CN109635467A - Printed circuit board cuts the acquisition methods of rate - Google Patents

Printed circuit board cuts the acquisition methods of rate Download PDF

Info

Publication number
CN109635467A
CN109635467A CN201811551258.5A CN201811551258A CN109635467A CN 109635467 A CN109635467 A CN 109635467A CN 201811551258 A CN201811551258 A CN 201811551258A CN 109635467 A CN109635467 A CN 109635467A
Authority
CN
China
Prior art keywords
motherboard
cuts
broadside
cut
long side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201811551258.5A
Other languages
Chinese (zh)
Other versions
CN109635467B (en
Inventor
符俭泳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to CN201811551258.5A priority Critical patent/CN109635467B/en
Priority to PCT/CN2018/124516 priority patent/WO2020124667A1/en
Publication of CN109635467A publication Critical patent/CN109635467A/en
Application granted granted Critical
Publication of CN109635467B publication Critical patent/CN109635467B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/30Circuit design
    • G06F30/39Circuit design at the physical level
    • G06F30/392Floor-planning or layout, e.g. partitioning or placement
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06QINFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00Administration; Management
    • G06Q10/04Forecasting or optimisation specially adapted for administrative or management purposes, e.g. linear programming or "cutting stock problem"
    • G06Q10/043Optimisation of two dimensional placement, e.g. cutting of clothes or wood

Abstract

The present invention provides the acquisition methods that a kind of printed circuit board cuts rate.Printed circuit board of the invention is cut in the acquisition methods of rate, according to multiple motherboard sizes and board size to be cut, the corresponding optimal motherboard long side cutting number of placing direction of different motherboard sizes and different plates to be cut is calculated using approximate algorithm and optimal motherboard broadside cuts number as selected motherboard long side and cuts number and selected motherboard broadside cutting number, and then in conjunction with it is preset cut rate calculation formula and calculate the placing direction of different motherboard sizes and different plates to be cut corresponding cut rate, the placing direction for choosing different motherboard sizes and different plates to be cut corresponding cuts in rate maximum one as most preferably cutting rate, be capable of quick obtaining printed circuit board most preferably cuts rate, it enables to more reasonably be laid out wires design, promote working efficiency, reduce production cost.

