CN109673116A - A kind of anti-dazzle cover board - Google Patents
A kind of anti-dazzle cover board Download PDFInfo
- Publication number
- CN109673116A CN109673116A CN201811544244.0A CN201811544244A CN109673116A CN 109673116 A CN109673116 A CN 109673116A CN 201811544244 A CN201811544244 A CN 201811544244A CN 109673116 A CN109673116 A CN 109673116A
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- CN
- China
- Prior art keywords
- layer
- cover board
- dazzle cover
- dazzle
- transparent bodies
- Prior art date
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 26
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 24
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 12
- 150000002500 ions Chemical class 0.000 claims description 7
- 238000003475 lamination Methods 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 179
- 238000000034 method Methods 0.000 description 22
- 230000003287 optical effect Effects 0.000 description 13
- 238000004140 cleaning Methods 0.000 description 12
- 239000010408 film Substances 0.000 description 12
- 238000001035 drying Methods 0.000 description 10
- 230000000873 masking effect Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- 229910052719 titanium Inorganic materials 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 239000005357 flat glass Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000004506 ultrasonic cleaning Methods 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- CXOWYMLTGOFURZ-UHFFFAOYSA-N azanylidynechromium Chemical compound [Cr]#N CXOWYMLTGOFURZ-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000012459 cleaning agent Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 239000012495 reaction gas Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000009738 saturating Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000003666 anti-fingerprint Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- -1 chromium-silicon-aluminium Chemical compound 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000002086 nanomaterial Substances 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000010020 roller printing Methods 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- ZVWKZXLXHLZXLS-UHFFFAOYSA-N zirconium nitride Chemical compound [Zr]#N ZVWKZXLXHLZXLS-UHFFFAOYSA-N 0.000 description 2
- FWWXYLGCHHIKNY-UHFFFAOYSA-N 2-ethoxyethyl prop-2-enoate Chemical compound CCOCCOC(=O)C=C FWWXYLGCHHIKNY-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910010037 TiAlN Inorganic materials 0.000 description 1
- 229910026551 ZrC Inorganic materials 0.000 description 1
- TZHYBRCGYCPGBQ-UHFFFAOYSA-N [B].[N] Chemical compound [B].[N] TZHYBRCGYCPGBQ-UHFFFAOYSA-N 0.000 description 1
- UMVBXBACMIOFDO-UHFFFAOYSA-N [N].[Si] Chemical compound [N].[Si] UMVBXBACMIOFDO-UHFFFAOYSA-N 0.000 description 1
- UGACIEPFGXRWCH-UHFFFAOYSA-N [Si].[Ti] Chemical compound [Si].[Ti] UGACIEPFGXRWCH-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 description 1
- SJKRCWUQJZIWQB-UHFFFAOYSA-N azane;chromium Chemical compound N.[Cr] SJKRCWUQJZIWQB-UHFFFAOYSA-N 0.000 description 1
- IVHJCRXBQPGLOV-UHFFFAOYSA-N azanylidynetungsten Chemical compound [W]#N IVHJCRXBQPGLOV-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229910001651 emery Inorganic materials 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 210000003739 neck Anatomy 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- ZDHCZVWCTKTBRY-UHFFFAOYSA-N omega-Hydroxydodecanoic acid Natural products OCCCCCCCCCCCC(O)=O ZDHCZVWCTKTBRY-UHFFFAOYSA-N 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 229910003470 tongbaite Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
- B41M1/30—Printing on other surfaces than ordinary paper on organic plastics, horn or similar materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
- B41M1/34—Printing on other surfaces than ordinary paper on glass or ceramic surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0047—Digital printing on surfaces other than ordinary paper by ink-jet printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/025—Duplicating or marking methods; Sheet materials for use therein by transferring ink from the master sheet
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
- G02B1/113—Anti-reflection coatings using inorganic layer materials only
- G02B1/115—Multilayers
Abstract
This application discloses a kind of anti-dazzle cover boards.The anti-dazzle cover board includes at least transparent bodies, diffusing reflection layer and the first antireflection layer, the diffusing reflection layer is arranged on the first surface of the transparent bodies, and first antireflection layer is arranged on the surface of the side of the diffusing reflection layer far from the transparent bodies.In this way, the cover board translucency that can be improved realizes its anti-dazzle function.
