CN109628008A - A kind of transparency cover band - Google Patents
A kind of transparency cover band Download PDFInfo
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- CN109628008A CN109628008A CN201811635981.1A CN201811635981A CN109628008A CN 109628008 A CN109628008 A CN 109628008A CN 201811635981 A CN201811635981 A CN 201811635981A CN 109628008 A CN109628008 A CN 109628008A
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- Prior art keywords
- copolymer
- ethylene
- layer
- middle layer
- styrene
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- 239000010410 layer Substances 0.000 claims abstract description 90
- 239000000463 material Substances 0.000 claims abstract description 40
- 229920002725 thermoplastic elastomer Polymers 0.000 claims abstract description 34
- 229920001038 ethylene copolymer Polymers 0.000 claims abstract description 31
- 238000007789 sealing Methods 0.000 claims abstract description 29
- -1 poly ethylene copolymer Polymers 0.000 claims abstract description 16
- 239000012790 adhesive layer Substances 0.000 claims abstract description 14
- 239000004698 Polyethylene Substances 0.000 claims abstract description 13
- 229920000573 polyethylene Polymers 0.000 claims abstract description 13
- 239000003607 modifier Substances 0.000 claims abstract description 8
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 31
- 229920001577 copolymer Polymers 0.000 claims description 16
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 14
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 claims description 13
- 229920001684 low density polyethylene Polymers 0.000 claims description 11
- 239000004702 low-density polyethylene Substances 0.000 claims description 11
- 239000006185 dispersion Substances 0.000 claims description 7
- 150000004678 hydrides Chemical class 0.000 claims description 7
- 229920001400 block copolymer Polymers 0.000 claims description 6
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 6
- 239000012793 heat-sealing layer Substances 0.000 claims description 6
- LVHBHZANLOWSRM-UHFFFAOYSA-N itaconic acid Chemical compound OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims description 6
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 6
- 229920006228 ethylene acrylate copolymer Polymers 0.000 claims description 5
- 229920006225 ethylene-methyl acrylate Polymers 0.000 claims description 5
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 5
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 4
- 229920000092 linear low density polyethylene Polymers 0.000 claims description 3
- 239000004707 linear low-density polyethylene Substances 0.000 claims description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 3
- 229920001526 metallocene linear low density polyethylene Polymers 0.000 claims description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 claims description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 2
- HEAMQYHBJQWOSS-UHFFFAOYSA-N ethene;oct-1-ene Chemical compound C=C.CCCCCCC=C HEAMQYHBJQWOSS-UHFFFAOYSA-N 0.000 claims description 2
- 229920006226 ethylene-acrylic acid Polymers 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 150000001336 alkenes Chemical class 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 1
- 238000007334 copolymerization reaction Methods 0.000 claims 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 claims 1
- 239000004615 ingredient Substances 0.000 claims 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims 1
- 239000003595 mist Substances 0.000 abstract description 12
- 230000005611 electricity Effects 0.000 abstract description 2
- 230000002045 lasting effect Effects 0.000 abstract description 2
- 230000003068 static effect Effects 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- 229920000123 polythiophene Polymers 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 238000005491 wire drawing Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000001993 dienes Chemical class 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 229920001870 copolymer plastic Polymers 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006124 polyolefin elastomer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000033764 rhythmic process Effects 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2453/00—Presence of block copolymer
- C09J2453/006—Presence of block copolymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Packages (AREA)
Abstract
The present invention relates to electronic component encapsulating material fields, a kind of transparency cover band is disclosed, including PET base material layer, adhesive layer, middle layer one, the middle layer two, hot sealing layer, antistatic backing set gradually, the principal component of the middle layer one is ethylene copolymer or modified poly ethylene copolymer, and the principal component of middle layer two is the blended modifier of ethylene copolymer and thermoplastic elastomer (TPE).Mist degree is 8~15%, and surface resistivity is E+08 ~ E+10, and static electricity resistance is lasting；Peel strength: 20~80g can realize different peeling forces, and peel strength is stablized when in use according to different sealing conditions.
Description
Technical field
The present invention relates to electronic component encapsulating material field, in particular cooperation carrier band uses the saturating of packaging electronic parts
Bright lid band.
Background technique
The transport and use of electronic component generally require and use packaging supporting body, supporting body generally have paper carrying belt or
Plastic carrier, carrier band is equipped with the pocket of electronic component shape, to store electronic component.After the completion of storage, upper table is being carried
Face is both needed to one layer of lid band of covering, is escaped with the electronic component for preventing carrier band from storing, also protects electronic component not by outer
The interference of boundary's dust and electrostatic etc.；Lid band both needed with storage carrier band face seal, again can be with when using electronic component
It is mutually removed with storage carrier band surface.
