CN109659116A - A kind of high Q chip inductor of small size and preparation method thereof - Google Patents
A kind of high Q chip inductor of small size and preparation method thereof Download PDFInfo
- Publication number
- CN109659116A CN109659116A CN201811510809.3A CN201811510809A CN109659116A CN 109659116 A CN109659116 A CN 109659116A CN 201811510809 A CN201811510809 A CN 201811510809A CN 109659116 A CN109659116 A CN 109659116A
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- China
- Prior art keywords
- porcelain core
- glue
- wire rod
- chip inductor
- main body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/022—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2823—Wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
- H01F27/306—Fastening or mounting coils or windings on core, casing or other support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/005—Impregnating or encapsulating
Abstract
The invention discloses high Q chip inductors of a kind of small size and preparation method thereof, the chip inductor includes inductance main body and UV glue package coating, wherein, the inductance main body includes I-shaped porcelain core, the termination electrode for being plated on porcelain core both ends and the coil being wound on porcelain core center pillar, the line end of the coil is soldered to the termination electrode, and the spacing between adjacent two circles coil is greater than 1.5 times of wire rod line footpath；The UV glue package coating carries out Semi surrounding type encapsulation from the back side of the inductance main body, and the Semi surrounding type encapsulation at least exposes the termination electrode；The material of the UV glue package coating is epoxy resin, and glue viscosity when being packaged is 2000~5000Pas.When encapsulation, first glue is injected in the die cavity of back mould band, the porcelain core of coiling is put into die cavity in a manner of back side elder generation glue again, enters the porcelain core back side and at least partly area in each face adjacent with the back side in glue, then carries out ultraviolet light baking and curing and form encapsulation coating.
Description
Technical field
The present invention relates to electronic components, and in particular to a kind of high Q chip inductor of small size and preparation method thereof.
Background technique
With the development of social economy, the progress of science and technology, requirement of the people to quality of the life is also higher and higher, numerous high-techs
Skill product even more constantly pours in people's lives.Now, people's lives are inseparable with network, and Netcom's class product is also it
One of.Wireless router constantly develops to distant signal transmission, and interchanger constantly develops to high frequency, low distortion direction, nothing
The distant signal transmission of line router and the low distortion signal of interchanger are required to the wire-wound inductor support of high Q.
Today of human lives is covered in information-based height, network communication is ubiquitous, and people's lives are also to various nets
Network communication height relies on.With the development of wireless router, interchanger, Netcom's class product size is increasingly miniaturized, and wireless biography
Defeated distance is constantly promoted, therefore requires also to increase accordingly to the internal components of Netcom's product, develops the small size with high q-factor
2012 chip inductors, very it is necessary to.
Quality factor (Q value) are a measurements of inductance relative loss factor, and the Q value of inductance is higher, and loss is smaller, and efficiency is got over
It is high.In the statement of chip inductor Q value, Q=XL/Re=2 π fL/Re=1/2 π fReC, wherein XLIndicate reactance, unit Ω；Re
Indicate equivalent resistance, unit Ω；F indicates test frequency, unit Hz；L herein indicates inductance value, unit nH；ReMainly include
Copper loss (i.e. copper wire send out thermogenetic loss) and iron loss Rac(magnetic hystersis loss occurred i.e. inside magnetic core and eddy-current loss etc. exchange damage
Consumption)；C is distribution capacity.By above-mentioned formula it will be seen that the factor for influencing chip inductor Q value includes frequency, inductance
Value, Re and distribution capacity C.In the statement of the inductance value L of chip inductor, L=μ0μrN2S/l, wherein μ0Indicate vacuum magnetic conductance
Rate, 4 π × 10-7, unit H/m；μrIndicate relative permeability, dimensionless, air μr≈1；N indicates the circle number of inductance coil, immeasurable
Guiding principle；S indicates inductance coil cross-sectional area, unit m2；L indicates the length of magnetic path, unit m.As can be seen that influencing the factor of inductance value
It include: wire circle, coil cross-sectional area, the length of magnetic path, relative permeability etc..
The disclosure of background above technology contents is only used for auxiliary and understands inventive concept and technical solution of the invention, not
The prior art for necessarily belonging to present patent application shows above content in the applying date of present patent application in no tangible proof
Before have disclosed in the case where, above-mentioned background technique should not be taken to evaluation the application novelty and creativeness.
Summary of the invention
Under same frequency, the factor for influencing chip inductor Q value includes Re and distribution capacity C, influences Re and then influences Q value
Factor include: D.C. resistance, kelvin effect etc., influence C and then influence the factor of Q value to refer mainly to copper wire line spacing.
Therefore, the present invention improves Q value by way of influencing the distribution capacity and D.C. resistance of chip inductor, proposes one
Kind high Q chip inductor of small size and preparation method thereof.
A kind of high Q chip inductor of small size, including inductance main body and UV glue package coating, wherein the inductance main body
Including I-shaped porcelain core, the coil that is plated on the termination electrode at porcelain core both ends and is wound on porcelain core center pillar, the coil
Line end is soldered to the termination electrode, and the spacing between adjacent two circles coil is greater than 1.5 times of wire rod line footpath；The UV mucilage sealing
It fills coating and carries out Semi surrounding type encapsulation from the back side of the inductance main body, the Semi surrounding type encapsulation at least exposes the end electricity
Pole；The material of the UV glue package coating is epoxy resin, and glue viscosity when being packaged is 2000~5000Pas.
Preferably, the porcelain core length is 2.0~2.1mm, and width is 1.30~1.55mm, highly for 1.30~
1.45mm, porcelain core centre pillar cross-section product are 1.14~1.4mm2。
Preferably, wire rod section used in coiling is round, rectangular or rectangle, wherein the diameter of round wire rod is
0.3~1.2mm, the cross-sectional area of rectangular wire rod are 0.071~1.13mm2, the cross-sectional area of rectangle wire rod is 0.071~
1.13mm2。
Preferably, the coil turn of coiling is 1~30.
Preferably, the wire rod of coiling is higher temperature line, softening resistance >=265 DEG C.
Preferably, the material of the porcelain core is AlxM2-xO3, M Cr, Ti, Fe or V, x >=1.92.
The inductance of the above-mentioned offer of the present invention, encapsulation coating use viscosity for the epoxide-resin glue of 2000~5000Pas
Water makes, when can be relatively thin to avoid coating the phenomenon that starved, to make the encapsulation coating thin as much as possible without influencing the Q of inductance
Value；According to the calculation formula R=ρ L/S of D.C. resistance, wherein ρ is the resistivity of wire rod, and " L " in this formula is coil-winding
Length, S be wire rod sectional area.It is found that D.C. resistance is mainly inversely proportional with wire rod line footpath, the meeting when selecting thick line diameter copper wire
R is reduced, and then proposes high q-factor.Calculation formula C=ε S/4 π kd, ε according to capacitor are dielectric constants, and S is that copper wire (is equal to electrode
Plate) positive area, 4 π k be a constant fixed value, d be copper wire line spacing.Know that winding department is inversely proportional away from d and distribution capacity,
When using biggish line spacing dredge around when can reduce C, and then propose high q-factor.To, the technical solution of the aforementioned offer of the present invention, greatly
Amplitude improves the Q value of inductance, so that the series of products are under the high frequency of 100MHz~1500MHz still with 50~100
High q-factor；Traditional high Q chip inductor component products are generally 2520 sizes, and chip inductor size of the invention only has 2012, greatly
Amplitude reduces size, saves space.
The present invention separately also proposed a kind of preparation method of high Q chip inductor of small size, comprising:
1) an I-shaped porcelain core is provided, and plates termination electrode at the both ends of porcelain core；
2) enameled conducting wire is wound on the center pillar of the porcelain core, the line end of extraction is welded to the end electricity at porcelain core both ends
Pole obtains inductance main body；Wherein, spacing when coiling between adjacent two circles coil is greater than 1.5 times of wire rod line footpath；
3) the UV glue that viscosity is 2000~5000Pas is injected in the die cavity of preset die, then by the inductance master
Body is put into the die cavity, and inductance main body the back side first glue, the back and each face adjacent with back for making porcelain core are extremely
Small part immerses in UV glue；Wherein, the UV glue is epoxy resin；
4) it by the inductance main body of gluing is put into together in UV ovens in the preset die and die cavity, carries out
Dry solidification；
5) the inductance main body with UV glue package coating is squeezed out from the back side of the preset die, obtains the chip
Inductance.
Preferably, the porcelain core length is 2.0~2.1mm, and width is 1.30~1.55mm, highly for 1.30~
1.45mm, porcelain core centre pillar cross-section product are 1.14~1.4mm2；The section of the enameled conducting wire is round, rectangular or rectangle,
Wherein the diameter of round wire rod is 0.3~1.2mm, and the cross-sectional area of rectangular wire rod is 0.071~1.13mm2, rectangle wire rod
Cross-sectional area be 0.071~1.13mm2；The coil turn of coiling is 1~30.
