CN109705772A - A kind of high electric strength and resistance to electrochemical trace POE glue film and preparation method - Google Patents
A kind of high electric strength and resistance to electrochemical trace POE glue film and preparation method Download PDFInfo
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Abstract
The invention discloses a kind of high electric strength and resistance to electrochemical trace POE glue films, including raw material in parts by weight: 70-90 parts of ethylene-octene copolymer modified particles, 10-30 parts of functional agglomerate；The raw material of the functional agglomerate includes in parts by weight: 70-90 parts of ethylene-vinyl acetate copolymer, 10-30 parts of ethylene methyl methacrylate copolymer, 0.1-5.0 parts of photoinitiator and 0.5-3.0 parts of stabilizer；The stabilizer is benzil class stabilizer.Also disclose the preparation method of above-mentioned POE glue film.POE glue film of the invention is on the basis of keeping glue film high transparency and cementability, with high electric strength and resistance to electric trace index, applied to photovoltaic component encapsulating, photovoltaic module electrical strength and resistance to electric trace index can be effectively improved, component power during photoelectric conversion is avoided to decline to a great extent or fail, to which hot spot effect, electrical breakdown destruction or tracking failure phenomenon be greatly decreased.
Description
Technical field
The present invention relates to technical field of solar batteries more particularly to a kind of high electric strength and resistance to electrochemical trace POE glue films
And preparation method.
Background technique
As solar utilization technique continues to develop, solar energy is widely used as green energy resource, photovoltaic group
For part as the unit carrier for utilizing solar energy, a combination thereof can be huge numbers of families at large-sized photovoltaic power station or familial distribution of cases formula small plant
Electric energy is continuously provided.
But photovoltaic module is converted into the work of electric energy in absorption luminous energy during installing grid-connected rear long-time service
It is included constantly tropical deterioration, thermo-oxidative ageing, high/low temperature aging, ultraviolet ageing, foreign substance pollution by natural environment under state
Etc. test, especially photovoltaic module needs cost efficiency in a hurry at this stage, from the perspective of system, it is higher input, it is defeated
Voltage class out can reduce the loss that alternating current-direct current side line undermines step down side winding, and the system effectiveness expection in power station can
To promote 1.5%-2%.Meanwhile the power density of equipment (inverter, transformer) is promoted, volume reduces, the side such as transport, maintenance
Face workload is also reduced, and is conducive to the reduction of photovoltaic system cost, design of photovoltaic power station and photovoltaic module, inverter, confluence
The products such as case, cable it is more and more from traditional 1000V photovoltaic system improve to 1500V photovoltaic system voltage requirements design and
Manufacture, the raising of photovoltaic system voltage, it is easier to there is hot spot effect, electrical breakdown destroys, tracking failure etc. electrically destroy to
Component power is caused to decline to a great extent even entirely ineffective.
Crucial encapsulating material of the photovoltaic encapsulation glue film as photovoltaic module, be the key that influence photovoltaic module electric property because
Element.The electric properties such as the electrical strength and tracking resistance of packaging adhesive film directly affect the electric property of photovoltaic module, influence
Power holding capacity and photoelectric conversion efficiency of the photovoltaic module in long-term use process.The packaging adhesive film used on existing photovoltaic market
Electrical strength and resistance to electric trace index it is generally relatively low, photovoltaic module after leading to encapsulation during prolonged application, holds outdoors
Easily there is the electrical breakoff phenomenon of component, final component power decaying is even failed.
Summary of the invention
It is an object of the invention to propose a kind of high electric strength and resistance to electrochemical trace POE glue film and preparation method, the POE glue
Film has the characteristics that high electric strength and resistance to electrochemical trace.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of high electric strength and resistance to electrochemical trace POE glue film, including raw material in parts by weight: ethylene-octene copolymer
70-90 parts of modified particles, 10-30 parts of functional agglomerate；
The raw material of functional agglomerate includes in parts by weight: 70-90 parts of ethylene-vinyl acetate copolymer, ethylene-methyl
10-30 parts of methyl acrylate copolymer, 0.1-5.0 parts of photoinitiator and 0.5-3.0 parts of stabilizer；Stabilizer is that benzil class is steady
Determine agent.
Further, the raw material of ethylene-octene copolymer modified particles includes in parts by weight: ethylene-octene copolymerization
100 parts of object, 0.1-5.0 parts of organic peroxide crosslinking agent, 0.1-5.0 parts of crosslinking accelerator and 0.5-3 parts of tackifier.
Further, the fusing point of ethylene-octene copolymer be 50-100 DEG C, melt index 10-30g/10min, second
Octene molar content is 15-60% in alkene-octene copolymer.
Further, organic peroxide crosslinking agent is that tert-butyl hydroperoxide 2- ethylhexyl carbonic ester, peroxidating two are different
- 2,5- pairs propyl benzene, cumyl t-butyl peroxide, dibenzoyl peroxide, 2,5- dimethyl-(t-butyl peroxy) hexane
With one of bis- (t-butyl peroxy) -3,3,5- trimethyl-cyclohexanes of 1,1- or a variety of mixtures；
Crosslinking accelerator is Dipentaerythritol Pentaacrylate, dibenzoyl benzoquinone dioxime, ethylene glycol dimethacrylate
Ester, double methyl methacrylate triethylene glycol ester, three (methylacryloyl methine) propane, tetraallyloxyethane and three hydroxyls
One of trimethacrylate or a variety of mixtures；
Tackifier are vinyl three ('beta '-methoxy ethyoxyl) silane, vinyltriethoxysilane, three second of γ-aminopropyl
Oxysilane, 3- glycidyl ether oxypropyltrimethoxysilane, γ-methacryloxypropyl trimethoxy silane,
Vinyltrimethoxysilane, three (β-of 3-aminopropyl trimethoxysilanes, γ-mercaptopropyltriethoxysilane and vinyl
Methoxy ethoxy) one of silane or a variety of mixtures.
Further, the weight content of the vinyl acetate in ethylene-vinyl acetate copolymer is 10%-40%, melting means
For 5-40g/10min.
Further, the weight content of the methyl methacrylate in ethylene methyl methacrylate copolymer is 10%-
40%, melting means 0.1-10g/10min.
Further, photoinitiator is cyano -3 2-, and 3 '-diphenylacrylate -2- ethylhexyls, 2- hydroxyl -4- are just pungent
Oxygroup benzophenone and 2- hydroxyl -4- (2 '-ethyl hexyl oxygen diyl) benzophenone and bis- (1,2,2,6,6- pentamethyl -4- piperidines
Base) one of sebacic acid ester or a variety of mixtures.
Further, stabilizer is p- anisil, 4- hydroxyl benzil, 4,4 '-dihydroxy benzils, 4- dodecane
Oxygroup benzil, 11 carbon -10- alkenyloxy group benzil of 4-, 4,4 '-two (dodecyloxy) benzils and 4,4 '-two (11
Carbon -10- alkenyloxy group) one of benzil or a variety of mixtures.
A kind of preparation method of above-mentioned glue film, comprising the following steps:
(1), it prepares functional agglomerate: ethylene-vinyl acetate copolymer and ethylene methyl methacrylate copolymer is pressed
Formula ratio is uniformly mixed, and formula ratio photoinitiator is added later and is uniformly mixed, and is added stabilizer and is uniformly mixed, in processing temperature
Under conditions of 90-150 DEG C, squeezes out cooling and dicing and functional agglomerate is made；
(2), ethylene-octene copolymer modified particles are prepared: by ethylene-octene copolymer, crosslinking agent, crosslinking accelerator and
Tackifier are uniformly mixed to obtain pre-composition according to formula ratio, pre-composition are carried out reactive extrursion by extruder, extrudate is through being subcooled
But, traction, pelletizing are at ethylene-octene copolymer modified particles；
(3), the functional agglomerate of step (1) and the ethylene-octene copolymer modified particles of step (2) are mixed in proportion
It is even, it puts into casting machine, through cooling, traction, ultraviolet light irradiation precrosslink, winding, obtains high electric strength and resistance to electric trace
POE glue film.
Further, in step (1), functional agglomerate is made and is installed using opaque packaging bag, place 2 hours or more；
In step (2), extruder is the double screw extruder that draw ratio is 28-35, and extrusion temperature is at 80-150 DEG C；
POE glue film with a thickness of 0.1-0.6mm, POE glue film is crosslinked in use, and the degree of cross linking is in 60%-85%
Between.
The invention has the benefit that
POE glue film of the invention is formed by ethylene-octene copolymer modified particles and functional agglomerate, in functional agglomerate
Photoinitiator can make ethylene-vinyl acetate copolymer and ethylene methyl methacrylate under conditions of ultraviolet irradiation
Crosslinking copolymers grafting, improves the crosslinking degree of glue film entirety.Meanwhile heat of benzil class stabilizer when not only can guarantee reaction
Processing stability, and this kind of stabilizer specifically has low ionization potential energy effectively to provide glue film to reduce the energy of energetic ion
Electrical strength and tracking resistance energy.
The present invention inhibits electronics directional migration by selection special stabilizers trapped electron, while passing through online ultraviolet spoke
According to cross-linked graft, glue film entirety crosslinking degree is improved, electronic conductance is reduced, improves glue film electrical strength and tracking resistance
Energy.POE glue film of the invention has high electric strength and resistance to electric trace on the basis of keeping glue film high transparency and cementability
Index is applied to photovoltaic component encapsulating, can effectively improve photovoltaic module electrical strength and resistance to electric trace index, component is avoided to exist
Power declines to a great extent or fails during photoelectric conversion, so that hot spot effect be greatly decreased, electrical breakdown destruction or tracking failure are existing
As.
Specific embodiment
Technical solution of the present invention is further illustrated below with reference to attached specific embodiment.
A kind of high electric strength and resistance to electrochemical trace POE glue film, including raw material in parts by weight: ethylene-octene copolymer
70-90 parts of modified particles, 10-30 parts of functional agglomerate；
The raw material of functional agglomerate includes in parts by weight: 70-90 parts of ethylene-vinyl acetate copolymer, ethylene-methyl
10-30 parts of methyl acrylate copolymer, 0.1-5.0 parts of photoinitiator and 0.5-3.0 parts of stabilizer；Stabilizer is that benzil class is steady
Determine agent.
POE glue film of the invention is formed by ethylene-octene copolymer modified particles and functional agglomerate, in functional agglomerate
Photoinitiator can make ethylene-vinyl acetate copolymer and ethylene methyl methacrylate under conditions of ultraviolet irradiation
Crosslinking copolymers grafting, improves the crosslinking degree of glue film entirety.Meanwhile heat of benzil class stabilizer when not only can guarantee reaction
Processing stability, and this kind of stabilizer specifically has low ionization potential energy effectively to provide glue film to reduce the energy of energetic ion
Electrical strength and tracking resistance energy.
Light transmittance and polarity that ethylene-vinyl acetate copolymer increases glue film are added in functional agglomerate.Functional agglomerate
In ethylene methyl methacrylate copolymer can improve the cohesive strength of glue film, further increase cohesive force.
The major reason of C-H bond high molecular material electricity trace is that the synergy of electric discharge induction ultraviolet light and heat causes absolutely
Edge material surface forms layer of charcoal, finally destroys insulating materials, therefore inhibits electric discharge, the erosion damage for reducing material, resistance
Hinder the means such as the formation of layer of charcoal, the structure design for improving insulated product that the resistance to electric trace ability of insulating materials all can be improved.This hair
It is bright by selecting special stabilizers trapped electron, inhibit electronics directional migration, while being grafted by online photocrosslinking, mentioned
Height reduces electronic conductance, improves glue film electrical strength and tracking resistance energy to finally improve glue film entirety crosslinking degree.
In addition, because the light transmittance and cohesive force of POE glue film are to influence photovoltaic module power and long-term outdoor service life
Key performance, this patent also emphasis solves and influences on POE glue film light transmittance and bonding force because of addition macromolecular stabilizer agent
Problem, by adding the poles such as ethylene-vinyl acetate copolymer (EVA) and ethylene methyl methacrylate copolymer (EMMA)
Property resin, and maintain glue film high transparency and cohesive force by way of photoinitiator online photocrosslinking grafting,
Ensure the comprehensive performance of glue film.
POE glue film of the invention has high electric strength and resistance to keeping glue film high transparency and on the basis of cementability
Electric trace index is applied to photovoltaic component encapsulating, can effectively improve photovoltaic module electrical strength and resistance to electric trace index, avoid
Component power during photoelectric conversion declines to a great extent or fails, so that hot spot effect be greatly decreased, electrical breakdown destroys or electric trace
Breakoff phenomenon.
Further, the raw material of ethylene-octene copolymer modified particles includes in parts by weight: ethylene-octene copolymerization
100 parts of object, 0.1-5.0 parts of organic peroxide crosslinking agent, 0.1-5.0 parts of crosslinking accelerator and 0.5-3 parts of tackifier.
Ethylene-octene copolymer and other materials have preferable compatibility.Organic peroxide crosslinking agent can ensure that POE glue
Film crosslinking ability, crosslinking accelerator can be further improved POE glue film grafting ability or crosslink density.Tackifier can be improved POE
The cohesive force of glue film.
Further, the fusing point of ethylene-octene copolymer is 50-100 DEG C, melt index 10-30g/10min, ethylene-
Octene molar content is 15-60% in octene copolymer.
By limiting the fusing point and melt index of ethylene-octene copolymer, realize to ethylene-octene copolymer molecular weight and
Performance so that being more advantageous to glue film machine-shaping in glue film preparation process, and makes ethylene-octene copolymer and other raw materials
There is better compatibility.By the restriction to octene content in ethylene-octene copolymer, guarantee octene content in range appropriate
It is interior, improve grafting density and crosslink density when reaction.
Organic peroxide crosslinking agent is tert-butyl hydroperoxide 2- ethylhexyl carbonic ester, cumyl peroxide, tertiary fourth
Base dicumyl peroxide, dibenzoyl peroxide, -2,5- pairs-(t-butyl peroxy) hexane of 2,5- dimethyl and 1,1- are bis-
One of (t-butyl peroxy) -3,3,5- trimethyl-cyclohexane or a variety of mixtures.Above-mentioned organic peroxide is at this
It can be used as crosslinking agent use in the POE glue film formula of invention, can ensure that the crosslinking ability of POE glue film.By improving POE
The crosslinking ability of glue film, and then improve POE glue film cohesive strength, light transmittance and insulation degree.
Crosslinking accelerator is Dipentaerythritol Pentaacrylate, dibenzoyl benzoquinone dioxime, ethylene glycol dimethacrylate
Ester, double methyl methacrylate triethylene glycol ester, three (methylacryloyl methine) propane, tetraallyloxyethane and three hydroxyls
One of trimethacrylate or a variety of mixtures.Above-mentioned organic compound is in POE glue of the invention
It can be used as crosslinking accelerator use in film formulation, grafting ability can be improved in the preparation process of glue film or crosslinking is close
Degree.
Tackifier are vinyl three ('beta '-methoxy ethyoxyl) silane, vinyltriethoxysilane, three second of γ-aminopropyl
Oxysilane, 3- glycidyl ether oxypropyltrimethoxysilane, γ-methacryloxypropyl trimethoxy silane,
Vinyltrimethoxysilane, three (β-of 3-aminopropyl trimethoxysilanes, γ-mercaptopropyltriethoxysilane and vinyl
Methoxy ethoxy) one of silane or a variety of mixtures.Above-mentioned several silane coupling agents are in POE glue film of the invention
It could act as tackifier use in formula.
Further, the weight content of the vinyl acetate in ethylene-vinyl acetate copolymer is 10%-40%, melting means
For 5-40g/10min.Preferably, the weight content of the vinyl acetate in ethylene-vinyl acetate copolymer is 25%-32%,
Melting means is 15-30g/10min.Vinyl acetate content restriction effect is the light transmittance so that ethylene-vinyl acetate copolymer
And polarity improves, melting means range restriction effect is easily processed into type, addition ethylene-vinyl acetate copolymer increase glue film
Light transmittance and polarity, and then improve glue film high transparency and cohesive force, it is ensured that the comprehensive performance of glue film.
Further, the weight content of the methyl methacrylate in ethylene methyl methacrylate copolymer is 10%-
40%, melting means 0.1-10g/10min.Preferably, the weight content of methyl methacrylate is 15%-25%, and melting means is
0.1-7g/10min.By limiting the content of the methyl methacrylate in ethylene methyl methacrylate copolymer, glue is improved
Film is cast processing heat stability；Melting means defines conducive to cohesive strength raising.Ethylene-methyl methacrylate is added in glue film formula
Methyl terpolymer improves the cohesive strength of glue film, further increases cohesive force.
Further, photoinitiator is cyano -3 2-, and 3 '-diphenylacrylate -2- ethylhexyls, 2- hydroxyl -4- are just pungent
Oxygroup benzophenone and 2- hydroxyl -4- (2 '-ethyl hexyl oxygen diyl) benzophenone and bis- (1,2,2,6,6- pentamethyl -4- piperidines
Base) one of sebacic acid ester or a variety of mixtures.Above-mentioned photoinitiator has high efficiency of initiation, it can be achieved that prepared by glue film
Ultraviolet irradiation cross-linked graft in the process improves glue film crosslinking degree.
Further, stabilizer is p- anisil, 4- hydroxyl benzil, 4,4 '-dihydroxy benzils, 4- dodecane
Oxygroup benzil, 11 carbon -10- alkenyloxy group benzil of 4-, 4,4 '-two (dodecyloxy) benzils and 4,4 '-two (11
Carbon -10- alkenyloxy group) one of benzil or a variety of mixtures.
Above-mentioned organic compound is benzil class stabilizer, all has low ionization potential energy, can trapped electron, inhibit
Electronics directional migration can reduce the energy of energetic ion and effectively provide glue film electrical strength and tracking resistance energy.
A kind of preparation method of above-mentioned glue film, comprising the following steps:
(1), it prepares functional agglomerate: ethylene-vinyl acetate copolymer and ethylene methyl methacrylate copolymer is pressed
Formula ratio is uniformly mixed, and formula ratio photoinitiator is added later and is uniformly mixed, and is added stabilizer and is uniformly mixed, in processing temperature
Under conditions of 90-150 DEG C, squeezes out cooling and dicing and functional agglomerate is made；
(2), ethylene-octene copolymer modified particles are prepared: by ethylene-octene copolymer, crosslinking agent, crosslinking accelerator and
Tackifier are uniformly mixed to obtain pre-composition according to formula ratio, pre-composition are carried out reactive extrursion by extruder, extrudate is through being subcooled
But, traction, pelletizing are at ethylene-octene copolymer modified particles；
(3), the functional agglomerate of step (1) and the ethylene-octene copolymer modified particles of step (2) are mixed in proportion
It is even, it puts into casting machine, through cooling, traction, ultraviolet light irradiation precrosslink, winding, obtains high electric strength and resistance to electric trace
POE glue film.
It is equal in ethylene-vinyl acetate copolymer and ethylene methyl methacrylate copolymer mixing in step (1)
Photoinitiator is added after even, is conducive to photoinitiator and comes into full contact with resin surface, and stabilizer is added later and is conducive to surface suction
It is attached to keep mixing uniform.Processing temperature is set as 90-150 DEG C, can ensure that suitable mobility, is conducive to squeeze out processing and energy
Auxiliary agent feed degradation is avoided to fail.
Further, in step (1), functional agglomerate is made and is installed using opaque packaging bag, place 2 hours or more.
After functional agglomerate is placed 2 hours, be conducive to photoinitiator it is fully penetrated enter mixture, and be absorbed, functional agglomerate had
There is good functionality.
In step (2), extruder is the double screw extruder that draw ratio is 28-35, and extrusion temperature is at 80-150 DEG C.It will
The processing temperature of ethylene-octene copolymer modified particles is set as between 80-150 DEG C, has both ensured that auxiliary agent and raw material are grafted micro- friendship
Connection reaction, and avoid excessively crosslinking that from can not squeezing out processing.
POE glue film with a thickness of 0.1-0.6mm, in actual production, the thickness of POE glue film can be adjusted as needed
Section.POE glue film is full cross-linked during encapsulated photovoltaic module, and the degree of cross linking is between 60%-85%.High-crosslinking-degree is conducive to
Improve POE glue film cohesive strength, light transmittance and insulation degree.
The present invention is further explained by the following examples.
Embodiment 1
The raw material of the formula of the POE glue film of the present embodiment in parts by weight is as shown in the table.
The preparation method of above-mentioned glue film, comprising the following steps:
(1), it prepares functional agglomerate: ethylene-vinyl acetate copolymer and ethylene methyl methacrylate copolymer is pressed
Formula ratio is uniformly mixed, and formula ratio photoinitiator is added later and is uniformly mixed, and is added stabilizer and is uniformly mixed, in processing temperature
It under conditions of 90-150 DEG C, squeezes out cooling and dicing and functional agglomerate is made, functional agglomerate is made and is installed using opaque packaging bag,
Place 2 hours or more；
(2), ethylene-octene copolymer modified particles are prepared: by ethylene-octene copolymer, crosslinking agent, crosslinking accelerator and
Tackifier are uniformly mixed to obtain pre-composition according to formula ratio, and pre-composition is carried out by the double screw extruder that draw ratio is 28-35
Reactive extrursion, extrusion temperature is at 80-150 DEG C, and extrudate is through supercooling, traction, pelletizing at ethylene-octene copolymer modified
Grain；
(3), the functional agglomerate of step (1) and the ethylene-octene copolymer modified particles of step (2) are mixed in proportion
It is even, it puts into casting machine, through cooling, traction, ultraviolet light irradiation precrosslink, winding, obtains high electric strength and resistance to electric trace
POE glue film.
POE glue film preparation technology parameter is as shown in the table.
| Step (1) | Processing temperature | 100℃ |
| Step (2) | Extrusion temperature | 100℃ |
| Step (3) | The thickness of POE glue film | 0.5mm |
Embodiment 2
The POE glue film of the present embodiment and preparation method thereof is substantially the same manner as Example 1, the difference is that formula and preparation
Technological parameter, shown in table specific as follows.
The raw material of the formula of the POE glue film of the present embodiment in parts by weight is as shown in the table.
POE glue film preparation technology parameter is as shown in the table.
| Step (1) | Processing temperature | 100℃ |
| Step (2) | Extrusion temperature | 110℃ |
| Step (3) | The thickness of POE glue film | 0.3mm |
Embodiment 3
The POE glue film of the present embodiment and preparation method thereof is substantially the same manner as Example 1, the difference is that formula and preparation
Technological parameter, shown in table specific as follows.
The raw material of the formula of the POE glue film of the present embodiment in parts by weight is as shown in the table.
POE glue film preparation technology parameter is as shown in the table.
| Step (1) | Processing temperature | 100℃ |
| Step (2) | Extrusion temperature | 110℃ |
| Step (3) | The thickness of POE glue film | 0.5mm |
Embodiment 4
The POE glue film of the present embodiment and preparation method thereof is substantially the same manner as Example 1, the difference is that formula and preparation
Technological parameter, shown in table specific as follows.
The raw material of the formula of the POE glue film of the present embodiment in parts by weight is as shown in the table.
POE glue film preparation technology parameter is as shown in the table.
Embodiment 5
The POE glue film of the present embodiment and preparation method thereof is substantially the same manner as Example 1, the difference is that formula and preparation
Technological parameter, shown in table specific as follows.
The raw material of the formula of the POE glue film of the present embodiment in parts by weight is as shown in the table.
POE glue film preparation technology parameter is as shown in the table.
| Step (1) | Processing temperature | 100℃ |
| Step (2) | Extrusion temperature | 100℃ |
| Step (3) | The thickness of POE glue film | 0.4mm |
Embodiment 6
The POE glue film of the present embodiment and preparation method thereof is substantially the same manner as Example 1, the difference is that formula and preparation
Technological parameter, shown in table specific as follows.
The raw material of the formula of the POE glue film of the present embodiment in parts by weight is as shown in the table.
POE glue film preparation technology parameter is as shown in the table.
| Step (1) | Processing temperature | 90℃ |
| Step (2) | Extrusion temperature | 150℃ |
| Step (3) | The thickness of POE glue film | 0.1mm |
Embodiment 7
The POE glue film of the present embodiment and preparation method thereof is substantially the same manner as Example 1, the difference is that formula and preparation
Technological parameter, shown in table specific as follows.
The raw material of the formula of the POE glue film of the present embodiment in parts by weight is as shown in the table.
POE glue film preparation technology parameter is as shown in the table.
| Step (1) | Processing temperature | 150℃ |
| Step (2) | Extrusion temperature | 80℃ |
| Step (3) | The thickness of POE glue film | 0.6mm |
Test the POE glue film of embodiment 1-7, test machine scheme is as follows: sample preparation vacuumizes at 150 DEG C
Sample is made in 5min, moulding pressure 1bar, dwell time 12min.Sample is tested as follows:
1. with ultra-clear glasses peel strength
" 180 ° of peeling strength test method flexible materials of adhesive are to rigidity by GB/T2790 according to national standards for test method
Material ".
2. light transmittance is tested
Test method GB2410-80 " transparent plastic light transmittance and haze test method " according to national standards.
3. electrical strength
Test method is according to photovoltaic industry association criterion 5.5.6 electrical strength test side, T/CPLA 0006-2017 China
Method.
4. resistance to electricity trace index
Test method is according to the resistance to electric trace index tests of T/CPLA 0006-2017 China photovoltaic industry association criterion 5.5.7
Method.
5. the degree of cross linking is tested
Test method is according to T/CPLA 0006-2017 China photovoltaic industry association criterion 5.5.2 degree of cross linking test method.
The POE glue film obtained through the foregoing embodiment, is tested, test result is as follows according to the above method:
Illustrate from above-described embodiment test result: the present invention and ultra-clear glasses have good adhesive effect, with higher
Light transmittance and the degree of cross linking, excellent electrical strength and resistance to electric trace index performance.
The technical principle of the invention is described above in combination with a specific embodiment.These descriptions are intended merely to explain of the invention
Principle, and shall not be construed in any way as a limitation of the scope of protection of the invention.Based on the explanation herein, the technology of this field
Personnel can associate with other specific embodiments of the invention without creative labor, these modes are fallen within
Within protection scope of the present invention.
Claims (10)
1. a kind of high electric strength and resistance to electrochemical trace POE glue film, which is characterized in that including raw material in parts by weight: ethylene-is pungent
70-90 parts of alkene copolymer modified particles, 10-30 parts of functional agglomerate；
The raw material of the functional agglomerate includes in parts by weight: 70-90 parts of ethylene-vinyl acetate copolymer, ethylene-methyl
10-30 parts of methyl acrylate copolymer, 0.1-5.0 parts of photoinitiator and 0.5-3.0 parts of stabilizer；The stabilizer is benzil
Class stabilizer.
2. glue film according to claim 1, which is characterized in that the raw material packet of the ethylene-octene copolymer modified particles
It includes in parts by weight: 100 parts of ethylene-octene copolymer, 0.1-5.0 parts of organic peroxide crosslinking agent, crosslinking accelerator
0.1-5.0 parts and tackifier 0.5-3 parts.
3. glue film according to claim 2, which is characterized in that the fusing point of the ethylene-octene copolymer is 50-100 DEG C,
Melt index is 10-30g/10min, and octene molar content is 15-60% in the ethylene-octene copolymer.
4. glue film according to claim 2, which is characterized in that the organic peroxide crosslinking agent is tert-butyl hydroperoxide
2- ethylhexyl carbonic ester, cumyl peroxide, cumyl t-butyl peroxide, dibenzoyl peroxide, 2,5- bis-
Methyl -2,5- is double-one of (t-butyl peroxy) hexane and bis- (the t-butyl peroxy) -3,3,5- trimethyl-cyclohexanes of 1,1- or
A variety of mixtures；
The crosslinking accelerator is Dipentaerythritol Pentaacrylate, dibenzoyl benzoquinone dioxime, ethylene glycol dimethacrylate
Ester, double methyl methacrylate triethylene glycol ester, three (methylacryloyl methine) propane, tetraallyloxyethane and three hydroxyls
One of trimethacrylate or a variety of mixtures；
The tackifier are vinyl three ('beta '-methoxy ethyoxyl) silane, vinyltriethoxysilane, three second of γ-aminopropyl
Oxysilane, 3- glycidyl ether oxypropyltrimethoxysilane, γ-methacryloxypropyl trimethoxy silane,
Vinyltrimethoxysilane, three (β-of 3-aminopropyl trimethoxysilanes, γ-mercaptopropyltriethoxysilane and vinyl
Methoxy ethoxy) one of silane or a variety of mixtures.
5. glue film according to claim 1, which is characterized in that the acetic acid second in the ethylene-vinyl acetate copolymer
The weight content of alkene is 10%-40%, melting means 5-40g/10min.
6. glue film according to claim 1, which is characterized in that the first in the ethylene methyl methacrylate copolymer
The weight content of base methyl acrylate is 10%-40%, melting means 0.1-10g/10min.
7. glue film according to claim 1, which is characterized in that the photoinitiator is cyano -3 2-, 3 '-diphenyl propylene
Acid -2- ethylhexyl, 2-hydroxy-4-n-octoxybenzophenone and 2- hydroxyl -4- (2 '-ethyl hexyl oxygen diyl) benzophenone and
One of bis- (1,2,2,6,6- pentamethyl -4- piperidyl) sebacic acid esters or a variety of mixtures.
8. glue film according to claim 1, which is characterized in that the stabilizer is p- anisil, 4- hydroxy benzenes idol
Acyl, 4,4 '-dihydroxy benzils, 4- dodecyloxy benzil, 11 carbon -10- alkenyloxy group benzil of 4-, 4,4 '-two (ten
Dialkoxy) one of benzil and 4,4 '-two (11 carbon -10- alkenyloxy group) benzils or a variety of mixtures.
9. the preparation method of any one of the claim 2-8 glue film, which comprises the following steps:
(1), functional agglomerate is prepared: by ethylene-vinyl acetate copolymer and ethylene methyl methacrylate copolymer by formula
Amount is uniformly mixed, and formula ratio photoinitiator is added later and is uniformly mixed, and is added stabilizer and is uniformly mixed, is in processing temperature
Under conditions of 90-150 DEG C, squeezes out cooling and dicing and functional agglomerate is made；
(2), ethylene-octene copolymer modified particles are prepared: by ethylene-octene copolymer, crosslinking agent, crosslinking accelerator and thickening
Agent is uniformly mixed to obtain pre-composition according to formula ratio, the pre-composition is carried out reactive extrursion by extruder, extrudate is through being subcooled
But, traction, pelletizing are at ethylene-octene copolymer modified particles；
(3), the ethylene-octene copolymer modified particles of the functional agglomerate of step (1) and step (2) are mixed in proportion,
It puts into casting machine, through cooling, traction, ultraviolet light irradiation precrosslink, winding, obtains the POE of high electric strength and resistance to electric trace
Glue film.
10. preparation method according to claim 9, which is characterized in that in the step (1), obtained functional agglomerate makes
It is installed with opaque packaging bag, place 2 hours or more；
In the step (2), the extruder is the double screw extruder that draw ratio is 28-35, and extrusion temperature is in 80-150
℃；
The POE glue film with a thickness of 0.1-0.6mm, the POE glue film is crosslinked in use, and the degree of cross linking is in 60%-
Between 85%.
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| CN114774006A (en) * | 2022-04-13 | 2022-07-22 | 杭州福斯特应用材料股份有限公司 | Polymer adhesive film, polymer conductor film, battery string and photovoltaic module |
| CN115746746A (en) * | 2022-11-22 | 2023-03-07 | 山东京博石油化工有限公司 | Polyolefin elastomer composition for photovoltaic packaging film |
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