CN109697730B - IC chip processing method, system and storage medium based on optical identification - Google Patents
IC chip processing method, system and storage medium based on optical identification Download PDFInfo
- Publication number
- CN109697730B CN109697730B CN201811414062.1A CN201811414062A CN109697730B CN 109697730 B CN109697730 B CN 109697730B CN 201811414062 A CN201811414062 A CN 201811414062A CN 109697730 B CN109697730 B CN 109697730B
- Authority
- CN
- China
- Prior art keywords
- chip
- tray
- dimensional image
- material tray
- image information
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/60—Analysis of geometric attributes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
- B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
- B65G2203/02—Control or detection
- B65G2203/0208—Control or detection relating to the transported articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
- B65G2203/04—Detection means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Mechanical Engineering (AREA)
- Geometry (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
An IC chip processing method, system and storage medium based on optical identification, wherein the circuit forming identification method comprises the following steps: irradiating the first material tray and the second material tray by using a laser light source; shooting the first material tray and the second material tray by using a camera device to obtain three-dimensional image information; the three-dimensional image information includes: two-dimensional size information between the IC chip and the goods grid, and distance information of the IC chip in the vertical direction; determining a grabbing and placing strategy of an IC chip between the first tray and the second tray according to the three-dimensional image information; and grabbing the IC chip from the goods lattice of the first tray according to the grabbing and placing strategy, and placing the IC chip into the goods lattice of the second tray.
Description
Technical Field
The present disclosure relates to the field of electronic technologies, and in particular, to an IC chip processing method and system based on optical recognition, and a storage medium.
Background
In the industry, Integrated Circuit (IC) chips are a very precious component and are also fragile. Therefore, in the industrial production process, the IC chip is carefully grabbed, and the grabbing device usually does not directly touch the IC chip, and the IC chip is grabbed in an empty space by a sucking mode.
With the popularization of industrial automation, industrial mechanical arms are used for automatically identifying and judging IC chips in the process of industrial production, and the operations of grabbing and placing are executed. Therefore, the central control device in charge of background control needs to identify the position of the IC chip through the camera shooting state, so as to instruct the industrial robot arm to perform the grabbing operation.
In the prior art, a two-dimensional camera device can be used for shooting and identifying, images are processed mainly after being shot, and IC image features are captured, so that the function of identifying ICs is realized. However, due to the influence of complex conditions of equipment devices in a production line, the recognition misjudgment rate of the two-dimensional camera device camera is high, so that the method cannot adapt to the requirements of industrial production.
Disclosure of Invention
The embodiment of the application provides an IC chip processing method, an IC chip processing system and a storage medium based on optical identification, which are used for accurately identifying, grabbing and placing IC chips on a production line.
A first aspect of an embodiment of the present application provides an IC chip processing method based on optical recognition, including:
irradiating the first material tray and the second material tray of the integrated circuit by using a laser light source; the first material tray is an original storage material tray of the IC chip, and the second material tray is a target material tray to which the IC chip is transferred; n and M goods grids for storing IC chips are respectively arranged in the first material tray and the second material tray, wherein M is a positive integer greater than or equal to N;
shooting the first material tray and the second material tray by using a camera device to obtain three-dimensional image information; the three-dimensional image information includes: two-dimensional size information between the IC chip and the goods grid, and distance information of the IC chip in the vertical direction;
determining a grabbing and placing strategy of an IC chip between the first tray and the second tray according to the three-dimensional image information; the grabbing and placing strategy comprises the following steps: the acquisition height for grabbing and placing the IC chip;
and grabbing the IC chip from the goods lattice of the first tray according to the grabbing and placing strategy, and placing the IC chip into the goods lattice of the second tray.
Further, the image pickup apparatus includes: a two-dimensional image pickup device and a three-dimensional image pickup device;
the two-dimensional camera device is used for shooting a high-precision two-dimensional plane image;
the three-dimensional camera device is used for shooting a three-dimensional image containing distance information of the IC chip in the vertical direction.
Further, the determining a capturing and placing strategy of the IC chip between the first tray and the second tray according to the three-dimensional image information includes:
determining first position information and first quantity information of the IC chip on the first tray according to the three-dimensional image information; determining a target IC chip which needs to be captured currently according to the first position information and the first quantity information;
determining second position information and second quantity information of the IC chip on the second tray according to the three-dimensional image information; and determining the placing position of the target IC chip in the second tray according to the second position information and the second quantity information.
Further, before determining the capturing and placing strategy of the IC chip between the first tray and the second tray according to the three-dimensional image information, the method includes:
determining whether an IC chip in the first tray is in an abnormal placement state or not according to the three-dimensional image information; the abnormal placement state includes: placing more than one IC chip in one cargo grid, wherein the IC chips are placed in the cargo grid in incorrect postures;
if the abnormal placement state does not exist, the step of determining the grabbing and placing strategy of the IC chip between the first tray and the second tray according to the three-dimensional image information is executed;
and if the abnormal placement state exists, removing the abnormal placement state, and executing the step of determining the grabbing and placing strategy of the IC chip between the first tray and the second tray according to the three-dimensional image information after the abnormal placement state is removed.