Preferably, the enameled conducting wire is higher temperature line, softening resistance >=265 DEG C；The material of the porcelain core is AlxM2-xO3, M
For Cr, Ti, Fe or V, x >=1.92.
The preparation method of the high Q chip inductor of small size of the above-mentioned offer of the present invention, when encapsulation use viscosity for 2000~
The UV glue of 5000Pas carries out immersion encapsulation, can obtain relatively thin but not starved, uniform encapsulation coating, ensure that
Conducting wire is not impaired and preparation process in easily by machine on the basis of the crawl of the back side, which hardly reduces inductance
Q value；On the other hand, the relatively thick conducting wire of use carries out big spacing coiling, so that the Q of inductance is worth with larger promotion.
Detailed description of the invention
Fig. 1 is the schematic diagram before the high Q chip inductor encapsulation of small size of the specific embodiment of the invention；
Fig. 2 is the structural schematic diagram of the high Q chip inductor of small size of the specific embodiment of the invention；
Back mould band schematic diagram Fig. 3 used when being the high Q chip inductor of providing covers for compact of the present invention；
Fig. 4 is the inductance value-frequency curve for the high Q chip inductor of small size that the specific embodiment of the invention is prepared；
Fig. 5 is the Q value-frequency curve for the high Q chip inductor of small size that the specific embodiment of the invention is prepared.
Specific embodiment
The invention will be further described with specific embodiment with reference to the accompanying drawing.
Specific embodiments of the present invention provide a kind of high Q chip inductor of small size, as depicted in figs. 1 and 2, including inductance
Main body and UV glue package coating, wherein the inductance main body includes I-shaped porcelain core 1, the end electricity for being plated on 1 both ends of porcelain core
Pole 21,22 and the coil 3 being wound on 1 center pillar of porcelain core, the line end of the coil 3 are soldered to the termination electrode, and adjacent two
Spacing between circle coil is greater than 1.5 times of wire rod line footpath；The UV glue package coating 4 from the back side of the inductance main body into
The encapsulation of row Semi surrounding type, the Semi surrounding type encapsulation at least expose the termination electrode；The material of the UV glue package coating
For epoxy resin, glue viscosity when being packaged is 2000~5000Pas.It should be noted that " back side " is and welding
The opposite one side in face (bottom surface).
The high Q chip inductor of small size of the invention, the length of this porcelain core are only 2.0~2.1mm, and width is 1.30~
1.55mm is highly 1.30~1.45mm, and porcelain core centre pillar cross-section product is 1.14~1.4mm2.Wire rod used in coiling is cut
Face is round, rectangular or rectangle, wherein the diameter of round wire rod is 0.3~1.2mm, the cross-sectional area of rectangular wire rod is
0.071~1.13mm2, the cross-sectional area of rectangle wire rod is 0.071~1.13mm2.The coil turn of coiling is 1~30.Coiling
The wire rod of coil is higher temperature line, softening resistance >=265 DEG C.The material of the porcelain core is AlxM2-xO3, M Cr, Ti, Fe or V, x >=
1.92.The structure of the termination electrode includes three layers from inside to outside, innermost layer Sn, middle layer Ni, outermost layer Ag, Ag-Pb or Mo-
Mn electrode.The high Q chip inductor of small size of the invention, size only have 2012 (traditional high Q chip inductor has 2025), but Q value
But it is higher by much, still there is 50~100 high q-factor under the high frequency of 100MHz~1500MHz.
The high Q chip inductor of small size and preparation method thereof of the invention is said below by specific embodiment
It is bright, and beneficial effects of the present invention are verified by emulating.
Embodiment 1
1.1, Al is selected1.98Fe0.02O3The I-shaped porcelain core of material, porcelain core length are 2.00mm, width 1.55mm, height
Degree is 1.30mm, and centre pillar cross-section product is 1.14mm2, termination electrode is electroplated out at porcelain core both ends, end-electrode structure is three layers, respectively
It is Sn layers, Ni layers, Ag layers；
1.2, choosing diameter specifications is the round wires of 0.3~1.2mm as enameled wire, and wire rod matter is copper, and paint film material is poly-
Urethane-polyester material is wound on enameled wire on porcelain core center pillar, and coiling 1,3,4,6,10,15,22 and 30 is enclosed respectively, line spacing
The outer line footpath * 1.5 of >=copper wire, and two exits are welded on termination electrode；Obtain eight groups of coiling porcelain cores；
1.3, first the UV glue that viscosity is 2000Pas is injected in the die cavity 5 of back mould band as shown in Figure 3, it then will
Porcelain core through coiling enameled wire is put into die cavity, and UV glue is by porcelain core back and at least partly face in each face adjacent with back
Product cladding is got up, and at least exposes termination electrode；
1.4, notacoria band is put into UV ovens together with the coiling porcelain core for being coated with UV glue in die cavity, to carry out UV glue
Dry solidification；
1.5, the cured product of function of glue coating is squeezed out from the back side of back mould band, obtains the high Q chip of required small size
Inductance.
The measurement analysis for carrying out inductance value under same frequency condition to eight groups of inductance samples obtained above, draws
To inductance value-frequency curve as shown in Figure 4, from the bottom to top respectively coil turn 1,3,4,6,10,15,22 and 30 enclose electricity
Feel the curve of sample；In addition the measurement analysis for also having carried out inductance Q value, obtains Q value-frequency curve as shown in Figure 5.From Fig. 4
With Fig. 5 as can be seen that the series of products under the high frequency of 100MHz~1500MHz still with 50~100 high q-factor, and
Inductance variation range is 2.6~820nH, and adjustable extent is big, so that its frequency modulation in Netcom's product is sensitive, compared to tradition
The loss of 2012 series of products is smaller, more efficient, using the characteristic of resonance, improves the amplitude of small-signal, widely used.
Embodiment 2
2.1, select Al1.96Fe0.04O3The I-shaped porcelain core of material, porcelain core length are 2.05mm, width 1.30mm, height
Degree is 1.45mm, and centre pillar cross-section product is 1.27mm2, it being electroplated to form termination electrode at porcelain core both ends, end-electrode structure is three layers, point
Not are as follows: Sn layers, Ni layers, Ag-Pb layers；
2.2, choosing cross-sectional area specification is 0.071~1.13mm2Square line as enameled wire, wire rod matter is iron, paint film
Material is improvement polyurethane material, and wire winding same as Example 1 is taken to obtain coiling product.
2.3, the UV glue that viscosity is 3500Pas is chosen, the technique being the same as example 1 then is taken finally to be produced
Product.Inductance-the frequency curve and Q value-frequency curve and embodiment 1 that the series of products are surveyed are suitable.
Embodiment 3
3.1, Al is selected2O3The I-shaped porcelain core of material, porcelain core length are 2.1mm, and width 1.40mm is highly
1.45mm, centre pillar cross-section product are 1.44mm2, it is electroplated to form termination electrode at porcelain core both ends, end-electrode structure is three layers, respectively
Are as follows: Sn, Ni, Mo-Mn；
3.2, choosing sectional area specification is 0.071~1.13mm2Rectangle line as enameled wire, wire rod matter is aluminium, paint
Membrane material is polyurethanes-co-polyesters and improvement polyurethane material, and wire winding same as Example 1 is taken to obtain coiling product.
3.3, the UV glue that viscosity is 5000pa*s is chosen, technique same as Example 1 is then taken to obtain final products.
Inductance-the frequency curve and Q value-frequency curve and embodiment one that the series of products are surveyed are suitable.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
Specific implementation of the invention is only limited to these instructions.For those skilled in the art to which the present invention belongs, it is not taking off
Under the premise of from present inventive concept, several equivalent substitute or obvious modifications can also be made, and performance or use is identical, all answered
When being considered as belonging to protection scope of the present invention.
Claims (10)
1. a kind of high Q chip inductor of small size, it is characterised in that: including inductance main body and UV glue package coating, wherein described
Inductance main body includes I-shaped porcelain core (1), the termination electrode (21,22) for being plated on porcelain core (1) both ends and is wound in porcelain core (1)
Coil (3) on center pillar, the line end of the coil (3) is soldered to the termination electrode, and the spacing between adjacent two circles coil is big
In 1.5 times of wire rod line footpath；
The UV glue package coating (4) carries out Semi surrounding type encapsulation, the Semi surrounding type envelope from the back side of the inductance main body
It is filled to and exposes the termination electrode less；The material of the UV glue package coating is epoxy resin, and glue when being packaged is viscous
Degree is 2000~5000Pas.
2. the high Q chip inductor of small size as described in claim 1, it is characterised in that: the porcelain core length is 2.0~2.1mm,
Width is 1.30~1.55mm, is highly 1.30~1.45mm, and porcelain core centre pillar cross-section product is 1.14~1.4mm2。
3. the high Q chip inductor of small size as claimed in claim 1 or 2, it is characterised in that: wire rod section used in coiling
For round, rectangular or rectangle, wherein the diameter of round wire rod is 0.3~1.2mm, the cross-sectional area of rectangular wire rod is 0.071
~1.13mm2, the cross-sectional area of rectangle wire rod is 0.071~1.13mm2。
4. the high Q chip inductor of small size as claimed in claim 3, it is characterised in that: the coil turn of coiling is 1~30.
5. the high Q chip inductor of small size as described in claim 1, it is characterised in that: the wire rod of coiling is higher temperature line, resistance to
The property of softening >=265 DEG C.
6. the high Q chip inductor of small size as described in claim 1, it is characterised in that: the material of the porcelain core is AlxM2-xO3, M
For Cr, Ti, Fe or V, x >=1.92.
7. the high Q chip inductor of small size as described in claim 1, it is characterised in that: the structure of the termination electrode is from inside to outside
Comprising three layers, innermost layer Sn, middle layer Ni, outermost layer Ag, Ag-Pb or Mo-Mn electrode.
8. a kind of preparation method of the high Q chip inductor of small size characterized by comprising
1) an I-shaped porcelain core is provided, and plates termination electrode at the both ends of porcelain core；
2) enameled conducting wire being wound on the center pillar of the porcelain core, the line end of extraction is welded to the termination electrode at porcelain core both ends,
Obtain inductance main body；Wherein, spacing when coiling between adjacent two circles coil is greater than 1.5 times of wire rod line footpath；
3) by the die cavity for the default back mould band of UV glue injection that viscosity is 2000~5000Pas, then by the inductance main body
Be put into the die cavity, and inductance main body the back side first glue, the back and each face adjacent with back for making porcelain core are at least
Part is immersed in UV glue；Wherein, the UV glue is epoxy resin；
4) the back mould band is put into UV ovens together together with the inductance main body of gluing, solidification is dried；
5) the inductance main body with UV glue package coating is squeezed out from the back side of the back mould band, obtains the chip inductor.
9. preparation method as claimed in claim 8, it is characterised in that: the porcelain core length is 2.0~2.1mm, and width is
1.30~1.55mm is highly 1.30~1.45mm, and porcelain core centre pillar cross-section product is 1.14~1.4mm2；
The section of the enameled conducting wire is round, rectangular or rectangle, wherein the diameter of round wire rod is 0.3~1.2mm, it is rectangular
The cross-sectional area of wire rod is 0.071~1.13mm2, the cross-sectional area of rectangle wire rod is 0.071~1.13mm2；
The coil turn of coiling is 1~30.
10. preparation method as claimed in claim 8, it is characterised in that: the enameled conducting wire be higher temperature line, softening resistance >=
265℃；The material of the porcelain core is AlxM2-xO3, M Cr, Ti, Fe or V, x >=1.92.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811510809.3A CN109659116A (en) | 2018-12-11 | 2018-12-11 | A kind of high Q chip inductor of small size and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811510809.3A CN109659116A (en) | 2018-12-11 | 2018-12-11 | A kind of high Q chip inductor of small size and preparation method thereof |
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| Publication Number | Publication Date |
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| CN109659116A true CN109659116A (en) | 2019-04-19 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114141523A (en) * | 2021-11-29 | 2022-03-04 | 宁波汇芯智能装备有限公司 | Manufacturing method of high-performance power inductor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2435825Y (en) * | 2000-07-17 | 2001-06-20 | 佳叶科技有限公司 | Inducer |
| JP2008306147A (en) * | 2007-06-11 | 2008-12-18 | Taiyo Yuden Co Ltd | Wire-wound inductor and method of manufacturing the same |
| CN101894656A (en) * | 2009-05-19 | 2010-11-24 | 吴忻生 | Method for manufacturing miniature high-quality wound chip inductor |
| CN107039146A (en) * | 2015-12-11 | 2017-08-11 | 株式会社村田制作所 | winding inductor |
-
2018
- 2018-12-11 CN CN201811510809.3A patent/CN109659116A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2435825Y (en) * | 2000-07-17 | 2001-06-20 | 佳叶科技有限公司 | Inducer |
| JP2008306147A (en) * | 2007-06-11 | 2008-12-18 | Taiyo Yuden Co Ltd | Wire-wound inductor and method of manufacturing the same |
| CN101894656A (en) * | 2009-05-19 | 2010-11-24 | 吴忻生 | Method for manufacturing miniature high-quality wound chip inductor |
| CN107039146A (en) * | 2015-12-11 | 2017-08-11 | 株式会社村田制作所 | winding inductor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114141523A (en) * | 2021-11-29 | 2022-03-04 | 宁波汇芯智能装备有限公司 | Manufacturing method of high-performance power inductor |
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Application publication date: 20190419 |