whether meet in required distance and corresponding differential lines corresponding differential series device stitch distance whether meet away from
From requiring, judged whether symmetrically after meeting the requirements according to the stitch coordinate of Tandem devices and differential series device, that is,
Whether symmetrical judge between stitch coordinate, realize and Tandem devices are automaticly inspected, avoid manually to Tandem devices into
Row operation, reduces the number of missing inspection, improves the accuracy rate of Tandem devices inspection, while improving the effect checked during series connection
Rate.
Referring to FIG. 1, process of the Fig. 1 for the inspection method of Tandem devices in a kind of PCB provided by the embodiment of the present application
Figure.
In the present embodiment, this method may include:
S101 determines signal wire to be checked according to the inspection information received；
This step be intended to from received user input inspection information in determine signal wire to be checked, specifically be exactly from
The id information of signal wire to be checked is found out in the inspection information of user's input, so as to pass through in the design data of PCB
Id information determines the data of signal wire to be checked.
Specifically, there are different types for the inspection information that receives of this step, it can be according to different types of inspection information
Determine signal wire to be checked.For example, signal wire to be checked may be exactly that the keyword indicates more when checking that information is keyword
A signal wire, when checking information is signal wire ID, signal wire to be checked is exactly the signal wire of signal wire ID meaning.As it can be seen that
It determines that the mode of signal wire to be checked is not unique according to inspection information, is not specifically limited herein.
S102 judges signal wire to be checked with the presence or absence of Tandem devices；If so, executing S103；
This step is intended to determine on the signal wire to be checked with the presence or absence of Tandem devices.Due to being possible to signal in the pcb
There is no Tandem devices connection on line, in order to avoid invalid signal wire checking process, improves and check efficiency, therefore, in this step
It needs to judge on signal wire to be checked with the presence or absence of Tandem devices.
Specifically, in the present embodiment Tandem devices can be whether there is according to the determined property of the signal wire to be checked.Example
Such as, if the attribute of the signal wire to be checked is Xnet, mean that there are other yuan between the origin-to-destination of signal wire
Part, that is, other devices of having connected, there are Tandem devices；If the attribute of the signal wire to be checked is Net, mean that
There is no any element between the origin-to-destination of the signal wire, i.e., Tandem devices are not present on the signal wire.
Optionally, this step may include:
Judge whether signal wire to be checked is Xnet according to the id information of signal wire to be checked.
The efficiency of signal wire judgement to be checked can be improved by this optinal plan.Wherein, Xnet refers to a bars
Other elements are connected in line, Net refers in a signal line without connecting other elements.
S103 obtains the first pin coordinate and the 2nd pin coordinate of Tandem devices；
On the basis of S102, when there are two pin (needles for when Tandem devices, obtaining the device for the signal wire to be checked
Foot) coordinate, that is, the coordinate of two stitch either pad.
Whether S104 judges the distance between the first pin coordinate and the 2nd pin coordinate in the first preset range；If so,
Then execute S105；
On the basis of S103, this step is intended to judge whether the distance between two pin of the Tandem devices conform to
It asks, that is, judges whether in the first preset range.
Whether the distance between Tandem devices stitch, which conforms to, mainly is being judged to the judgement of Tandem devices in pcb board card
It asks, and judges whether Tandem devices are symmetrical with differential series device.Therefore, the pin of the Tandem devices is first judged in this step
The distance between whether meet the requirements.
Optionally, this step may include:
Step 1, when Tandem devices are disposed vertically, by the ordinate of the ordinate of the first pin coordinate and the 2nd pin coordinate
Subtract each other, obtains the stitch distance of Tandem devices；
Step 2, when Tandem devices are horizontally arranged, by the abscissa of the abscissa of the first pin coordinate and the 2nd pin coordinate
Subtract each other, obtains the stitch distance of Tandem devices；
Step 3, judge the stitch distance of Tandem devices whether in the first preset range.
This optinal plan describes a kind of mode of judgement for carrying out stitch distance, and stitch judgement is divided into vertically and horizontally
Two kinds, the stitch Distance Judgment method of reply different situations is realized, the order of accuarcy of judgement is improved.
S105 obtains the first difference of the differential series device of corresponding position in differential lines corresponding with signal wire to be checked
Pin coordinate and the second difference pin coordinate；
On the basis of S104, this step is intended to obtain corresponding after the pin distance of Tandem devices checks and passes through
The pin coordinate of differential device, that is, obtain the first difference pin coordinate and the second difference pin coordinate of differential series device.