Such as the packaging belt and preparation method thereof of the storage carrier band of electronic component disclosed in Patent No. CN104960292A,
It is selected by the component to different layers, obtained packaging belt can be sealed with the surface of storage carrier band, and can control one
The case where service performance of fixed peeling force, packaging belt is also stable, and when curling is not in cracking, quick-fried band.
But can also have some problems, for example, being all to take raising temperature at present with the continuous improvement of package speed
Mode sealed, be easy to make heat cover excessively melting occur, wire drawing phenomenon occur, and peel strength is unstable；With
The micromation of electronic component, higher and higher to requirement of the lid with transparency, the mist degree of existing lid band is seldom within 10%.
Summary of the invention
Against the above technical problems, a kind of transparency cover band is had developed, 8~15% low-temperature heat-sealing may be implemented, thoroughly in mist degree
Lightness is high and peel strength is stablized.
The present invention adopts the following technical scheme that:
A kind of transparency cover band, including set gradually PET base material layer, adhesive layer, middle layer one, middle layer two, hot sealing layer, prevent it is quiet
Electric layer, the principal component of the middle layer one are ethylene copolymer or modified ethylene copolymer, and the principal component of middle layer two is ethylene
The blended modifier of copolymer and thermoplastic elastomer (TPE).
Above-mentioned technical proposal of the invention is selected by the component to middle layer one, middle layer two, is improved sealing and is drawn
Silk phenomenon, middle layer one of the invention uniform can must disperse, absorb heat of the lid with heat-sealing when, be transmitted as such to hot sealing layer
Heat is not too high or uneven, will not generate wire drawing.Middle layer two can preferably assist the effect of middle layer one, can subtract
Pulling force fluctuation when small removing, peel strength are stablized, and middle layer two can be bonded preferably with hot sealing layer.
Preferably, the ethylene copolymer be low density polyethylene (LDPE), linear low density polyethylene, metallocene PE,
Ethylene-vinyl acetate copolymer, ethylene octene or butylene copolymer, ethylene acrylate copolymer, ethylene methacrylate are total
One or more of polymers, ethylene acrylate copolymer.
Preferably, modified ethylene copolymer is maleic anhydride modified polyethylene and ethylene copolymers or acrylic acid modified polyethylene
The modified polyethylene copolymer of the polyethylene and ethylene copolymers or methylene-succinic acid that copolymer or methyl propenoic acid glycidyl ether are modified
Object.
Ethylene copolymer selected in above scheme as middle layer one and middle layer two solves the effect of wire drawing phenomenon
Fruit is obvious, is acted between PET base material layer by adhesive layer, convenient for control peeling force, can effectively improve stabilization when removing
Property.
Preferably, the thermoplastic elastomer (TPE) is selected from block copolymer, styrene and the isoamyl of styrene and butadiene
The block copolymer or styrene of diene and butadiene, the copolymer of isoprene or styrene and butadiene or styrene and
The hydride of isoprene copolymer.
Middle layer two assists the effect of middle layer one, can reduce pulling force fluctuation when removing, and peel strength is stablized, and
It is preferably bonded with hot sealing layer, selects above-mentioned thermoplastic elastomer (TPE), it is more effective to improve wire drawing problem.
Preferably, 5~25 μm of the thickness of the middle layer one.
Further preferred 10~20 μm, more preferable 10~15 μm.
Preferably, 5~25 μm of the thickness of the middle layer two, further preferred 10~20 μm, more preferable 10~15 μm.
Preferably, heat-sealing layer material is the material with heat seal property, preferably polyethylene kind copolymer, ethylene vinyl acetate second
Alkene copolymer, ethylene methyl acrylate copolymer, ethylene acrylate copolymer, styrene-butadiene-copolymer, styrene isoamyl
Diene copolymers, the hydride of styrene-butadiene-copolymer, styrene isoprene one or both of hydride with
On.
Preferably, 5~30 μm of hot sealing layer thickness, preferably 10~25 μm, more preferable 10~20 μm.
Preferably, the antistatic backing is the PEDOT-PSS aqueous dispersions that weight ratio is 5-30%.
By implementing above-mentioned technical proposal, the present invention has the advantage that low-temperature heat-sealing may be implemented in 1. lid bands, sealing is not
It will appear excessive melting, be not in wire drawing phenomenon；2. the mist degree of lid band meets needs 8~15%；3. surface resistivity is E
+ 08 ~ E+10, and static electricity resistance is lasting；4. peel strength: 20~80g when in use can be according to different sealing items
Part realizes different peeling forces, and peel strength is stablized.
Specific embodiment
Below by specific embodiment, the technical solution that present invention be described in more detail.
Embodiment 1:
A kind of transparency cover band, this lid band use 6 layers of structure: PET base material layer, AC adhesive layer, middle layer one, middle layer two, heat-sealing
Layer, antistatic backing.
Pet layer: 20 μm of thickness.
AC adhesive layer, using AC agent, to bond PET and middle layer one.
Middle layer one: 15 μm of thickness, material is low density polyethylene (LDPE).
Middle layer two: 15 μm of thickness；Material is the blended modifier of ethylene copolymer and thermoplastic elastomer (TPE), ethylene copolymer
Object selects low density polyethylene (LDPE), thermoplastic elastomer (TPE), the present embodiment preferably with the preferable styrene of ethylene copolymer compatibility and fourth
The block copolymer of diene.
Hot sealing layer: 10 μm of thickness；Material is the material with heat seal property, and the present embodiment selects polyethylene kind copolymer.
Antistatic backing: material is permanent type conductive material-polythiophene class conduction liquid: the PEDOT-PSS water that weight ratio is 5%
Dispersion liquid.
Transparency cover obtained band product mist degree is 10%, and 190 DEG C of heat-sealing temperature, surface resistivity E+09, peel strength is
30~50g.
Embodiment 2:
A kind of transparency cover band, this lid band use 6 layers of structure: PET base material layer, AC adhesive layer, middle layer one, middle layer two, heat-sealing
Layer, antistatic backing.
PET base material layer: 10 μm of thickness.
AC adhesive layer, using AC agent.
Middle layer one: 20 μm of thickness；Material is polyolefin elastomer.
Middle layer two: 15 μm of thickness；Material is the blended modifier of ethylene copolymer and thermoplastic elastomer (TPE), ethylene copolymer
Object selects metallocene PE, and thermoplastic elastomer (TPE) selects the block copolymer (SIS) of styrene and isoprene.
Hot sealing layer: 20 μm of thickness；Material is the material vinyl butyl acrylate with heat seal property.
Antistatic backing: material is permanent type conductive material-polythiophene class conduction liquid: the PEDOT-PSS that weight ratio is 10%
Aqueous dispersions.
Transparency cover obtained band product mist degree is 13%, and 190 DEG C of heat-sealing temperature, surface resistivity E+08, peel strength is
60~80g.
Embodiment 3:
A kind of transparency cover band, using 6 layers of structure: PET base material layer, AC adhesive layer, middle layer one, middle layer two, hot sealing layer, prevent it is quiet
Electric layer.
Pet layer: 25 μm of thickness.
AC adhesive layer, using AC agent, to bond PET and middle layer one.
Middle layer one: 10 μm of thickness, material is ethylene-vinyl acetate copolymer (EVA).
Middle layer two: 10 μm of thickness；Material is the blended modifier of ethylene copolymer and thermoplastic elastomer (TPE), ethylene copolymer
Object selects LDPE, thermoplastic elastomer (TPE), and the present embodiment is preferably embedding with the preferable styrene of ethylene copolymer compatibility and butadiene
Section copolymer (SBS).
Hot sealing layer: 10 μm of thickness；Material is the material with heat seal property, and the present embodiment selects ethylene-methyl acrylate
Copolymer (EMA).
Antistatic backing: material is permanent type conductive material-polythiophene class conduction liquid: the PEDOT-PSS that weight ratio is 15%
Aqueous dispersions.
Transparency cover obtained band product mist degree is 15%, and 190 DEG C of heat-sealing temperature, surface resistivity E+08, peel strength is
40~60g.
Embodiment 4:
A kind of transparency cover band, this lid band use 6 layers of structure: PET base material layer, AC adhesive layer, middle layer one, middle layer two, heat-sealing
Layer, antistatic backing.
Pet layer: 15 μm of thickness.
AC adhesive layer, using AC agent, to bond PET and middle layer one.
Middle layer one: 15 μm of thickness, material is maleic anhydride modified polyethylene and ethylene copolymers.
Middle layer two: 20 μm of thickness；Material is the blended modifier of ethylene copolymer and thermoplastic elastomer (TPE), ethylene copolymer
Object selects LLDPE, thermoplastic elastomer (TPE), the copolymer of the present embodiment optimization styrene and butadiene, isoprene.
Hot sealing layer: 5 μm of thickness；Material is the material with heat seal property, and the present embodiment selects styrene isoprene
Hydride.
Antistatic backing: material is permanent type conductive material-polythiophene class conduction liquid: the PEDOT-PSS that weight ratio is 10%
Aqueous dispersions.
Transparency cover obtained band product mist degree is 10%, and 190 DEG C of heat-sealing temperature, surface resistivity E+08, peel strength is
25~45g.
Embodiment 5:
A kind of transparency cover band, this lid band use 6 layers of structure: PET base material layer, AC adhesive layer, middle layer one, middle layer two, heat-sealing
Layer, antistatic backing.
Pet layer: 20 μm of thickness.
AC adhesive layer, using AC agent, to bond PET and middle layer one.
Middle layer one: 15 μm of thickness, material is the modified polyethylene and ethylene copolymers of methylene-succinic acid.
Middle layer two: 25 μm of thickness；Material is the blended modifier of ethylene copolymer and thermoplastic elastomer (TPE), ethylene copolymer
Object selects low density polyethylene (LDPE), thermoplastic elastomer (TPE), the hydride of the present embodiment optimization styrene and isoprene copolymer.
Hot sealing layer: 10 μm of thickness；Material is the material with heat seal property, and the present embodiment selects styrenebutadiene copolymer
Object.
Antistatic backing: material is permanent type conductive material-polythiophene class conduction liquid: the PEDOT-PSS that weight ratio is 30%
Aqueous dispersions.
Transparency cover obtained band product mist degree is 8%, and 190 DEG C of heat-sealing temperature, surface resistivity E+08, peel strength is
50~70g.
Comparative example 1:
It is with the difference of embodiment 1, is not provided with middle layer two.
Transparency cover band product mist degree obtained is 10%, 210 DEG C of heat-sealing temperature, surface resistivity E+08, is difficult to obtain steady
Fixed removing.
Comparative example 2:
It is with the difference of embodiment 1, middle layer one uses polypropylene.
Transparency cover obtained band product mist degree is 18%, 200 DEG C of heat-sealing temperature, surface resistivity E+09, peel strength
10-40g is removed not smooth.
Comparative example 3:
It is with the difference of embodiment 1, is added without thermoplastic elastomer (TPE) in middle layer two.
Transparency cover obtained band product mist degree is 12%, 205 DEG C of heat-sealing temperature, surface resistivity E+09, peel strength
20-50 removes pause and transition in rhythm or melody sense.
Claims (8)
1. a kind of transparency cover band, which is characterized in that including PET base material layer, adhesive layer, the middle layer one, middle layer set gradually
Two, hot sealing layer, antistatic backing, the principal component of the middle layer one are ethylene copolymer or modified ethylene copolymer, middle layer two
Principal component be ethylene copolymer and thermoplastic elastomer (TPE) blended modifier.
2. a kind of transparency cover band according to claim 1, which is characterized in that the ethylene copolymer be low density polyethylene (LDPE),
Linear low density polyethylene, metallocene PE, ethylene-vinyl acetate copolymer, ethylene octene or butylene copolymer, ethylene propylene
One or more of olefin(e) acid ester copolymer, ethylene methyl acrylate copolymer, ethylene acrylate copolymer.
3. a kind of transparency cover band according to claim 1, which is characterized in that the modified ethylene copolymer changes for maleic anhydride
Property polyethylene and ethylene copolymers or acrylic acid modified polyethylene and ethylene copolymers or methyl propenoic acid glycidyl ether it is modified polyethylene it is total
The polyethylene and ethylene copolymers that polymers or methylene-succinic acid are modified.
4. a kind of transparency cover band according to claim 1, which is characterized in that the thermoplastic elastomer (TPE) is styrene and fourth two
The copolymerization of the block copolymer of alkene, the block copolymer of styrene and isoprene or styrene and butadiene, isoprene
The hydride of object or styrene and butadiene or styrene and isoprene copolymer.
5. a kind of according to claim 1 or 2 or 3 or 4 transparency cover bands, which is characterized in that the heat-sealing layer material is selected from poly-
Ethene copolymer, ethylene-vinyl acetate copolymer, ethylene methyl acrylate copolymer, ethylene acrylate copolymer, styrene
Butadiene copolymer, styrene isoprene copolymer, the hydride of styrene-butadiene-copolymer, styrene isoprene
One or more of hydride.
6. a kind of transparency cover band according to claim 1, which is characterized in that 5~25 μm of the thickness of the middle layer one, it is intermediate
5~25 μm of thickness of layer two.
7. a kind of transparency cover band according to claim 6, which is characterized in that 5~30 μm of the hot sealing layer thickness.
8. a kind of transparency cover band according to claim 1, which is characterized in that the ingredient of the antistatic backing use weight ratio for
The PEDOT-PSS aqueous dispersions of 5-30%.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811635981.1A CN109628008A (en) | 2018-12-29 | 2018-12-29 | A kind of transparency cover band |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811635981.1A CN109628008A (en) | 2018-12-29 | 2018-12-29 | A kind of transparency cover band |
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| CN109628008A true CN109628008A (en) | 2019-04-16 |
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| CN201811635981.1A Pending CN109628008A (en) | 2018-12-29 | 2018-12-29 | A kind of transparency cover band |
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| CN (1) | CN109628008A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110699000A (en) * | 2019-10-11 | 2020-01-17 | 上海固柯胶带科技有限公司 | