CN109684680A - A kind of soldered ball optimization method of BGA device - Google Patents
A kind of soldered ball optimization method of BGA device Download PDFInfo
- Publication number
- CN109684680A CN109684680A CN201811481528.XA CN201811481528A CN109684680A CN 109684680 A CN109684680 A CN 109684680A CN 201811481528 A CN201811481528 A CN 201811481528A CN 109684680 A CN109684680 A CN 109684680A
- Authority
- CN
- China
- Prior art keywords
- soldered ball
- fatigue life
- bga
- pad diameter
- bga device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000005457 optimization Methods 0.000 title claims abstract description 24
- 229910000679 solder Inorganic materials 0.000 claims abstract description 41
- 238000012360 testing method Methods 0.000 claims abstract description 11
- 230000001351 cycling effect Effects 0.000 claims abstract description 9
- 239000000945 filler Substances 0.000 claims abstract description 8
- 238000004088 simulation Methods 0.000 claims abstract description 6
- 230000004087 circulation Effects 0.000 claims description 5
- 238000009825 accumulation Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 238000013461 design Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 208000025599 Heat Stress disease Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000011158 quantitative evaluation Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
- G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
Abstract
The invention belongs to device packaging technique fields, and in particular to a kind of soldered ball optimization method of BGA device.This method includes the thermal fatigue characteristics using finite element method simulation BGA device soldered ball in temperature cycling test, calculates plastic strain energy density variable quantity of the soldered ball in temperature cycles；BGA device soldered ball total fatigue life is predicted according to pad diameter and plastic strain energy density variable quantity using Darveaux energy fatigue life prediction model；Predict the Solder Joint of BGA under different filler amount and lower pad diameter；And lower pad diameter and corresponding solder amount when the total fatigue life maximum of calculating.The present invention analyzes lower pad diameter and the relationship between BGA device soldered ball total fatigue life, and when can find out the total fatigue life maximum of BGA device soldered ball, the maximum value of corresponding lower pad diameter and corresponding solder amount are achieved in the optimization to soldered ball.
Description
Technical field
The invention belongs to device packaging technique fields, and in particular to a kind of soldered ball optimization method of BGA device.
Background technique
Currently, semiconductor devices just develops towards smaller characteristic size, more door numbers and chip I/O number direction.
BGA Package (BGA) becomes the encapsulation shape generallyd use due to its pitch size and good electrical and mechanical characteristic
Formula.BGA soldered ball serves not only as the input/output medium of device electricity, also plays a part of mechanical support to device.Due to its weldering
Ball bearing height ratio using other surfaces mounting technology it is much smaller, when soldered ball be in temperature cycles load under, be easy to cause
The heat fatigue of soldered ball, it is therefore necessary to which the soldered ball thermal fatigue failure mechanism of BGA device is furtherd investigate.In operating condition
Under, for BGA soldered ball often in temperature cycles load, long-term temperature cycles load can generate periodic stress in soldered ball
Strain path leads to the thermal fatigue failure of soldered ball.Temperature cycling test is accelerated to be usually utilized to the accelerated thermal fatigue failure procedure, and
The thermal fatigue property of quantitative evaluation solder joint.To the research of BGA package reliability primarily directed to the weldering of interface unit and pcb board
Ball, failure mechanism are mainly coefficient of thermal expansion mismatch during temperature cycles between device substrate and pcb board material, soldered ball
The variation of micro-structure and intermetallic compounds layer thickness.And knocked-down device is from factory to undergoing one section of storage before assembly
With the process of transport, it also will appear soldered ball fatigue and the failures such as soldered ball falls off, generate soldered ball integrity problem.Therefore, BGA is studied
The soldered ball optimization method of device has directive significance to the practical application of bga device.
Summary of the invention
(1) technical problems to be solved
The present invention proposes a kind of soldered ball optimization method of BGA device, is lost with solving how to improve the thermal fatigue resistance of BGA soldered ball
The technical issues of imitating performance.
(2) technical solution
In order to solve the above-mentioned technical problem, the present invention proposes a kind of soldered ball optimization method of BGA device, soldered ball optimization method
Include the following steps:
S1, the thermal fatigue characteristics using finite element method simulation BGA device soldered ball in temperature cycling test, calculate
Plastic strain energy density variable quantity of the soldered ball in temperature cycles；
S2, using Darveaux energy fatigue life prediction model, become according to pad diameter and plastic strain energy density
Change amount predicts BGA device soldered ball total fatigue life；
The Solder Joint of BGA when S3, prediction different filler amount and lower pad diameter；
Lower pad diameter and corresponding solder amount when S4, the total fatigue life maximum of calculating.