Whether S106 judges the distance between the first difference pin coordinate and the second difference pin coordinate in the second preset range
It is interior；If so, executing S107；
On the basis of step S105, this step is intended to judge whether the distance between pin of differential device meets the requirements,
Namely judge the distance between the first difference pin coordinate and the second difference pin coordinate whether in the second preset range.
Optionally, this step may include:
Step 1, when difference Tandem devices are disposed vertically, by the ordinate and the second difference pin of the first difference pin coordinate
The ordinate of coordinate subtracts each other, and obtains the stitch distance of differential series device；
Step 2, when difference Tandem devices are horizontal positioned, by the abscissa and the second difference pin of the first difference pin coordinate
The abscissa of coordinate subtracts each other, and obtains the stitch distance of differential series device；
Step 3, judge the stitch distance of differential series device whether in the second preset range.
This optinal plan describes a kind of mode of judgement for carrying out stitch distance, and stitch judgement is divided into vertically and horizontally
Two kinds, the stitch Distance Judgment method of reply different situations is realized, the order of accuarcy of judgement is improved.
S107, according to the first pin coordinate, the 2nd pin coordinate, the first difference pin coordinate and the second difference pin coordinate,
Judge whether Tandem devices are symmetrical with differential series device；If so, executing S108；
On the basis of S106, this step is intended to when the pin distance of difference Tandem devices meets the requirements, according to acquisition
Whether four pin coordinates judge symmetrical between Tandem devices and differential series device.
S108 then determines that Tandem devices inspection passes through when Tandem devices and differential series device are symmetrical.
On the basis of S107, when Tandem devices and differential series device are symmetrical, determine on the signal wire to be checked
Tandem devices inspection passes through.
To sum up, the present embodiment determines the signal wire to be checked for needing to check by receiving the inspection information of user's input, then
Further judge whether the stitch distance of the Tandem devices on the signal wire to be checked meets required distance and corresponding difference
Whether the corresponding differential series device stitch distance on line meets required distance, after meeting the requirements according to Tandem devices and
Symmetrically whether the stitch coordinate of differential series device judges whether symmetrically, that is, judge between stitch coordinate, to realize to string
Connection device is automaticly inspected, and is avoided and is manually operated to Tandem devices, reduces the number of missing inspection, improve serializer
The accuracy rate of part inspection, while improving the efficiency checked during series connection.
On the basis of a upper embodiment, the present embodiment provides a kind of tools for implementing above method.The tool passes through
Automatically Tandem devices are carried out after inspection, then the Tandem devices and the Tandem devices of difference is subjected to symmetry judgement, it is real
Show and Tandem devices have been automaticly inspected, has improved inspection efficiency.
In the present embodiment, which may include:
1, selection signal line unit.
1) selection signal line button is clicked, according to user's demands on examination, the HW High Way to be checked is inputted, can input
Keyword is quickly filtered, and the HW High Way filtered out is chosen to carry out subsequent examination.Complete signal can also be inputted
Line name carries out subsequent examination.
2) button is selected entirely, and program can choose all high-speed lines (being named as * _ DN, * DP in signal wire name) to be checked.
2, rules unit inputs the requirement of D11/D22&D12 for obtaining user, regular as checking.Wherein, D11 with
D22 is the stitch distance of Tandem devices Yu differential series device respectively, D12 be between Tandem devices and differential series device away from
From.
3, inspection unit, for the HW High Way according to selection, its id information of Program extraction, it is determined whether it is Xnet,
If it is Net, illustrates that centre without Tandem devices, is directly ignored, carry out next signal ray examination；If it is Xnet, mention
The Tandem devices information (ID, coordinate, capacitor or resistance etc.) for taking it to connect.
According to the coordinate (1pin (x1, y1), 2pin (x2, y2)) of two pin of this part, if x1=x2&y1！=y2,
Then illustrate that this part is vertically to put, calculates the space D 11=y1-y2 of two pin of this part；If y1=y2&x1！=x2,
Then illustrate that this part is that level is put, calculates the space D 11=x1-x2 of two pin of this part.If D11 is not inputted in user
It in the range of value, is then recorded in database, without checking as follows.If D11 in the range of user input values, meets
It is required that continuing with inspection.
Further, its another the root network id information and corresponding parts information for corresponding to differential lines is found, it is same to determine
It is vertical or horizontal puts and the space D 22 of two pin.If D22 is recorded not in the range of user input values
Into database, without checking as follows.If D22 in the range of user input values, is met the requirements, inspection is continued with
It looks into.
Compare the coordinate for the Tandem devices that this differential lines both threads is connected.If in the case where vertically putting, a) two
The y value of the 1pin of part is equal, and the y value of 2pin is also equal, then illustrates that two parts are symmetrically put, while calculating two parts
Space D 12, if D12 is recorded in database not in the range of user input values；If D12 is in user input values
In the range of, then continue next inspection；If b) the y value of 1pin differs, the y value of 2pin is also unequal, then illustrates it is not pair
Title is put, and is recorded in database.
If in the case that level is put, a) the x value of the 1pin of two two pieces is equal, the x value of 2pin is also equal, then illustrates
Two parts are symmetrically put, at the same calculate two parts space D 12, if D12 not in the range of user input values,
It is recorded in database；If D12 in the range of user input values, continues next inspection；If b) the x value of 1pin is not
Equal, the x value of 2pin is also unequal, then illustrates it is not symmetrically to put, be recorded in database.
4, unit, the signal wire information for that will be unsatisfactory for requiring are shown in result unit as the result is shown.
5, audit report generation unit, for inspection result storage into text document, to be convenient for subsequent access.
The embodiment of the present application provides a kind of inspection method of Tandem devices in PCB, can pass through and receive user's input
It checks that information determines the signal wire to be checked for needing to check, further judges the needle of the Tandem devices on the signal wire to be checked
Pin pitch from whether meet in required distance and corresponding differential lines corresponding differential series device stitch distance whether meet
Required distance judges whether symmetrically, also after meeting the requirements according to the stitch coordinate of Tandem devices and differential series device
It is to judge between stitch coordinate whether symmetrically, to realize and automaticly inspect Tandem devices, avoid manually to Tandem devices
It is operated, reduces the number of missing inspection, improve the accuracy rate of Tandem devices inspection, while being checked during improving series connection
Efficiency.
The inspection system of Tandem devices in a kind of PCB provided by the embodiments of the present application is introduced below, is described below
A kind of PCB in Tandem devices inspection system and the inspection methods of Tandem devices in a kind of above-described PCB can be mutually right
It should refer to.
Referring to FIG. 2, structure of the Fig. 2 for the inspection system of Tandem devices in a kind of PCB provided by the embodiment of the present application
Schematic diagram.
In the present embodiment, which may include:
Data obtaining module 100 is checked, for determining signal wire to be checked according to the inspection information received；
Tandem devices judgment module 200, for judging signal wire to be checked with the presence or absence of Tandem devices；
Tandem devices coordinate obtaining module 300, for obtaining Tandem devices when signal wire to be checked is there are when Tandem devices
The first pin coordinate and the 2nd pin coordinate；
Tandem devices coordinate judgment module 400, for judging that the distance between the first pin coordinate and the 2nd pin coordinate be
It is no in the first preset range；
Differential series device coordinate obtains module 500, for when the distance between the first pin coordinate and the 2nd pin coordinate
When in the first preset range, the of the differential series device of corresponding position in corresponding with signal wire to be checked differential lines is obtained
One difference pin coordinate and the second difference pin coordinate；
Differential series device coordinate judgment module 600, for judging the first difference pin coordinate and the second difference pin coordinate
The distance between whether in the second preset range；
The symmetrical judgment module 700 of Tandem devices, between the first difference pin coordinate and the second difference pin coordinate
It is poor according to the first pin coordinate, the 2nd pin coordinate, the first difference pin coordinate and second when distance is in the second preset range
Divide pin coordinate, judges whether Tandem devices are symmetrical with differential series device；
It checks through module 800, for when Tandem devices and differential series device are symmetrical, then determining Tandem devices inspection
Pass through.
Optionally, the Tandem devices judgment module 200 specifically can be used for being judged according to the id information of signal wire to be checked
Whether signal wire to be checked is Xnet.
Optionally, the Tandem devices coordinate judgment module 400 may include:
Vertical computing unit, for when Tandem devices are disposed vertically, by the ordinate and the 2nd pin of the first pin coordinate
The ordinate of coordinate subtracts each other, and obtains the stitch distance of Tandem devices；
Level calculation unit, for when Tandem devices are horizontally arranged, by the abscissa and the 2nd pin of the first pin coordinate
The abscissa of coordinate subtracts each other, and obtains the stitch distance of Tandem devices；
First distance judging unit, for judging the stitch distance of Tandem devices whether in the first preset range.
Optionally, the differential series device coordinate judgment module 600 may include:
Vertical computing unit, for when difference Tandem devices are disposed vertically, by the ordinate of the first difference pin coordinate with
The ordinate of second difference pin coordinate subtracts each other, and obtains the stitch distance of differential series device；
Level calculation unit, for when difference Tandem devices are horizontal positioned, by the abscissa of the first difference pin coordinate with
The abscissa of second difference pin coordinate subtracts each other, and obtains the stitch distance of differential series device；
Second distance judging unit, for judging the stitch distance of differential series device whether in the second preset range.
The embodiment of the present application also provides a kind of PCB check device, comprising:
Memory, for storing computer program；
Processor, the step of inspection method as described above in Example is realized when for executing the computer program.
The embodiment of the present application also provides a kind of computer readable storage medium, stores on the computer readable storage medium
There is computer program, the computer program realizes the step of inspection method as described above in Example when being executed by processor
Suddenly.
The computer readable storage medium may include: USB flash disk, mobile hard disk, read-only memory (Read-Only
Memory, ROM), random access memory (Random Access Memory, RAM), magnetic or disk etc. is various to deposit
Store up the medium of program code.
Each embodiment is described in a progressive manner in specification, the highlights of each of the examples are with other realities
The difference of example is applied, the same or similar parts in each embodiment may refer to each other.For device disclosed in embodiment
Speech, since it is corresponded to the methods disclosed in the examples, so being described relatively simple, related place is referring to method part illustration
?.
Professional further appreciates that, unit described in conjunction with the examples disclosed in the embodiments of the present disclosure
And algorithm steps, can be realized with electronic hardware, computer software, or a combination of the two, in order to clearly demonstrate hardware and
The interchangeability of software generally describes each exemplary composition and step according to function in the above description.These
Function is implemented in hardware or software actually, the specific application and design constraint depending on technical solution.Profession
Technical staff can use different methods to achieve the described function each specific application, but this realization is not answered
Think beyond scope of the present application.
The step of method described in conjunction with the examples disclosed in this document or algorithm, can directly be held with hardware, processor
The combination of capable software module or the two is implemented.Software module can be placed in random access memory (RAM), memory, read-only deposit
Reservoir (ROM), electrically programmable ROM, electrically erasable ROM, register, hard disk, moveable magnetic disc, CD-ROM or technology
In any other form of storage medium well known in field.
Above to the inspection method of Tandem devices, inspection system, PCB check device in a kind of PCB provided herein
And computer readable storage medium is described in detail.Used herein principle and implementation of the specific case to the application
Mode is expounded, the description of the example is only used to help understand the method for the present application and its core ideas.It should
It points out, it for those skilled in the art, can also be to this Shen under the premise of not departing from the application principle
Please some improvement and modification can also be carried out, these improvement and modification are also fallen into the protection scope of the claim of this application.
Claims (10)
1. the inspection method of Tandem devices in a kind of PCB characterized by comprising
Signal wire to be checked is determined according to the inspection information received；
Judge the signal wire to be checked with the presence or absence of Tandem devices；
When there are the first pin coordinates for when Tandem devices, obtaining the Tandem devices and the 2nd pin to sit for the signal wire to be checked
Mark；
Judge the distance between the first pin coordinate and described 2nd pin coordinate whether in the first preset range；
When the distance between the first pin coordinate and the 2nd pin coordinate are in first preset range, obtain with
First difference pin coordinate of the differential series device of corresponding position and second poor in the corresponding differential lines of the signal wire to be checked
Divide pin coordinate；
Judge the distance between the first difference pin coordinate and the second difference pin coordinate whether in the second preset range
It is interior；
When the distance between the first difference pin coordinate and the second difference pin coordinate are in second preset range
When, according to the first pin coordinate, the 2nd pin coordinate, the first difference pin coordinate and the second difference pin
Coordinate judges whether the Tandem devices and the differential series device are symmetrical；
When the Tandem devices and the differential series device are symmetrical, then determine that the Tandem devices inspection passes through.
2. inspection method according to claim 1, which is characterized in that judge the signal wire to be checked with the presence or absence of series connection
Device, comprising:
Judge whether the signal wire to be checked is Xnet according to the id information of the signal wire to be checked.
