CN109651613A - Containing the POSS nano hybridization molecular compound of multiple silicon-hydrogen bonds and its application - Google Patents

Containing the POSS nano hybridization molecular compound of multiple silicon-hydrogen bonds and its application Download PDF

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CN109651613A
CN109651613A CN201710946225.XA CN201710946225A CN109651613A CN 109651613 A CN109651613 A CN 109651613A CN 201710946225 A CN201710946225 A CN 201710946225A CN 109651613 A CN109651613 A CN 109651613A
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silicon
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张汝志
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Florian Photoelectric Materials (suzhou) Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/44—Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
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    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

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Abstract

The invention discloses a kind of POSS nano hybridization molecular compound containing multiple silicon-hydrogen bonds, typical structure are shown below:

Description

Containing the POSS nano hybridization molecular compound of multiple silicon-hydrogen bonds and its application
Technical field
POSS nano hybridization molecular compound (POSS=eight silicon times that present invention relates particularly to a kind of containing multiple silicon-hydrogen bonds Half oxygen alkane), the curable silicon composition comprising the POSS nano hybridization molecular compound containing multiple silicon-hydrogen bonds Deng can be applied to the encapsulation field of such as light emitting diode (LED) semiconductor devices, electronic device.
Background technique
LED (semiconductor light-emitting-diode) is widely used in because having many advantages, such as low energy consumption, long-life, small size The fields such as illumination, backlight.And packaging process is a very important process in LED processing procedure, for the workability of LED Energy, cost etc. have the influence of highly significant.
With the development of semiconductor devices, the performance requirement of packaging plastic is stepped up.For example, with light emitting diode (LED) continuous improvement of power and brightness proposes the optical property, physical property and chemical property etc. of silicon composition Higher requirement, traditional epoxy resin encapsulating material have been unable to meet actual needs.
Currently, using by the polysiloxane-based component containing unsaturated bond and as the component containing si-h bond of crosslinking agent High-power and high-luminance is carried out by the polysiloxane-based compound that hydrosilylation heat cure is formed in the presence of a catalyst The encapsulation of white light LEDs has become the mode that industry is commonly used.However, existing crosslinking agent there are still it is some be difficult to overcome lack It falls into.For example, using the organic silicon packaging glue of existing crosslinking agent usually exist curing rate is slow, curing time is long, solidify after have The defects of machine silicon packaging plastic hardness is smaller and index of refraction is lower, therefore when being applied to carry out the encapsulation of LED etc., often it will affect Its light extraction efficiency, light quality, photochromic homogeneity, device reliability etc..
Cage modle polysilsesquioxane, English name polyhedral oligomeric silsesquioxane, referred to as POSS, general formula (RSiO3/2) n, wherein R is eight apex angle Si atom institute linking groups.POSS is the silicon alternately connected by Si-O The inorganic kernel of oxygen skeleton composition, the group R that Si atom is connected on its eight apex angles can be reactivity or inertia base Group's (bibliography: the new component of multifunctionality of POSS- high molecular material, " chemistry notification ", 04 phase in 2007；Polyhedral oligomeric The progress of synthesis of silsesquioxane, " macromolecule notification ", 10 phases in 2014；Developments of polyhedral oligomeric silsesquioxanes(POSS),POSS nanocomposites and their applications:A review,Journal of Scientific&Industrial Research,Vol.68,June 2009,pp.437- 464).The visible light index of refraction of polysiloxanes containing alkyl is generally lower than 1.45, but POSS is due to polyhedral inner core And generally possessing the index of refraction higher than 1.5, this conforms exactly to the needs of the optoelectronic packages material bloom such as LED extraction.But POSS receives Rice hybrid molecule compound does not have reactive functional group generally, universal because being polycrystalline or solid even if there is reactive group yet And it is difficult to be scattered in curable silicon composition, or be difficult to apply to gluing process.For example, eight vinyl-POSS are The crystal of white, is difficult to be dissolved in curable silicon composition (http://www.sigmaaldrich.com/ Catalog/product/aldrich/475424? lang=zh&region=CN).Meanwhile containing containing multiple silicon-hydrogen bonds POSS is not easy to manufacture yet or there is a problem of unstable at room temperature.Further, the POSS material containing Si -- H bond and alkenyl simultaneously Material is also to have not been reported, it is contemplated that material when can accelerate the curing rate of curable organosilicon composition and reduce solidification is received Contracting.These are all urgent problems in LED encapsulation.
Summary of the invention
The POSS nano hybridization molecular compound that the main purpose of the present invention is to provide a kind of containing multiple silicon-hydrogen bonds, can Cured silicon composition and its application, to overcome deficiency in the prior art.
For realization aforementioned invention purpose, the technical solution adopted by the present invention includes:
The embodiment of the invention provides a kind of POSS nano hybridization molecular compound containing multiple silicon-hydrogen bonds, chemical formula For (R') x (R ") y (SiO3/2) z, wherein R'=CH2CH2(CH3)2Si-m-C6H4-Si(CH3)2H, or R'=CHCH3-(CH3)2Si-m-C6H4-Si(CH3)2H, wherein R " be selected from the alkyl of substituted or unsubstituted C1-C20, C1-C20 unsaturated alkenyl, Unsaturated alkynyl, aryl, the CH of C1-C202CH2(CH3)2Si-m-C6H4-Si(CH3)2Or CHCH H,3-(CH3)2Si-m-C6H4- Si(CH3)2H, R', R " are same or different, and x, y are integers, and x >=3, z=6,8,10 or 12, x+y=z.
The embodiment of the invention also provides described, and the POSS nano hybridization molecular compound containing multiple silicon-hydrogen bonds is used as friendship Join application of the agent in hydrosilylation.
The POSS nano hybridization molecular compound containing multiple silicon-hydrogen bonds is prepared the embodiment of the invention also provides a kind of Method comprising: make eight silsesquioxanes containing at least three vinyl and the compound containing at least two si-h bonds Hydrosilylation is carried out under the conditions of having existing for catalyst, generates the POSS nano hybridization containing multiple silicon-hydrogen bonds Molecular compound, the POSS nano hybridization molecular compound containing multiple silicon-hydrogen bonds contain at least three Si -- H bond.
