CN109672082A - A kind of the mode of laser group and its monitoring method of built-in monitoring shoot laser power - Google Patents
A kind of the mode of laser group and its monitoring method of built-in monitoring shoot laser power Download PDFInfo
- Publication number
- CN109672082A CN109672082A CN201910063251.7A CN201910063251A CN109672082A CN 109672082 A CN109672082 A CN 109672082A CN 201910063251 A CN201910063251 A CN 201910063251A CN 109672082 A CN109672082 A CN 109672082A
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- Prior art keywords
- laser
- photodiode
- mode
- group
- diode
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0262—Photo-diodes, e.g. transceiver devices, bidirectional devices
- H01S5/0264—Photo-diodes, e.g. transceiver devices, bidirectional devices for monitoring the laser-output
Abstract
A kind of the mode of laser group and its monitoring method of built-in monitoring shoot laser power, the mode of laser group includes substrate, there is the laser diode and photodiode in two different dies independently encapsulated on the substrate, there is or be packaged with diffraction optical element in the upper end of laser diode, there is side wall around laser diode and photodiode, there are cover board lens to be packaged for top, and reflecting medium is located at side of the cover board lens towards photodiode.The invention enables the emergent rays for passing through DOE can be reflected into module internal, and then is acquired and fed back to system by photodiode PD, so that system be allow to make corresponding actions according to shoot laser intensity, eliminates the potential danger to human body.
Description
Technical field
The present invention relates to mode of laser group fields, specifically, being related to one kind is built-in with monitoring device, it can be to laser emitting function
The mode of laser group that rate is monitored, and its monitoring method of adjustment.
Background technique
Laser generates the hot spot of specific shape by diffraction optical element (DOE), then emits after the sending of mode of laser group
The set of projection ray out is known as structure light.Structure light depth measurement needs laser light source, the power decision of laser product
Whether laser damages human body, common laser safety monitoring include be that PD (two pole of photoelectricity is added in laser module internal
Pipe) it is monitored, or by range sensor measurement, whether someone is close to laser emitter, and then controls laser power.
In above-mentioned first method, usual laser diode LD and photodiode PD are compounded in the same tube core,
DOE is packaged on the outside of tube core, LD emits laser, and PD receives laser, is monitored, can be obtained to PD state by interlock circuit
Know whether the working condition of LD normal, such as whether open, power it is whether too low or too high etc..But the PD in same tube core without
Method learn when laser from tube core be emitted after, especially by the later emergent ray state of DOE, i.e., by diffraction optical element it
The body surface i.e. light condition of background is projected afterwards, if missing, damage occurs in diffraction optical element, will cause emergent light function
Rate is too strong, there is the potential danger caused harm to the human body.
In above-mentioned second method, only from the Distance Judgment degree of danger of people and mode of laser group, it is saturating that collimation can not be perceived
Whether mirror and DOE (diffraction optical element) lose.
To sum up, the laser that mode of laser group issues can power attenuation after collimation lens and DOE (diffraction optical element)
And equalization, and then meet safe range.But if collimation lens and DOE occur damaging or Loss, above two monitoring
Method can not all make reply, and there are security risks.
Therefore, how laser emitting power is monitored, especially laser is carried out by DOE later emergent power
Monitoring prevents the laser power after DOE loses excessively high, becomes prior art urgent need to resolve so as to cause the injury to personnel
Technical problem.
Summary of the invention
It is an object of the invention to propose the mode of laser group and its monitoring method of a kind of built-in monitoring shoot laser power, energy
Enough that laser emitting power is monitored, especially laser is monitored by the later emergent power of DOE, improves laser
The applicability and timeliness of power monitoring.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of mode of laser group of built-in monitoring shoot laser power, it is characterised in that:
Including substrate, there is the laser diode and photodiode independently encapsulated on the substrate, described
The upper end of laser diode has or is packaged with diffraction optical element, has reflection on the emitting light path of diffraction optical element
Medium, so that the laser reflection light echo electric diode being emitted via diffraction optical element be measured.
Optionally, described on the substrate to there is the laser diode independently encapsulated and photodiode to refer to
The laser diode and photodiode are individually enclosed in two different tube cores.
Optionally, the upper end of tube core where the diffraction optical element is encapsulated in the laser diode.
Optionally, the substrate can be pcb board or FPC plate.
Optionally, the reflecting medium is located at the top of photodiode, or is located at outgoing above laser diode LD
Around hole.
Optionally, there is side wall around the laser diode and photodiode, top has cover board lens
(Cover Lens) is packaged, and the reflecting medium is located at side of the cover board lens towards photodiode.
Optionally, the cover board lens are the material of high transparency, and the reflecting medium is to be plated on the inside of cover board lens
High-reflecting film or reflectance ink.
Optionally, the cover board lens have black ink in the intersection with the side wall.
Optionally, the tube core of the laser diode and the photodiode PD are set side by side.
A kind of mode of laser group using above-mentioned built-in monitoring shoot laser power carries out the side of laser emitting power monitoring
Method, comprising:
In the production process of the mode of laser group, the electric current detected to photodiode carries out calibration record；?
In actual use, the electric current that photodiode passes through is detected, obtains second group of data, then subtract with second group of data
One group of data obtains data to the end, when data exceed a certain range, illustrates to be emitted that optical power is excessive, and diffraction optical element is damaged
It is bad, need to close laser and user prompted to send and repair, when data be lower than a certain range, illustrate be emitted optical power it is too low, prompt use
Family, which is sent, repairs, and is adjusted to laser diode.
The present invention is using increase can around cover lens (cover-plate glass) perforation hole or above photodiode PD
The reflecting medium of reflection laser, such as high anti-ink enable emergent ray to be reflected into module internal, and then by two pole of photoelectricity
Pipe PD acquires and feeds back system, so that system be allow to make corresponding actions according to shoot laser intensity, eliminates to human body
Potential danger.As security protection monitoring means, the present invention is emitted laser bodies optical power before the monitoring rate of optical power
Monitoring level of coverage is wider, and and then corresponding safeguard measure can also much sooner, and protection mechanism also improves and improves.
Detailed description of the invention
Fig. 1 is the schematic diagram of the mode of laser group of the built-in monitoring shoot laser power of specific embodiment according to the present invention.
The technical characteristic in appended drawing reference the respectively referred to generation in figure are as follows:
1, substrate；2, laser diode；3, diffraction optical element；4, photodiode；5, reflecting medium；6, side wall；7,
Cover board lens；8, black ink.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limiting the invention.It also should be noted that in order to just
Only the parts related to the present invention are shown in description, attached drawing rather than entire infrastructure.
The invention reside in laser diode LD and photodiode PD to be individually enclosed in two different tube cores, swashing
It is packaged with diffraction optical element DOE on the outside of tube core where optical diode, in the laser emitting optical path on the outside of DOE, especially
It is provided with reflecting medium above photodiode PD, so that two pole of photoelectricity can be reflected back by the emergent light of DOE
Pipe PD enables photodiode PD to measure reflected light, to know whether is DOE that laser diode LD is passed through
It is damaged, further can know whether current LD working condition is normal by tabling look-up, and adjust according to laser intensity
Corresponding voltage and current.
Referring to Fig. 1, the mode of laser group of the built-in monitoring shoot laser power of specific embodiment according to the present invention is shown
Schematic diagram.
The mode of laser group includes substrate 1, has the laser diode LD 2 and photoelectricity independently encapsulated on the substrate
Diode PD4 has or is packaged with diffraction optical element DOE3 in the upper end of the laser diode, in diffraction optical element
There is reflecting medium 5, thus the laser reflection light echo electricity that will be emitted via diffraction optical element DOE3 on the emitting light path of DOE3
Diode PD4 is measured.
Specifically, described have the laser diode LD 2 and photodiode PD4 independently encapsulated on the substrate
Refer to that the laser diode LD 2 and photodiode PD4 are individually enclosed in two different tube cores.
Further, the diffraction optical element DOE3 is encapsulated in the upper end of the 2 place tube core of laser diode LD.I.e.
So that the light beam of laser diode outgoing has to pass through diffraction optical element DOE3, so that being by the light that reflecting medium reflects
Penetrated the laser of diffraction optical element DOE3.
The substrate can be pcb board or FPC plate.
The reflecting medium is located at the top of photodiode PD4, or the perforation hole above laser diode LD
Around.In this way, making laser diode LD 2 that there is the access of laser emitting, and pass through the part light above photodiode PD4
Beam, or segment beam around perforation hole above laser diode LD are then reflected back toward photodiode PD4 progress
Measurement.Not only reflection measurement but also does not hinder the main transmission path of laser beam positioned at the emergent light on periphery in this way.
Further, there is side wall 6 around the laser diode LD 2 and photodiode PD4, top has lid
Plate lens 7 (Cover Lens) are packaged, and the reflecting medium is located at side of the cover board lens towards photodiode PD4.
The cover board lens can be the material of high transparency to guarantee to be emitted visual angle, and the reflecting medium 5 can be plating
High-reflecting film or reflectance ink on the inside of cover board lens, so that the thickness of reflecting medium is reduced, with reflective portion laser to PD.
Further, the cover board lens 7 have black ink 8 in the intersection with the side wall 6, to avoid laser
The astigmatism of emergent light.
Wherein the tube core of the laser diode LD 2 and the photodiode PD are set side by side, to reduce the mode of laser
The whole size of group.
Further, the invention also discloses a kind of mode of laser groups using built-in monitoring shoot laser power to carry out laser
The method of emergent power monitoring, in the production process of the mode of laser group, electric current that photodiode PD is detected into
Row calibration record, when laser works normally, detects the electric current that PD passes through and is recorded as first that is, in producing line
Group data；In actual use, the electric current that PD passes through is detected, obtains second group of data, then subtract with second group of data
First group of data obtains data to the end, when data exceed a certain range, illustrates to be emitted optical power excessive, it may be possible to which DOE is damaged
It is bad, need to close laser and user prompted to send and repair, when data be lower than a certain range, illustrate be emitted optical power it is too low, need to mention
Show that user send to repair, laser diode LD is adjusted.
In conclusion the present invention is using around cover lens (cover-plate glass) perforation hole or on photodiode PD
Fang Zengjia is capable of the reflecting medium of reflection laser, such as high anti-ink, enables emergent ray to be reflected into module internal, in turn
It is acquired and fed back to system by photodiode PD, so that system be allow to make corresponding actions according to shoot laser intensity, disappear
In addition to the potential danger to human body.As security protection monitoring means, the present invention is emitted laser before the monitoring rate of optical power
Ontology optical power monitoring level of coverage is wider, and and then corresponding safeguard measure can also much sooner, and protection mechanism also obtains
It improves and improves.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
A specific embodiment of the invention is only limitted to this, for those of ordinary skill in the art to which the present invention belongs, is not taking off
Under the premise of from present inventive concept, several simple deduction or replace can also be made, all shall be regarded as belonging to the present invention by institute
Claims of submission determine protection scope.
Claims (10)
1. a kind of mode of laser group of built-in monitoring shoot laser power, it is characterised in that:
Including substrate, there is the laser diode and photodiode independently encapsulated on the substrate, in the laser
The upper end of diode has or is packaged with diffraction optical element, on the emitting light path of diffraction optical element there is reflection to be situated between
Matter, so that the laser reflection light echo electric diode being emitted via diffraction optical element be measured.
2. mode of laser group according to claim 1, it is characterised in that:
It is described on the substrate to there is the laser diode independently encapsulated and photodiode to refer to the laser two
Pole pipe and photodiode are individually enclosed in two different tube cores.
3. mode of laser group according to claim 2, it is characterised in that:
The upper end of tube core where the diffraction optical element is encapsulated in the laser diode.
4. mode of laser group according to claim 3, it is characterised in that:
The substrate can be pcb board or FPC plate.
5. mode of laser group according to claim 3, it is characterised in that:
The reflecting medium is located at the top of photodiode, or around perforation hole above laser diode LD.
6. mode of laser group according to claim 1, it is characterised in that:
There is side wall, top is carried out with cover board lens (Cover Lens) around the laser diode and photodiode
Encapsulation, the reflecting medium are located at side of the cover board lens towards photodiode.
7. mode of laser group according to claim 1, it is characterised in that:
The cover board lens are the material of high transparency, and the reflecting medium is the high-reflecting film or anti-being plated on the inside of cover board lens
Penetrate ink.
8. mode of laser group according to claim 1, it is characterised in that:
The cover board lens have black ink in the intersection with the side wall.
9. mode of laser group according to claim 1, it is characterised in that:
The tube core of the laser diode and the photodiode PD are set side by side.
10. a kind of mode of laser group using built-in monitoring shoot laser power described in any one of claim 1-9 carries out
The method of laser emitting power monitoring, comprising:
In the production process of the mode of laser group, the electric current detected to photodiode carries out calibration record；In reality
In use, detecting to the electric current that photodiode passes through, second group of data is obtained, then subtract first group with second group of data
Data obtain data to the end, when data exceed a certain range, illustrate to be emitted that optical power is excessive, and diffraction optical element is damaged,
Need to close laser and user prompted to send and repair, when data be lower than a certain range, illustrate be emitted optical power it is too low, prompt user give
It repairs, laser diode is adjusted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910063251.7A CN109672082A (en) | 2019-01-23 | 2019-01-23 | A kind of the mode of laser group and its monitoring method of built-in monitoring shoot laser power |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910063251.7A CN109672082A (en) | 2019-01-23 | 2019-01-23 | A kind of the mode of laser group and its monitoring method of built-in monitoring shoot laser power |
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| Publication Number | Publication Date |
|---|---|
| CN109672082A true CN109672082A (en) | 2019-04-23 |
Family
ID=66149774
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910063251.7A Pending CN109672082A (en) | 2019-01-23 | 2019-01-23 | A kind of the mode of laser group and its monitoring method of built-in monitoring shoot laser power |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112217982A (en) * | 2020-12-08 | 2021-01-12 | 武汉仟目激光有限公司 | Compact TOF camera module for 3D sensing |
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| JPH09312033A (en) * | 1996-05-23 | 1997-12-02 | Matsushita Electric Ind Co Ltd | Optical pickup |
| US5786890A (en) * | 1996-03-22 | 1998-07-28 | Lg Electronics Inc. | Optical output detector |
| CN1189668A (en) * | 1996-12-26 | 1998-08-05 | 三洋电机株式会社 | Optical readout unit and optical record media driving device containing the same |
| CN108923246A (en) * | 2018-09-30 | 2018-11-30 | Oppo广东移动通信有限公司 | A kind of mode of laser group and terminal device |
| CN109142391A (en) * | 2018-09-13 | 2019-01-04 | 深圳阜时科技有限公司 | A kind of sensing device and equipment |
| CN109256672A (en) * | 2018-09-30 | 2019-01-22 | Oppo广东移动通信有限公司 | A kind of mode of laser group and terminal device |
-
2019
- 2019-01-23 CN CN201910063251.7A patent/CN109672082A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5786890A (en) * | 1996-03-22 | 1998-07-28 | Lg Electronics Inc. | Optical output detector |
| JPH09312033A (en) * | 1996-05-23 | 1997-12-02 | Matsushita Electric Ind Co Ltd | Optical pickup |
| CN1189668A (en) * | 1996-12-26 | 1998-08-05 | 三洋电机株式会社 | Optical readout unit and optical record media driving device containing the same |
| CN109142391A (en) * | 2018-09-13 | 2019-01-04 | 深圳阜时科技有限公司 | A kind of sensing device and equipment |
| CN108923246A (en) * | 2018-09-30 | 2018-11-30 | Oppo广东移动通信有限公司 | A kind of mode of laser group and terminal device |
| CN109256672A (en) * | 2018-09-30 | 2019-01-22 | Oppo广东移动通信有限公司 | A kind of mode of laser group and terminal device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112217982A (en) * | 2020-12-08 | 2021-01-12 | 武汉仟目激光有限公司 | Compact TOF camera module for 3D sensing |
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Application publication date: 20190423 |