3. inspection method according to claim 1, which is characterized in that judge the first pin coordinate and the 2nd pin
Whether the distance between coordinate is in the first preset range, comprising:
When the Tandem devices are disposed vertically, by the vertical seat of the ordinate of the first pin coordinate and the 2nd pin coordinate
Mark subtracts each other, and obtains the stitch distance of the Tandem devices；
When the Tandem devices are horizontal positioned, by the horizontal seat of the abscissa of the first pin coordinate and the 2nd pin coordinate
Mark subtracts each other, and obtains the stitch distance of the Tandem devices；
Judge the stitch distance of the Tandem devices whether in first preset range.
4. inspection method according to claim 1, which is characterized in that judge the first difference pin coordinate and described
Whether the distance between two difference pin coordinates are in the second preset range, comprising:
When the differential series device is disposed vertically, by the ordinate of the first difference pin coordinate and second difference
The ordinate of pin coordinate subtracts each other, and obtains the stitch distance of the differential series device；
When the differential series device is horizontal positioned, by the abscissa of the first difference pin coordinate and second difference
The abscissa of pin coordinate subtracts each other, and obtains the stitch distance of the differential series device；
Judge the stitch distance of the differential series device whether in second preset range.
5. the inspection system of Tandem devices in a kind of PCB characterized by comprising
Data obtaining module is checked, for determining signal wire to be checked according to the inspection information received；
Tandem devices judgment module, for judging the signal wire to be checked with the presence or absence of Tandem devices；
Tandem devices coordinate obtaining module, for obtaining the serializer when the signal wire to be checked is there are when Tandem devices
First pin coordinate of part and the 2nd pin coordinate；
Tandem devices coordinate judgment module, for judging that the distance between the first pin coordinate and described 2nd pin coordinate be
It is no in the first preset range；
Differential series device coordinate obtains module, for when the distance between the first pin coordinate and described 2nd pin coordinate
When in first preset range, the differential series of corresponding position in differential lines corresponding with the signal wire to be checked are obtained
First difference pin coordinate of device and the second difference pin coordinate；
Differential series device coordinate judgment module, for judging the first difference pin coordinate and the second difference pin coordinate
The distance between whether in the second preset range；
The symmetrical judgment module of Tandem devices, between the first difference pin coordinate and the second difference pin coordinate
When distance is in second preset range, according to the first pin coordinate, the 2nd pin coordinate, first difference
Pin coordinate and the second difference pin coordinate judge whether the Tandem devices and the differential series device are symmetrical；
It checks through module, for when the Tandem devices and the differential series device are symmetrical, then determining the serializer
Part inspection passes through.
6. inspection system according to claim 5, which is characterized in that the Tandem devices judgment module is specifically used for root
Judge whether the signal wire to be checked is Xnet according to the id information of the signal wire to be checked.
7. inspection system according to claim 5, which is characterized in that the Tandem devices coordinate judgment module, comprising:
Vertical computing unit, for when the Tandem devices are disposed vertically, by the ordinate of the first pin coordinate with it is described
The ordinate of 2nd pin coordinate subtracts each other, and obtains the stitch distance of the Tandem devices；
Level calculation unit, for when the Tandem devices are horizontal positioned, by the abscissa of the first pin coordinate with it is described
The abscissa of 2nd pin coordinate subtracts each other, and obtains the stitch distance of the Tandem devices；
First distance judging unit, for judging the stitch distance of the Tandem devices whether in first preset range.
8. inspection system according to claim 5, which is characterized in that the differential series device coordinate judgment module, packet
It includes:
Vertical computing unit, for when the differential series device is disposed vertically, by the vertical seat of the first difference pin coordinate
It marks and subtracts each other with the ordinate of the second difference pin coordinate, obtain the stitch distance of the differential series device；
Level calculation unit is used for when the differential series device is horizontal positioned, by the horizontal seat of the first difference pin coordinate
It marks and subtracts each other with the abscissa of the second difference pin coordinate, obtain the stitch distance of the differential series device；
Second distance judging unit, for judging the stitch distance of the differential series device whether in second preset range
It is interior.
9. a kind of PCB check device characterized by comprising
Memory, for storing computer program；
Processor realizes the step such as the described in any item inspection methods of Claims 1-4 when for executing the computer program
Suddenly.
10. a kind of computer readable storage medium, which is characterized in that be stored with computer on the computer readable storage medium
Program realizes the step such as the described in any item inspection methods of Claims 1-4 when the computer program is executed by processor
Suddenly.
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