CN109680252B - Hydrophobic aluminum alloy composite material - Google Patents

Hydrophobic aluminum alloy composite material Download PDF

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CN109680252B
CN109680252B CN201811549297.1A CN201811549297A CN109680252B CN 109680252 B CN109680252 B CN 109680252B CN 201811549297 A CN201811549297 A CN 201811549297A CN 109680252 B CN109680252 B CN 109680252B
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layer
silicon dioxide
dioxide layer
aluminum alloy
molybdenum disulfide
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CN109680252A (en
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何录菊
马李
盘茂森
葛雅莉
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Guangdong University of Petrochemical Technology
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Guangdong University of Petrochemical Technology
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0623—Sulfides, selenides or tellurides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/10—Glass or silica
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3492—Variation of parameters during sputtering

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
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Abstract

The invention discloses a hydrophobic aluminum alloy composite material which comprises an aluminum alloy substrate layer, wherein an epoxy resin protective layer is coated on the aluminum alloy substrate layer, a first molybdenum disulfide layer, a first silicon dioxide layer, a second molybdenum disulfide layer, a second silicon dioxide layer, a third molybdenum disulfide layer and a third silicon dioxide layer are sequentially deposited on the epoxy resin protective layer, the first molybdenum disulfide layer, the first silicon dioxide layer, the second molybdenum disulfide layer, the second silicon dioxide layer, the third molybdenum disulfide layer and the third silicon dioxide layer are sequentially deposited and superposed on the epoxy resin protective layer, and the grain diameters of the first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are sequentially increased in a gradient mode. The hydrophobic aluminum alloy composite material has the characteristics of good hydrophobicity, high compactness, green and environment-friendly process and low cost.

Description

Hydrophobic aluminum alloy composite material
Technical Field
The invention relates to the technical field of aluminum alloy composite materials, in particular to a hydrophobic aluminum alloy composite material.
Background
The aluminum alloy material is used as a conventional engineering metal and has important significance in the industries of military affairs, communication, traffic, energy and the like
The application value of (2). The super-hydrophobic surface is a surface with a contact angle with water of more than 150 degrees and a rolling angle of less than 10 degrees, and the super-hydrophobic functional surface is constructed on an aluminum alloy material and can be widely applied to the scientific research and industrial fields of self-cleaning, ice coating prevention, oil-water separation, corrosion prevention, drag reduction, transportation increase and the like. However, since the aluminum alloy material is a hydrophilic material, the lyophilic property of the aluminum alloy material needs to be enhanced by constructing a proper microstructure on the surface, and the surface energy is reduced by modifying a low-surface-energy material on the basis of the microstructure, so that the super-hydrophobicity is obtained. However, the research on the preparation method of the aluminum alloy super-hydrophobic surface with extreme wettability is still in the exploration stage so far, and the existing preparation method has many problems in the aspects of safety, environmental protection, efficiency and the like, so that the preparation method of the engineering metal material surface microstructure and the surface with extreme wettability, which are suitable for industrialization, needs to be developed.
Currently, micro-nano special processing technology is often used for constructing a special microstructure required by an extremely-wetting surface of an engineering metal material, and according to different processing principles, the micro-nano special processing technology can be divided into a laser etching method, a mechanical cutting method, an electrochemical dissolution method, an electrochemical deposition method, an anodic oxidation method, an electrochemical deposition method, a chemical deposition method, a thermal oxidation method and the like. However, the existing methods have more or less problems, such as that the mechanical cutting technology is not mature at present; laser etching equipment is expensive; the electrochemical dissolution method uses a large amount of strong acid and strong base when preparing the extremely-wetting surface of the metal material, and has great harm to operators and the environment; the electroplating solution used in the electrochemical deposition method is added with more chemical reagents, so that the production cost is increased; most of the anodic oxidation methods adopt strong acid as electrolyte and have low efficiency, and the processing time is as long as several hours; the chemical deposition method is mainly characterized in that a large amount of noble metals such as gold, silver and the like are deposited on the surface of a metal material in a replacement way, and the production cost is high; the high-temperature oxidation method has the advantages of longer time for treating the metal surface, low production efficiency and high energy consumption.