Description
Technical field
This application involves cover board processing technique fields, more particularly to a kind of anti-dazzle cover board.
Background technique
General cover-plate glass does not mostly have anti-dazzle function at present or anti-dazzle function is poor, and such cover-plate glass is relatively strong
Reflection can be generated under the incidence of light source, caused user to see the image of oneself or local environment on cover-plate glass, seriously affected
The use of user；The reflection of strong light also will use family and generate dazzling sense.
To solve the above problems, there are two types of settling modes at present:
1) electrochemical filming embrane method makes cover-plate glass contain a kind of gluing body, applies small charge, and glue cuts out body and just shades, when
Photosensitive sensor is felt when dazzling the eyes strong light, and charge is just excited, cover-plate glass just not dazzle.But it can be produced during being coated with
Raw pollution.
2) protective film and protective liquid etc. are set on glass body and assist product, the basic machine of protective film and protective liquid work
Reason is: it has or is capable of forming the surface layer with hydrophilic interaction, prevents rainwater from forming water droplet, light is not irregular
Reflection, but these auxiliary products have many limitations in use condition, and service life is also shorter.
Summary of the invention
The application provides a kind of anti-dazzle cover board, with the cover board translucency of raising, realizes its anti-dazzle function.
In order to solve the above technical problems, the technical solution that the application uses is: providing a kind of anti-dazzle cover board, this is anti-
Dazzle cover board includes at least transparent bodies, diffusing reflection layer and the first antireflection layer, and the first of transparent bodies is arranged in diffusing reflection layer
On surface, the first antireflection layer is arranged on surface of the diffusing reflection layer far from the side of transparent bodies.
Wherein, anti-dazzle cover board further comprises the second antireflection layer being arranged on transparent bodies second surface, wherein
First surface is oppositely arranged with second surface.
Wherein, the first antireflection layer includes the first titanium oxide layer, silicon oxide layer and the second titanium oxide of successively lamination setting
Layer.
Wherein, the first titanium oxide layer thickness range is 10nm-50nm, and the thickness range of silicon oxide layer is 20nm-60nm, the
The thickness range of titanium dioxide layer is 10nm-50nm.
Wherein, the sum of the first titanium oxide layer, silicon oxide layer and thickness of the second titanium oxide layer are arranged to make anti-dazzle cover board
The Mohs' hardness on surface is greater than 7.0.
Wherein, average reflectance of first antireflection layer within the scope of visible light 380-780nm is less than 1%.
Wherein, coordinate value of the reflected light of anti-dazzle cover board in the CIE LAB colour space are as follows: 45≤L≤60, -1≤a≤
≤ 1, -4≤b≤4.
Wherein, diffusing reflection layer is the porous nanometer structure being formed on one side surface of transparent bodies in a manner of ion source bombardment
Layer.
Wherein, anti-dazzle cover board further comprises color layers, and color layers are arranged in the first antireflection layer far from transparent bodies
Side surface on.
Wherein, color layers include pattern layer or texture layer.
The beneficial effect of the application is: being different from the prior art, the embodiment of the present application anti-dazzle cover board includes at least transparent
Ontology, diffusing reflection layer and the first antireflection layer, the diffusing reflection layer are arranged on the first surface of the transparent bodies, and described
One antireflection layer is arranged on the surface of the side of the diffusing reflection layer far from the transparent bodies.In this way, this Shen
Please embodiment can be improved the light transmission rates of transparent bodies by the first antireflection layer, can be realized the anti-dazzle of anti-dazzle cover board
Function, while the reflected light not penetrated is carried out by diffusing reflection by diffusing reflection layer, the dazzle of anti-dazzle cover board can be further reduced.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the application anti-dazzle cover board first embodiment；
Fig. 2 is the structural schematic diagram of the first antireflection layer in Fig. 1 embodiment anti-dazzle cover board；
Fig. 3 is the structural schematic diagram of the application anti-dazzle cover board second embodiment；
Fig. 4 is the flow diagram of one embodiment of manufacturing method of Fig. 3 embodiment anti-dazzle cover board；
Fig. 5 is the idiographic flow schematic diagram of step S401 in Fig. 4 embodiment；
Fig. 6 is the structural schematic diagram of the application anti-dazzle cover board 3rd embodiment；
Fig. 7 is the flow diagram of one embodiment of manufacturing method of Fig. 6 embodiment anti-dazzle cover board；
Fig. 8 is the structural schematic diagram of one embodiment of the application terminal.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of embodiments of the present application, rather than whole embodiments.Based on this
Embodiment in application, those of ordinary skill in the art are obtained every other under the premise of not making creative labor
Embodiment shall fall in the protection scope of this application.
The application proposes a kind of cover board first, as shown in Figure 1, the present embodiment anti-dazzle cover board 101 includes at least transparent
Body 102, diffusing reflection layer 103 and the first antireflection layer 104, diffusing reflection layer 103 are arranged on the first surface of transparent bodies 102,
First antireflection layer 104 is arranged on the surface of side of the diffusing reflection layer 103 far from transparent bodies 102.
The present embodiment anti-dazzle cover board 101 can be the cover board of terminal, such as the cover board of mobile phone.By anti-dazzle cover board
101 when being installed on terminal body, and the transparent bodies 102 of anti-dazzle cover board 101 are arranged away from terminal body, i.e. anti-dazzle cover board
101 when in use using another side surface of the separate diffusing reflection layer 103 of transparent bodies 102 as outer surface.
In other embodiments, anti-dazzle cover board can be also used for the products such as household electrical appliances, automobile.
The present embodiment anti-dazzle cover board 101 is penetrated by the light that the first antireflection layer 104 can be improved transparent bodies 102
Rate can be realized the anti-dazzle function of anti-dazzle cover board 101, while be carried out the reflected light not penetrated by diffusing reflection layer 103
Diffusing reflection can be further reduced the dazzle of anti-dazzle cover board 101.
Further, consider that the first antireflection layer 104 is in visible light 380- from the physical features of the first antireflection layer 104
For average reflectance within the scope of 780nm less than 1%, which can be 0.2%, 0.5% and 0.8% etc.；First subtracts
The range of surface roughness in reflecting layer 104 can be 1nm-10nm, the surface roughness be specifically as follows 1nm, 2nm, 4nm,
6nm, 8nm and 10nm.
Further, consider from the material of transparent bodies 102, to realize said effect, transparent bodies 102 may include height
The ultra-clear glasses ontology of transmitance, or including other glass bodies, ceramic body, polystyrene ontology or polymethylacrylic acid
The transparent bodies of the high transmittances such as formicester ontology.
Optionally, the diffusing reflection layer 103 of the present embodiment is to be formed in 102 side table of transparent bodies in a manner of ion source bombardment
Porous nanometer structure layer on face.
Light can generate light reflection when transmitting in the medium with different refractivity.Light air and transparent bodies 102 it
Between can generate reflection when transmitting, the present embodiment (is gas in hole by the way that porous nanometer structure is arranged in a surface of transparent bodies 102
Body), to form diffusing reflection layer 103, the light for being incident to nano-pore can be made to be not reflected, therefore can be improved transparent bodies 102
To the transmitance of light.That is, porous nanometer structure can make the light mean refractive index of transparent bodies 102 closer to air
Optical index.
For the hardness for increasing anti-dazzle cover board 101, laminated construction is can be used in first antireflection layer 104 of the present embodiment, should
Laminated construction include successively lamination the first titanium oxide layer 201, silicon oxide layer 202 and the second oxygen on diffusing reflection layer 103 are set
Change titanium layer 203, as shown in Figure 2.
Further, it is examined from the thicknesses of layers of the first titanium oxide layer 201, silicon oxide layer 202 and the second titanium oxide layer 203
Consider, the first titanium oxide layer thickness range can be 10nm-50nm, which is specially 10nm, 20nm, 30nm, 40nm and 50nm；
The thickness range of silicon oxide layer can be 20nm-60nm, which is specially 20nm, 30nm, 40nm, 50nm and 60nm；Second
The thickness range of titanium oxide layer can be 10nm-50nm, which is specially 10nm, 20nm, 30nm, 40nm and 50nm.
Further, it is examined from the physical features of the first titanium oxide layer 201, silicon oxide layer 202 and the second titanium oxide layer 203
Consider, the sum of the first titanium oxide layer 201, silicon oxide layer 202 and thickness of the second titanium oxide layer 203 are arranged to make anti-dazzle cover board
The Mohs' hardness on 101 surface is greater than 7.0, which is specifically as follows 7.2,7.5,8.0 and 8.5 etc..
In a concrete application, coordinate value of the reflected light of anti-dazzle cover board 101 in the CIE LAB colour space are as follows: 45≤L
≦≤1≤60, -1≤a, -4≤b≤4.
To further increase anti-dazzle cover board to the transmitance of light, the application proposes the anti-dazzle cover board of second embodiment,
As shown in figure 3, the present embodiment anti-dazzle cover board 301 further comprises being arranged saturating on the basis of above-mentioned anti-dazzle cover board 101
The second antireflection layer 303 on the second surface of bright ontology 302, wherein first surface is oppositely arranged with second surface.
The present embodiment, can will be by the first anti-reflection by second antireflection layer 303 on the second surface of transparent bodies 302
The light for penetrating the reflection of layer 304 is transmitted, and therefore, can be improved the light transmission rate of anti-dazzle cover board 301.
Wherein, in order to simplify the manufacturing process and save the cost of anti-dazzle cover board 301, the second antireflection layer 303 and first
The material of antireflection layer 304, size are all the same, and the two is formed by same technique.
The application is it is further proposed that a kind of manufacturing method of anti-dazzle cover board, as shown in figure 4, the manufacturing method can be used for
State anti-dazzle cover board 301, specifically, the manufacturing method of the present embodiment the following steps are included:
S401: the surface of transparent bodies 302 is cleaned and is dried.
Since the cleanliness on 302 surface of transparent bodies is affected to coating process and ion source bombardment technique, need
The preferable mode of cleaning effect cleaning to transparent bodies 302 is used, the present embodiment can use ultrasonic cleaning side
Formula is cleaned and is dried to transparent bodies 302.
In a concrete application, step S401 can be realized by method as described in Figure 5, the present embodiment is specifically following to be walked
Suddenly include:
S501: being added cleaning agent in the first slot, and is heated to the first preset temperature, then by transparent bodies 302
It is put into the first slot, impregnates 3 minutes.
S502: being added cleaning agent in the second slot, and is heated to the second preset temperature, then by transparent bodies 302
It is put into the second slot, and transparent bodies 302 are cleaned 2 minutes by spray cleaning way.
S503: pure water is added in third slot, and transparent bodies 302 are put into third slot, then passes through ultrasonic cleaning
Mode cleans transparent bodies 302 2 minutes.
S504: ultrasonic cleaning agent being added in the 4th slot, and transparent bodies 302 are put into the 4th slot, then by super
Sound cleaning way cleans transparent bodies 302 2 minutes.
S505: pure water is added in the 5th slot and in the 6th slot, and transparent bodies 302 are put into the 5th slot, then leads to
It crosses ultrasonic cleaning mode to clean transparent bodies 302 5 minutes, then transparent bodies 302 are put into the 6th slot, and pass through ultrasound
Cleaning way cleans transparent bodies 302 5 minutes.
S506: transparent bodies 302 being put into the 7th slot and are dehydrated, and dewatered transparent bodies 302 are successively put
Enter in the 8th slot and heat dries dehydration in the 9th slot.
Wherein, the first slot to the 4th slot is common rinse bath, and the 5th slot and the 6th slot are ultrasonic tank, and the 7th slot is slow lifting
Slot is dehydrated slot, and the 8th slot and the 9th slot are drying tank.
Above-mentioned cleaning/drying process, cleaning/drying temperature and cleaning/drying time can be according to the materials of transparent bodies 302
The factors such as material and surface roughness carry out adaptation；After the present embodiment can also detect automatically cleaning every time by detector
Transparent plate body 302 surface cleanness, and according to the cleannes adjust or plan the process, clear of subsequent cleaning/drying
/ drying temperature and cleaning/drying time are washed, carries out cleaning and drying efficiency and effect to improve transparent bodies 302.
S402: the first surface of the transparent bodies 302 after drying is handled using ion source bombardment technique, saturating
Diffusing reflection layer 305 is formed on the first surface of bright ontology 302.
Specifically, the transparent bodies 302 after drying are placed in coating machine, are vacuumized；Under vacuum conditions, anode is used
Ion source bombards the first surface of transparent bodies 302, continues 2 minutes, unrestrained anti-to be formed on the first surface of transparent bodies 302
Penetrate layer 303.
Wherein, ion source technological parameter is as shown in Table 1:
Table one
| Background vacuum | 8.0×10—3Pa |
| Target-substrate distance | 10mm |
| Sputtering power | 20KW |
| Operating pressure | 0.9Pa |
| Transparent bodies | Glass |
| Argon flow | 100Sccm |
| Oxygen flow | 0Sccm |
S403: the first antireflection layer 304 is coated with and saturating away from a side surface of transparent bodies 302 in diffusing reflection layer 305
The second surface of bright ontology 302 is coated with to form the second antireflection layer 303.
Specifically, first by titanium target technique diffusing reflection layer 305 away from transparent bodies 102 a side surface and transparent
The second surface of body 302 sputters 3 minutes, to form the first titanium oxide layer 201；Then silicon target technique is in the first titanium oxide layer 201
It is sputtered 2 minutes away from a side surface of diffusing reflection layer 103 and the second surface of transparent bodies 302, to form silicon oxide layer 202；
Finally by titanium target technique silicon oxide layer 202 away from the first titanium oxide layer 201 a side surface and transparent bodies 302 second
Surface sputters 3 minutes, to form the second titanium oxide layer 203.
Wherein, titanium target technological parameter is as shown in Table 2:
Table two:
| Background vacuum | 8.0×10—3Pa |
| Target-substrate distance | 10mm |
| Sputtering power | 60KW |
| Operating pressure | 0.9Pa |
| Transparent bodies | Optical glass |
| Argon flow | 400Sccm |
| Oxygen flow | 150Sccm |
Titanium target technological parameter is as shown in Table 3:
Table three:
| Background vacuum | 8.0×10—3Pa |
| Target-substrate distance | 10mm |
| Sputtering power | 60KW |
| Operating pressure | 0.9Pa |
| Transparent bodies | Glass |
| Argon flow | 350Sccm |
| Oxygen flow | 120Sccm |
The sputtering plating method of the present embodiment is in the state of vacuum, to be filled with argon gas gas in magnetic control continuous film plating machine
Body ionizes argon gas, bombards target material surface under the influence of a magnetic field, while being also filled with reaction gas, target and reaction gas
It collides and reacts with target surface, from the compound deposition of reaction gas and target to diffusing reflection layer 305 away from transparent
On one side surface of ontology 302 and on the second surface of transparent bodies 302.
For further enrich cover board appearance, the application it is further proposed that fourth embodiment cover board, such as Fig. 6 institute
Show, the present embodiment cover board 601 and Fig. 1 embodiment cover board 301 the difference is that: the present embodiment cover board 601 further comprises
The color layers 604 that first antireflection layer 602 deviates from 603 side of diffusing reflection layer are set.
The color layers 604 of the present embodiment are pattern layer 604.Pattern layer 604 can be formed in by silk-screen printing technique
On one antireflection layer 602.Pattern layer 604 may include specific pattern mark, the expository writing as needed for the Logo of product, product
Word, product pattern and decorative pattern etc..
In one embodiment, the techniques such as laser engraving, chemical etching, ink printing can also be used to be formed on prime coat
Pattern or Logo, it is not limited here.
In another embodiment, color layers are texture layer, the texture layer can be transferred for magnetic texture layer, UV texture layer,
At least one of thermal transfer texture layer, the specific pattern of texture layer can flexible choices according to actual needs.
Wherein, the method for forming magnetic texture layer can be magnetic spraying, i.e., in spraying process, control magnetic by magnetic field
The distribution of property material, forms it into required textured pattern.
The method for forming UV transfer texture layer can process to be transferred and being imprinted using UV, i.e., by designed texture maps
Shape exports the Cheng Guanghui film or the glass film with laser drawing machine, is coated with a release layer in the first antireflection layer, and in release layer
Coating UV glue, and the first antireflection layer coated UV glue draws the film with light or the glass film fits closely, and is exposed into
Picture, and then texture maps pattern layer is just formed on the first antireflection layer.
The method for forming thermal transfer texture layer can be for PVC heat transfer film to be attached on the first antireflection layer, with default temperature
Degree baking preset time removes PVC film later to get thermal transfer texture is arrived.
In this way, can further make on the basis of above-described embodiment effect cover board present specific pattern or
Textured pattern etc..
In one embodiment, color layers can also be gradual change chromatograph.Specifically, gradual change chromatograph includes multilayer ink layer,
In, can upper formation multilayer ink layer by method as shown in Figure 7 in the first antireflection layer, the method packet of the present embodiment
It includes:
S701: the scheme of colour of gradual change chromatograph is obtained.
Specifically, can design the scheme of colour of gradual change chromatograph by computer simulator, which be can wrap
Include the first ink layer, the thickness of the second ink layer, area coverage and Color scheme.
S702: at least one masking baffle is prepared according to scheme of colour.
Specifically, being designed to obtain masking baffle according to scheme of colour, masking baffle is not provided with the first ink for covering
The region of layer and the second ink layer.
S703: masking baffle is placed on plastic film layer.
Wherein, masking baffle is for covering first area, first area be the first antireflection layer first surface on do not set
It is equipped with the region of the first ink layer.
S704: the first ink layer is set on the first antireflection layer.
Specifically, the first ink layer can be printed or be printed by silk-screen printing, roller printing or inkjet printing technology
On the first surface of the first antireflection layer.
S705: masking baffle is placed at least in the local surfaces of the first ink layer.
Wherein, masking baffle is to be not provided with the second ink on the first ink layer for covering second area, second area
The region of layer.
S706: the second ink layer is at least set in the local surfaces of the first ink layer.
Specifically, the second ink layer can be printed or be printed by silk-screen printing, roller printing or inkjet printing technology
On the first ink layer.
Further, masking baffle is placed at least in the local surfaces of the second ink layer.Wherein, masking baffle is for covering
Lid third region, third region are the region that the n-th ink layer (n is the integer greater than 2) is not provided on the second ink layer.N-th
The chemical gas that ink layer can be enhanced by optical coating, physical vapour deposition (PVD) (PVD), chemical vapor deposition (CVD), plasma
Mutually deposition (PECVD), reactivity DC penetrate the process deposits such as erosion, RF sputter or magnetron sputtering on the second ink layer.
The masking baffle mode used in through this embodiment, can block the first antireflection layer, the first ink layer, second
The different parts of ink layer or the n-th ink layer, to realize that color gradient gradient significantly shows effect.
Further, the thickness of the second ink layer can be by the first ink layer left border boundary to the right when spraying
It is gradually thinning, to obtain fade effect.Alternatively, can be sprayed to the first ink layer local surfaces after waiting the first ink layer dry
Apply at least one layer of second ink layer.It in other embodiments, can be after the second ink layer be dry, at least in the second ink layer
Local surfaces spray ink, to form third ink layer.Wherein, the thickness of the first ink layer, the second ink layer and third ink layer
Spend it is identical, but cover area be gradually reduced.For example, the first ink layer area coverage is the first antireflection layer area coverage
100%, the second ink layer area coverage is the 70% of the first antireflection layer area coverage, and third ink layer is the first antireflection layer
The 30% of area coverage.
The material of first ink layer, the second ink layer and third ink layer may include UV solidified resin, monomer, light-initiated
Agent, emery dust and additive, wherein may include pigment in additive；UV solidified resin may include epoxy acrylic resin, second
Oxygroup ethoxyethyl acrylate and modified polyurethane resin；Monomer may include TPGDA and HDDA；Photoinitiator can be
TPO；Pigment can be to dry type resin pigment.
In one embodiment, gradual change chromatograph may include multilayer dielectricity layer, and each layer of dielectric layer can be by nanostructure color
Crystal mixes composition with gloss oil.Wherein, nanostructure color crystal can be crushed to obtain by multilayer optical interference film, multilayer optical
Interference thin film can be to have first refractive index optical media player L1, L2 and the second refractive optical dielectric layer with alternating deposit
The structure of H1, H2, H3, that is to say, that multilayer optical interference film may include the second refractive optical being cascading
Dielectric layer H1, first refractive index optical media player L1, the second refractive optical dielectric layer H3, first refractive index optical media player L2
And the second refractive optical dielectric layer H2.
It in one embodiment, is the hardness and abrasion resistance properties that improve cover board, it can be further in the second table of transparent bodies
Transparent stiffening layer is arranged in face setting.
The material of transparent stiffening layer includes at least one of nitride and diamond-like-carbon or combination.The nitride is also
It can be nitrogen boride or nitrogen carbide.For example, silicon nitride, aluminium nitride, titanium nitride, chromium nitride, tantalum nitride, zirconium nitride, nitridation
Sial, TiAlN, chromium nitride aluminum, chromium nitride titanium aluminum, nitridation chromium-silicon-aluminium, titanium silicon nitride aluminium, boron nitride, nitrogen titanium boride, nitrogen boron
Change chromium, nitrogen titanium boride aluminium, nitrogen titanium boride silicon, nitrogen silicon boride titanium aluminium, TiCN, nitrogen chromium carbide, nitrogen zirconium carbide, in nitrogen tungsten carbide
At least one or combination.
Further, anti-fingerprint layer can also be set in transparent bodies second surface.Wherein, anti-fingerprint layer is with thin using having
Aqueous and the polymer coating of oleophobic property or the plated film of suitable material.
The application is it is further proposed that a kind of terminal, as shown in figure 8, Fig. 8 is the structural representation of one embodiment of the application terminal
Figure.The present embodiment terminal 801 includes anti-dazzle cover board 802, and the transparent bodies of anti-dazzle cover board are set away from terminal body 803
Set, i.e., transparent bodies be terminal 801 outermost.
The present embodiment anti-dazzle cover board 802 can be the various embodiments described above anti-dazzle cover board, structure and working principle, this
In do not repeat.
The present embodiment terminal 801 may include mobile phone, tablet computer or wearable device etc..
The embodiment of the present application anti-dazzle cover board can be widely used in many necks such as optical instrument, electronics, auto industry
Domain.
It is different from the prior art, the embodiment of the present application anti-dazzle cover board includes at least transparent bodies, diffusing reflection layer and first
Antireflection layer, the diffusing reflection layer are arranged on the first surface of the transparent bodies, and first antireflection layer is arranged in institute
On the surface for stating side of the diffusing reflection layer far from the transparent bodies.In this way, the embodiment of the present application subtracts by first
Reflecting layer can be improved the light transmission rate of transparent bodies, can be realized the anti-dazzle function of anti-dazzle cover board, while by unrestrained anti-
It penetrates layer and the reflected light not penetrated is subjected to diffusing reflection, the dazzle of anti-dazzle cover board can be further reduced.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the patents of the application, all to utilize this
Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field similarly includes in the scope of patent protection of the application.
Claims (10)
1. a kind of anti-dazzle cover board, which is characterized in that the anti-dazzle cover board includes at least transparent bodies, diffusing reflection layer and first
Antireflection layer, the diffusing reflection layer are arranged on the first surface of the transparent bodies, and first antireflection layer is arranged in institute
On the surface for stating side of the diffusing reflection layer far from the transparent bodies.
2. anti-dazzle cover board according to claim 1, which is characterized in that the anti-dazzle cover board further comprises that setting exists
The second antireflection layer on the transparent bodies second surface, wherein the first surface is oppositely arranged with the second surface.
3. anti-dazzle cover board according to claim 1, which is characterized in that first antireflection layer is set including successively lamination
The first titanium oxide layer, silicon oxide layer and the second titanium oxide layer set.
4. anti-dazzle cover board according to claim 3, which is characterized in that the first titanium oxide layer thickness range is
10nm-50nm, the thickness range of the silicon oxide layer are 20nm-60nm, and the thickness range of second titanium oxide layer is 10nm-
50nm。
5. anti-dazzle cover board according to claim 4, which is characterized in that first titanium oxide layer, the silica
The sum of the thickness of layer and second titanium oxide layer is arranged to make the Mohs' hardness of the anti-dazzle lid surface to be greater than 7.0.
6. anti-dazzle cover board according to claim 1, which is characterized in that first antireflection layer is in visible light 380-
Average reflectance within the scope of 780nm is less than 1%.
7. anti-dazzle cover board according to claim 1-6, which is characterized in that the reflected light of the anti-dazzle cover board
Coordinate value in the CIE LAB colour space are as follows: 45≤L≤60, ≦≤1-1≤a ,-4≤b≤4.
8. anti-dazzle cover board according to claim 1, which is characterized in that the diffusing reflection layer is in a manner of ion source bombardment
The porous nanometer structure layer being formed on one side surface of transparent bodies.
9. anti-dazzle cover board according to claim 1, which is characterized in that the anti-dazzle cover board further comprises color
Layer, the color layers are arranged on the surface of the side of first antireflection layer far from the transparent bodies.
10. anti-dazzle cover board according to claim 9, which is characterized in that the color layers include pattern layer or texture layer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811544244.0A CN109673116A (en) | 2018-12-17 | 2018-12-17 | A kind of anti-dazzle cover board |
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|---|---|---|---|
| CN201811544244.0A CN109673116A (en) | 2018-12-17 | 2018-12-17 | A kind of anti-dazzle cover board |
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Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103921487A (en) * | 2014-04-04 | 2014-07-16 | 武汉理工大学 | Dual-function film coated glass capable of realizing anti-dazzle performance and visible light antireflection and preparation method of glass |
| CN204203492U (en) * | 2014-07-22 | 2015-03-11 | 广州市光机电技术研究院 | A kind of anti-dazzle catoptron |
| CN105086627A (en) * | 2014-05-21 | 2015-11-25 | 中钞特种防伪科技有限公司 | Optically variable pigment and manufacturing method thereof |
| CN105260056A (en) * | 2015-09-30 | 2016-01-20 | 信利光电股份有限公司 | Touch screen manufacturing method, touch screen and touch apparatus |
| CN106585165A (en) * | 2016-12-06 | 2017-04-26 | 中钞特种防伪科技有限公司 | Optical anti-counterfeiting element, optical anti-counterfeiting product and manufacturing method of optical anti-counterfeiting element |
| CN207711549U (en) * | 2017-12-11 | 2018-08-10 | 伯恩光学(惠州)有限公司 | Cover sheet |
| CN207895093U (en) * | 2017-11-24 | 2018-09-21 | 江苏康耐特光学有限公司 | A kind of anti-blue light anti-dazzle plated film resin lens |
| CN108724858A (en) * | 2018-08-17 | 2018-11-02 | Oppo广东移动通信有限公司 | The shell of electronic device, the manufacturing process of electronic device and shell |
| CN108966552A (en) * | 2018-07-27 | 2018-12-07 | Oppo（重庆）智能科技有限公司 | Shell and preparation method thereof and electronic equipment |
| CN108966548A (en) * | 2018-07-05 | 2018-12-07 | Oppo广东移动通信有限公司 | Shell of electronic equipment and preparation method thereof, electronic equipment |
| CN210042485U (en) * | 2018-12-17 | 2020-02-07 | 佛山市易晟达科技有限公司 | Anti-dazzle apron |
-
2018
- 2018-12-17 CN CN201811544244.0A patent/CN109673116A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103921487A (en) * | 2014-04-04 | 2014-07-16 | 武汉理工大学 | Dual-function film coated glass capable of realizing anti-dazzle performance and visible light antireflection and preparation method of glass |
| CN105086627A (en) * | 2014-05-21 | 2015-11-25 | 中钞特种防伪科技有限公司 | Optically variable pigment and manufacturing method thereof |
| CN204203492U (en) * | 2014-07-22 | 2015-03-11 | 广州市光机电技术研究院 | A kind of anti-dazzle catoptron |
| CN105260056A (en) * | 2015-09-30 | 2016-01-20 | 信利光电股份有限公司 | Touch screen manufacturing method, touch screen and touch apparatus |
| CN106585165A (en) * | 2016-12-06 | 2017-04-26 | 中钞特种防伪科技有限公司 | Optical anti-counterfeiting element, optical anti-counterfeiting product and manufacturing method of optical anti-counterfeiting element |
| CN207895093U (en) * | 2017-11-24 | 2018-09-21 | 江苏康耐特光学有限公司 | A kind of anti-blue light anti-dazzle plated film resin lens |
| CN207711549U (en) * | 2017-12-11 | 2018-08-10 | 伯恩光学(惠州)有限公司 | Cover sheet |
| CN108966548A (en) * | 2018-07-05 | 2018-12-07 | Oppo广东移动通信有限公司 | Shell of electronic equipment and preparation method thereof, electronic equipment |
| CN108966552A (en) * | 2018-07-27 | 2018-12-07 | Oppo（重庆）智能科技有限公司 | Shell and preparation method thereof and electronic equipment |
| CN108724858A (en) * | 2018-08-17 | 2018-11-02 | Oppo广东移动通信有限公司 | The shell of electronic device, the manufacturing process of electronic device and shell |
| CN210042485U (en) * | 2018-12-17 | 2020-02-07 | 佛山市易晟达科技有限公司 | Anti-dazzle apron |
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