CN109640413A - A kind of plate thick film heating device, churning device and manufacturing process - Google Patents
A kind of plate thick film heating device, churning device and manufacturing process Download PDFInfo
- Publication number
- CN109640413A CN109640413A CN201910067531.5A CN201910067531A CN109640413A CN 109640413 A CN109640413 A CN 109640413A CN 201910067531 A CN201910067531 A CN 201910067531A CN 109640413 A CN109640413 A CN 109640413A
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- dielectric layer
- churning
- conductor
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 title abstract description 7
- 239000004020 conductor Substances 0.000 claims abstract description 52
- 238000003756 stirring Methods 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 240000007643 Phytolacca americana Species 0.000 claims abstract description 17
- 238000007789 sealing Methods 0.000 claims description 15
- 238000002360 preparation method Methods 0.000 claims description 7
- 238000007639 printing Methods 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 5
- 238000005245 sintering Methods 0.000 claims description 5
- 230000008094 contradictory effect Effects 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 239000008267 milk Substances 0.000 claims 1
- 210000004080 milk Anatomy 0.000 claims 1
- 235000013336 milk Nutrition 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 235000012054 meals Nutrition 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007651 thermal printing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J31/00—Apparatus for making beverages
- A47J31/44—Parts or details or accessories of beverage-making apparatus
- A47J31/4403—Constructional details
- A47J31/441—Warming devices or supports for beverage containers
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
- A47J43/00—Implements for preparing or holding food, not provided for in other groups of this subclass
- A47J43/04—Machines for domestic use not covered elsewhere, e.g. for grinding, mixing, stirring, kneading, emulsifying, whipping or beating foodstuffs, e.g. power-driven
- A47J43/07—Parts or details, e.g. mixing tools, whipping tools
- A47J43/075—Safety devices
- A47J43/0761—Safety devices for machines with tools driven from the lower side
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/16—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being mounted on an insulating base
Landscapes
- Engineering & Computer Science (AREA)
- Food Science & Technology (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
Abstract
The invention discloses a kind of plate thick film heating device, churning device and manufacturing process, belong to churning assembly heater field, the heater includes substrate layer and dielectric layer, dielectric layer is arranged on the substrate layer, it further include resistive layer, conductor layer, glassy layer and poke hole pipe, resistive layer and conductor layer are arranged on dielectric layer, and glassy layer is arranged on resistive layer and conductor layer.By being provided with poke hole pipe, it is heated so as to which heater is directly installed on churning device, with good heating effect, the stirring emptying aperture of setting is cooperated with poke hole pipe simultaneously, it can be designed that the heater that a blender is assembled and used with, so that blender can be mounted directly upper heater, the churning device of the application has structure simple simultaneously, have the function of heating and stirring simultaneously, manufacturing cost is low, can be 10 yuan lower than the price in market or more, it has good market prospects, it is good in economic efficiency.
Description
Technical field
The present invention relates to churning assembly heater field more particularly to a kind of plate thick film heating devices, churning device and manufacture
Technique.
Background technique
Thick film thermal printing techniques have graduallyd mature at present, with heating conduction is good, heat dissipation area is big and security performance is high
The characteristics of, but the fully effective design requirement utilized is had not been reached yet for the efficiency and performance of fluid heating.Such as existing skill
It is used to make the thick film heater of churning device in art, it generally adopts monolithic heating plate and is fixed on the backboard of churning device, to avoid
Contact in heating plate between thick film circuit and object to be added, while guaranteeing the power demands of thick film heater and avoiding leaking
Electricity.The heater of existing churning device has been integrated in substantially inside dress device, so that usually can in process
There is the case where individual larger, shell larger (thickness).Technology therein depends on the thickness for the heater that the inside generates heat, existing
Some thick film heater thickness is thicker, while usually will appear heating temperature and detecting not accurate situation, can usually make meal
Situations such as burning cannot meet the needs of users.
Since the space that thick film heater uses is smaller, traditional churning device thick film heater has not designed special outfit
Churning device uses, so that churning device can only be stirred individually, could not be stirred and carry out simultaneously with heating well, therefore
Using effect is bad, is not able to satisfy the demand of people, and therefore, it is necessary to design a kind of higher churning device thick-film heating of safety
Device.
Summary of the invention
The purpose of the present invention is to provide a kind of plate thick film heating device, churning device and manufacturing process, solve existing churning
Device could not heat simultaneously, and the technical issues of without designing the heater being assembled and used with blender.The heater according to
The details at family is designed, so that position of shape, size and corresponding mounting hole etc. is the peace according to user
Installing meter, while the structure design for the product installed as needed.
A kind of plate thick film heating device, including substrate layer and dielectric layer, the dielectric layer are arranged on the substrate layer, feature
It is: further includes resistive layer, conductor layer, glassy layer and poke hole pipe, the resistive layer and conductor layer are arranged on dielectric layer,
The glassy layer is arranged on resistive layer and conductor layer,
The substrate layer is provided in round structural slab, and stirring emptying aperture is provided on the circular configuration plate, and the stirring is empty
Dielectric layer and glassy layer above hole are respectively provided with emptying aperture structure, and the poke hole pipe setting is in stirring emptying aperture bottom.
Further, dielectric layer fixing groove is provided on the dielectric layer, the dielectric layer fixing groove is arranged in dielectric layer
Edge, the dielectric layer fixing groove is set as arcuate structure, and the quantity of the dielectric layer fixing groove is two, two media
Edge mutually contradictory on dielectric layer is arranged in layer fixing groove.
Further, the resistive layer is made of resistive conductor, is connected in series between the resistive conductor and resistive conductor, the electricity
Resistance layer is provided with power tag slot, and the power tag slot is provided with power words identification, between the resistive conductor and resistive conductor
Between be divided into 11-19 microns.
Further, the conductor layer includes connecting wire and current interface, resistive conductor of the connecting wire disconnection
Discontinuities be connected with each other, the quantity of the current interface is two, is set as the electric current input and output point of resistive conductor.
Further, it is empty that glassy layer stirring emptying aperture, power tag slot emptying aperture and current interface are provided on the glassy layer
Hole, above stirring emptying aperture, the current interface emptying aperture is arranged above current interface simultaneously for the glassy layer stirring emptying aperture setting
Hollow, power tag slot emptying aperture is arranged above power tag slot.
A kind of churning device of plate thick film heating device, including churning device ontology, churning device lid, churning leaf, sealing edge sealing, bottom
Plate, heater, rotary electric machine, power module, switch and power supply line;
The churning device lid is movably arranged on churning device ontology, and bottom plate setting is described in churning device body interior
The bottom of bottom plate is arranged in heater, and the rotary electric machine is arranged in heater base, and the churning leaf is fixed on rotary electric machine
On, and exposing bottom plate upper end, the power module is arranged in heater base, and the power supply line is through power module and rotary electric machine
Churning device outer body is arranged in connection, the switch, and controls power supply line and be powered or power off, and the sealing edge sealing is arranged in churning
At the shaft and contacts baseplate of leaf, the heater is heater described above.
Further, the power module is the power module of BA150-24S05.
A kind of preparation process of plate thick film heating device, the preparation process include the following steps,
Step 1: carrying out cover half to substrate layer according to the requirement of corresponding product is circular plate structure, and opens up stirring emptying aperture,
Poke hole pipe is welded on the bottom of stirring emptying aperture;
Step 2: using printing machine first medium layer being printed by silk-screen printing on the substrate layer, be put into 850 degrees Celsius
It is sintered in sintering furnace, republishes third dielectric layer after then printing second dielectric layer sintering, the overall thickness of dielectric layer is not small
In 90 microns;
Step 3: using being screen printed onto printed resistor layer on dielectric layer, between the resistive conductor and resistive conductor in resistive layer
Between be divided into 12 microns -18 microns;
Step 4: the printed conductor layer on dielectric layer, it is cooling after on resistive layer and conductor layer printed glass layer.
Further, the thickness for controlling resistive layer in the step 3 in printed resistor layer is compared by front and back weight, than
It is expected it is light after, one layer of thin resistive layer is republished on original resistive layer, the specific thickness of thin resistive layer is according to difference
Weight calculates.
Present invention employs above-mentioned technical proposal, the present invention is had following technical effect that
The present invention by be provided with poke hole pipe, heated so as to which heater is directly installed on churning device,
With good heating effect, while the stirring emptying aperture being arranged is cooperated with poke hole pipe, can be designed that a blender
The heater being assembled and used with, so that blender can be mounted directly upper heater, while the churning device of the application has structure
Simply, while having the function of heating and stirring, manufacturing cost is low, can be 10 yuan lower than the price in market or more, have fine
Market prospects, it is good in economic efficiency.
Detailed description of the invention
Fig. 1 is heater structure schematic diagram of the invention.
Fig. 2 is heater sectional view of the invention.
Fig. 3 is heater resistance schematic diagram of a layer structure of the invention.
Fig. 4 is heated conductor schematic diagram of a layer structure of the invention.
Fig. 5 is heater glass schematic diagram of a layer structure of the invention.
Fig. 6 is heater size structural schematic diagram of the invention.
Fig. 7 is the A-A structural schematic diagram of Fig. 6 of the invention.
Fig. 8 is the B-B structural schematic diagram of Fig. 7 of the invention.
Fig. 9 is churning device sectional view of the invention.
Numbered in figure: 1- substrate layer, 1.1- stirring emptying aperture, 2- dielectric layer, 2.1- dielectric layer fixing groove, 3- resistive layer,
3.1- resistive conductor, 3.2- power tag slot, 4- conductor layer, 4.1- connecting wire 4.2- current interface, 5- glassy layer, 5.1- glass
Layer stirring emptying aperture, 5.2- power tag slot emptying aperture, 5.3- current interface emptying aperture, 6- poke hole pipe, 10- churning device lid, 20- churning
Leaf, 30- sealing edge sealing, 40- bottom plate, 50- heater, 60- rotary electric machine, 70- power module, 80- switch, 90- power supply line.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention more comprehensible, referring to the drawings and preferred reality is enumerated
Example is applied, the present invention is described in more detail.However, it is necessary to illustrate, many details listed in specification are only to be
Reader is set to have a thorough explanation to one or more aspects of the present invention, it can also be with even without these specific details
Realize the aspects of the invention.
As shown in figures 1-8, a kind of plate thick film heating device structural schematic diagram according to the present invention, including substrate layer 1 and Jie
Matter layer 2, the dielectric layer 2 are arranged on substrate layer 1, further include resistive layer 3, conductor layer 4, glassy layer 5 and poke hole pipe 6, institute
It states resistive layer 3 and conductor layer 4 is arranged on dielectric layer 2, the glassy layer 5 is arranged on resistive layer 3 and conductor layer 4,
The substrate layer 1 is provided in round structural slab, and stirring emptying aperture 1.1 is provided on the circular configuration plate, described to stir
The dielectric layer 2 and glassy layer 5 for mixing 1.1 top of emptying aperture are respectively provided with emptying aperture structure, and the setting of poke hole pipe 6 is in stirring emptying aperture 1.1
Bottom.Substrate layer 1 and poke hole pipe 6 are made of using metal material.
The thick film heating device of the application, which can be directly installed on, can complete to use on blender, have matching used
Effect, thus have it is easy for installation, can directly connect with the mains can realize heating function.Existing one can be directly added into
Under old-fashioned not heating function blender in, the unexpected economic benefit effect of flicker.
In the embodiment of the present invention, dielectric layer fixing groove 2.1, the dielectric layer fixing groove 2.1 are provided on the dielectric layer 2
The edge of dielectric layer 2 is set, and the dielectric layer fixing groove 2.1 is set as arcuate structure, the dielectric layer fixing groove 2.1
Quantity is two, and edge mutually contradictory on dielectric layer 2 is arranged in two dielectric layer fixing grooves 2.1.Dielectric layer fixing groove 2.1
For being fixed on blender, has the effect of fixation.Mutually contradictory edge is set, there is better fixed effect.
In the embodiment of the present invention, the resistive layer 3 is made of resistive conductor 3.1, the resistive conductor 3.1 and resistive conductor 3.1 it
Between be connected in series, the resistive layer 3 is provided with power tag slot 3.2, and the power tag slot 3.2 is provided with power text mark
Know, between the resistive conductor 3.1 and resistive conductor 3.1 between be divided into 11-19 microns.Resistive conductor 3.1 and the interval of resistive conductor 3.1 are set
11-19 microns are set to, there is the danger for preventing electric arc, so that safety is higher.Power data on power tag slot 3.2
So that all having fixed mark on every piece of heater, being more convenient to install and using.
In the embodiment of the present invention, the conductor layer 4 includes connecting wire 4.1 and current interface 4.2, the connecting wire
The discontinuities of the resistive conductor 3.1 of 4.1 disconnections are connected with each other, and the quantity of the current interface 4.2 is two, are set as resistive conductor
3.1 electric current input and output point.Current interface 4.2 is output and input for electric current, provides electric current for fever for resistance wire.
In the embodiment of the present invention, glassy layer stirring emptying aperture 5.1, power tag slot emptying aperture 5.2 are provided on the glassy layer 5
With current interface emptying aperture 5.3, glassy layer stirring emptying aperture 5.1 setting is above stirring emptying aperture 1.1, the current interface emptying aperture
5.3 settings are above current interface 4.2 and hollow, and power tag slot emptying aperture 5.2 is arranged above power tag slot 3.2.
A kind of churning device of plate thick film heating device, as shown in figure 9, including churning device ontology, churning device lid 10, churning leaf
20, edge sealing 30, bottom plate 40, heater 50, rotary electric machine 60, power module 70, switch 80 and power supply line 90 are sealed;
The churning device lid 10 is movably arranged on churning device ontology, and the bottom plate 40 is arranged in churning device body interior,
The bottom of bottom plate 40 is arranged in the heater 50, and the rotary electric machine 60 is arranged in 50 bottom of heater, the churning leaf 20
It is fixed on rotary electric machine 60, and exposes 40 upper end of bottom plate, the power module 70 is arranged in 50 bottom of heater, the power supply
Line 90 is connect through power module 70 with rotary electric machine 60, and churning device outer body is arranged in the switch 80, and controls power supply line 90
It is powered or shaft and 40 contact position of bottom plate of churning leaf 20 is arranged in power-off, the sealing edge sealing 30, the heater 50 is upper
State the heater.The power module 70 is the power module of BA150-24S05.
Churning device ontology, churning device lid 10, churning leaf 20, sealing edge sealing 30 and bottom plate 40 are existing structure, power supply
Module 70 also connect with heater 50 and is powered, so as to the effect heated while rotating.
A kind of preparation process of plate thick film heating device, the preparation process include the following steps,
Step 1: carrying out cover half to substrate layer 1 according to the requirement of corresponding product is circular plate structure, and opens up stirring emptying aperture
1.1, poke hole pipe 6 is welded on the bottom of stirring emptying aperture 1.1.The welding of poke hole pipe 6 is welded using laser welding technology
It connects.
Step 2: printing first medium layer 2 by being screen printed on substrate layer 1 using printing machine, be put into 850 degrees Celsius
Sintering furnace in be sintered, then print second dielectric layer 2 be sintered after republish third dielectric layer 2, the overall thickness of dielectric layer 2
Not less than 90 microns;
Step 3: using being screen printed onto printed resistor layer 3 on dielectric layer 2, the resistive conductor 3.1 and resistive conductor in resistive layer 3
12 microns -18 microns are divided between 3.1;
Step 4: the printed conductor layer 4 on dielectric layer 2, it is cooling after on resistive layer 3 and conductor layer 4 printed glass layer 5.
Controlling the thickness of resistive layer 3 in the step 3 in printed resistor layer 3 is compared by front and back weight, than expected
After light, one layer thin of resistive layer 3 is republished on original resistive layer 3, the specific thickness of thin resistive layer 3 is according to difference weight
It calculates.When the resistance of printing is thicker, use laser to be aoxidized so that
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the principle of the present invention, it can also make several improvements and retouch, these improvements and modifications are also answered
It is considered as protection scope of the present invention.
Claims (9)
1. a kind of plate thick film heating device, including substrate layer (1) and dielectric layer (2), the dielectric layer (2) is arranged in substrate layer
(1) on, it is characterised in that: further include resistive layer (3), conductor layer (4), glassy layer (5) and poke hole pipe (6), the resistive layer
(3) it being arranged on dielectric layer (2) with conductor layer (4), the glassy layer (5) is arranged on resistive layer (3) and conductor layer (4),
The substrate layer (1) is provided in round structural slab, and stirring emptying aperture (1.1) is provided on the circular configuration plate, described to stir
It mixes dielectric layer (2) and glassy layer (5) above emptying aperture (1.1) and is respectively provided with emptying aperture structure, poke hole pipe (6) setting is being stirred
Emptying aperture (1.1) bottom.
2. a kind of plate thick film heating device according to claim 1, it is characterised in that: be provided on the dielectric layer (2)
Dielectric layer fixing groove (2.1), the dielectric layer fixing groove (2.1) are arranged in the edge of dielectric layer (2), and the dielectric layer is fixed
Slot (2.1) is set as arcuate structure, and the quantity of the dielectric layer fixing groove (2.1) is two, two dielectric layer fixing grooves (2.1)
Mutually contradictory edge on dielectric layer (2) is set.
3. a kind of plate thick film heating device according to claim 1, it is characterised in that: the resistive layer (3) is by resistive conductor
(3.1) it forms, is connected in series between the resistive conductor (3.1) and resistive conductor (3.1), the resistive layer (3) is provided with power mark
Know area (3.2), the power tag slot (3.2) is provided with power words identification, the resistive conductor (3.1) and resistive conductor (3.1)
Between between be divided into 11-19 microns.
4. a kind of plate thick film heating device according to claim 3, it is characterised in that: the conductor layer (4) includes connection
Conducting wire (4.1) and current interface (4.2), the connecting wire (4.1) mutually interconnect the discontinuities of the resistive conductor (3.1) of disconnection
It connects, the quantity of the current interface (4.2) is two, is set as the electric current input and output point of resistive conductor (3.1).
5. a kind of plate thick film heating device according to claim 4, it is characterised in that: be provided on the glassy layer (5)
Glassy layer stirs emptying aperture (5.1), power tag slot emptying aperture (5.2) and current interface emptying aperture (5.3), and the glassy layer stirs emptying aperture
(5.1) above stirring emptying aperture (1.1), current interface emptying aperture (5.3) setting is above current interface (4.2) and leaks for setting
Sky, power tag slot emptying aperture (5.2) setting is above power tag slot (3.2).
6. a kind of churning device of plate thick film heating device, it is characterised in that: including churning device ontology, churning device lid (10), churning
Leaf (20), sealing edge sealing (30), bottom plate (40), heater (50), rotary electric machine (60), power module (70), switch (80) and
Power supply line (90);
The churning device lid (10) is movably arranged on churning device ontology, and the bottom plate (40) is arranged in churning device body interior,
In the bottom of bottom plate (40), rotary electric machine (60) setting is described in heater (50) bottom for the heater (50) setting
Churning leaf (20) is fixed on rotary electric machine (60), and exposes bottom plate (40) upper end, and power module (70) setting is being heated
Device (50) bottom, the power supply line (90) connect through power module (70) with rotary electric machine (60), and switch (80) setting is stirred
Milk device outer body, and control power supply line (90) and be powered or power off, sealing edge sealing (30) setting turns in churning leaf (20)
Axis and bottom plate (40) contact position, the heater (50) are heater described in claim 1-5 any one.
7. a kind of churning device of plate thick film heating device according to claim 6, it is characterised in that: the power module
(70) power module for being BA150-24S05.
8. a kind of preparation process of plate thick film heating device described in -5 any one according to claim 1, which is characterized in that institute
Preparation process is stated to include the following steps,
Step 1: carrying out cover half to substrate layer (1) according to the requirement of corresponding product is circular plate structure, and opens up stirring emptying aperture
(1.1), poke hole pipe (6) is welded on the bottom of stirring emptying aperture (1.1);
Step 2: printing first medium layer (2) by being screen printed on substrate layer (1) using printing machine, be put into 850 degrees Celsius
Sintering furnace in be sintered, then print second dielectric layer (2) sintering after republish third dielectric layer (2), dielectric layer (2)
Overall thickness is not less than 90 microns;
Step 3: using being screen printed onto printed resistor layer (3) on dielectric layer (2), the resistive conductor (3.1) in resistive layer (3) and electricity
12 microns -18 microns are divided between resistance line (3.1);
Step 4: the printed conductor layer (4) on dielectric layer (2), it is cooling after on resistive layer (3) and conductor layer (4) printed glass layer
(5)。
9. a kind of preparation process of plate thick film heating device according to claim 8, which is characterized in that in the step 3
The thickness of control resistive layer (3) is compared by front and back weight in printed resistor layer (3), after light than expected, in original electricity
One layer of thin resistive layer (3) is republished in resistance layer (3), the specific thickness of thin resistive layer (3) is calculated according to difference weight.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201910067531.5A CN109640413A (en) | 2019-01-24 | 2019-01-24 | A kind of plate thick film heating device, churning device and manufacturing process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201910067531.5A CN109640413A (en) | 2019-01-24 | 2019-01-24 | A kind of plate thick film heating device, churning device and manufacturing process |
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CN109640413A true CN109640413A (en) | 2019-04-16 |
Family
ID=66063389
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CN201910067531.5A Pending CN109640413A (en) | 2019-01-24 | 2019-01-24 | A kind of plate thick film heating device, churning device and manufacturing process |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113876210A (en) * | 2021-09-27 | 2022-01-04 | 东莞市东思电子技术有限公司 | Thick-film heating disc for milk foam machine and preparation process thereof |
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---|---|---|---|---|
CN201805562U (en) * | 2010-07-16 | 2011-04-20 | 杨旭光 | Thick film heater |
CN107692879A (en) * | 2017-10-26 | 2018-02-16 | 东莞佐佑电子科技有限公司 | A kind of wall-breaking machine heated with high-speed breakage food |
CN108209630A (en) * | 2018-02-09 | 2018-06-29 | 熊兴剑 | A kind of frothing milk machine |
EP3308685B1 (en) * | 2016-10-14 | 2019-01-09 | Taurus Research and Development S.L.U. | Cooking appliance |
CN210093590U (en) * | 2019-01-24 | 2020-02-18 | 广西桂仪科技有限公司 | Flat thick film heater and milk stirrer thereof |
-
2019
- 2019-01-24 CN CN201910067531.5A patent/CN109640413A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201805562U (en) * | 2010-07-16 | 2011-04-20 | 杨旭光 | Thick film heater |
EP3308685B1 (en) * | 2016-10-14 | 2019-01-09 | Taurus Research and Development S.L.U. | Cooking appliance |
CN107692879A (en) * | 2017-10-26 | 2018-02-16 | 东莞佐佑电子科技有限公司 | A kind of wall-breaking machine heated with high-speed breakage food |
CN108209630A (en) * | 2018-02-09 | 2018-06-29 | 熊兴剑 | A kind of frothing milk machine |
CN210093590U (en) * | 2019-01-24 | 2020-02-18 | 广西桂仪科技有限公司 | Flat thick film heater and milk stirrer thereof |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113876210A (en) * | 2021-09-27 | 2022-01-04 | 东莞市东思电子技术有限公司 | Thick-film heating disc for milk foam machine and preparation process thereof |
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Application publication date: 20190416 |
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RJ01 | Rejection of invention patent application after publication |