In summary, the existing methods for preparing the super-hydrophobic aluminum alloy material include: high manufacturing cost, complex manufacturing process, low controllable degree of process parameters, long preparation time, great environmental pollution and the like, so the method is not suitable for preparing large-area and large-scale super-hydrophobic surfaces. And the obtained super-hydrophobic material has low hydrophobicity and poor durability.
In view of the above, chinese patent application CN107649352A discloses a method for rapidly manufacturing a large-sized super-hydrophobic aluminum alloy material with extreme wettability, comprising the steps of: 1) pretreating an aluminum alloy material; 2) etching the aluminum alloy material; 3) and hydrophobization treatment of the aluminum alloy material. The method can rapidly obtain the super-hydrophobic aluminum alloy material through three simple steps of pretreatment, etching treatment and hydrophobization treatment of the aluminum alloy material, and the contact angle of the prepared super-hydrophobic aluminum alloy material is as high as 155-165 degrees, and the rolling angle is less than 10 degrees. The preparation process has the advantages of simple operation, low equipment dependence, no need of expensive equipment, no influence of the shape of a base material, and wide application in large-scale industrial production. By the method, the high-performance super-hydrophobic aluminum alloy material can be obtained, and the manufacturing cost of the super-hydrophobic aluminum alloy material is greatly reduced. However, it must be seen that the treatment process of the process requires etching treatment based on the consideration of the bonding force, and inevitably generates the discharge of a large amount of chemical wastewater, which is contrary to the theme of green environmental protection, and the etching treatment also causes the loss of the aluminum alloy material.
Meanwhile, the chinese patent application CN106903034A discloses a super-hydrophobic aluminum alloy surface preparation method and a super-hydrophobic aluminum alloy surface, wherein the super-hydrophobic aluminum alloy surface preparation method mainly comprises the following steps: aluminum substrate pretreatment, including cutting, grinding, polishing and cleaning; photoetching, cleaning and drying; etching with 0.05M NaOH at 80 deg.C for 4.5-5.5 min; then treating with 100 ℃ boiling water for 45-50 minutes; cleaning and drying; and (5) post-treatment. The method disclosed by the invention can reduce the preparation difficulty and the operation complexity while ensuring the surface performance of the super-hydrophobic aluminum alloy, reduce the manufacturing cost of the super-hydrophobic aluminum alloy surface, and is suitable for large-scale application. Similarly, the processes of polishing and cleaning, photoetching treatment, cleaning and drying in the process are complicated, and waste water discharge cannot be avoided.
In addition, the chinese patent application CN108857273A discloses a 7075 aluminum alloy superhydrophobic surface preparation process, which belongs to the field of electrodeposition application, and solves the problem of preparing a superhydrophobic structure, and the preparation process comprises the following steps: polishing the surface of the aluminum alloy by adopting metallographic abrasive paper to make the surface smooth; polishing the surface of the polished workpiece by using a metallographic specimen polishing machine, and placing the polished workpiece in deionized water for ultrasonic cleaning; constructing a pit-shaped structure on the surface of the polished workpiece by using a laser marking machine, placing the workpiece in deionized water for ultrasonic cleaning, and drying; performing nickel ion electrodeposition on the workpiece substrate subjected to laser treatment, and placing the workpiece substrate in deionized water for ultrasonic cleaning; controlling the electrodeposition time of the workpiece to be about 4 min; the plating solution comprises the following components: NiSO4.6H2O, triammonium citrate, ammonia water and ammonium acetate; and (3) placing the deposited surface in a drying oven for heat treatment at 150 ℃, preserving the heat for 2 hours and cooling the surface to room temperature along with the furnace. The surface hydrophobicity of the invention is better, and the hydrophobic contact angle of the surface prepared by laser electrodeposition composite preparation is up to 152 degrees. The process is complicated andthe problem of waste water discharge is likewise unavoidable.
Disclosure of Invention
The invention mainly aims to provide the hydrophobic aluminum alloy composite material, which takes an aluminum alloy material as a substrate material and has the characteristics of good hydrophobicity, high compactness, green and environment-friendly process and low cost. .
The invention can be realized by the following technical scheme:
the invention discloses a hydrophobic aluminum alloy composite material which comprises an aluminum alloy substrate layer, wherein an epoxy resin protective layer is coated on the aluminum alloy substrate layer, a first molybdenum disulfide layer, a first silicon dioxide layer, a second molybdenum disulfide layer, a second silicon dioxide layer, a third molybdenum disulfide layer and a third silicon dioxide layer are sequentially deposited on the epoxy resin protective layer, the first molybdenum disulfide layer, the first silicon dioxide layer, the second molybdenum disulfide layer, the second silicon dioxide layer, the third molybdenum disulfide layer and the third silicon dioxide layer are sequentially deposited and superposed on the epoxy resin protective layer, and the grain diameters of the first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are sequentially increased in a gradient manner.
Further, the first silicon dioxide layer has a thickness of 10 to 100 μm and a surface roughness of 2 to 6 μm.
Further, the second silicon dioxide layer has a thickness of 10 to 100 μm and a surface roughness of 2 to 6 μm.
Further, the first molybdenum disulfide layer has a thickness of 10-20 microns and is deposited on the epoxy resin protective layer by a magnetron sputtering method.
Further, a second molybdenum disulfide layer having a thickness of 10 to 20 micrometers is deposited on the first silicon dioxide layer by a magnetron sputtering method.
Further, a third molybdenum disulfide layer having a thickness of 10-20 microns is deposited on the second silicon dioxide layer by magnetron sputtering.
Further, a third silicon dioxide layer having a thickness of 2-6 microns is deposited on the third molybdenum disulfide layer by magnetron sputtering.
Further, the first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are deposited by magnetron sputtering by taking modified 3-aminopropyl methyl dioxysilane as a target material.
Further, the magnetron sputtering conditions of the first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are as follows: bias voltage of 100V-150V, medium frequency current of 3-8A, argon: 100-150sccM, the flow of oxygen is gradually reduced from 150sccM to 50sccM, and the sputtering time is 3-6 minutes.
The hydrophobic aluminum alloy composite material has the following beneficial technical effects:
the first and the second silicon dioxide layers and the third silicon dioxide layer are deposited on the epoxy resin protective layer, and the silicon dioxide layer forms a better hydrophobic layer on the surface of the aluminum alloy substrate; meanwhile, the grain diameters of the first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are sequentially increased in a gradient mode, the hydrophobic gaps among different silicon dioxide layers are sequentially increased from the aluminum alloy substrate to the outside, the hydrophobic effect of the surface of the aluminum alloy material is effectively guaranteed, and through testing, the contact angle of the surface of the aluminum alloy material is 157-165 degrees;
secondly, the compactness is good, if a pure vapor deposition silicon dioxide layer is adopted to form a hydrophobic layer on the surface of the aluminum alloy substrate, the hydrophobic layer of the silicon dioxide formed by magnetron sputtering is looser and easy to fall off from the surface of the aluminum alloy substrate, which is not beneficial to maintaining the loosening effect of the aluminum alloy material, molybdenum disulfide particles can enter gaps of the silicon dioxide hydrophobic layers to generate a friction-increasing lubricating effect by depositing molybdenum disulfide among different silicon dioxide hydrophobic layers, so that adverse effects caused by the fact that the hydrophobic layers are too loose are avoided, moreover, particles among different molybdenum disulfide layers form point contact with each other, a hydrophobic framework is formed, and a hydrophobic channel cannot be blocked, and on the basis of the reason, the thicknesses of the first molybdenum disulfide layer, the second molybdenum disulfide layer and the third molybdenum disulfide layer are not too thick or too thin, the hydrophobic channel is blocked due to too thick layers, and the compactness of the hydrophobic layer cannot be influenced due to too thin layers due to the insufficient exertion of the framework effect;
the process is green and environment-friendly, the epoxy resin protective layer is coated on the surface of the aluminum alloy substrate, the function of protecting the surface of the substrate is achieved, the photocuring property of the epoxy resin is utilized, the bonding force between the first silicon dioxide layer and the aluminum alloy substrate is ensured, etching treatment is not needed, waste water discharge is avoided, and the process is green and environment-friendly;
fourthly, the cost is low, the whole preparation process of the hydrophobic aluminum alloy composite material can be completed in a magnetron sputtering system, continuous production control can be realized without sequence conversion, the preparation time is saved, large-scale production is facilitated, and the cost is saved by more than 30% compared with the cost in the traditional mode.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the following provides a detailed description of the product of the present invention with reference to the examples.
The invention discloses a hydrophobic aluminum alloy composite material which comprises an aluminum alloy substrate layer, wherein an epoxy resin protective layer is coated on the aluminum alloy substrate layer, a first molybdenum disulfide layer, a first silicon dioxide layer, a second molybdenum disulfide layer, a second silicon dioxide layer, a third molybdenum disulfide layer and a third silicon dioxide layer are sequentially deposited on the epoxy resin protective layer, the first molybdenum disulfide layer, the first silicon dioxide layer, the second molybdenum disulfide layer, the second silicon dioxide layer, the third molybdenum disulfide layer and the third silicon dioxide layer are sequentially deposited and superposed on the epoxy resin protective layer, and the grain diameters of the first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are sequentially increased in a gradient manner.
Further, the first silicon dioxide layer has a thickness of 10 to 100 μm and a surface roughness of 2 to 6 μm.
Further, the second silicon dioxide layer has a thickness of 10 to 100 μm and a surface roughness of 2 to 6 μm.
Further, the first molybdenum disulfide layer has a thickness of 10-20 microns and is deposited on the epoxy resin protective layer by a magnetron sputtering method.
Further, a second molybdenum disulfide layer having a thickness of 10 to 20 micrometers is deposited on the first silicon dioxide layer by a magnetron sputtering method.
Further, a third molybdenum disulfide layer having a thickness of 10-20 microns is deposited on the second silicon dioxide layer by magnetron sputtering.
Further, a third silicon dioxide layer having a thickness of 2-6 microns is deposited on the third molybdenum disulfide layer by magnetron sputtering.
Further, the first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are deposited by magnetron sputtering by taking modified 3-aminopropyl methyl dioxysilane as a target material.
Further, the magnetron sputtering conditions of the first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are as follows: bias voltage of 100V-150V, medium frequency current of 3-8A, argon: 100-150sccM, the flow of oxygen is gradually reduced from 150sccM to 50sccM, and the sputtering time is 3-6 minutes.
Example 1
The invention discloses a hydrophobic aluminum alloy composite material which comprises an aluminum alloy substrate layer, wherein an epoxy resin protective layer is coated on the aluminum alloy substrate layer, a first molybdenum disulfide layer, a first silicon dioxide layer, a second molybdenum disulfide layer, a second silicon dioxide layer, a third molybdenum disulfide layer and a third silicon dioxide layer are sequentially deposited on the epoxy resin protective layer, the first molybdenum disulfide layer, the first silicon dioxide layer, the second molybdenum disulfide layer, the second silicon dioxide layer, the third molybdenum disulfide layer and the third silicon dioxide layer are sequentially deposited and superposed on the epoxy resin protective layer, and the grain diameters of the first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are sequentially increased in a gradient manner.
In this embodiment, the first silicon dioxide layer has a thickness of 100 μm and a surface roughness of 2-6 μm. The second silicon dioxide layer has a thickness of 55 μm and a surface roughness of 2-6 μm. The first molybdenum disulfide layer, having a thickness of 10 microns, was deposited on the epoxy protective layer by magnetron sputtering. The second molybdenum disulfide layer, having a thickness of 20 microns, was deposited on the first silicon dioxide layer by magnetron sputtering. The third molybdenum disulphide layer, having a thickness of 15 μm, was deposited on the second silicon dioxide layer by means of magnetron sputtering. The third silicon dioxide layer, having a thickness of 2 microns, was deposited on the third molybdenum disulphide by means of magnetron sputtering. The first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are deposited by magnetron sputtering by taking modified 3-aminopropyl methyl dioxysilane as a target material. The magnetron sputtering conditions of the first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are as follows: bias voltage of 100V-150V, medium frequency current of 3-8A, argon: 100-150sccM, the flow of oxygen is gradually reduced from 150sccM to 50sccM, and the sputtering time is 3-6 minutes. The specific thickness is adjusted.
Example 2
The invention discloses a hydrophobic aluminum alloy composite material which comprises an aluminum alloy substrate layer, wherein an epoxy resin protective layer is coated on the aluminum alloy substrate layer, a first molybdenum disulfide layer, a first silicon dioxide layer, a second molybdenum disulfide layer, a second silicon dioxide layer, a third molybdenum disulfide layer and a third silicon dioxide layer are sequentially deposited on the epoxy resin protective layer, the first molybdenum disulfide layer, the first silicon dioxide layer, the second molybdenum disulfide layer, the second silicon dioxide layer, the third molybdenum disulfide layer and the third silicon dioxide layer are sequentially deposited and superposed on the epoxy resin protective layer, and the grain diameters of the first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are sequentially increased in a gradient manner.
In this example, the first silica layer has a thickness of 55 μm and a surface roughness of 2 to 6 μm. The second silicon dioxide layer has a thickness of 10 μm and a surface roughness of 2-6 μm. The first molybdenum disulfide layer, having a thickness of 20 microns, was deposited on the epoxy protective layer by magnetron sputtering. The second molybdenum disulfide layer, 15 microns thick, was deposited on the first silicon dioxide layer by magnetron sputtering. The third molybdenum disulfide layer, having a thickness of 10 microns, was deposited on the second silicon dioxide layer by magnetron sputtering. The third silicon dioxide layer, having a thickness of 6 microns, was deposited on the third molybdenum disulphide by means of magnetron sputtering. The first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are deposited by magnetron sputtering by taking modified 3-aminopropyl methyl dioxysilane as a target material. The magnetron sputtering conditions of the first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are as follows: bias voltage of 100V-150V, medium frequency current of 3-8A, argon: 100-150sccM, gradually reducing the flow of oxygen from 150sccM to 50sccM, and regulating the sputtering time for 3-6 minutes by specifically combining the thickness.
Example 3
The invention discloses a hydrophobic aluminum alloy composite material which comprises an aluminum alloy substrate layer, wherein an epoxy resin protective layer is coated on the aluminum alloy substrate layer, a first molybdenum disulfide layer, a first silicon dioxide layer, a second molybdenum disulfide layer, a second silicon dioxide layer, a third molybdenum disulfide layer and a third silicon dioxide layer are sequentially deposited on the epoxy resin protective layer, the first molybdenum disulfide layer, the first silicon dioxide layer, the second molybdenum disulfide layer, the second silicon dioxide layer, the third molybdenum disulfide layer and the third silicon dioxide layer are sequentially deposited and superposed on the epoxy resin protective layer, and the grain diameters of the first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are sequentially increased in a gradient manner.
In this embodiment, the first silicon dioxide layer has a thickness of 10 μm and a surface roughness of 2-6 μm. The second silicon dioxide layer has a thickness of 100 μm and a surface roughness of 2-6 μm. The first molybdenum disulfide layer, 15 microns thick, was deposited on the epoxy protective layer by magnetron sputtering. The second molybdenum disulfide layer, having a thickness of 10 microns, was deposited on the first silicon dioxide layer by magnetron sputtering. A third molybdenum disulfide layer having a thickness of 20 microns was deposited on the second silicon dioxide layer by magnetron sputtering. The third silicon dioxide layer, having a thickness of 4 microns, was deposited on the third molybdenum disulphide by means of magnetron sputtering. The first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are deposited by magnetron sputtering by taking modified 3-aminopropyl methyl dioxysilane as a target material. The magnetron sputtering conditions of the first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are as follows: bias voltage of 100V-150V, medium frequency current of 3-8A, argon: 100-150sccM, the flow of oxygen is gradually reduced from 150sccM to 50sccM, the sputtering time is 3-6 minutes, and the specific combination thickness is adjusted.
Example 4
The invention discloses a hydrophobic aluminum alloy composite material which comprises an aluminum alloy substrate layer, wherein an epoxy resin protective layer is coated on the aluminum alloy substrate layer, a first molybdenum disulfide layer, a first silicon dioxide layer, a second molybdenum disulfide layer, a second silicon dioxide layer, a third molybdenum disulfide layer and a third silicon dioxide layer are sequentially deposited on the epoxy resin protective layer, the first molybdenum disulfide layer, the first silicon dioxide layer, the second molybdenum disulfide layer, the second silicon dioxide layer, the third molybdenum disulfide layer and the third silicon dioxide layer are sequentially deposited and superposed on the epoxy resin protective layer, and the grain diameters of the first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are sequentially increased in a gradient manner.
In this embodiment, the first silica layer has a thickness of 80 μm and a surface roughness of 2 to 6 μm. The second silicon dioxide layer has a thickness of 20 μm and a surface roughness of 2-6 μm. The first molybdenum disulfide layer, having a thickness of 18 microns, was deposited on the epoxy protective layer by magnetron sputtering. The second molybdenum disulfide layer, having a thickness of 12 microns, was deposited on the first silicon dioxide layer by magnetron sputtering. A third molybdenum disulfide layer having a thickness of 18 microns was deposited on the second silicon dioxide layer by magnetron sputtering. The third silicon dioxide layer, having a thickness of 3 microns, was deposited on the third molybdenum disulfide by magnetron sputtering. The first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are deposited by magnetron sputtering by taking modified 3-aminopropyl methyl dioxysilane as a target material. The magnetron sputtering conditions of the first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are as follows: bias voltage of 100V-150V, medium frequency current of 3-8A, argon: 100-150sccM, the flow of oxygen is gradually reduced from 150sccM to 50sccM, and the sputtering time is 3-6 minutes.
Example 5
The invention discloses a hydrophobic aluminum alloy composite material which comprises an aluminum alloy substrate layer, wherein an epoxy resin protective layer is coated on the aluminum alloy substrate layer, a first molybdenum disulfide layer, a first silicon dioxide layer, a second molybdenum disulfide layer, a second silicon dioxide layer, a third molybdenum disulfide layer and a third silicon dioxide layer are sequentially deposited on the epoxy resin protective layer, the first molybdenum disulfide layer, the first silicon dioxide layer, the second molybdenum disulfide layer, the second silicon dioxide layer, the third molybdenum disulfide layer and the third silicon dioxide layer are sequentially deposited and superposed on the epoxy resin protective layer, and the grain diameters of the first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are sequentially increased in a gradient manner.
In this embodiment, the first silicon dioxide layer has a thickness of 30 μm and a surface roughness of 2 to 6 μm. The second silicon dioxide layer has a thickness of 70 μm and a surface roughness of 2-6 μm. The first molybdenum disulfide layer, having a thickness of 13 microns, was deposited on the epoxy protective layer by magnetron sputtering. The second molybdenum disulfide layer, 17 microns thick, was deposited on the first silicon dioxide layer by magnetron sputtering. A third molybdenum disulfide layer having a thickness of 13 microns was deposited on the second silicon dioxide layer by magnetron sputtering. The third silicon dioxide layer, having a thickness of 5 microns, was deposited on the third molybdenum disulphide by means of magnetron sputtering. The first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are deposited by magnetron sputtering by taking modified 3-aminopropyl methyl dioxysilane as a target material. The magnetron sputtering conditions of the first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are as follows: bias voltage of 100V-150V, medium frequency current of 3-8A, argon: 100-150sccM, gradually reducing the flow of oxygen from 150sccM to 50sccM, and regulating the sputtering time for 3-6 minutes by specifically combining the thickness.
Comparative example 1
The only difference between comparative example 1 and example 5 is that there is no first, second, third molybdenum disulfide layer.
Comparative example 2
The only difference between comparative example 2 and example 5 is that no gradient is formed in the particle size between the first, second and third silica layers.
Comparative example 3
Comparative example 3 differs from example 5 in that there is no epoxy protective layer.
In order to evaluate the technical effects of the present invention, the performance tests of examples 1 to 5 and comparative examples 1 to 3 were performed, and the test results are shown in table 1:
table 1 results of performance testing
Figure 285270DEST_PATH_IMAGE002
The foregoing is merely a preferred embodiment of the invention and is not intended to limit the invention in any manner; as will be readily apparent to those skilled in the art from the disclosure herein, the present invention may be practiced without these specific details; however, those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention; meanwhile, any changes, modifications, and evolutions of the equivalent changes of the above embodiments according to the actual techniques of the present invention are still within the protection scope of the technical solution of the present invention.

Claims (9)

1. The hydrophobic aluminum alloy composite material comprises an aluminum alloy substrate layer and is characterized in that: the aluminum alloy substrate is characterized in that an epoxy resin protective layer is coated on the aluminum alloy substrate layer, a first molybdenum disulfide layer, a first silicon dioxide layer, a second molybdenum disulfide layer, a second silicon dioxide layer, a third molybdenum disulfide layer and a third silicon dioxide layer are sequentially deposited on the epoxy resin protective layer, the first molybdenum disulfide layer, the first silicon dioxide layer, the second molybdenum disulfide layer, the second silicon dioxide layer, the third molybdenum disulfide layer and the third silicon dioxide layer are sequentially deposited and superposed on the epoxy resin protective layer, and the grain diameters of the first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are sequentially increased in a gradient mode.
2. The hydrophobic aluminum alloy composite of claim 1, wherein: the first silicon dioxide layer has a thickness of 10-100 μm and a surface roughness of 2-6 μm.
3. The hydrophobic aluminum alloy composite of claim 1 or 2, wherein: the second silicon dioxide layer has a thickness of 10-100 μm and a surface roughness of 2-6 μm.
4. The hydrophobic aluminum alloy composite of claim 3, wherein: the first molybdenum disulfide layer has a thickness of 10-20 microns and is deposited on the epoxy resin protective layer by a magnetron sputtering method.
5. The hydrophobic aluminum alloy composite of claim 4, wherein: the second molybdenum disulfide layer has a thickness of 10-20 microns and is deposited on the first silicon dioxide layer by magnetron sputtering.
6. The hydrophobic aluminum alloy composite of claim 5, wherein: the third molybdenum disulfide layer has a thickness of 10-20 microns and is deposited on the second silicon dioxide layer by magnetron sputtering.
7. The hydrophobic aluminum alloy composite of claim 6, wherein: the third silicon dioxide layer has a thickness of 2-6 microns and is deposited on the third molybdenum disulfide by magnetron sputtering.
8. The hydrophobic aluminum alloy composite of claim 7, wherein: the first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are deposited by magnetron sputtering by taking modified 3-aminopropyl methyl dioxysilane as a target material.
9. The hydrophobic aluminum alloy composite of claim 8, wherein: the magnetron sputtering conditions of the first silicon dioxide layer, the second silicon dioxide layer and the third silicon dioxide layer are as follows: bias voltage of 100V-150V, medium frequency current of 3-8A, argon: 100-150sccm, gradually reducing the flow of oxygen from 150sccm to 50sccm, and the sputtering time is 3-6 minutes.
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