Further, in temperature cycling test in step sl, temperature range is -55 DEG C~125 DEG C, and high and low temperature stops
Staying the time is respectively 10min, and the heating-cooling time is respectively 2min, cycle period 24min, carries out 1400 circulations altogether.
Further, in step sl, by calculating the accumulation of the plastic energy of the 3rd temperature cycles, weldering is obtained
Plastic strain energy density variable quantity of the ball in temperature cycles.
Further, in step s 2, according to formula Nf=N0+Na, calculate the total fatigue life N of soldered ballf；Wherein,
N0=7860 Δ W
In formula, N0For the initialization cycle in crack, NaFor the expanded period in crack, d is the diameter of pad；Δ W answers for plasticity
Become energy density variable quantity.
Further, in step s3, using Surface Evolver software, pad diameter in fixation changes printing pricker
The i.e. lower pad diameter of the diameter of material, salient point solder amount is added with printing solder amount, corresponding solder joint volume is obtained, then carries out
BGA Solder joint shape prediction under different filler amount, finds the Solder Joint of optimal reliability.
Further, in step s 4, by changing lower pad diameter, corresponding BGA device soldered ball total tired longevity is calculated
Life；And fit the approximate function face between BGA device soldered ball total fatigue life and lower pad diameter；According to approximate function face,
It determines the maximum value of BGA device soldered ball total fatigue life, and thus finds out the maximum value of corresponding lower pad diameter and corresponding
Solder amount realizes the optimization to soldered ball.
(3) beneficial effect
The soldered ball optimization method of BGA device proposed by the present invention, including use finite element method simulation BGA device weldering
Thermal fatigue characteristics of the ball in temperature cycling test calculate plastic strain energy density variable quantity of the soldered ball in temperature cycles；
BGA is predicted according to pad diameter and plastic strain energy density variable quantity using Darveaux energy fatigue life prediction model
Device soldered ball total fatigue life；Predict the Solder Joint of BGA under different filler amount and lower pad diameter；And calculate total fatigue
Lower pad diameter and corresponding solder amount when service life maximum.The present invention is total by analyzing lower pad diameter and BGA device soldered ball
Relationship between fatigue life, when can find out the total fatigue life maximum of BGA device soldered ball, the maximum of corresponding lower pad diameter
Value and corresponding solder amount, are achieved in the optimization to soldered ball.
Specific embodiment
To keep the purpose of the present invention, content and advantage clearer, below with reference to embodiment, to specific implementation of the invention
Mode is described in further detail.
Solder Joint is the surface structure shape after sold joint, pressure suffered by overhead welding disk, overhead welding disk diameter and back welding
Disk diameter, volume of solder, surface tension and solder density determine the geometric shape of solder joint.It is generally believed that influencing solder joint
The big factor of the two of height be pad diameter and volume of solder, and solder joint height and solder joint reliably whether it is directly related.
The fatigue failure process of soldered ball is divided into two parts: the initialization in crack and the extension in crack.That is the total fatigue of soldered ball
Service life NfIt is constituted by two, the initialization cycle (N in crack0) and crack expanded period (Na)。
The present embodiment proposes a kind of soldered ball optimization method of BGA device, which specifically comprises the following steps:
S1, the thermal fatigue characteristics using finite element method simulation BGA device soldered ball in temperature cycling test, calculate
Plastic strain energy density variable quantity of the soldered ball in temperature cycles
BGA device is placed in temperature cycling test, temperature range is -55 DEG C~125 DEG C, the high and low temperature residence time point
Not Wei 10min, the heating-cooling time is respectively 2min, cycle period 24min, carries out 1400 circulations altogether.After every circulation 200 times,
It takes out sample and carries out solder ball shear strength test using the shearing force mode of DAGE4000 system.It is surveyed by solder ball shear strength
Examination carries out Electronic Speculum observation to the plane of disruption and follows with the use of finite element analysis software ANSYS simulation BGA device soldered ball in temperature
Thermal fatigue characteristics in ring test calculate the accumulation of the plastic energy of the 3rd temperature cycles, obtain soldered ball in temperature cycles
In plastic strain energy density variable quantity.
S2, Darveaux energy fatigue life prediction model prediction BGA device soldered ball total fatigue life is used
According to formula Nf=N0+Na, calculate the total fatigue life N of soldered ballf.Wherein,
N0=7860 Δ W
In formula, d is the diameter of pad；Δ W is plastic strain energy density variable quantity.
The Solder Joint of BGA when S3, prediction different filler amount and lower pad diameter
Using Surface Evolver software, pad diameter in fixation, the i.e. lower pad of diameter for changing printing solder is straight
Salient point solder amount is added with printing solder amount, obtains corresponding solder joint volume, then carry out the BGA under different filler amount by diameter
Solder joint shape prediction finds the Solder Joint of optimal reliability.
Lower pad diameter and corresponding solder amount when S4, the total fatigue life maximum of calculating
In the Solder Joint optimization of BGA, multiple design variable points are selected in entire design variable compartment equalization,
Acquire its target function value Nf, N is fitted by above-mentioned multiple data pointsfApproximate function face, by NfDirectly it is expressed as under design variable
Pad dbApproximate function, in conjunction with numerical optimization techniques, from NfApproximate function face determine NfMaximum value, and obtain corresponding
The i.e. lower pad diameter d of design variablebMaximum value, to realize optimization to soldered ball.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the technical principles of the invention, several improvement and deformations can also be made, these improvement and deformations
Also it should be regarded as protection scope of the present invention.
Claims (6)
1. a kind of soldered ball optimization method of BGA device, which is characterized in that the soldered ball optimization method includes the following steps:
S1, the thermal fatigue characteristics using finite element method simulation BGA device soldered ball in temperature cycling test, calculate soldered ball
Plastic strain energy density variable quantity in temperature cycles；
S2, using Darveaux energy fatigue life prediction model, according to pad diameter and plastic strain energy density variable quantity,
Predict BGA device soldered ball total fatigue life；
The Solder Joint of BGA when S3, prediction different filler amount and lower pad diameter；
Lower pad diameter and corresponding solder amount when S4, the total fatigue life maximum of calculating.
2. soldered ball optimization method as described in claim 1, which is characterized in that the temperature cycling test in step sl
In, temperature range is -55 DEG C~125 DEG C, and the high and low temperature residence time is respectively 10min, and the heating-cooling time is respectively 2min, circulation
Period is 24min, carries out 1400 circulations altogether.
3. soldered ball optimization method as described in claim 1, which is characterized in that in step sl, followed by calculating the 3rd temperature
The accumulation of the plastic energy of ring obtains plastic strain energy density variable quantity of the soldered ball in temperature cycles.
4. soldered ball optimization method as described in claim 1, which is characterized in that in step s 2, according to formula Nf=N0+Na, meter
Calculate the total fatigue life N of soldered ballf；Wherein,
N0=7860 Δ W
In formula, N0For the initialization cycle in crack, NaFor the expanded period in crack, d is the diameter of pad；Δ W is plastic energy
Metric density variable quantity.
5. soldered ball optimization method as described in claim 1, which is characterized in that in step s3, using Surface Evolver
Software, pad diameter in fixation change the i.e. lower pad diameter of diameter of printing solder, by salient point solder amount with print solder amount phase
Add, obtain corresponding solder joint volume, then carries out the BGA Solder joint shape prediction under different filler amount, find optimal reliability
Solder Joint.
6. soldered ball optimization method as described in claim 1, which is characterized in that in step s 4, by changing lower pad diameter,
Calculate corresponding BGA device soldered ball total fatigue life；And it fits between BGA device soldered ball total fatigue life and lower pad diameter
Approximate function face；According to the approximate function face, the maximum value of BGA device soldered ball total fatigue life is determined, and thus look for
The maximum value of corresponding lower pad diameter and corresponding solder amount out realize the optimization to soldered ball.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811481528.XA CN109684680A (en) | 2018-12-05 | 2018-12-05 | A kind of soldered ball optimization method of BGA device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811481528.XA CN109684680A (en) | 2018-12-05 | 2018-12-05 | A kind of soldered ball optimization method of BGA device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109684680A true CN109684680A (en) | 2019-04-26 |
Family
ID=66187057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811481528.XA Pending CN109684680A (en) | 2018-12-05 | 2018-12-05 | A kind of soldered ball optimization method of BGA device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109684680A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112309882A (en) * | 2020-09-21 | 2021-02-02 | 中国电子科技集团公司第十三研究所 | Three-dimensional integrated device welding reliability test method and monitoring system |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101984442A (en) * | 2010-10-29 | 2011-03-09 | 北京工业大学 | Method for predicting fatigue life of lead-free solder joint in electronic packaging |
| CN102148215A (en) * | 2011-01-21 | 2011-08-10 | 哈尔滨理工大学 | Interconnection structure for improving reliability of soldering spot of soft soldering of CCGA (Ceramic Column Grid Array) device and implementation method |
| CN103778292A (en) * | 2014-01-23 | 2014-05-07 | 北京航空航天大学 | Method for predicting fatigue life of BGA (Ball Grid Array) welding spot under heat-vibration combined loads |
| CN107203666A (en) * | 2017-05-22 | 2017-09-26 | 北京航空航天大学 | A kind of Forecasting Methodology and system of BGA thermal fatigue life of solder joint |
-
2018
- 2018-12-05 CN CN201811481528.XA patent/CN109684680A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101984442A (en) * | 2010-10-29 | 2011-03-09 | 北京工业大学 | Method for predicting fatigue life of lead-free solder joint in electronic packaging |
| CN102148215A (en) * | 2011-01-21 | 2011-08-10 | 哈尔滨理工大学 | Interconnection structure for improving reliability of soldering spot of soft soldering of CCGA (Ceramic Column Grid Array) device and implementation method |
| CN103778292A (en) * | 2014-01-23 | 2014-05-07 | 北京航空航天大学 | Method for predicting fatigue life of BGA (Ball Grid Array) welding spot under heat-vibration combined loads |
| CN107203666A (en) * | 2017-05-22 | 2017-09-26 | 北京航空航天大学 | A kind of Forecasting Methodology and system of BGA thermal fatigue life of solder joint |
Non-Patent Citations (2)
| Title |
|---|
| 刘正伟: "基于柔性基板的叠层CSP无铅焊点热疲劳可靠性研究", 《电子设计工程》 * |
| 周文凡: "ＢＧＡ焊点的形态预测及可靠性优化设计", 《电子工艺技术》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112309882A (en) * | 2020-09-21 | 2021-02-02 | 中国电子科技集团公司第十三研究所 | Three-dimensional integrated device welding reliability test method and monitoring system |
| CN112309882B (en) * | 2020-09-21 | 2022-06-07 | 中国电子科技集团公司第十三研究所 | Three-dimensional integrated device welding reliability test method and monitoring system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Due et al. | Reliability of thermal interface materials: A review | |
| Samson et al. | Interface Material Selection and a Thermal Management Technique in Second-Generation Platforms Built on Intel® Centrino™ Mobile Technology. | |
| US10908110B2 (en) | Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures | |
| Zhao et al. | Reliability modeling of lead-free solder joints in wafer-level chip scale packages | |
| CN109684680A (en) | A kind of soldered ball optimization method of BGA device | |
| CN107515366B (en) | LED lead service life prediction method and test device based on coffee-Mason | |
| Yu et al. | Reliability assessment of preloaded solder joint under thermal cycling | |
| Wang et al. | Prediction of chip solder fatigue in IGBTs | |
| US20200135611A1 (en) | Implementing strain sensing thermal interface materials | |
| De Vries | Failure mechanism of anisotropic conductive adhesive interconnections in flip chip ICs on flexible substrates | |
| Sinha et al. | Predicting thermo-mechanical degradation of first-level thermal interface materials (TIMs) in flip-chip electronic packages | |
| Olatunji et al. | Durability of Copper Traces in Ball Grid Array (BGA) Assemblies under Sequential Harmonic Vibration and Temperature Cycling | |
| Garner et al. | Effect of compression loads on the solder joint reliability of flip chip BGA packages | |
| CN113779839A (en) | Method for calculating heat conduction effect of non-uniform thermal interface material | |
| Kilian et al. | Finite Element-Based Monitoring of Solder Degradation in Discrete SiC MOSFETs | |
| Zhong et al. | Viscoelastic Characterization and Simulation of Thermal Interface Materials | |
| CN106449453A (en) | Detection method for natural-convection heat exchange coefficients and thermal resistance of semiconductor package body | |
| Yao et al. | Lifetime prediction for press pack IGBT device by considering fretting wear failure | |
| Koh et al. | Thermal Performance of Advanced TIMs for High-Power FCLBGAs | |
| Quittard et al. | Use of a SPICE-based Transfer Function to Model the Absolute Humidity in a Power Semiconductor Module | |
| He et al. | Thermo-mechanical simulation and optimization analysis for warpage-induced PBGA solder joint failures | |
| Wang et al. | Thermo-Hygroscopic-Mechanical Coupling Simulation Method for Power Electronics under Power Cycling Test | |
| Kilian et al. | Assessing thermal resistance as a degradation metric for solder bump arrays in discrete SiC MOSFET packages | |
| Venkategowda et al. | Evaluating Solder Joint Reliability of Airborne Electronics under Harsh Environment Conditions | |
| Qu et al. | Thermal Resistance Simulation Analysis and Test Research of Wire Bond Ball Grid Array Package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190426 |