Description

Printed circuit board cuts the acquisition methods of rate
Technical field
The present invention relates to the acquisition methods that field of display technology more particularly to a kind of printed circuit board cut rate.
Background technique
With the development of display technology, the planes such as liquid crystal display (Liquid Crystal Display, LCD) display dress It sets because having many advantages, such as that high image quality, power saving, fuselage is thin and has a wide range of application, and is widely used in mobile phone, TV, a number The various consumer electrical products such as word assistant, digital camera, laptop, desktop computer, become the master in display device Stream.
Liquid crystal display device on existing market is largely backlight liquid crystal display comprising liquid crystal display panel and Backlight module (backlight module).The working principle of liquid crystal display panel is put in the parallel glass mother board of two panels Liquid crystal molecule is set, liquid crystal molecule is controlled whether by being powered and changes direction, the light refraction of backlight module is come out and generates picture Face.
Usual liquid crystal display panel needs to be driven by external drive circuit, and the external drive circuit generally wraps It includes: timing controller (TCON), power management chip (Power manage IC) and programmable gamma correction chip (P- Gamma IC) etc., wherein the timing controller is mainly used for low-voltage differential (Low-Voltage Differential Signaling, LVDS) signal is converted into the high Mini-LVDS signal of low amplitude value transmission frequency and generation drives liquid crystal display panel Timing signal, the power management chip mainly for generation of driving all kinds of voltages of liquid crystal display panel, the programmable gal Horse correcting chip is mainly for generation of gamma electric voltage.Chip component in external drive circuit is generally set to printed circuit board On (Printed Circuit Board, PCB).
At present when carrying out printed circuit board layout, usually by printed circuit board layout design engineer according to part Quantity come measure the size of printed circuit board and be sent to production printed circuit board manufacturer, make manufacturer's evidence of printed circuit board This selects the rate that cuts of printed circuit mother board in the manufacturing process of printed circuit board.Printed circuit board layout engineer Cost accounting can not be carried out to printed circuit board plate in advance in design and optimal cut is selected to be carried out after rate again rationally Layout, is unable to reach maximizing the benefits.
Summary of the invention
The purpose of the present invention is to provide the acquisition methods that a kind of printed circuit board cuts rate, being capable of quick obtaining printing electricity Road plate most preferably cuts rate, promotes working efficiency, reduces production cost.
To achieve the above object, the present invention provides the acquisition methods that a kind of printed circuit board cuts rate, includes the following steps:
Step S1, multiple motherboard sizes and board size to be cut are provided;Each motherboard size includes motherboard length and motherboard Width;The board size to be cut includes plate length to be cut and board width to be cut;
Step S2, one in multiple motherboard sizes is selected as motherboard size to be calculated;
Step S3, one first length and one second length are set, first length and the second length are respectively plate to be cut Length and board width to be cut;
Step S4, motherboard long side maximum corresponding with motherboard size to be calculated, the first length, the combination of the second length is calculated It cuts number and motherboard broadside maximum cuts number;
Step S5, N number of practical cutting number of motherboard long side and the practical cutting number of N number of motherboard broadside, N number of motherboard long side are chosen Practical cutting number successively differs preset difference value and the difference of motherboard long side maximum cutting number and the practical cutting number of maximum motherboard long side Value is preset difference value, and N number of practical cutting number of motherboard broadside successively differs preset difference value and motherboard broadside maximum cuts number and maximum Motherboard broadside it is practical cutting number difference be preset difference value, N is positive integer;
Step S6, the practical cutting number of N number of motherboard long side is calculated, motherboard long side maximum cuts number, N number of motherboard broadside is practical cuts Cut the corresponding theoretical surplus of number, motherboard broadside maximum cutting number and demand surplus;
Step S7, corresponding theoretical surplus in the practical cutting number of N number of motherboard long side and motherboard long side maximum cutting number is chosen Maximum one is cut number for selected motherboard long side in cutting number more than or equal to corresponding demand surplus, and it is wide to choose N number of motherboard Corresponding theoretical surplus is more than or equal to the cutting of corresponding demand surplus in the practical cutting number in side and motherboard broadside maximum cutting number Maximum one is cut number for selected motherboard broadside in number;
Step S8, it is calculated and motherboard size to be calculated, the first length, the second length according to the preset rate calculation formula that cuts The combination that degree, selected motherboard long side cutting number, selected motherboard broadside cut number is corresponding to cut rate;
Step S9, it sets the first length and the second length is respectively board width to be cut and plate length to be cut, repetition is held Row step S4 to step S8 executes step S10 after step S8;
Step S10, step S2 to S9 is repeated, until all motherboard sizes complete step S2 to S9, obtains multiple sanctions Rate is cut, it is each to cut rate and a motherboard size, the first length, the second length, selected motherboard long side cutting number, selected motherboard broadside The combination for cutting number is corresponding;
Step S11, it chooses and multiple cuts in rate maximum one as most preferably cutting rate.
Get it is described most preferably cut rate after, according to selected motherboard long side cutting number corresponding with rate is most preferably cut, choosing Determine motherboard broadside cutting number respectively to the long side with the printed circuit mother board for most preferably cutting with this corresponding motherboard size of rate and Broadside is cut, and multiple printed circuit boards, the equidirectional ruler of the long side of each printed circuit board and printed circuit mother board are obtained It is very little most preferably to cut the corresponding first size of rate, the equidirectional size of the broadside of each printed circuit board and printed circuit mother board for this Corresponding second size of rate is most preferably cut for this.
In the step S4, calculated and motherboard size to be calculated, the first length according to preset maximum cutting number calculation formula Degree, the corresponding motherboard long side maximum cutting number of combination of the second length and motherboard broadside maximum cut number;
The preset maximum cutting number calculation formula are as follows:
Wherein Nx0 is that motherboard long side maximum cuts number, and Ny0 is that motherboard broadside maximum cuts number, and x is motherboard size to be calculated Motherboard length, y be motherboard size to be calculated motherboard width, x1 be the first length, y1 be the second length.
In step S6, the practical cutting number of N number of motherboard long side, motherboard long side are calculated according to preset theoretical surplus calculation formula The corresponding theoretical surplus of maximum cutting number, the practical cutting number of N number of motherboard broadside, motherboard broadside maximum cutting number;
The preset theoretical surplus calculation formula are as follows:
Wherein, j0 is that motherboard long side maximum cuts the corresponding theoretical surplus of number, and Nxm is the practical cutting number of N number of motherboard long side In the practical cutting number of m-th of motherboard long side, m is positive integer less than or equal to N, jm be m-th of motherboard long side it is practical cut it is several right The theoretical surplus answered, k0 are that motherboard broadside maximum cuts the corresponding theoretical surplus of number, and Nym is the practical cutting number of N number of motherboard broadside In the practical cutting number of m-th of motherboard broadside, km be the practical cutting number of m-th of motherboard broadside it is corresponding theory surplus.
In step S6, the practical cutting number of N number of motherboard long side, motherboard long side are calculated according to preset demand surplus calculation formula Maximum cutting number, the practical cutting number of N number of motherboard broadside, motherboard broadside maximum cut the corresponding demand surplus of number;
The preset demand surplus calculation formula are as follows:
Wherein, p0 is that motherboard long side maximum cuts the corresponding demand surplus of number, and pm is the practical cutting number of m-th of motherboard long side Corresponding demand surplus, q0 are that motherboard broadside maximum cuts the corresponding demand surplus of number, and km is the practical cutting of m-th of motherboard broadside The corresponding demand surplus of number, a are preset first to cut loss amount, and b is preset second to cut loss amount, and c is preset the Three cut loss amount.
Described first cuts loss amount as 2mm, and described second cuts loss amount as 13.5mm, and the third cuts loss amount For 4mm.
It is described preset to cut rate calculation formula are as follows:
Wherein, Nxmax is that selected motherboard long side cuts number, and Nymax is that selected motherboard broadside cuts number.
3 motherboard sizes are provided in the step S1.
N is 5.
The preset difference value is 1.
Beneficial effects of the present invention: printed circuit board of the invention is cut in the acquisition methods of rate, according to multiple motherboard rulers Board size very little and to be cut, it is corresponding with the placing direction that approximate algorithm calculates different motherboard sizes and different plates to be cut Optimal motherboard long side cutting number and optimal motherboard broadside cutting number are wide as selected motherboard long side cutting number and selected motherboard Number is cut on side, and then combines the preset side of putting for cutting rate calculation formula and calculating different motherboard sizes and different plates to be cut Cut rate to corresponding, choose different motherboard sizes and different plates to be cut placing direction it is corresponding cut it is maximum in rate One as most preferably cutting rate, is capable of the best of quick obtaining printed circuit board and cuts rate, enable to more reasonably into The design of row placement-and-routing, promotes working efficiency, reduces production cost.
Detailed description of the invention
For further understanding of the features and technical contents of the present invention, it please refers to below in connection with of the invention detailed Illustrate and attached drawing, however, the drawings only provide reference and explanation, is not intended to limit the present invention.
In attached drawing,
Fig. 1 is the flow chart for the acquisition methods that printed circuit board of the invention cuts rate;
Fig. 2 and Fig. 3 is the schematic diagram that the prior art cuts printed circuit mother board.
Specific embodiment
Further to illustrate technological means and its effect adopted by the present invention, below in conjunction with preferred implementation of the invention Example and its attached drawing are described in detail.
Referring to Fig. 1, the present invention provides the acquisition methods that a kind of printed circuit board cuts rate, include the following steps:
Step S1, multiple motherboard sizes and board size to be cut are provided.Each motherboard size includes motherboard length and motherboard Width.The board size to be cut includes plate length to be cut and board width to be cut.
Specifically, 3 motherboard sizes are provided in step S3 of the invention, the motherboard length in 3 motherboard sizes is 1230mm, the motherboard width in 3 motherboard sizes is respectively 927mm, 1030mm and 1079mm.
Step S2, one in multiple motherboard sizes is selected as motherboard size to be calculated.
Step S3, one first length and one second length are set, first length and the second length are respectively plate to be cut Length and board width to be cut.
Step S4, motherboard long side maximum corresponding with motherboard size to be calculated, the first length, the combination of the second length is calculated It cuts number and motherboard broadside maximum cuts number.
Specifically, in the step S4, according to preset maximum cutting number calculation formula calculate with motherboard size to be calculated, First length, the corresponding motherboard long side maximum cutting number of combination of the second length and motherboard broadside maximum cut number.
The preset maximum cutting number calculation formula are as follows:
Wherein Nx0 is that motherboard long side maximum cuts number, and Ny0 is that motherboard broadside maximum cuts number, and x is motherboard size to be calculated Motherboard length, y be motherboard size to be calculated motherboard width, x1 be the first length, y1 be the second length.
Step S5, N number of practical cutting number of motherboard long side and the practical cutting number of N number of motherboard broadside, N number of motherboard long side are chosen Practical cutting number successively differs preset difference value and the difference of motherboard long side maximum cutting number and the practical cutting number of maximum motherboard long side Value is preset difference value, and N number of practical cutting number of motherboard broadside successively differs preset difference value and motherboard broadside maximum cuts number and maximum Motherboard broadside it is practical cutting number difference be preset difference value, N is positive integer.
Preferably, the practical cutting number of 5 motherboard long sides and 5 mothers are chosen in 5 N, preset difference value 1 namely step S5 The practical cutting number of plate broadside, which is subtracted 1, subtracts 2, subtracted 3 by motherboard long side maximum cutting number respectively, Subtract 4, subtract 5 and obtain, which subtracts 1 by motherboard broadside maximum cutting number respectively, subtracts 2, subtracts 3, subtracts 4, subtracts 5 obtain.
Step S6, the practical cutting number of N number of motherboard long side is calculated, motherboard long side maximum cuts number, N number of motherboard broadside is practical cuts Cut the corresponding theoretical surplus of number, motherboard broadside maximum cutting number and demand surplus.
Specifically, in step S6, according to preset theoretical surplus calculation formula calculate the practical cutting number of N number of motherboard long side, Motherboard long side maximum is cut number, the practical cutting number of N number of motherboard broadside, motherboard broadside maximum and is cut more than the corresponding theory of number Amount.
The preset theoretical surplus calculation formula are as follows:
Wherein, j0 is that motherboard long side maximum cuts the corresponding theoretical surplus of number, and Nxm is the practical cutting number of N number of motherboard long side In the practical cutting number of m-th of motherboard long side, m is positive integer less than or equal to N, jm be m-th of motherboard long side it is practical cut it is several right The theoretical surplus answered, k0 are that motherboard broadside maximum cuts the corresponding theoretical surplus of number, and Nym is the practical cutting number of N number of motherboard broadside In the practical cutting number of m-th of motherboard broadside, km be the practical cutting number of m-th of motherboard broadside it is corresponding theory surplus.
Specifically, in step S6, according to preset demand surplus calculation formula calculate the practical cutting number of N number of motherboard long side, Motherboard long side maximum is cut number, the practical cutting number of N number of motherboard broadside, motherboard broadside maximum and is cut more than the corresponding demand of number Amount.
The preset demand surplus calculation formula are as follows:
Wherein, p0 is that motherboard long side maximum cuts the corresponding demand surplus of number, and pm is the practical cutting number of m-th of motherboard long side Corresponding demand surplus, q0 are that motherboard broadside maximum cuts the corresponding demand surplus of number, and km is the practical cutting of m-th of motherboard broadside The corresponding demand surplus of number, a are preset first to cut loss amount, and b is preset second to cut loss amount, and c is preset the Three cut loss amount.Incorporated by reference to Fig. 2 and Fig. 3, the prior art when carrying out printed circuit mother board cutting to make printed circuit board, First time cutting is carried out to printed circuit mother board 1 first, so that it is cut into the mother baby plate 11 of 4 block arrays arrangement, cuts for the first time Place 12 is depleted, and the width of first time cut place 12 is defined as the first cutting loss amount, then, to each mother baby plate 11 into Row cuts the printed circuit board 111 being arranged in array for the second time, and when cutting for the second time, the surrounding of mother baby plate 11 needs to be arranged Reserved area 112 is to facilitate cutting processing procedure, which not will form printed circuit board 111, the reserved area 112 Width is defined as the second cutting loss amount, and second of cut place 113 is depleted, the width definition of second of cut place 113 Loss amount is cut for third.
Preferably, it is 2mm that first in the preset demand surplus calculation formula, which cuts loss amount, and described second cuts Loss amount is 13.5mm, and it is 4mm that the third, which cuts loss amount,.
Step S7, corresponding theoretical surplus in the practical cutting number of N number of motherboard long side and motherboard long side maximum cutting number is chosen Maximum one is cut number for selected motherboard long side in cutting number more than or equal to corresponding demand surplus, and it is wide to choose N number of motherboard Corresponding theoretical surplus is more than or equal to the cutting of corresponding demand surplus in the practical cutting number in side and motherboard broadside maximum cutting number Maximum one is cut number for selected motherboard broadside in number.
Step S8, it is calculated and motherboard size to be calculated, the first length, the second length according to the preset rate calculation formula that cuts The combination that degree, selected motherboard long side cutting number, selected motherboard broadside cut number is corresponding to cut rate.
It is specifically, described preset to cut rate calculation formula are as follows:
Wherein, Nxmax is that selected motherboard long side cuts number, and Nymax is that selected motherboard broadside cuts number.
Step S9, it sets the first length and the second length is respectively board width to be cut and plate length to be cut, repetition is held Row step S4 to step S8 executes step S10 after step S8.
Step S10, step S2 to S9 is repeated, until all motherboard sizes complete step S2 to S9, obtains multiple sanctions Rate is cut, it is each to cut rate and a motherboard size, the first length, the second length, selected motherboard long side cutting number, selected motherboard broadside The combination for cutting number is corresponding.
Step S11, it chooses and multiple cuts in rate maximum one as most preferably cutting rate.
Specifically, get it is described most preferably cut rate after, using existing motherboard cutting mode, according to most preferably cut The corresponding selected motherboard long side cutting number of rate, selected motherboard broadside cutting number most preferably cut the corresponding mother of rate with this to having respectively The long side and broadside of the printed circuit mother board of board size are cut, and obtain multiple printed circuit boards, each printed circuit board with The long side of printed circuit mother board is equidirectional most preferably to cut the corresponding first size of rate, each printed circuit board and print having a size of this The broadside of brush circuit motherboard is equidirectional most preferably to cut corresponding second size of rate having a size of this.
It should be noted that printed circuit board of the invention is cut in the acquisition methods of rate, according to multiple motherboard sizes and Board size to be cut, it is corresponding best with the placing direction that approximate algorithm calculates different motherboard sizes and different plates to be cut Motherboard long side cutting number and optimal motherboard broadside cutting number cut as selected motherboard long side cutting number and selected motherboard broadside Number is cut, and then combines the preset placing direction pair for cutting rate calculation formula and calculating different motherboard sizes and different plates to be cut That answers cuts rate, and the placing direction for choosing different motherboard sizes and different plates to be cut corresponding cuts in rate maximum one As most preferably rate is cut, be capable of quick obtaining printed circuit board most preferably cuts rate, enables to more reasonably carry out cloth Office's wires design, promotes working efficiency, reduces production cost.
In conclusion printed circuit board of the invention is cut in the acquisition methods of rate, according to multiple motherboard sizes and to be cut Board size is cut, the corresponding optimal mother of placing direction that different motherboard sizes and different plates to be cut are calculated with approximate algorithm Plate long side cuts number and optimal motherboard broadside cutting number as selected motherboard long side cutting number and selected motherboard broadside and cuts number, And then cut that rate calculation formula calculates different motherboard sizes and the placing direction of different plates to be cut is corresponding in conjunction with preset Rate is cut, the placing direction for choosing different motherboard sizes and different plates to be cut corresponding cuts a maximum conduct in rate Rate most preferably is cut, be capable of quick obtaining printed circuit board most preferably cuts rate, enables to more reasonably be laid out cloth Line design, promotes working efficiency, reduces production cost.
The above for those of ordinary skill in the art can according to the technique and scheme of the present invention and technology Other various corresponding changes and modifications are made in design, and all these change and modification all should belong to the claims in the present invention Protection scope.

Claims (10)

1. the acquisition methods that a kind of printed circuit board cuts rate, which comprises the steps of:
Step S1, multiple motherboard sizes and board size to be cut are provided;Each motherboard size includes motherboard length and motherboard width; The board size to be cut includes plate length to be cut and board width to be cut;
Step S2, one in multiple motherboard sizes is selected as motherboard size to be calculated;
Step S3, one first length and one second length are set, first length and the second length are respectively plate length to be cut And board width to be cut;
Step S4, motherboard long side maximum cutting corresponding with motherboard size to be calculated, the first length, the combination of the second length is calculated Several and motherboard broadside maximum cuts number;
Step S5, N number of practical cutting number of motherboard long side and the practical cutting number of N number of motherboard broadside are chosen, N number of motherboard long side is practical Cutting number successively differs preset difference value and motherboard long side maximum cutting number and the difference of the practical cutting number of maximum motherboard long side are Preset difference value, N number of practical cutting number of motherboard broadside successively differs preset difference value and motherboard broadside maximum cuts number and maximum mother The difference of the practical cutting number of plate broadside is preset difference value, and N is positive integer;
Step S6, the practical cutting number of N number of motherboard long side is calculated, motherboard long side maximum cuts number, the practical cutting of N number of motherboard broadside The corresponding theoretical surplus of number, motherboard broadside maximum cutting number and demand surplus;
Step S7, corresponding theoretical surplus in the practical cutting number of N number of motherboard long side and motherboard long side maximum cutting number is chosen to be greater than Maximum one is cut number for selected motherboard long side in cutting number equal to corresponding demand surplus, and it is real to choose N number of motherboard broadside It cuts corresponding theoretical surplus in number and motherboard broadside maximum cutting number and is more than or equal in the cutting number of corresponding demand surplus in border Maximum one is cut number for selected motherboard broadside;
Step S8, it is calculated and motherboard size to be calculated, the first length, the second length, choosing according to the preset rate calculation formula that cuts Determine motherboard long side cutting number, the combination of selected motherboard broadside cutting number corresponding cuts rate;
Step S9, it sets the first length and the second length is respectively board width to be cut and plate length to be cut, repeat step Rapid S4 to step S8, executes step S10 after step S8;
Step S10, repeat step S2 to S9, until all motherboard sizes complete step S2 to S9, obtain it is multiple cut rate, It is each to cut rate and a motherboard size, the first length, the second length, selected motherboard long side cutting number, selected motherboard broadside cutting Several combinations is corresponding;
Step S11, it chooses and multiple cuts in rate maximum one as most preferably cutting rate.
2. the acquisition methods that printed circuit board as described in claim 1 cuts rate, which is characterized in that described best getting After cutting rate, according to selected motherboard long side cutting number corresponding with rate is most preferably cut, selected motherboard broadside cutting number respectively to tool The long side and broadside for having the printed circuit mother board that the corresponding motherboard size of rate is most preferably cut with this are cut, and multiple printings are obtained Circuit board, each printed circuit board with the long side of printed circuit mother board is equidirectional that rate corresponding first is most preferably cut having a size of this Size, each printed circuit board and the broadside of printed circuit mother board be equidirectional most preferably to cut corresponding second ruler of rate having a size of this It is very little.
3. the acquisition methods that printed circuit board as described in claim 1 cuts rate, which is characterized in that in the step S4, according to It is calculated according to preset maximum cutting number calculation formula corresponding with motherboard size to be calculated, the first length, the combination of the second length Motherboard long side maximum cuts number and motherboard broadside maximum cuts number;
The preset maximum cutting number calculation formula are as follows:
Wherein Nx0 is that motherboard long side maximum cuts number, and Ny0 is that motherboard broadside maximum cuts number, and x is the mother of motherboard size to be calculated Plate length, y are the motherboard width of motherboard size to be calculated, and x1 is the first length, and y1 is the second length.
4. the acquisition methods that printed circuit board as claimed in claim 3 cuts rate, which is characterized in that in step S6, according to pre- If theoretical surplus calculation formula calculate the practical cutting number of N number of motherboard long side, motherboard long side maximum cutting number, N number of motherboard broadside The corresponding theoretical surplus of practical cutting number, motherboard broadside maximum cutting number;
The preset theoretical surplus calculation formula are as follows:
Wherein, j0 is that motherboard long side maximum cuts the corresponding theoretical surplus of number, and Nxm is m in the practical cutting number of N number of motherboard long side A practical cutting number of motherboard long side, m are the positive integer less than or equal to N, and jm is the corresponding reason of the practical cutting number of m-th of motherboard long side By surplus, k0 is that motherboard broadside maximum cuts the corresponding theoretical surplus of number, and Nym is m-th in the practical cutting number of N number of motherboard broadside The practical cutting number of motherboard broadside, km are the corresponding theoretical surplus of the practical cutting number of m-th of motherboard broadside.
5. the acquisition methods that printed circuit board as claimed in claim 4 cuts rate, which is characterized in that in step S6, according to pre- If demand surplus calculation formula calculate the practical cutting number of N number of motherboard long side, motherboard long side maximum cutting number, N number of motherboard broadside Practical cutting number, motherboard broadside maximum cut the corresponding demand surplus of number;
The preset demand surplus calculation formula are as follows:
Wherein, p0 is that motherboard long side maximum cuts the corresponding demand surplus of number, and pm is that the practical cutting number of m-th of motherboard long side is corresponding Demand surplus, q0 is that motherboard broadside maximum cuts the corresponding demand surplus of number, km be m-th of motherboard broadside it is practical cut it is several right The demand surplus answered, a are preset first cutting loss amount, and b is preset second cutting loss amount, and c is preset third sanction Cut loss amount.
6. the acquisition methods that printed circuit board as claimed in claim 5 cuts rate, which is characterized in that described first cuts loss Amount is 2mm, and described second cuts loss amount as 13.5mm, and it is 4mm that the third, which cuts loss amount,.
7. the acquisition methods that printed circuit board as claimed in claim 5 cuts rate, which is characterized in that described preset to cut rate Calculation formula are as follows:
Wherein, Nxmax is that selected motherboard long side cuts number, and Nymax is that selected motherboard broadside cuts number.
8. the acquisition methods that printed circuit board as described in claim 1 cuts rate, which is characterized in that provided in the step S1 3 motherboard sizes.
9. the acquisition methods that printed circuit board as described in claim 1 cuts rate, which is characterized in that N 5.
10. the acquisition methods that printed circuit board as described in claim 1 cuts rate, which is characterized in that the preset difference value is 1。
CN201811551258.5A 2018-12-18 2018-12-18 Method for acquiring cutting rate of printed circuit board Active CN109635467B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201811551258.5A CN109635467B (en) 2018-12-18 2018-12-18 Method for acquiring cutting rate of printed circuit board
PCT/CN2018/124516 WO2020124667A1 (en) 2018-12-18 2018-12-27 Method for obtaining cutting rate of printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811551258.5A CN109635467B (en) 2018-12-18 2018-12-18 Method for acquiring cutting rate of printed circuit board

Publications (2)

Publication Number Publication Date
CN109635467A true CN109635467A (en) 2019-04-16
CN109635467B CN109635467B (en) 2020-12-04

Family

ID=66075360

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811551258.5A Active CN109635467B (en) 2018-12-18 2018-12-18 Method for acquiring cutting rate of printed circuit board

Country Status (2)

Country Link
CN (1) CN109635467B (en)
WO (1) WO2020124667A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112836305A (en) * 2020-12-30 2021-05-25 沈阳建筑大学 Wide and thick plate shearing strategy calculation method

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001010177A1 (en) * 1999-08-03 2001-02-08 Xsil Technology Limited A circuit singulation system and method
US20090062951A1 (en) * 2005-07-05 2009-03-05 Yoshiaki Awata Production condition determining method, production condition determining apparatus, mounter, and program
CN101742823A (en) * 2008-11-21 2010-06-16 华通电脑股份有限公司 Circuit board bearing device and application method thereof
CN101879724A (en) * 2009-05-08 2010-11-10 王国仲 Movable cutter module for cutting circuit board
CN101932198A (en) * 2010-06-10 2010-12-29 瀚宇博德科技(江阴)有限公司 Manufacturing method for transplanting printed circuit board and structure thereof
CN102045964A (en) * 2009-10-15 2011-05-04 欣兴电子股份有限公司 Making method of circuit board
CN102170754A (en) * 2010-02-26 2011-08-31 富葵精密组件(深圳)有限公司 Method for manufacturing circuit board with superouter fitting

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050086616A1 (en) * 2003-10-15 2005-04-21 Jim Wang Method for printed circuit board panelization
KR20090070406A (en) * 2007-12-27 2009-07-01 삼성전자주식회사 Pcb strip and apparatus and method for molding thereof
CN102083276A (en) * 2009-11-30 2011-06-01 英业达股份有限公司 Circuit board cutting method
CN102612268A (en) * 2012-03-09 2012-07-25 常熟金像电子有限公司 Production method of printed circuit board with oversized layout size
CN105678408A (en) * 2015-12-30 2016-06-15 广州兴森快捷电路科技有限公司 Printed circuit board (PCB) combining and joining method and system
CN106231800B (en) * 2016-08-15 2019-02-05 梅州市志浩电子科技有限公司 Printed circuit board method for processing forming
CN106686883B (en) * 2017-02-10 2019-04-23 深圳市华星光电技术有限公司 Printed circuit board and liquid crystal display
CN107567188A (en) * 2017-08-10 2018-01-09 勤基电路板(深圳)有限公司 Processing method, equipment and the printed circuit board of printed circuit board

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001010177A1 (en) * 1999-08-03 2001-02-08 Xsil Technology Limited A circuit singulation system and method
US20090062951A1 (en) * 2005-07-05 2009-03-05 Yoshiaki Awata Production condition determining method, production condition determining apparatus, mounter, and program
CN101742823A (en) * 2008-11-21 2010-06-16 华通电脑股份有限公司 Circuit board bearing device and application method thereof
CN101879724A (en) * 2009-05-08 2010-11-10 王国仲 Movable cutter module for cutting circuit board
CN102045964A (en) * 2009-10-15 2011-05-04 欣兴电子股份有限公司 Making method of circuit board
CN102170754A (en) * 2010-02-26 2011-08-31 富葵精密组件(深圳)有限公司 Method for manufacturing circuit board with superouter fitting
CN101932198A (en) * 2010-06-10 2010-12-29 瀚宇博德科技(江阴)有限公司 Manufacturing method for transplanting printed circuit board and structure thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
曾璐华: "印刷线路板纵向剪切工艺改进", 《现代机械》 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112836305A (en) * 2020-12-30 2021-05-25 沈阳建筑大学 Wide and thick plate shearing strategy calculation method
CN112836305B (en) * 2020-12-30 2023-10-03 沈阳建筑大学 Calculation method for shearing strategy of wide and thick plates

Also Published As

Publication number Publication date
CN109635467B (en) 2020-12-04
WO2020124667A1 (en) 2020-06-25

Similar Documents

Publication Publication Date Title
CN103424923B (en) A kind of LCDs, its driving method and display device
CN103366666B (en) Display driving framework and signal transmission method thereof, display device and manufacturing method thereof
CN105590609B (en) Driving method for liquid crystal display panel and liquid crystal display panel drive system
CN101593496B (en) Grid output control method
CN103745703A (en) Driving circuit of liquid crystal display panel, liquid crystal display panel and liquid crystal display device
CN201812478U (en) Display drive system of liquid crystal screen and flexible circuit board thereof
CN103730096B (en) White balance adjustment method and system, liquid crystal display manufacture method
CN103761947A (en) Method for adjusting white balance, method for manufacturing liquid crystal display and liquid crystal display
CN102402963A (en) Drive circuit and drive method for liquid crystal display
CN108597470A (en) Display device drive system and method and display device
CN106814490A (en) The preparation method of narrow frame liquid crystal display panel
CN105185324A (en) Liquid crystal display panel and device
WO2023103062A1 (en) Liquid crystal display panel and display apparatus
CN109635467A (en) Printed circuit board cuts the acquisition methods of rate
CN101950547A (en) LCD panel display driving system and flexible circuit board thereof
US20150187294A1 (en) Display panel assembly, method for adjusting the display panel assembly, and display device
CN206236400U (en) The burn-in board of liquid crystal module
CN109358458A (en) Display device
CN204305459U (en) A kind of flexible printed circuit board and display device
CN205670222U (en) A kind of TFT liquid crystal panel
WO2020113646A1 (en) Driving method and driving circuit for display panel
CN106384579B (en) Gamma reference voltage generation circuit, liquid crystal display panel
CN203337959U (en) Liquid crystal alignment control system
CN210606407U (en) LED display device and LED display screen formed by same
CN103345089B (en) LCD alignment control system and method

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant