CN109702810A - A kind of cross cutting substrate and die cutting method for RFID antenna production - Google Patents
A kind of cross cutting substrate and die cutting method for RFID antenna production Download PDFInfo
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- CN109702810A CN109702810A CN201811589601.5A CN201811589601A CN109702810A CN 109702810 A CN109702810 A CN 109702810A CN 201811589601 A CN201811589601 A CN 201811589601A CN 109702810 A CN109702810 A CN 109702810A
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Abstract
The invention discloses a kind of cross cutting substrates and die cutting method for RFID antenna production, including the off-style paper layer being sequentially distributed from top to bottom, silicon layer, gluing belt, enhancement layer and copper foil layer, the off-style paper layer with a thickness of 80-90 μm, the silicon layer with a thickness of 5-8 μm, the gluing belt with a thickness of 15-20 μm, state enhancement layer with a thickness of 10-15 μm, the copper foil layer with a thickness of 15-20 μm, the off-style paper layer is the bearing bed of RFID antenna pattern after cross cutting, the silicon layer be convenient for and after separate waste material, the enhancement layer is used to increase the intensity of copper foil layer, the gluing belt is that tacky on two sides is used for off-style paper layer, enhancement layer phase viscose glue.Energy conservation and environmental protection of the present invention, and guarantee to produce the effect and efficiency of RFID antenna, the significantly larger than speed of etching method, and also faster than print process, it has a good application prospect.
Description
Technical field
The present invention relates to RF tags for technical field, and in particular to it is a kind of for RFID antenna production cross cutting substrate and
Die cutting method.
Background technique
An important application of the Radio Frequency Identification Technology (RFID) as technology of Internet of things, in recent years obtained quick hair
Exhibition.In RFID label tag manufacturing process, antenna cost and chip cost are almost fifty and fifty percent, are all the key that constitute RFID label tag
Element.Since the demand of RFID label tag is huge, the processing cost of RFID antenna how is reduced, is currently to need what is solved to ask
Topic.
The processing method of traditional RFID antenna, including etching method, print process and galvanoplastic, equal Shortcomings, specifically such as
Under:
(1) etching method, although product qualification rate is higher, excellent antenna performance, manufacturing process is cumbersome, and speed of production is slow, and
The waste of raw material is big, and can generation environment pollution；
(2) print process, antenna performance is poor, and there are deviations for the electric conductivity of every chip antenna, and when reading identification, there are problem, prints
Brush antenna ink material is expensive, causes to produce the at high cost of RFID antenna；
(3) galvanoplastic, small lot high production cost, electroplating wastewater do not utilize environmental protection there are biggish pollution.
Summary of the invention
The purpose of the present invention is overcome the processing method of traditional RFID antenna, existing deficiency.Of the invention is used for
The cross cutting substrate and die cutting method of RFID antenna production are die cut substrate by building, and make RFID antenna by cross cutting mode,
It is pollution-free and easy to operate, energy conservation and environmental protection, and guarantee to produce the effect and efficiency of RFID antenna, significantly larger than etching method
Speed, and it is also faster than print process, and method is ingenious, high reliablity, and pollution-free, has a good application prospect.
In order to achieve the above object, the technical scheme adopted by the invention is that:
A kind of cross cutting substrate for RFID antenna production, including the off-style paper layer, silicon layer, gluing being sequentially distributed from top to bottom
Belt, enhancement layer and copper foil layer,
The off-style paper layer (1) with a thickness of 80-90 μm, the silicon layer (2) with a thickness of 5-8 μm, the gluing belt (3)
With a thickness of 15-20 μm, the enhancement layer (4) with a thickness of 10-15 μm, the copper foil layer (5) with a thickness of 15-20 μm,
The off-style paper layer be cross cutting after RFID antenna pattern bearing bed, the silicon layer be convenient for and after separate waste material, it is described
Enhancement layer is used to increase the intensity of copper foil layer, and the gluing belt is that tacky on two sides is used for off-style paper layer, enhancement layer phase viscose glue.
Be previously described for the cross cutting substrate of RFID antenna production, the off-style paper layer (1) with a thickness of 90 μm, the silicone oil
Layer (2) with a thickness of 5 μm, the gluing belt (3) with a thickness of 18 μm, the enhancement layer (4) with a thickness of 12 μm, the copper
Layers of foil with a thickness of 18 μm.
It is previously described for the cross cutting substrate of RFID antenna production, the enhancement layer is made of the PET base material of 12 μ m-thicks.
It is previously described for the cross cutting substrate of RFID antenna production, the gluing belt is aqueous emulsion gluing belt.
It is previously described for the cross cutting substrate of RFID antenna production, by laminating machine successively by gluing belt, enhancement layer and copper
Layers of foil fits on off-style paper layer.
It is previously described for the cross cutting substrate of RFID antenna production, before overlay film, the surface preparation of off-style paper layer forms lamination
Paper.
A kind of die cutting method of the cross cutting substrate for RFID antenna production, includes the following steps,
Step (A) makes corresponding cutting die by RFID antenna pattern, which is single cutting edge of a knife or a sword cutting die, before cutting
It is preheated；
Step (B) carries out lateral frame half to cross cutting substrate by cutting die on cross cutting substrate delivery to die cutting operation platform
It cuts, the gluing belt above depth of cut to silicon layer；
Step (C) carries out first time waste discharge to the cross cutting substrate for completing lateral frame hemisect, by the waste material except lateral frame
It is transferred on gluing belt, and is glued belt and takes away；
Step (D) is rolled the cross cutting substrate after first time waste discharge；
Step (E) carries out internal pattern hemisect to cross cutting substrate by cutting die, the glue above depth of cut to silicon layer
Adhesive tape layer；
Step (F) carries out second of waste discharge to the cross cutting substrate for completing internal pattern hemisect, by the waste material except internal pattern
It is transferred on gluing belt, and is glued belt and takes away；
Step (G), the lateral frame of RFID antenna, internal pattern are retained on off-style paper layer, complete the cross cutting of RFID antenna.
It is previously described for the die cutting method of the cross cutting substrate of RFID antenna production, step (A), which is single cutting edge of a knife or a sword knife
The inclined surface of mould, the list cutting edge of a knife or a sword cutting die is located at outside.
It is previously described for the die cutting method of the cross cutting substrate of RFID antenna production, step (A) before cutting carries out it pre-
Heat, the preheating temperature of the cutting die are between 220 DEG C -300 DEG C.
It is previously described for the die cutting method of the cross cutting substrate of RFID antenna production, further includes step (H), after completing cross cutting
Cross cutting substrate, carry out hot-press solidifying.
The beneficial effects of the present invention are: the cross cutting substrate and die cutting method for RFID antenna production of the invention, passes through
Building cross cutting substrate, and RFID antenna is made by cross cutting mode, pollution-free and easy to operate, energy conservation and environmental protection, and guarantee to produce
The effect and efficiency of RFID antenna, the significantly larger than speed of etching method out, and it is also faster than print process, and method is ingenious, reliably
Property it is high and pollution-free, have a good application prospect.
Detailed description of the invention
Fig. 1 is the cross cutting schematic diagram of the cross cutting substrate for RFID antenna production of the invention.
Attached meaning marked in the figure is as follows:
1: off-style paper layer；2: silicon layer；3: gluing belt；4: enhancement layer；5: copper foil layer；6: cutting die.
Specific embodiment
Below in conjunction with Figure of description, the present invention is further illustrated.
As shown in Figure 1, the cross cutting substrate for RFID antenna production of the invention, including be sequentially distributed from top to bottom from
Type paper layer 1, silicon layer 2, gluing belt 3, enhancement layer 4 and copper foil layer 5,
The off-style paper layer 1 with a thickness of 80-90 μm, the silicon layer 2 with a thickness of 5-8 μm, the thickness of the gluing belt 3
Be 15-20 μm, the enhancement layer 4 with a thickness of 10-15 μm, the copper foil layer 5 with a thickness of 15-20 μm, the conduction of copper foil layer 5
Excellent performance, radio frequency effect is good,
The off-style paper layer 1 be cross cutting after RFID antenna pattern bearing bed, the silicon layer 2 be convenient for and after separate waste material, institute
It is that tacky on two sides is used for off-style paper layer 1,4 phase of enhancement layer that enhancement layer 4, which is stated, for increasing the intensity of copper foil layer 5, the gluing belt 3
Viscose glue, silicon layer 2 can reduce the viscosity of gluing belt 3 and off-style paper layer 1 convenient for demoulding, off-style paper layer 1 as supporting substrate,
It is low in cost, convenient for batch production.
Preferably, the off-style paper layer 1 with a thickness of 90 μm, the silicon layer 2 with a thickness of 5 μm, the gluing belt 3
With a thickness of 18 μm, the enhancement layer 4 with a thickness of 12 μm, the copper foil layer 5 with a thickness of 18 μm, to make molding
For RFID antenna with a thickness of 143 μm, thickness is reasonable.
Preferably, the enhancement layer 4 is made of the PET base material of 12 μ m-thicks, easy to disconnect since copper foil layer 5 is than relatively thin, leads to
It crosses PET base material to protect copper foil layer 5, improves the structural strength of copper foil layer 5.
Preferably, the gluing belt 3 is aqueous emulsion gluing belt, and the effect of gluing is good, and glue after contacting with silicon layer 2
Viscous reduced performance.
Preferably, successively gluing belt 3, enhancement layer 4 and copper foil layer 5 are fitted on off-style paper layer 1 by laminating machine, is covered
Before film, the surface preparation of off-style paper layer 1 forms lamination paper, and lamination paper is convenient for the smearing of silicon layer 2, and is able to maintain
Silicon layer 2.
The die cutting method of cross cutting substrate for RFID antenna production of the invention, includes the following steps,
Step (A) makes corresponding cutting die 6 by RFID antenna pattern, which is single cutting edge of a knife or a sword cutting die, the cross cutting
Cutting die is single cutting edge of a knife or a sword cutting die, and the inclined surface of the list cutting edge of a knife or a sword cutting die is located at outside, guarantees the uniform performance of cut surface, improves RFID antenna
Performance, the tilt angle of the list cutting edge of a knife or a sword cutting die, in the case where guaranteeing single cutting edge of a knife or a sword cutter die structure intensity, improves the cutting edge of a knife or a sword of cutter head less than 5 °
Sharp degree, before cutting preheats it, and the preheating temperature of cutting die is to be convenient for cutting die between 220 DEG C -300 DEG C
Cutting to copper foil layer, cross cutting effect are good；
Step (B) carries out lateral frame half to cross cutting substrate by cutting die on cross cutting substrate delivery to die cutting operation platform
Cutting, gluing belt 3 of the depth of cut to 2 top of silicon layer；
Step (C) carries out first time waste discharge to the cross cutting substrate for completing lateral frame hemisect, by the waste material except lateral frame
It is transferred on gluing belt 3, and is glued belt 3 and takes away；
Step (D) is rolled the cross cutting substrate after first time waste discharge, can guarantee that the cross cutting substrate of first time waste discharge is steady
Property, which is the committed step before subsequent secondary waste discharge, can be improved the cutting effect that internal pattern carries out hemisect；
Step (E) carries out internal pattern hemisect, depth of cut to 2 top of silicon layer to cross cutting substrate by cutting die
Gluing belt 3；
Step (F) carries out second of waste discharge to the cross cutting substrate for completing internal pattern hemisect, by the waste material except internal pattern
It is transferred on gluing belt 3, and is glued belt 3 and takes away；
Step (G), the lateral frame of RFID antenna, internal pattern are retained on off-style paper layer 1, complete the mould of RFID antenna
It cuts.
Further include step (H), to the cross cutting substrate completed after being die cut, carries out hot-press solidifying, hot-press solidifying can guarantee
The lateral frame of RFID antenna, internal pattern are retained in the reliability of position on off-style paper layer 1, prevent from deviating, improve product
Qualification rate.
In conclusion the cross cutting substrate and die cutting method for RFID antenna production of the invention, is die cut base by building
Material, and RFID antenna is made by cross cutting mode, pollution-free and easy to operate, energy conservation and environmental protection, and guarantee to produce RFID antenna
Effect and efficiency, the significantly larger than speed of etching method, and also faster than print process, method is ingenious, high reliablity, and without dirt
Dye, has a good application prospect.
Basic principles and main features and advantage of the invention have been shown and described above.The technical staff of the industry should
Understand, the present invention is not limited to the above embodiments, and the above embodiments and description only describe originals of the invention
Reason, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes and improvements
It all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by appended claims and its equivalent circle
It is fixed.
Claims (10)
1. a kind of cross cutting substrate for RFID antenna production, it is characterised in that: including the release paper being sequentially distributed from top to bottom
Layer (1), silicon layer (2), gluing belt (3), enhancement layer (4) and copper foil layer (5),
The off-style paper layer (1) with a thickness of 80-90 μm, the silicon layer (2) with a thickness of 5-8 μm, the gluing belt (3)
With a thickness of 15-20 μm, the enhancement layer (4) with a thickness of 10-15 μm, the copper foil layer (5) with a thickness of 15-20 μm,
The off-style paper layer (1) be cross cutting after RFID antenna pattern bearing bed, the silicon layer (2) be convenient for and after separate it is useless
Material, the enhancement layer (4) are used to increase the intensity of copper foil layer (5), and the gluing belt (3) is that tacky on two sides is used for off-style paper layer
(1), enhancement layer (4) phase viscose glue.
2. the cross cutting substrate according to claim 1 for RFID antenna production, it is characterised in that: the off-style paper layer
(1) with a thickness of 90 μm, the silicon layer (2) with a thickness of 5 μm, the gluing belt (3) with a thickness of 18 μm, the enhancing
Layer (4) with a thickness of 12 μm, the copper foil layer (5) with a thickness of 18 μm.
3. the cross cutting substrate according to claim 2 for RFID antenna production, it is characterised in that: the enhancement layer (4)
It is made of the PET base material of 12 μ m-thicks.
4. the cross cutting substrate according to claim 1 for RFID antenna production, it is characterised in that: the gluing belt
It (3) is aqueous emulsion gluing belt.
5. the cross cutting substrate according to claim 1 for RFID antenna production, it is characterised in that: successively by laminating machine
Gluing belt (3), enhancement layer (4) and copper foil layer (5) are fitted on off-style paper layer (1).
6. the cross cutting substrate according to claim 5 for RFID antenna production, it is characterised in that: before overlay film, release paper
The surface preparation of layer (1) forms lamination paper.
7. a kind of die cutting method of the cross cutting substrate for RFID antenna production, it is characterised in that: include the following steps,
Step (A) makes corresponding cutting die by RFID antenna pattern, which is single cutting edge of a knife or a sword cutting die, before cutting
It is preheated；
Step (B) carries out lateral frame half to cross cutting substrate by cutting die on cross cutting substrate delivery to die cutting operation platform
It cuts, the gluing belt (3) above depth of cut to silicon layer (2)；
Step (C) carries out first time waste discharge to the cross cutting substrate for completing lateral frame hemisect, by the waste material except lateral frame
It is transferred on gluing belt (3), and is glued belt (3) and takes away；
Step (D) is rolled the cross cutting substrate after first time waste discharge；
Step (E) carries out internal pattern hemisect, depth of cut to silicon layer (2) top to cross cutting substrate by cutting die
Gluing belt (3)；
Step (F) carries out second of waste discharge to the cross cutting substrate for completing internal pattern hemisect, by the waste material except internal pattern
It is transferred on gluing belt (3), and is glued belt (3) and takes away；
Step (G), the lateral frame of RFID antenna, internal pattern are retained on off-style paper layer (1), complete the mould of RFID antenna
It cuts.
8. the die cutting method of the cross cutting substrate according to claim 7 for RFID antenna production, it is characterised in that: step
(A), which is single cutting edge of a knife or a sword cutting die, and the inclined surface of the list cutting edge of a knife or a sword cutting die is located at outside.
9. the die cutting method of the cross cutting substrate according to claim 7 for RFID antenna production, it is characterised in that: step
(A), it is preheated before cutting, the preheating temperature of the cutting die is between 220 DEG C -300 DEG C.
10. benefit is used for the die cutting method for being die cut substrate that RFID antenna makes described in requiring 7, it is characterised in that: further include step
Suddenly (H) carries out hot-press solidifying to the cross cutting substrate completed after being die cut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811589601.5A CN109702810A (en) | 2018-12-25 | 2018-12-25 | A kind of cross cutting substrate and die cutting method for RFID antenna production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811589601.5A CN109702810A (en) | 2018-12-25 | 2018-12-25 | A kind of cross cutting substrate and die cutting method for RFID antenna production |
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| CN109702810A true CN109702810A (en) | 2019-05-03 |
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| CN201811589601.5A Pending CN109702810A (en) | 2018-12-25 | 2018-12-25 | A kind of cross cutting substrate and die cutting method for RFID antenna production |
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Cited By (3)
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| CN111816998A (en) * | 2020-06-15 | 2020-10-23 | 上海优比科电子科技有限公司 | Forming method of high-frequency/ultrahigh-frequency die-cut antenna |
| CN115648824A (en) * | 2022-10-27 | 2023-01-31 | 深圳市琥玟科技有限公司 | Method for improving die cutting precision of antenna |
| WO2023178546A1 (en) * | 2022-03-23 | 2023-09-28 | 上海航空印刷有限公司 | Novel rfid tag antenna manufacturing method |
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Application publication date: 20190503 |