Preferably, the chemical formula of eight silsesquioxanes containing at least three vinyl is (R1)a(R2)b(SiO3/2) C, wherein R1Selected from substituted or unsubstituted vinyl or allyl, R2Alkyl, C1- selected from substituted or unsubstituted C1-C20 The unsaturated alkenyl of C20, the unsaturated alkynyl of C1-C20 or aryl, R1、R2Same or different, a, b are integers, and a >=3, C=6,8,10 or 12, a+b=c.
Preferably, the chemical formula of the compound for containing at least two si-h bonds is H (CH3)2Si-m-C6H4-Si(CH3)2H.The embodiment of the invention also provides a kind of curable silicon compositions, including polysiloxane-based group containing vinyl Point, the component and hydrosilylation catalysts of silicon-hydrogen bond containing；The component of the silicon-hydrogen bond containing includes described containing multiple silicon-hydrogen bonds POSS nano hybridization molecular compound.
The embodiment of the invention also provides the curable silicon compositions in article bonding, prepares article surface painting Application in layer or article encapsulation.
POSS nano hybridization molecular compound containing multiple silicon-hydrogen bonds of the invention is in the friendship that application is hydrosilylation When joining agent, have many advantages, such as more high refractive index, more high viscosity, more high crosslink density compared with existing crosslinking agent, compared with existing POSS nano hybridization molecular compound have liquid fluidity, be readily dispersed in silicon composition at the same possess Si -- H bond and The advantages that alkenyl, and include the silicon composition of the POSS nano hybridization molecular compound containing multiple silicon-hydrogen bonds of the invention also Hardness is compared with high and index of refraction compared with high, thermogravimetric weight loss is low, solidification after-contraction is small after having the characteristics that curing efficiency height, solidifying.
Technical solution of the present invention is more specifically illustrated with reference to embodiments, but not as to the present invention Restriction.
Specific embodiment
A kind of POSS nano hybridization molecule chemical combination containing multiple silicon-hydrogen bonds that the one aspect of the embodiment of the present invention provides Object, chemical formula are (R') x (R ") y (SiO3/2) z, wherein R'=CH2CH2(CH3)2Si-m-C6H4-Si(CH3)2H, or R'= CHCH3-(CH3)2Si-m-C6H4-Si(CH3)2H, wherein R " is selected from the alkyl of substituted or unsubstituted C1-C20, C1-C20 not It is saturated unsaturated alkynyl, aryl, the CH of alkenyl, C1-C202CH2(CH3)2Si-m-C6H4-Si(CH3)2Or CHCH H,3-(CH3)2Si-m-C6H4-Si(CH3)2H, R', R " are same or different, and x, y are integers, and x >=3, z=6,8,10 or 12, x+y=z.
Preferably, x=8, y=0, z=8.
Preferably, R " is selected from substituted or unsubstituted C1-C20 alkyl.
It is further preferred that R " is selected from substituted or unsubstituted C1-C8 alkyl.
It is furthermore preferred that R " is selected from methyl, ethyl, propyl, isopropyl, butyl or 2- ethylhexyl.
Preferably, R " is selected from substituted or unsubstituted C1-C20 unsaturation alkenyl.
It is further preferred that R " is selected from substituted or unsubstituted C1-C8 unsaturation alkenyl.
It is furthermore preferred that R " is selected from vinyl, acrylic, isopropenyl, allyl, cyclobutenyl or isobutenyl.
Preferably, R " is selected from substituted or unsubstituted C1-C20 unsaturation alkynyl.
It is further preferred that R " is selected from substituted or unsubstituted C1-C8 unsaturation alkynyl.
It is furthermore preferred that R " is selected from acetenyl, propinyl, isopropynyl, propargyl, butynyl or butynyl.
Preferably, R " is selected from substituted or unsubstituted phenyl；It is further preferred that R " is selected from phenyl, 4- methyl-benzene Base, 4- methoxyl group-phenyl or the chloro- phenyl of 4-.
In one more preferably case study on implementation, the POSS nano hybridization molecular compound containing multiple silicon-hydrogen bonds With structure shown in following formula:
POSS nano hybridization molecular compound containing multiple silicon-hydrogen bonds of the invention is in the friendship that application is hydrosilylation When joining agent, have many advantages, such as more high refractive index, more high viscosity, more high crosslink density compared with existing crosslinking agent, and include this hair The silicon composition of the bright POSS nano hybridization molecular compound containing multiple silicon-hydrogen bonds also has curing efficiency height, solidification speed Degree is fast, hardness is higher and the features such as index of refraction is higher, thermogravimetric weight loss is low, viscosity is suitable for industrial application after solidification.
Moreover, present inventors have surprisingly found that, POSS nano hybridization molecular compound of the invention has certain viscosity Liquid, be especially advantageous for being scattered in curable silicon composition and formed it is stable, can be easy to the LED operated with envelope Package material, the possible reason is being led since silicon hydrogenation reaction has the addition product of geneva and anti-geneva there are multiple isomers It causes.
Another aspect provides the described POSS nano hybridization molecularization containing multiple silicon-hydrogen bonds of the embodiment of the present invention Close application of the object as crosslinking agent in hydrosilylation.
The one aspect of the embodiment of the present invention provides the POSS nano hybridization containing multiple silicon-hydrogen bonds described in a kind of prepare point The method of sub- compound comprising: there are eight vinyl, eight silsesquioxane and the compound containing at least two si-h bonds Hydrosilylation is carried out under the conditions of catalyst is existing, generates the POSS nano hybridization molecule containing multiple silicon-hydrogen bonds Compound, the POSS nano hybridization molecular compound containing multiple silicon-hydrogen bonds contain at least three Si -- H bond.It needs to illustrate , due to silicon hydrogenation reaction have anti-Markonikov's rule and markovnikov's rule addition product (referring to Silicon in Organic, Organometallic, and Polymer Chemistry by Michael A.Brook, Wiley Interscience, pp 401-458), it will lead to the presence of multiple isomers, these isomers are also within the scope of the present patent application.
Preferably, the chemical formula of eight silsesquioxanes containing at least three vinyl is (R1)a(R2)b(SiO3/2) C, wherein R1Selected from substituted or unsubstituted vinyl or allyl, R2Alkyl, C1- selected from substituted or unsubstituted C1-C20 The unsaturated alkenyl of C20, the unsaturated alkynyl of C1-C20 or aryl, R1、R2Same or different, a, b are integers, and a >=3, C=6,8,10 or 12, a+b=c.
It is especially preferred, c=8, a=8, b=0.
Preferably, R2Selected from substituted or unsubstituted C1-C20 alkyl.
It is especially preferred, R2Selected from substituted or unsubstituted C1-C8 alkyl.
It is further preferred that R2Selected from methyl, ethyl, propyl, isopropyl, butyl or 2- ethylhexyl.
Preferably, R2Selected from substituted or unsubstituted C1-C20 unsaturation alkenyl.
It is further preferred that R2Selected from substituted or unsubstituted C1-C8 unsaturation alkenyl.
It is further preferred that R2Selected from vinyl, acrylic, isopropenyl, allyl, cyclobutenyl or isobutenyl.
Preferably, R2Selected from substituted or unsubstituted C1-C20 unsaturation alkynyl.
It is further preferred that R2Selected from substituted or unsubstituted C1-C8 unsaturation alkynyl.
It is further preferred that R2Selected from acetenyl, propinyl, isopropynyl, propargyl, butynyl or butynyl.
Preferably, R2Selected from substituted or unsubstituted phenyl.It is further preferred that R2Selected from selected from phenyl, 4- methyl-benzene Base, 4- methoxyl group-phenyl or the chloro- phenyl of 4-.
Still more preferably, R1And R2It is selected from vinyl.
Especially preferred, eight silsesquioxane is eight vinyl-POSS.
In some more preferably case study on implementation, the octavinyl-POSS has structure shown in following formula:
Preferably, the chemical formula of the compound for containing at least two si-h bonds is H (CH3)2Si-m-C6H4-Si(CH3)2H。
In some more preferably case study on implementation, the compound containing at least two si-h bonds has shown in following formula Structure:
In some more specific embodiments, the preparation method is specifically included: by eight vinyl, eight silicon sesquialter After oxygen alkane, the compound containing at least two si-h bonds, catalyst and organic solvent mixing, it is anti-to be heated to reflux progress Si―H addition reaction It answers, generates the POSS nano hybridization molecular compound containing multiple silicon-hydrogen bonds.Wherein, the organic solvent can be selected from Eight vinyl, eight silsesquioxane, compound containing at least two si-h bonds can be dissolved, but not with eight vinyl eight Silsesquioxane, the compound containing at least two si-h bonds, in catalyst any reaction organic solvent, such as benzene, first The common organic solvents such as benzene.
Further, the condition of aforementioned hydrosilylation can be with reference to " hydrosilylation and research " (Shaoyang teachers training school Journal, the 2nd phase in 1998, p82-84) etc. documents.
The silicon composition curable another aspect provides one kind of the embodiment of the present invention, including contain vinyl Polysiloxane-based component, the component and hydrosilylation catalysts of silicon-hydrogen bond containing；The component of the silicon-hydrogen bond containing includes described The POSS nano hybridization molecular compound containing multiple silicon-hydrogen bonds.
In some preferred embodiments, the polysiloxane-based component containing vinyl contains at least two and silicon key The aromatic radical of the alkenyl of conjunction and at least one and silicon bonding.
Preferably, the index of refraction of the polysiloxane-based component containing vinyl is not less than 1.5, especially preferably 1.50 ~1.65.
Preferably, the polysiloxane-based component containing vinyl in 25 DEG C viscosity be 10~10,000cPs, especially Preferably 50~5000cPs.
Preferably, polysiloxane-based group containing vinyl is selected from linear polymer, branched polymers or netted poly- Close the one or more of object.
It is further preferred that polysiloxane-based group containing vinyl is selected from linear polymer.
Still more preferably, the polysiloxane-based component containing vinyl has structure shown in following formula:
Wherein, D=1~500, M=1~500, N=1~500；More preferably, D=1~50, M=1~500, N=1 ~50.In some preferred embodiments, vinyl contained in the polysiloxane-based component containing vinyl with it is described The molar ratio of si-h bond contained in the component of silicon-hydrogen bond containing is 10:1~1:10, preferably 2:1~1:2.
In the present invention, the dosage of preceding hydrosilylation catalyst should be enough to promote consolidating for silicon composition of the present invention Change.These hydrosilylation catalysts are as known in the art and are commercially available, such as be may be selected from but not limited to Following substance: platinum group metal: platinum, rhodium, ruthenium, palladium, osmium or iridium metals or its organo-metallic compound and combinations thereof.Specifically , platinum black, the compound such as reaction product of chloroplatinic acid, chloroplatinic acid hexahydrate and monohydric alcohol, bis- (ethyls can be selected from Acetoacetate) platinum, bis- (acetopyruvic acid) platinum, platinous chloride and the compound and alkene or low molecular weight organic poly- silicon oxygen Alkane or in matrix or core-shell type structure the platinum compounds of microencapsulation compound.The organopolysiloxane of platinum and low molecular weight Compound, including 1,3- divinyl -1,1 with platinum, 3,3- tetramethyl disiloxane compounds.These compounds can be in Microencapsulation in resinous substrates.Optionally, catalyst may include 1, the 3- divinyl -1,1 with platinum, 3,3- tetramethyl, two silicon oxygen Alkane compound.These hydrosilylation catalysts can refer to CN1863875A (0020-0021 sections of specification), US 3,159, 601, US3,220,972, US3,296,291, No. US3,419,593, US3,516,946, US3,814,730, US3,989, 668, US4,784,879, US5,036,117, No. US5,175,325, EP 0 347 895 B, US4,766,176, US5,017, 654 equal documents.And/or at least one UV active Pt catalyst, it can refer to US8,314,200.More specifically, the hydrogenation Silylation catalyst can be selected from platinum catalyst, rhodium catalyst or the palladium catalyst of catalytic amount；Preferably, the platinum catalyst choosing From platinum micro mist, chloroplatinic acid, the alcoholic solution of chloroplatinic acid, platinum/alkenylsiloxane complex, platinum/alkene complex and platinum/carbonyl network Close the one or more of object.Preferably, dosage of the hydrosilylation catalysts in the silicon composition is 0.1ppm to 10,000ppm.
In some case study on implementation, based on the weight of silicon composition of the present invention, preceding hydrosilylation catalyst Amount can be following range of platinum group metal: 0.1ppm to 10,000ppm is optionally 1ppm to 1000ppm, and is optionally 10ppm to 100ppm.
Among some embodiments, the silicon composition also may include solvent or diluent.Preferably, described The dosage of solvent or diluent is enough to cooperate with each component of the silicon composition and form homogeneous phase solution.In the present invention In, solvent or diluent above-mentioned can be the mixture of applicable any type, such as water, organic solvent or both, preferably From organic solvent, such as it may be selected from but not limited to n-hexane, toluene, chloroform, methylene chloride, ethyl alcohol, acetone, 2- butanone, 4- first Base -2 pentanone, rouge, photoresist solvent (such as PGME, PGMEA) etc., to be with remaining combination of materials in the composition Liquid with good fluidity, especially homogeneous phase solution.
Among some embodiments, the silicon composition also may include inhibitor.The inhibitor, i.e. silicon hydrogen Addition reaction inhibitor, which refers to, can result in the undesirable substance of hydrosilylation, with reference to CN1863875A (the 0025th section) etc., It can be selected from alkynol compound, alkene-alkine compounds, siloxanes or benzotriazole and other hydrosilanes reaction suppressors.Example Such as, alkynol compound inhibitor can be selected from 2- phenyl -3- butyne-2-alcohol, 2- methyl -3- butyne-2-alcohol, 3,5- dimethyl - 1- hexin -3- alcohol etc.；Alkene-alkine compounds can be selected from 3- methyl-pirylene etc., and siloxanes can be selected from 1,3,5,7- Four hexenyl cyclotetrasiloxane of tetramethyl -1,3,5,7-, 1,3,5,7- tetramethyl -1,3,5,7- tetravinyl cyclotetrasiloxane Deng.Wherein preferred alkynol compound, particularly preferred 2- phenyl -3- butyne-2-alcohol.
Among some embodiments, the silicon composition also may include other additives, such as small molecule silicon Alkane (can be with or without ethylene or Si-H functional group), adhesion promoters, heat or the cured epoxy/acrylic acid/polyurethane of UV/ The resins such as bismaleimide, inorganic filler, rheology modifier, tackifier, wetting agent, defoaming agent, levelling agent, dyestuff and glimmering Any one of light powder antisettling agent (such as SHIN-ETSU HANTOTAI DM-30, Sanwell SH series LED fluorescent powder anti-settling agent etc.) or two kinds with On combination.
Wherein, the tackifier or adhesive accelerant can be selected from ethyl orthosilicate, vinyltrimethoxysilane, boric acid N-butyl, boric acid isopropyl ester, isooctyl acid titanium, zirconium iso-octoate, tetrabutyl titanate, isopropyl titanate, KH-171, KH-560, KH- 570, (the reference such as ethenylmethoxy silicone homopolymer, 3- glycidyl ether oxypropyltrimethoxysilane The 0026th section of CN1863875A specification etc.), the adhesive accelerant that commercially available approach can obtain can produce for Dow Corning Corporation JCR6101, JCR6101UP, EG6301, OE6336, JCR6175, JCR6109, Hipec4939, Hipec1-9224, OE6250, SR7010, SE9207, SE1740, SE9187L etc., but not limited to this.
Wherein, the inorganic filler can be as known in the art and be commercially available, such as may include Inorganic filler such as silica, for example, colloidal silicon dioxide, pyrogenic silica, silica flour, titanium oxide, glass, oxidation Aluminium, zinc oxide, or combinations thereof, filler can be micron or nanometer particle, it is however preferred to have 5000 nanometers or smaller average grain Diameter and will not be by scattering or absorbing reduction percent transmission.
And about such as rheology modifier, wetting agent, defoaming agent, levelling agent, dyestuff etc., definition is that industry notes, And it can freely be chosen out of industry common respective material.
Preferably, the content of additive is not more than 50wt% in the curable silicon composition, particularly preferably exists 10wt% is hereinafter, more preferably in 5wt% or less.
In addition, also may include except the present invention in silicon composition of the invention in some feasible embodiments The component of other one or more silicon-hydrogen bond containings except POSS nano hybridization molecular compound containing multiple silicon-hydrogen bonds, such as Three (dimethyl siloxane) phenyl silanes etc..Certainly, the effect of these embodiments may be to be inferior to only have in of the invention Those of POSS nano hybridization molecular compound of the present invention containing multiple silicon-hydrogen bonds embodiment is added in machine silicon composition.
In some more specifically preferred embodiments, the silicon composition includes: containing for 10~95 parts by weight There are the polysiloxane-based component of vinyl, the component of the silicon-hydrogen bond containing of 5~90 parts by weight, the hydrosilanes of 0.1~10000ppm Change catalyst, the hydrosilanes reaction suppressor of 0.001~1.0 parts by weight, the additive of 0.001~5 parts by weight, 0.001~ The diluent of 90 parts by weight.
Further, the index of refraction of the silicon composition is 1.35~2.0, preferably 1.50~1.60.
Further, the viscosity of the silicon composition is 1~10,000,000cPs, preferably 1,000~100, 000cPs。
Silicon composition of the invention can refer to the group of formula of the widely applied organic silica gel mixture of current industry Formula is prepared, for example, its component is divided into component A (mainly comprising the polysiloxane-based component containing vinyl, platinum catalysis Agent, additive etc.) and component B ((main includes component, the additive etc. of silicon-hydrogen bond containing), when in use by two component of A, B by one Certainty ratio mixing.Compared to the organic silica gel for being applied to semiconductor packages at present, silicon composition of the invention also has packet Contain but be not limited to the advantages of listing as follows, comprising: still has long service life (greater than 8h without significantly gluing at room temperature Degree variation), simplify semiconductor devices (such as LED) encapsulation process and improve yield, and, storage-stable is more preferably (at 0-5 DEG C Under, it is greater than 1 month, preferably 3 months, more preferably 6 months).
What the other side of the embodiment of the present invention additionally provided the curable silicon composition is fully cured object.
The other side of the embodiment of the present invention, which additionally provides, prepares the completely solid of the curable silicon composition The method of compound may include: to keep the silicon composition complete by heating or electromagnetic irradiation (such as the irradiation of UV light) Solidification.
In certain specific embodiments of the invention, the system that object is fully cured of the curable silicon composition Preparation Method may include:
In a planet strrier special plastic cup, it is added by the composition of the curable silicon composition each Component is simultaneously uniformly mixed；
By the fluid stirred evenly (preferably liquid) at 25~300 DEG C 1~5,000min of heat cure.
Preferably, the hardness that object is fully cured is shore hardness A20~shore hardness D 95, especially preferably shore Hardness 20~shore hardness of A D65.
Preferably, it is described be fully cured object for visible light light transmittance be 80%~100%, especially preferably 95%~ 100%.
By silicon composition of the present invention, can make between device or device and the external world be able to maintain it is good every From, including physics and chemical isolation, and/or device is made to be able to maintain good light output or intake efficiency.
Meanwhile the object that is fully cured of the silicon composition also shows good bonding force and flexibility, and dielectric The performances such as constant, heat transfer efficiency, anti-aging are also ideal.
Postscript, compared to existing organic silica gel class product, silicon composition of the invention also have comprising but it is unlimited In list as follows the advantages of, comprising: still have at room temperature long service life (be greater than 8h without significant viscosity change), Better blind performance simplifies the encapsulation process of semiconductor devices (such as LED) and improves yield, and, storage-stable More preferably (at 0-5 DEG C, it is greater than 1 month, preferably 3 months, more preferably 6 months).
Correspondingly, the other side of the embodiment of the present invention additionally provides the curable silicon composition in article Be bonded, prepare article surface covering or article encapsulation in application.
In the present invention, " encapsulation " (packaging) should be understood that including at least following connotation e.g. passes through More than two articles are bonded (adhesive) by the silicon composition, alternatively, by the silicon composition in article The some regions on surface are formed by curing protective layer (coating), alternatively, the part of one or more articles is immersed to be had by described Machine silicon composition formed solidfied material in, alternatively, by one or more articles integrally embed sealing (encapsulation) in by In the solidfied material that the silicon composition is formed, certainly, the functions such as bonding above-mentioned, coating, sealing also can be achieved at the same time.
The other side of the embodiment of the present invention additionally provides a kind of adhering method comprising:
Apply between the first article and/or the second article surface and/or the first article and the second article described curable Silicon composition,
Make the silicone composition, realizes that the first article is bonding with the second article；
Preferably, the cured condition includes: to keep the silicon composition completely solid by heating or electromagnetic irradiation Change.
The other side of the embodiment of the present invention additionally provides a kind of semiconductor packages material, comprising described curable Silicon composition and/or the silicon composition solidfied material.
The other side of the embodiment of the present invention additionally provides a kind of film or coating, is mainly had by described curable Machine silicon composition is formed by curing.
The other side of the embodiment of the present invention additionally provides a kind of semiconductor light-emitting apparatus comprising: semiconductor light emitting Chip, and, the film or coating；And the semiconductor luminous chip and the film or coating interval are arranged.
The other side of the embodiment of the present invention additionally provides a kind of packaging method comprising:
Article to be packaged is provided,
The curable silicon composition is applied on the article to be packaged, and by radiation and/or is added Heat makes the silicone composition and realizes the encapsulation of the article.
Preferably, the article to be packaged includes semiconductor devices or electronic device.It is further preferred that described partly lead Body device includes semiconductor photoelectric device.Still more preferably, the semiconductor photoelectric device includes light emitting semiconductor device Such as LED etc..The other side of the embodiment of the present invention additionally provides a kind of device, and it includes what is formed by aforementioned encapsulation method Encapsulating structure.
Preferably, the encapsulating structure is mainly by the solidfied material of the curable silicon composition and by the solidification The article composition of object encapsulation, wherein packed article includes semiconductor devices or electronic device.
Preferably, the semiconductor devices includes semiconductor photoelectric device.It is further preferred that the semiconductor light electric appliance Part includes light emitting semiconductor device such as LED, especially chip size packages semiconductor devices or wafer level semiconductor device etc..
In addition, silicon composition of the invention with fluorescent materials such as fluorescent powder, fluorescence quantums in use, can also assist With using, for example, aforementioned fluorescent material can be mixed the silicon composition, then to packaged articles.In the process, Inventor is also found surprisingly that very much, silicon composition of the invention can pole significantly reduce and even be eliminated phosphor The sedimentation that material, especially fluorescent powder generate at any time, for example, when commonly all kinds of fluorescent materials are combined with of the invention by industry After object mixing, at room temperature, there is no a precipitation status greater than 8h, preferably for 24 hours more than, thus can produce more uniform Packaging effect improves the Luminescence Uniformity etc. of light emitting semiconductor device class.
For example, in some embodiments of the invention, a kind of fluorescence encapsulating composition may include the organosilicon group Close object and the fluorescent material that is dispersed in the silicon composition, the fluorescent material includes fluorescent powder and/or glimmering Light quanta point etc..
Preferably, in the fluorescence encapsulating composition fluorescent material account for non-solvent component content be 0.01wt%~ 90wt%, further preferably 1wt%~80wt%, more preferably 3wt%~70wt%.
Aforementioned fluorescent powder includes rare earth phosphor, rare-earth garnet fluorescent powder, sulfurized alkaline earth metal gallate, alkaline-earth metal Sulfide, vulcanization zinc-type, alkali earth metal aluminate, phosphate, borate, silicate, fluorine arsenate, fluogermanate, rare earth sulphur Compound, rare earth oxide, vanadate, any one two or more combination in nitride phosphor.The fluorescence encapsulation group It is preferably 1.0wt%~90wt% that fluorescent powder, which accounts for the content of non-solvent component, in conjunction object, more preferably 1.0wt%~70wt%.
More preferably, aforementioned fluorescent powder can use nano-phosphor.
The composition material of aforementioned fluorescent quantum dot include II-VI group or iii-v element, such as can be ZnSe, CdS, Any one two or more combination material in CdSe and CdSe.Fluorescence quantum accounts for non-in the fluorescence encapsulating composition The content of solvent composition is preferably 0.01~50wt%, more preferably 0.01~5.0wt%.
Fluorescence encapsulating composition above-mentioned is particularly suitable for the application in semiconductor light emitting device packages, comprising: wafer scale Encapsulate (WLP), chip size packages (CSP), LED filament encapsulation etc..
Technical solution of the present invention is made specifically below in conjunction with several more specifically embodiments and corresponding comparative example Explanation.But still it is emphasized that these embodiments are not to be construed as constituting any restrictions to protection scope of the present invention. Postscript, unless otherwise specified, all numbers, percentage, the ratio etc. in description of the invention are by weight.
The component of silicon composition can be refering to table 1 in following each embodiment and reference examples.And these embodiments, control The component applied in example is specific as follows:
Resin: the mixture of resin 1 and resin 2 that mass ratio is about 0.833:13, the equivalent of vinyl contained therein (equivalent weight) is about 1.66mmol/g.
Resin 1:50wt% diphenyldimethyl methylvinyl-polysiloxane, ethenyl blocking, refractive index 1.541 are glued Spend 10700cPs.
Resin 2: the silsesquioxane of methyl (Me), phenyl (Ph), vinyl, refractive index 1.550, viscosity are had 55000cPs。
Crosslinking agent 1: refractive index 1.5028, viscosity 6.0cPs.
Crosslinking agent 2:30wt% diphenyldimethyl methylhydrogenpolysi,oxane, refractive index 1.4630, viscosity 400.0cPs.
Crosslinking agent 3: refractive index 1.460, viscosity 2.5cPs.
Crosslinking agent 4: refractive index 1.551, viscosity 1310.0cPs.
Adhesion promoters (Adhesion Promoter): 3- glycidyl ether oxypropyltrimethoxysilane.
Inhibitor (Si―H addition reaction inhibitor): 2- phenyl -3- butyne-2-alcohol.
Catalyst (hydrosilylation catalyst): platinum catalyst.
Aforementioned resin 1, crosslinking agent 1, crosslinking agent 2, crosslinking agent 3, crosslinking agent 4 are as follows.
Aforementioned resin, resin 1, resin 2, crosslinking agent 1, crosslinking agent 2, crosslinking agent 3, crosslinking agent 6, adhesion promoters, inhibition Agent (Si―H addition reaction inhibitor), catalyst (hydrosilylation catalyst) etc. can be obtained by the approach such as commercially available.
Aforementioned crosslinking agent 4 can synthesize as follows:
(1) 0.5g hydrosilylation catalyst platinum is taken, 5mL dilution with toluene is added, is then added in 250mL three-neck flask；
(2) eight vinyl-POSS of 6.33g (POSS-Octavinyl substituted, molecular weight MW=633.05g/ are taken Mol), three-neck flask is added after 50mL dilution with toluene being added；
(3) 23.33g 1 is taken, (1,3-Bis (dimethylsilyl) benzene divides bis- (dimetylsilyl) benzene of 3- Son amount=194.42), three-neck flask is added after 25mL dilution with toluene is added；
(4) it is arranged 130 DEG C of oil bath temperature, opens stirring, opens condensed water, until when temperature is 119 DEG C in three-neck flask, instead Mixture is answered to start to flow back；
(5) it flows back after a period of time, draws a small amount of reaction mixture and carry out IR test, to judge whether reaction has carried out Entirely.
After (6) 48 hours, IR as the result is shown carbon-free carbon double bond absorption peak then indicate reaction terminate, 1H NMR as the result is shown without Reaction mixture is transferred to Rotary Evaporators at this time and steams solvent by vinyl H, be precipitated product crosslinking agent 4 (FT-IR:3080~ 2921,2124,1691,1516,1405~1201,1119,1053,901,836~626cm-1；1H NMR δ: 7.58~7.18, 4.32~4.27,2.50~2.00,1.00~-0.50).It should be noted that the product is the mixed of hydrosilylation formation Close object.
Characterization and test: further, inventor is also in such a way that industry is commonly seen to foregoing embodiments, control Performance change situation, solidification situation and condensate performance of the silicon composition involved in example in room temperature environment, including Light transmittance, hardness etc. are investigated respectively, as a result if the following table 2 is (it should be noted that each test data therein is multiple examinations The average value of the test result of sample).
Table 1
Table 2
Likewise, other compounds and proportion that inventor is also addressed using this specification are assembled as raw material and are formd Other multiple groups silicon compositions, and its properties is tested one by one, test result is also admirably suitable for industry Using.
For example, inventor has also synthesized crosslinking agent 5, and structural formula is as follows in other some embodiments:
The synthesis technology of the crosslinking agent 5 is similar to crosslinking agent 4, i.e., are as follows:
Using the crosslinking agent 4 in the crosslinking agent 5 substitution previous embodiment 1, and equally tested accordingly, performance with Crosslinking agent 4 is close.
It can be seen that being added using the POSS nano hybridization molecular compound of the invention containing multiple silicon-hydrogen bonds as silicon hydrogen At the crosslinking agent of reaction, not only have many advantages, such as more high refractive index, more high viscosity, more high crosslink density, but also can make to wrap Also have that curing efficiency is high, curing rate is fast, hardness is higher after solidification and index of refraction is higher, thermogravimetric containing its silicon composition Lose the features such as low, viscosity is suitble to industrial application.To be allowed to be suitable for the encapsulating material of great power LED, it can also be used to its The encapsulation of his semiconductor photoelectric device, electronic device such as optical switch, photoelectrical coupler, solid-state image pickup element etc.；In addition, this has Machine silicon composition can be used for optical adhesive, photoelectric device surface protection etc..
It should be noted that, in this document, the terms "include", "comprise" or its any other variant are intended to non-row His property includes, so that the process, method, article or equipment for including a series of elements not only includes those elements, and And further include other elements that are not explicitly listed, or further include for this process, method, article or equipment institute it is intrinsic Element.It should be appreciated that the technical concepts and features of above-described embodiment only to illustrate the invention, its object is to allow be familiar with this The personage of technology cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention.All According to equivalent change or modification made by spirit of the invention, should be covered by the protection scope of the present invention.

Claims (13)

1. a kind of POSS nano hybridization molecular compound containing multiple silicon-hydrogen bonds, which is characterized in that its chemical formula is (R') x (R”)y(SiO3/2) z, wherein R'=CH2CH2(CH3)2Si-m-C6H4-Si(CH3)2H, or R'=CHCH3-(CH3)2Si-m- C6H4-Si(CH3)2H, wherein R " is selected from unsaturated alkenyl, the C1-C20 of the alkyl of substituted or unsubstituted C1-C20, C1-C20 Unsaturated alkynyl, aryl, CH2CH2(CH3)2Si-m-C6H4-Si(CH3)2Or CHCH H,3-(CH3)2Si-m-C6H4-Si(CH3)2H, R', R " are same or different, and x, z are integers, and x >=3, z=6,8,10 or 12, x+y=z；Preferably, x=8, y=0, z =8；
Preferably, R " is selected from substituted or unsubstituted C1-C20 alkyl；It is further preferred that R " is selected from substituted or unsubstituted C1-C8 alkyl；It is furthermore preferred that R " is selected from methyl, ethyl, propyl, isopropyl, butyl or 2- ethylhexyl；
Preferably, R " is selected from substituted or unsubstituted C1-C20 unsaturation alkenyl；Replace or do not take it is further preferred that R " is selected from The C1-C8 unsaturation alkenyl in generation；It is furthermore preferred that R " is selected from vinyl, acrylic, isopropenyl, allyl, cyclobutenyl or isobutyl Alkenyl；
Preferably, R " is selected from substituted or unsubstituted C1-C20 unsaturation alkynyl；Replace or do not take it is further preferred that R " is selected from The C1-C8 unsaturation alkynyl in generation；It is furthermore preferred that R " is selected from acetenyl, propinyl, isopropynyl, propargyl, butynyl or different Butynyl；
Preferably, R " is selected from substituted or unsubstituted phenyl；It is further preferred that R " be selected from selected from phenyl, 4- methylphenyl, 4- methoxyl group-phenyl or the chloro- phenyl of 4-；
Preferably, the POSS nano hybridization molecular compound containing multiple silicon-hydrogen bonds has structure shown in following formula:
2. the POSS nano hybridization molecular compound described in claim 1 containing multiple silicon-hydrogen bonds adds as crosslinking agent in silicon hydrogen At the application in reaction.
3. a kind of preparation method of the POSS nano hybridization molecular compound containing multiple silicon-hydrogen bonds, characterized by comprising: make to contain Eight silsesquioxanes and the compound containing at least two si-h bonds for having at least three vinyl are having item existing for catalyst Hydrosilylation is carried out under part, generates the POSS nano hybridization molecular compound containing multiple silicon-hydrogen bonds described in claim 1, The POSS nano hybridization molecular compound containing multiple silicon-hydrogen bonds contains at least three Si -- H bond；
Preferably, the chemical formula of eight silsesquioxanes containing at least three vinyl is (R1)a(R2)b(SiO3/2) c, Middle R1Selected from substituted or unsubstituted vinyl or allyl, R2Alkyl, C1-C20 selected from substituted or unsubstituted C1-C20 The unsaturated alkynyl or aryl of unsaturated alkenyl, C1-C20, R1、R2Same or different, a, c are integers, and a >=3, c=6, 8,10 or 12, a+b=c；It is especially preferred, c=8, a=8, b=0；It is especially preferred, R2Selected from substituted or unsubstituted C1- C20 alkyl；Preferably, R2Selected from substituted or unsubstituted C1-C8 alkyl；It is further preferred that R2Selected from methyl, ethyl, third Base, isopropyl, butyl or 2- ethylhexyl；Alternatively, R2Selected from substituted or unsubstituted C1-C20 unsaturation alkenyl；Preferably, R2 Selected from substituted or unsubstituted C1-C8 unsaturation alkenyl；It is further preferred that R2Selected from vinyl, acrylic, isopropenyl, Allyl, cyclobutenyl or isobutenyl；Alternatively, R2Selected from substituted or unsubstituted C1-C20 unsaturation alkynyl；Preferably, R2Choosing From substituted or unsubstituted C1-C8 unsaturation alkynyl；It is further preferred that R2Selected from acetenyl, propinyl, isopropynyl, alkynes Propyl, butynyl or butynyl；Alternatively, R2Selected from substituted or unsubstituted phenyl；Preferably, R2Selected from selected from phenyl, 4- first Base-phenyl, 4- methoxyl group-phenyl or the chloro- phenyl of 4-；
Still more preferably, R1And R2It is selected from vinyl, especially preferred, eight silsesquioxane is eight vinyl- POSS；
Still more preferably, eight silsesquioxanes containing at least three vinyl have structure shown in following formula:
Preferably, the chemical formula of the compound for containing at least two si-h bonds is H (CH3)2Si-m-C6H4-Si(CH3)2H；
Still more preferably, the compound containing at least two si-h bonds has structure shown in following formula:
Preferably, the preparation method includes: that will contain eight silsesquioxanes of at least three vinyl, contain at least two silicon After compound, organic solvent and the catalyst of hydrogen bond mix, it is heated to reflux carry out hydrosilylation, is generated described containing multiple The POSS nano hybridization molecular compound of silicon-hydrogen bond.
4. a kind of curable silicon composition, including the polysiloxane-based component containing vinyl, the component of silicon-hydrogen bond containing And hydrosilylation catalysts；It is characterized by: the component of the silicon-hydrogen bond containing includes described in claim 1 containing multiple silicon- The POSS nano hybridization molecular compound of hydrogen bond；
Preferably, the polysiloxane-based component containing vinyl contains the alkenyl and at least one of at least two Yu silicon bonding A aromatic radical with silicon bonding；Preferably, the index of refraction of the polysiloxane-based component containing vinyl is not less than 1.5, especially It is preferably 1.50~1.65；Preferably, the polysiloxane-based component containing vinyl in 25 DEG C viscosity be 10~50, 000cPs, especially preferably 50~5000cPs；Preferably, polysiloxane-based group containing vinyl be selected from linear polymer, Branched polymers or network polymers it is one or more；It is further preferred that described contain the polysiloxane-based of vinyl Group is selected from linear polymer；It is tied shown in following formula it is further preferred that the polysiloxane-based component containing vinyl has Structure:
Wherein, D=1~500, M=1~500, N=1~500；More preferably, D=1~50, M=1~500, N=1~ 50；
Preferably, the hydrosilylation catalysts are selected from platinum catalyst, rhodium catalyst or the palladium catalyst of catalytic amount；It is preferred that , the platinum catalyst is selected from platinum micro mist, chloroplatinic acid, the alcoholic solution of chloroplatinic acid, platinum/alkenylsiloxane complex, platinum/alkene Complex compound and platinum/carbonyl complex are one or more；Preferably, the hydrosilylation catalysts are combined in the organosilicon Dosage in object is 0.1ppm to 10,000ppm；
Preferably, in the component of vinyl contained in the polysiloxane-based component containing vinyl and the silicon-hydrogen bond containing The molar ratio of contained si-h bond is 10:1~1:10, preferably 2:1~1:2；
Preferably, the curable silicon composition further include hydrosilanes reaction suppressor and/or additive and/or Diluent；
Preferably, the hydrosilanes reaction suppressor is selected from alkynol compound, alkene-alkine compounds, siloxanes or benzo three Azoles；Preferably, the content of additive is not more than 50wt% in the curable silicon composition, particularly preferably in 5wt% Below；
Preferably, the dosage of the diluent is enough to cooperate with each component of the silicon composition and form homogeneous phase solution；
It is further preferred that the silicon composition includes: polysiloxane-based group containing vinyl of 10~95 parts by weight Divide, the component of silicon-hydrogen bond containing of 5~90 parts by weight, the hydrosilylation catalysts of 0.1~10000ppm, 0.001~1.0 weight Part hydrosilanes reaction suppressor, the additives of 0.001~5 parts by weight, 0.001~90 parts by weight diluent；
Preferably, the index of refraction of the silicon composition is 1.35~2.0, preferably 1.50~1.60；
Preferably, the viscosity of the silicon composition is 1~10,000,000cPs, preferably 1,000~100,000cPs.
5. object is fully cured in curable silicon composition as claimed in claim 4；Preferably, the object of being fully cured Hardness is shore hardness A20~shore hardness D 95, especially preferably 20~shore hardness of shore hardness A D65；Preferably, institute Stating and object is fully cured is 80%~100%, especially preferably 95%~100% for the light transmittance of visible light；Preferably, described The preparation method that object is fully cured includes: that the silicon composition is fully cured by heating or electromagnetic irradiation.
6. fluorescence encapsulating composition, it is characterised in that comprising curable silicon composition as claimed in claim 4 and The even fluorescent material being scattered in the silicon composition, the fluorescent material include fluorescent powder and/or fluorescence quantum；
Preferably, the content that fluorescent material accounts for non-solvent component in the fluorescence encapsulating composition is 0.01wt%~90wt%, Further preferably 1wt%~80wt%, more preferably 3wt%~70wt%；
Preferably, the fluorescent powder includes rare earth phosphor, rare-earth garnet fluorescent powder, sulfurized alkaline earth metal gallate, alkaline earth It is metal sulfide, vulcanization zinc-type, alkali earth metal aluminate, phosphate, borate, silicate, fluorine arsenate, fluogermanate, dilute Native sulfide, rare earth oxide, vanadate, any one two or more combination in nitride phosphor；
Preferably, it is preferably 1.0wt%~90wt% that fluorescent powder, which accounts for the content of non-solvent component, in the fluorescence encapsulating composition, More preferably 1.0wt%~70wt%；
More preferably, the fluorescent powder uses nano-phosphor；
Preferably, the composition material of the fluorescence quantum includes II-VI group or iii-v element；More preferably, described glimmering The composition material of light quanta point includes any one two or more combination in ZnSe, CdS, CdSe and CdSe；
Preferably, in the fluorescence encapsulating composition fluorescence quantum account for the content of non-solvent component be preferably 0.01~ 50wt%, more preferably 0.01~5.0wt%.
7. curable silicon composition described in claim 4 or fluorescence encapsulating composition as claimed in claim 6 are in article Be bonded, prepare article surface covering or article encapsulation in application.
8. a kind of adhering method, characterized by comprising:
Applying between the first article and/or the second article surface and/or the first article and the second article can described in claim 4 Cured silicon composition,
Make the silicone composition, realizes that the first article is bonding with the second article；
Preferably, the cured condition includes: that the silicon composition is fully cured by heating or electromagnetic irradiation.
9. semiconductor packages material includes silicon composition and/or the organosilicon curable described in claim 4 The solidfied material of the solidfied material of composition or fluorescence encapsulating composition as claimed in claim 6 and/or the fluorescence encapsulating composition.
10. film or coating, main silicon composition curable as described in claim 4 or as claimed in claim 6 glimmering Light encapsulating composition is formed by curing.
11. semiconductor light-emitting apparatus, characterized by comprising: semiconductor luminous chip, and, film described in any one of claim 10 Or coating；And the semiconductor luminous chip and the film or coating interval are arranged.
12. a kind of packaging method, characterized by comprising:
Article to be packaged is provided,
Silicon composition curable described in claim 4 or fluorescence encapsulating composition as claimed in claim 6 are applied to On the article to be packaged, and the silicone composition is set to realize the article by radiation and/or heating Encapsulation；Preferably, the article to be packaged includes semiconductor devices or electronic device；It is further preferred that the semiconductor Device includes semiconductor photoelectric device；Still more preferably, the semiconductor photoelectric device includes light emitting semiconductor device, institute Stating light emitting semiconductor device includes LED.
13. a kind of device, it is characterised in that include the encapsulating structure formed by claim 12 the method；Preferably, described Mainly silicon composition curable as described in claim 4 or fluorescence as claimed in claim 6 encapsulate combination to encapsulating structure The solidfied material of object and the article encapsulated by the solidfied material form, wherein packed article includes semiconductor devices or electronics device Part；Preferably, the semiconductor devices includes semiconductor photoelectric device；It is further preferred that the semiconductor photoelectric device packet Light emitting semiconductor device is included, the light emitting semiconductor device includes LED, preferably chip size packages semiconductor devices or wafer Level semiconductor device.
CN201710946225.XA 2017-10-12 2017-10-12 Containing the POSS nano hybridization molecular compound of multiple silicon-hydrogen bonds and its application Withdrawn CN109651613A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110770280A (en) * 2017-06-26 2020-02-07 美国陶氏有机硅公司 Process for hydrosilylating aliphatically unsaturated alkoxysilanes and hydrogen-terminated organosiloxane oligomers using rhodium catalysts to prepare alkoxysilyl-terminated polymers useful for functionalizing polyorganosiloxanes
WO2023123746A1 (en) * 2021-12-28 2023-07-06 深圳市首骋新材料科技有限公司 Flexible packaging agent for semiconductor element and preparation method therefor, and thin film packaging method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110770280A (en) * 2017-06-26 2020-02-07 美国陶氏有机硅公司 Process for hydrosilylating aliphatically unsaturated alkoxysilanes and hydrogen-terminated organosiloxane oligomers using rhodium catalysts to prepare alkoxysilyl-terminated polymers useful for functionalizing polyorganosiloxanes
CN110770280B (en) * 2017-06-26 2022-02-22 美国陶氏有机硅公司 Process for preparing alkoxy-functional organohydrogensiloxane oligomers
WO2023123746A1 (en) * 2021-12-28 2023-07-06 深圳市首骋新材料科技有限公司 Flexible packaging agent for semiconductor element and preparation method therefor, and thin film packaging method

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Application publication date: 20190419