CN109688715B - 静电纺丝与化学沉积技术制备柔性导电线路的方法及装置 - Google Patents
静电纺丝与化学沉积技术制备柔性导电线路的方法及装置 Download PDFInfo
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- CN109688715B CN109688715B CN201910081674.1A CN201910081674A CN109688715B CN 109688715 B CN109688715 B CN 109688715B CN 201910081674 A CN201910081674 A CN 201910081674A CN 109688715 B CN109688715 B CN 109688715B
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- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims abstract description 56
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims abstract description 44
- 239000011668 ascorbic acid Substances 0.000 claims abstract description 28
- 229960005070 ascorbic acid Drugs 0.000 claims abstract description 28
- 235000010323 ascorbic acid Nutrition 0.000 claims abstract description 28
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- 229910001961 silver nitrate Inorganic materials 0.000 claims abstract description 22
- 238000006243 chemical reaction Methods 0.000 claims abstract description 7
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- 239000007921 spray Substances 0.000 claims description 44
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
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- 229920000647 polyepoxide Polymers 0.000 claims description 4
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electrostatic Spraying Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201910081674.1A CN109688715B (zh) | 2019-01-28 | 2019-01-28 | 静电纺丝与化学沉积技术制备柔性导电线路的方法及装置 |
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CN201910081674.1A CN109688715B (zh) | 2019-01-28 | 2019-01-28 | 静电纺丝与化学沉积技术制备柔性导电线路的方法及装置 |
Publications (2)
Publication Number | Publication Date |
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CN109688715A CN109688715A (zh) | 2019-04-26 |
CN109688715B true CN109688715B (zh) | 2022-03-25 |
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CN201910081674.1A Active CN109688715B (zh) | 2019-01-28 | 2019-01-28 | 静电纺丝与化学沉积技术制备柔性导电线路的方法及装置 |
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Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN112122614B (zh) * | 2020-09-12 | 2022-09-27 | 青岛理工大学 | 一种基于自激发静电场驱动喷射沉积3d打印装置、工作方法及其应用 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100544820B1 (ko) * | 2003-04-22 | 2006-01-24 | 세이코 엡슨 가부시키가이샤 | 패턴의 형성 방법 및 디바이스의 제조 방법, 전기 광학장치 및 전자 기기 |
CN102692332A (zh) * | 2012-06-11 | 2012-09-26 | 东北大学 | 一种用于真空喷雾特性研究的镀膜装置 |
CN103906365A (zh) * | 2014-03-06 | 2014-07-02 | 广东工业大学 | 一种基于石墨烯的电子电路的制作设备及其制作方法 |
CN104010446A (zh) * | 2014-05-30 | 2014-08-27 | 西安工程大学 | 微滴喷射与化学沉积技术制备柔性导电线路的方法及装置 |
DE102014004631A1 (de) * | 2013-05-17 | 2014-11-20 | Mann + Hummel Gmbh | Vorrichtung und Verfahren zum elektrostatischen Verspinnen von Polymerlösungen und Filtermedium |
KR20140142481A (ko) * | 2013-06-04 | 2014-12-12 | 주식회사 나래나노텍 | 약액 정밀 토출용 스프레이 시스템, 및 이를 구비한 스프레이 방식의 패턴 인쇄 장치 |
CN105873370A (zh) * | 2016-04-26 | 2016-08-17 | 北京梦之墨科技有限公司 | 用于喷墨与液态金属混合打印的打印方法、装置及产品 |
-
2019
- 2019-01-28 CN CN201910081674.1A patent/CN109688715B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100544820B1 (ko) * | 2003-04-22 | 2006-01-24 | 세이코 엡슨 가부시키가이샤 | 패턴의 형성 방법 및 디바이스의 제조 방법, 전기 광학장치 및 전자 기기 |
CN102692332A (zh) * | 2012-06-11 | 2012-09-26 | 东北大学 | 一种用于真空喷雾特性研究的镀膜装置 |
DE102014004631A1 (de) * | 2013-05-17 | 2014-11-20 | Mann + Hummel Gmbh | Vorrichtung und Verfahren zum elektrostatischen Verspinnen von Polymerlösungen und Filtermedium |
KR20140142481A (ko) * | 2013-06-04 | 2014-12-12 | 주식회사 나래나노텍 | 약액 정밀 토출용 스프레이 시스템, 및 이를 구비한 스프레이 방식의 패턴 인쇄 장치 |
CN103906365A (zh) * | 2014-03-06 | 2014-07-02 | 广东工业大学 | 一种基于石墨烯的电子电路的制作设备及其制作方法 |
CN104010446A (zh) * | 2014-05-30 | 2014-08-27 | 西安工程大学 | 微滴喷射与化学沉积技术制备柔性导电线路的方法及装置 |
CN105873370A (zh) * | 2016-04-26 | 2016-08-17 | 北京梦之墨科技有限公司 | 用于喷墨与液态金属混合打印的打印方法、装置及产品 |
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Effective date of registration: 20240313 Address after: 065000 Da Wang Wu Si Village, Qiuzhuang Township, Anci District, Langfang City, Hebei Province Patentee after: Hebei Tianmei Anhong Cable Co.,Ltd. Country or region after: China Address before: 230000 floor 1, building 2, phase I, e-commerce Park, Jinggang Road, Shushan Economic Development Zone, Hefei City, Anhui Province Patentee before: Dragon totem Technology (Hefei) Co.,Ltd. Country or region before: China |