Further, the determining whether the IC chip in the first tray has an abnormal placement state according to the three-dimensional image information includes any one of the following combinations:
judging whether more than one IC chip is placed in one goods grid or not according to the distance information of the IC chips in the three-dimensional image information in the vertical direction, if so, judging that an abnormal placing state exists;
or the like, or, alternatively,
judging whether more than two kinds of distance information exist in the area of one cargo grid in which the pixel information corresponding to the same IC chip in the error precision range according to the distance information of the IC chip in the three-dimensional image information in the vertical direction, if so, judging that an abnormal placement state exists;
or the like, or, alternatively,
and judging whether the placing posture of the IC chip in the goods lattice is inclined or not according to the two-dimensional size information between the IC chip and the goods lattice in the three-dimensional image information, if so, judging that an abnormal placing state exists.
Further, before determining the capturing and placing strategy of the IC chip between the first tray and the second tray according to the three-dimensional image information, the method includes:
determining whether the first tray and the second tray are matched or not according to the three-dimensional image information;
if yes, executing the step of determining the grabbing and placing strategy of the IC chip between the first tray and the second tray according to the three-dimensional image information;
and if not, replacing the second tray.
Further, the determining whether the first tray and the second tray are matched according to the three-dimensional image information includes:
and judging whether the depth of the goods grids in the second material plate in the vertical direction is greater than the thickness of the IC chip placed in the first material plate, if so, the depth of the goods grids in the second material plate meets the condition.
Further, the irradiating the first tray and the second tray by using the laser light source further comprises:
irradiating a third material tray by using a laser light source, wherein the third material tray is a material tray on which an IC chip is not placed;
and shooting the third tray by using a camera device to obtain the three-dimensional image information of the tray in a state that the IC chip is not placed.
Further, the three-dimensional image information further includes: the length, width, height and size information of the material tray and three-dimensional coordinates of other parts of the material tray;
the grabbing and placing strategy further comprises: horizontal coordinates of the grab and the grab order.
A second aspect of the embodiments of the present application provides an IC chip processing system, including:
the vision device is used for irradiating a first material tray and a second material tray on the integrated circuit IC chip production line by using a laser light source; the first material tray is an original storage material tray of the IC chip, and the second material tray is a target material tray to which the IC chip is transferred; n and M goods grids for storing IC chips are respectively arranged in the first material tray and the second material tray, wherein M is a positive integer greater than or equal to N; shooting the first material tray and the second material tray by using a camera device to obtain three-dimensional image information; the three-dimensional image information includes: two-dimensional size information between the IC chip and the goods grid, and distance information of the IC chip in the vertical direction;
the central control device is used for determining a grabbing and placing strategy of the IC chip between the first material tray and the second material tray according to the three-dimensional image information; the grabbing and placing strategy comprises the following steps: the acquisition height for grabbing and placing the IC chip;
and the executing device is used for grabbing the IC chip from the goods lattice of the first material tray according to the grabbing and placing strategy and placing the IC chip into the goods lattice of the second material tray.
A third aspect of the embodiments of the present application provides another electronic apparatus, including: the optical identification-based IC chip processing method comprises a memory, a processor and a computer program which is stored on the memory and can run on the processor, wherein when the processor executes the computer program, the optical identification-based IC chip processing method provided by the first aspect of the embodiment of the application is realized.
A fourth aspect of the embodiments of the present application provides a computer-readable storage medium, on which a computer program is stored, where the computer program, when executed by a processor, implements the method for processing an IC chip based on optical recognition provided in the first aspect of the embodiments of the present application.
According to the scheme, the laser light source is used for irradiating the first material tray and the second material tray on the integrated circuit IC chip production line, and the first material tray and the second material tray are shot by the camera device to obtain three-dimensional image information; because the three-dimensional image information contains the distance information of the IC chip in the vertical direction, the grabbing height can be accurately and dynamically controlled according to the grabbing and placing strategies determined by the three-dimensional image information, the three-dimensional image information can adapt to the complex industrial production state, the damage of the IC chip caused by the fact that the grabbing device touches the IC chip is avoided, and the success rate of effective grabbing is improved.
Drawings
FIG. 1-a is a schematic flow chart of a method for processing an IC chip based on optical recognition according to an embodiment of the present application;
FIG. 1-b is a schematic flow chart illustrating a method for processing an IC chip based on optical recognition according to an embodiment of the present disclosure;
FIG. 1-c is a schematic flow chart illustrating a method for processing an IC chip based on optical recognition according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
fig. 3 is a schematic diagram of a hardware structure of an electronic device according to another embodiment of the present disclosure.
Detailed Description
In order to make the objects, features and advantages of the present invention more apparent and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Suffixes such as "module", "part", or "unit" used to denote elements are used herein only for the convenience of description of the present invention, and have no specific meaning in themselves.
Example one
The embodiment of the application provides an IC chip processing method, an IC chip processing system and a storage medium based on optical identification, which are used for accurately identifying, grabbing and placing IC chips on a production line.
In the embodiment of the invention, the IC chip processing system for realizing the IC chip processing method based on the optical identification comprises a vision device, a central control device and an execution device. The vision device is mainly used for acquiring image information of a target area, providing the image information to the central control device for analysis processing, determining an execution strategy of the IC chip by the central control device, and sending the execution strategy to the execution device to finish specified operation.
Referring to fig. 1-a, the IC chip processing method based on optical recognition mainly includes the following steps:
101. irradiating a first material tray and a second material tray on an IC chip production line by using a laser light source;
the vision device irradiates the first material tray and the second material tray by using a laser light source; the first material tray is an original storage material tray of the IC chip, and the second material tray is a target material tray to which the IC chip is transferred; n and M goods grids for storing IC chips are respectively arranged in the first material tray and the second material tray, and M is a positive integer greater than or equal to N.
Specifically, the laser light source may be a specially-made narrow-band light source.
In particular, in an embodiment of the present invention, the volume of the cargo space is larger than the volume of the IC chip, i.e., the cargo space can completely accommodate the IC chip.
In the embodiment of the present invention, the goods shelves in the first tray are not necessarily all loaded with IC chips, and the IC chips may be placed in the first tray in an unordered manner, so that the visual device is required to dynamically identify the distribution positions of the IC chips in the current first tray (i.e. which IC chips are located in which goods shelves), and the remaining number of the IC chips in the current first tray, so that the central control device can determine whether the task of grabbing and placing the IC chips is completed and the current progress of completing the task in real time.
102. Shooting the first material tray and the second material tray by using a camera device to obtain three-dimensional image information;
the vision device shoots the first material tray and the second material tray by using a camera device to obtain three-dimensional image information; the three-dimensional image information includes: two-dimensional size information between the IC chip and the shelf, and distance information of the IC chip in the vertical direction. Further, the three-dimensional image information further includes: length, width, height and size information of the material tray and three-dimensional coordinates of other parts of the material tray.
Specifically, the imaging apparatus includes: a two-dimensional image pickup device and a three-dimensional image pickup device;
the two-dimensional camera device is used for shooting a high-precision two-dimensional plane image;
the three-dimensional camera device is used for shooting a three-dimensional image containing distance information of the IC chip in the vertical direction and a three-dimensional image of the material tray.
In practical application, according to the requirement of the actual operation link on the corresponding operation precision, if the identification precision of the three-dimensional camera device on the plane pixel can meet the requirement, a two-dimensional camera device is not necessarily provided.
In practical application, a camera of the camera device is inclined at a certain angle to capture a laser light source, and image information in a light source range is collected; and, the light source and the camera are moved integrally at a constant specific speed, the entire product is scanned, and relevant image information is continuously collected.
103. Determining a grabbing and placing strategy of an IC chip between the first tray and the second tray according to the three-dimensional image information;
the central control device determines a grabbing and placing strategy of an IC chip between the first tray and the second tray according to the three-dimensional image information; the grabbing and placing strategy comprises the following steps: the height of the pick and place IC chip. Further, the grabbing and placing strategy further comprises: horizontal coordinates of the grab and the grab order.
In practical application, the vision device needs to dynamically identify the distribution position of the IC chips in the current first tray and the remaining number of the IC chips in the current first tray according to the three-dimensional image information, and identify the placement condition of the IC chips in the current second tray, so that the central control device can analyze how to grasp the IC chips and how to place the IC chips, that is, the grasping and placing strategies of the IC chips between the first tray and the second tray.
Specifically, before step 101, the method further includes: irradiating a third material tray by using a laser light source, wherein the third material tray is a material tray on which an IC chip is not placed; and shooting the third tray by using a camera device to obtain the three-dimensional image information of the tray in a state that the IC chip is not placed. In order to obtain the distribution positions of the IC chips in the material tray, the central control device can compare and analyze the image characteristics of the material tray without the IC chips when performing image analysis, so as to obtain the positions of the IC chips in the material tray in which the goods grids are located.
Furthermore, in order to facilitate position indication of the execution device, the central control device can perform position calibration of the tray and the execution device. Specifically, a reference point may be found in the imaging area as the origin of the three-dimensional coordinates, and a three-dimensional coordinate system may be established according to the reference point. The tray and the executing device can be located in the same three-dimensional coordinate system, and the central control device can conveniently indicate the three-dimensional position movement of the executing device.
In the embodiment of the invention, for the prior art, the grabbing and placing strategy includes the information of the acquisition height for grabbing and placing the IC chip, so that the grabbing height can be accurately and dynamically controlled, and the damage of the IC chip caused by the grabbing device touching the IC chip can be more effectively avoided.
For example, in the embodiment of the present invention, the determination manner of the capturing and placing policy may be:
determining first position information and first quantity information of the IC chip on the first tray according to the three-dimensional image information; determining a target IC chip which needs to be captured currently according to the first position information and the first quantity information;
determining second position information and second quantity information of the IC chip on the second tray according to the three-dimensional image information; and determining the placing position of the target IC chip in the second tray according to the second position information and the second quantity information.
104. The grabbing of the IC chip in the first tray and the placing in the second tray.
And the executing device grabs the IC chip from the goods lattice of the first material tray according to the grabbing and placing strategy and places the IC chip into the goods lattice of the second material tray.
According to the scheme, the laser light source is used for irradiating the first material tray and the second material tray on the integrated circuit IC chip production line, and the first material tray and the second material tray are shot by the camera device to obtain three-dimensional image information; because the three-dimensional image information contains the distance information of the IC chip in the vertical direction, the grabbing height can be accurately and dynamically controlled according to the grabbing and placing strategies determined by the three-dimensional image information, the three-dimensional image information can adapt to the complex industrial production state, the damage of the IC chip caused by the fact that the grabbing device touches the IC chip is avoided, and the success rate of effective grabbing is improved.
Example two
In practical applications, there may be abnormal placement states of the IC chips in the tray, and the embodiment of the present application provides a corresponding solution, please refer to fig. 1-b, which specifically includes:
201. irradiating a first material tray and a second material tray on an IC chip production line by using a laser light source;
the vision device uses a laser light source to irradiate a first material tray and a second material tray on an Integrated Circuit (IC) chip production line; the first material tray is an original storage material tray of the IC chip, and the second material tray is a target material tray to which the IC chip is transferred; n and M goods grids for storing IC chips are respectively arranged in the first material tray and the second material tray, and M is a positive integer greater than or equal to N.
202. Shooting the first material tray and the second material tray by using a camera device to obtain three-dimensional image information;
the vision device shoots the first material tray and the second material tray by using a camera device to obtain three-dimensional image information; the three-dimensional image information includes: two-dimensional size information between the IC chip and the shelf, and distance information of the IC chip in the vertical direction.
203. Determining whether an IC chip in the first tray is in an abnormal placement state or not according to the three-dimensional image information;
the central control device determines whether an IC chip in the first tray is in an abnormal placement state or not according to the three-dimensional image information; the abnormal placement state includes: more than one IC chip is placed in one cargo grid, and the placement posture of the IC chip in the cargo grid is incorrect.
If the abnormal placement state does not exist, go to step 205;
if the abnormal placement state exists, step 204 is executed.
Specifically, the incorrect posture of the placement device includes: tilt of the IC chip, tilt of the IC chip placement, and reverse placement of the IC chip.
Illustratively, the corresponding abnormal placement state may include any one of the following combinations of the determination placement:
and judging whether more than one IC chip is placed in one goods grid or not according to the distance information of the IC chips in the three-dimensional image information in the vertical direction, if so, judging that an abnormal placing state exists. Specifically, if more than two chips are placed in one cargo space, the distance information of the IC chip in the vertical direction in the three-dimensional image information is represented differently and can be recognized by the central control device.
Or the like, or, alternatively,
according to the distance information of the IC chip in the three-dimensional image information in the vertical direction, whether more than two kinds of distance information exist in the area where one cargo grid is located in the pixel information corresponding to the same IC chip within the error precision range or not is judged (namely the IC chip is placed to be tilted and not horizontal, so that the pixel information corresponding to the IC chip respectively has multiple kinds of distance information), and if yes, an abnormal placing state exists. The error accuracy range mentioned above means that different distance information caused by some slight tilt can be considered to be within the error accuracy range.
Or the like, or, alternatively,
and judging whether the placing posture of the IC chip in the goods lattice is inclined or not according to the two-dimensional size information between the IC chip and the goods lattice in the three-dimensional image information, if so, judging that an abnormal placing state exists. In practical application, in order to ensure that the IC chip does not shake greatly in the process of placing the goods lattice, the IC chip needs to be placed in the goods lattice as exactly as possible.
204. Removing abnormal placement state;
specifically, the abnormal placement state elimination may be to send an alarm message to the central control device, and instruct the work maintainer to adjust the placement condition of the IC chip, so as to eliminate the abnormal placement state.
205. Determining a grabbing and placing strategy of an IC chip between the first tray and the second tray according to the three-dimensional image information;
the central control device determines a grabbing and placing strategy of an IC chip between the first tray and the second tray according to the three-dimensional image information; the grabbing and placing strategy comprises the following steps: the height of the pick and place IC chip.
206. The grabbing of the IC chip in the first tray and the placing in the second tray.
The vision device shoots the first material tray and the second material tray by using a camera device to obtain three-dimensional image information; the three-dimensional image information includes: two-dimensional size information between the IC chip and the shelf, and distance information of the IC chip in the vertical direction.
Compared with the prior art, the three-dimensional image information has height data in the vertical direction, so that the abnormal placement state can be identified more effectively, the abnormal placement state can be eliminated more effectively, and the safety of the IC chip in grabbing and placing is improved.
EXAMPLE III
In practical applications, in the process of transferring the IC chip between trays, a situation that the transferred target tray is not matched may occur, and the embodiment of the present application provides a corresponding solution, please refer to fig. 1-c, which specifically includes:
301. irradiating a first material tray and a second material tray on an IC chip production line by using a laser light source;
the vision device uses a laser light source to irradiate a first material tray and a second material tray on an Integrated Circuit (IC) chip production line; the first material tray is an original storage material tray of the IC chip, and the second material tray is a target material tray to which the IC chip is transferred; n and M goods grids for storing IC chips are respectively arranged in the first material tray and the second material tray, and M is a positive integer greater than or equal to N.
302. Shooting the first material tray and the second material tray by using a camera device to obtain three-dimensional image information;
the vision device shoots the first material tray and the second material tray by using a camera device to obtain three-dimensional image information; the three-dimensional image information includes: two-dimensional size information between the IC chip and the shelf, and distance information of the IC chip in the vertical direction.
303. Determining whether the first tray and the second tray are matched or not according to the three-dimensional image information;
and the central control device determines whether the first material tray is matched with the second material tray or not according to the three-dimensional image information.
Specifically, the conditions for tray adaptation include: 1. the number of the goods grids in the second material tray is greater than or equal to that of the goods grids in the first material tray; 2. the area of the goods check in the second charging tray in the horizontal direction is larger than the area of the goods check in the first charging tray in the horizontal direction, and the difference value of the two areas is within a preset range. 3. The depth of the goods grids in the second material tray in the vertical direction is larger than the thickness of the IC chips placed in the first material tray (namely, whether the depth of the goods grids in the second material tray in the vertical direction is larger than the thickness of the IC chips placed in the first material tray is judged, and if yes, the depth of the goods grids in the second material tray meets the condition).
In practical application, if any of the above conditions is not met, the first tray and the second tray can be judged to be not matched.
If yes, go to step 305;
if not, go to step 304.
304. Replacing the second tray;
and the central control device sends out an instruction to replace the second material tray.
305. Determining a grabbing and placing strategy of an IC chip between the first tray and the second tray according to the three-dimensional image information;
the central control device determines a grabbing and placing strategy of an IC chip between the first tray and the second tray according to the three-dimensional image information; the grabbing and placing strategy comprises the following steps: the height of the pick and place IC chip.
306. The grabbing of the IC chip in the first tray and the placing in the second tray.
The vision device shoots the first material tray and the second material tray by using a camera device to obtain three-dimensional image information; the three-dimensional image information includes: two-dimensional size information between the IC chip and the shelf, and distance information of the IC chip in the vertical direction.
Compared with the prior art, the three-dimensional image information of the embodiment of the application has height data in the vertical direction, so that whether the second tray can meet the placing requirement of an IC chip in depth or not can be effectively identified.
Example four
Referring to fig. 2, an electronic device is provided according to an embodiment of the present application. The electronic device can be used for realizing the IC chip processing method based on optical identification provided by the embodiment shown in the figure 1-a. As shown in fig. 2, the electronic device mainly includes:
a vision device 210 for irradiating a first tray and a second tray on an integrated circuit IC chip production line with a laser light source; the first material tray is an original storage material tray of the IC chip, and the second material tray is a target material tray to which the IC chip is transferred; n and M goods grids for storing IC chips are respectively arranged in the first material tray and the second material tray, wherein M is a positive integer greater than or equal to N; shooting the first material tray and the second material tray by using a camera device to obtain three-dimensional image information; the three-dimensional image information includes: two-dimensional size information between the IC chip and the goods grid, and distance information of the IC chip in the vertical direction;
the central control device 220 is used for determining a grabbing and placing strategy of the IC chip between the first tray and the second tray according to the three-dimensional image information; the grabbing and placing strategy comprises the following steps: the acquisition height for grabbing and placing the IC chip;
and the executing device 230 is used for grabbing the IC chip from the goods lattice of the first tray according to the grabbing and placing strategy and placing the IC chip into the goods lattice of the second tray.
It should be noted that, in the embodiment of the electronic device illustrated in fig. 2, the division of the functional modules is only an example, and in practical applications, the above functions may be distributed by different functional modules according to needs, for example, configuration requirements of corresponding hardware or convenience of implementation of software, that is, the internal structure of the electronic device is divided into different functional modules to complete all or part of the functions described above. In practical applications, the corresponding functional modules in this embodiment may be implemented by corresponding hardware, or may be implemented by corresponding hardware executing corresponding software. The above description principles can be applied to various embodiments provided in the present specification, and are not described in detail below.
For a specific process of each function module in the electronic device provided in this embodiment to implement each function, please refer to the specific content described in the embodiment shown in fig. 1-a, which is not described herein again.
EXAMPLE five
An embodiment of the present application provides an electronic device, please refer to fig. 3, which includes:
a memory 301, a processor 302 and a computer program stored in the memory 301 and executable on the processor 302, wherein the processor 302 executes the computer program to implement the IC chip processing method based on optical identification described in the embodiment of fig. 1-a.
Further, the electronic device further includes:
at least one input device 303 and at least one output device 304.
The memory 301, the processor 302, the input device 303, and the output device 304 are connected via a bus 305.
The input device 303 may be a camera, a touch panel, a physical button, a mouse, or the like. The output device 304 may specifically be a display screen.
The Memory 301 may be a Random Access Memory (RAM) Memory or a non-volatile Memory (non-volatile Memory), such as a magnetic disk Memory. The memory 301 is used to store a set of executable program code, and the processor 302 is coupled to the memory 301.
Further, an embodiment of the present application also provides a computer-readable storage medium, where the computer-readable storage medium may be provided in an electronic device in the foregoing embodiments, and the computer-readable storage medium may be the memory in the foregoing embodiment shown in fig. 3. The computer-readable storage medium has stored thereon a computer program which, when executed by a processor, implements the optical recognition-based IC chip processing method described in the foregoing embodiment shown in fig. 1-a. Further, the computer-readable storage medium may be various media that can store program codes, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a RAM, a magnetic disk, or an optical disk.
In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the modules is merely a logical division, and in actual implementation, there may be other divisions, for example, multiple modules or components may be combined or integrated into another system, or some features may be omitted, or not implemented. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or modules, and may be in an electrical, mechanical or other form.
The modules described as separate parts may or may not be physically separate, and parts displayed as modules may or may not be physical modules, may be located in one place, or may be distributed on a plurality of network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment.
In addition, functional modules in the embodiments of the present application may be integrated into one processing module, or each of the modules may exist alone physically, or two or more modules are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode.
The integrated module, if implemented in the form of a software functional module and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application may be substantially implemented or contributed to by the prior art, or all or part of the technical solution may be embodied in a software product, which is stored in a readable storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned readable storage medium includes: various media capable of storing program codes, such as a U disk, a removable hard disk, a ROM, a RAM, a magnetic disk, or an optical disk.
It should be noted that, for the sake of simplicity, the above-mentioned method embodiments are described as a series of acts or combinations, but those skilled in the art should understand that the present application is not limited by the described order of acts, as some steps may be performed in other orders or simultaneously according to the present application. Further, those skilled in the art should also appreciate that the embodiments described in the specification are preferred embodiments and that the acts and modules referred to are not necessarily required in this application.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In view of the above description of the IC chip processing method, system and storage medium based on optical recognition provided by the present application, those skilled in the art will recognize that the present application can be practiced without departing from the spirit and scope of the present application.
Claims (12)
1. An IC chip processing method based on optical identification is characterized by comprising the following steps:
irradiating the first material tray and the second material tray by using a laser light source; the first material tray is an original storage material tray of the integrated circuit IC chip, and the second material tray is a target material tray to which the IC chip is transferred; n and M goods grids for storing IC chips are respectively arranged in the first material tray and the second material tray, wherein M is a positive integer greater than or equal to N;
shooting the first material tray and the second material tray by using a camera device to obtain three-dimensional image information; the three-dimensional image information includes: two-dimensional size information between the IC chip and the goods grid, and distance information of the IC chip in the vertical direction;
determining a grabbing and placing strategy of an IC chip between the first tray and the second tray according to the three-dimensional image information; the grabbing and placing strategy comprises the following steps: the acquisition height for grabbing and placing the IC chip;
and grabbing the IC chip from the goods lattice of the first tray according to the grabbing and placing strategy, and placing the IC chip into the goods lattice of the second tray.
2. The method of claim 1,
the image pickup apparatus includes: a two-dimensional image pickup device and a three-dimensional image pickup device;
the two-dimensional camera device is used for shooting a high-precision two-dimensional plane image;
the three-dimensional camera device is used for shooting a three-dimensional image containing distance information of the IC chip in the vertical direction and a three-dimensional image of the material tray.
3. The method of claim 1,
the method for determining the grabbing and placing strategies of the IC chip between the first tray and the second tray according to the three-dimensional image information comprises the following steps:
determining first position information and first quantity information of the IC chip on the first tray according to the three-dimensional image information; determining a target IC chip which needs to be captured currently according to the first position information and the first quantity information;
determining second position information and second quantity information of the IC chip on the second tray according to the three-dimensional image information; and determining the placing position of the target IC chip in the second tray according to the second position information and the second quantity information.
4. The method of claim 1,
before determining the grabbing and placing strategy of the IC chip between the first tray and the second tray according to the three-dimensional image information, the method comprises the following steps:
determining whether an IC chip in the first tray is in an abnormal placement state or not according to the three-dimensional image information; the abnormal placement state includes: placing more than one IC chip in one cargo grid, wherein the IC chips are placed in the cargo grid in incorrect postures;
if the abnormal placement state does not exist, the step of determining the grabbing and placing strategy of the IC chip between the first tray and the second tray according to the three-dimensional image information is executed;
and if the abnormal placement state exists, removing the abnormal placement state, and executing the step of determining the grabbing and placing strategy of the IC chip between the first tray and the second tray according to the three-dimensional image information after the abnormal placement state is removed.
5. The method of claim 4,
the step of determining whether the IC chip in the first tray is in an abnormal placement state or not according to the three-dimensional image information comprises any one of the following combinations:
judging whether more than one IC chip is placed in one goods grid or not according to the distance information of the IC chips in the three-dimensional image information in the vertical direction, if so, judging that an abnormal placing state exists;
or the like, or, alternatively,
judging whether more than two kinds of distance information exist in the area of one cargo grid in which the pixel information corresponding to the same IC chip in the error precision range according to the distance information of the IC chip in the three-dimensional image information in the vertical direction, if so, judging that an abnormal placement state exists;
or the like, or, alternatively,
and judging whether the placing posture of the IC chip in the goods lattice is inclined or not according to the two-dimensional size information between the IC chip and the goods lattice in the three-dimensional image information, if so, judging that an abnormal placing state exists.
6. The method of claim 1,
before determining the grabbing and placing strategy of the IC chip between the first tray and the second tray according to the three-dimensional image information, the method comprises the following steps:
determining whether the first tray and the second tray are matched or not according to the three-dimensional image information;
if yes, executing the step of determining the grabbing and placing strategy of the IC chip between the first tray and the second tray according to the three-dimensional image information;
and if not, replacing the second tray.
7. The method of claim 6,
the determining whether the first tray and the second tray are matched according to the three-dimensional image information includes:
and judging whether the depth of the goods grids in the second material plate in the vertical direction is greater than the thickness of the IC chip placed in the first material plate, if so, the depth of the goods grids in the second material plate meets the condition.
8. The method of claim 1,
the use laser source to shine first charging tray and second charging tray still includes:
irradiating a third material tray by using a laser light source, wherein the third material tray is a material tray on which an IC chip is not placed;
and shooting the third tray by using a camera device to obtain the three-dimensional image information of the tray in a state that the IC chip is not placed.
9. The method of claim 1,
the three-dimensional image information further includes: the length, width, height and size information of the material tray and three-dimensional coordinates of other parts of the material tray;
the grabbing and placing strategy further comprises: horizontal coordinates of the grab and the grab order.
10. An IC chip processing system, comprising:
the vision device is used for irradiating a first material tray and a second material tray on the integrated circuit IC chip production line by using a laser light source; the first material tray is an original storage material tray of the IC chip, and the second material tray is a target material tray to which the IC chip is transferred; n and M goods grids for storing IC chips are respectively arranged in the first material tray and the second material tray, wherein M is a positive integer greater than or equal to N; shooting the first material tray and the second material tray by using a camera device to obtain three-dimensional image information; the three-dimensional image information includes: two-dimensional size information between the IC chip and the goods grid, and distance information of the IC chip in the vertical direction;
the central control device is used for determining a grabbing and placing strategy of the IC chip between the first material tray and the second material tray according to the three-dimensional image information; the grabbing and placing strategy comprises the following steps: the acquisition height for grabbing and placing the IC chip;
and the executing device is used for grabbing the IC chip from the goods lattice of the first material tray according to the grabbing and placing strategy and placing the IC chip into the goods lattice of the second material tray.
11. An electronic device, comprising: memory, processor and computer program stored on the memory and executable on the processor, characterized in that the processor implements the method of any one of claims 1 to 9 when executing the computer program.
12. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the method of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811414062.1A CN109697730B (en) | 2018-11-26 | 2018-11-26 | IC chip processing method, system and storage medium based on optical identification |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811414062.1A CN109697730B (en) | 2018-11-26 | 2018-11-26 | IC chip processing method, system and storage medium based on optical identification |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109697730A CN109697730A (en) | 2019-04-30 |
| CN109697730B true CN109697730B (en) | 2021-02-09 |
Family
ID=66230198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811414062.1A Active CN109697730B (en) | 2018-11-26 | 2018-11-26 | IC chip processing method, system and storage medium based on optical identification |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109697730B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110270482B (en) * | 2019-06-14 | 2024-06-18 | 深圳市金洲精工科技股份有限公司 | Automatic material arranging machine and automatic material arranging method |
| CN114013988B (en) * | 2021-10-28 | 2023-08-01 | 惠州佰维存储科技有限公司 | SSD transfer method and device, readable storage medium and electronic equipment |
| CN114745491A (en) * | 2022-04-24 | 2022-07-12 | 平安国际智慧城市科技股份有限公司 | Reagent warehousing management method, device, equipment and storage medium |
| CN115799127B (en) * | 2023-02-07 | 2023-04-11 | 成都光创联科技有限公司 | Chip subpackaging method based on camera identification and subpackaging device thereof |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104495172A (en) * | 2014-11-21 | 2015-04-08 | 格兰达技术（深圳）有限公司 | Automatic IC (integrated circuit) charging-tray chip transferring machine |
| CN105301023A (en) * | 2015-11-04 | 2016-02-03 | 无锡日联科技股份有限公司 | IC material plate detection device based on X-ray detection |
| CN105572147A (en) * | 2016-01-08 | 2016-05-11 | 上海恒浥智能科技股份有限公司 | Chip automatic detection method |
| CN105665304A (en) * | 2016-02-01 | 2016-06-15 | 先驱智能机械（深圳）有限公司 | Object grabbing and sorting system and sorting disc |
| CN106670757A (en) * | 2016-11-24 | 2017-05-17 | 南京景曜智能科技有限公司 | Stacked item automatic sorting system based on stereo vision |
| CN107720292A (en) * | 2017-09-30 | 2018-02-23 | 环旭电子股份有限公司 | A kind of loading and unloading system and loading and unloading method |
| CN108171748A (en) * | 2018-01-23 | 2018-06-15 | 哈工大机器人（合肥）国际创新研究院 | A kind of visual identity of object manipulator intelligent grabbing application and localization method |
| CN108537841A (en) * | 2017-03-03 | 2018-09-14 | 株式会社理光 | A kind of implementation method, device and the electronic equipment of robot pickup |
| CN108712946A (en) * | 2017-08-23 | 2018-10-26 | 深圳蓝胖子机器人有限公司 | Cargo arrangement method, device, system and electronic equipment and readable storage medium storing program for executing |
| CN108745942A (en) * | 2018-04-27 | 2018-11-06 | 成都西纬科技有限公司 | A kind of detection method and device for product appearance |
| CN108778634A (en) * | 2015-12-16 | 2018-11-09 | Mbl有限公司 | Robot kitchen including robot, storing unit and its container |
-
2018
- 2018-11-26 CN CN201811414062.1A patent/CN109697730B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104495172A (en) * | 2014-11-21 | 2015-04-08 | 格兰达技术（深圳）有限公司 | Automatic IC (integrated circuit) charging-tray chip transferring machine |
| CN105301023A (en) * | 2015-11-04 | 2016-02-03 | 无锡日联科技股份有限公司 | IC material plate detection device based on X-ray detection |
| CN108778634A (en) * | 2015-12-16 | 2018-11-09 | Mbl有限公司 | Robot kitchen including robot, storing unit and its container |
| CN105572147A (en) * | 2016-01-08 | 2016-05-11 | 上海恒浥智能科技股份有限公司 | Chip automatic detection method |
| CN105665304A (en) * | 2016-02-01 | 2016-06-15 | 先驱智能机械（深圳）有限公司 | Object grabbing and sorting system and sorting disc |
| CN106670757A (en) * | 2016-11-24 | 2017-05-17 | 南京景曜智能科技有限公司 | Stacked item automatic sorting system based on stereo vision |
| CN108537841A (en) * | 2017-03-03 | 2018-09-14 | 株式会社理光 | A kind of implementation method, device and the electronic equipment of robot pickup |
| CN108712946A (en) * | 2017-08-23 | 2018-10-26 | 深圳蓝胖子机器人有限公司 | Cargo arrangement method, device, system and electronic equipment and readable storage medium storing program for executing |
| CN107720292A (en) * | 2017-09-30 | 2018-02-23 | 环旭电子股份有限公司 | A kind of loading and unloading system and loading and unloading method |
| CN108171748A (en) * | 2018-01-23 | 2018-06-15 | 哈工大机器人（合肥）国际创新研究院 | A kind of visual identity of object manipulator intelligent grabbing application and localization method |
| CN108745942A (en) * | 2018-04-27 | 2018-11-06 | 成都西纬科技有限公司 | A kind of detection method and device for product appearance |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109697730A (en) | 2019-04-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109697730B (en) | IC chip processing method, system and storage medium based on optical identification | |
| US9529945B2 (en) | Robot simulation system which simulates takeout process of workpieces | |
| JP7047249B2 (en) | Image processing system, image processing device, work pickup method, and work pickup program | |
| KR20180120647A (en) | System and method for tying together machine vision coordinate spaces in a guided assembly environment | |
| JP2019509559A (en) | Box location, separation, and picking using a sensor-guided robot | |
| CN108827154B (en) | Robot non-teaching grabbing method and device and computer readable storage medium | |
| JP2020196124A (en) | Robotic system with dynamic packing mechanism | |
| CN109835706B (en) | Workpiece configuration system | |
| CN111015652B (en) | Manipulator control method, manipulator control device, terminal device and readable storage medium | |
| JP7175487B1 (en) | Robotic system with image-based sizing mechanism and method for operating the robotic system | |
| CN114505864B (en) | Hand-eye calibration method, device, equipment and storage medium | |
| CN114310892B (en) | Object grabbing method, device and equipment based on point cloud data collision detection | |
| CN112150427A (en) | Mixed unstacking method, device and equipment based on point cloud information | |
| CN115330824A (en) | Box body grabbing method and device and electronic equipment | |
| JP2012137841A (en) | Picking system and picking method | |
| US11839980B2 (en) | Image processing apparatus monitoring target, control method therefor, and storage medium storing control program therefor | |
| DE112021003955T5 (en) | Information processing device and information processing method | |
| Martinez et al. | Automated 3D vision guided bin picking process for randomly located industrial parts | |
| CN108145712B (en) | Method and device for sorting articles by robot and robot | |
| JP2014174628A (en) | Image recognition method | |
| CN103802107A (en) | Method for achieving industrial mechanical arm with vision | |
| US11823414B2 (en) | Information processing device, information processing method, and information processing non-transitory computer readable medium | |
| CN114631114A (en) | Image processing apparatus, image processing method, and program | |
| CN111498213A (en) | Robot system with dynamic packaging mechanism | |
| WO2024142159A1 (en) | Control device, robot system, object presence/absence determination mehtod, and program |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |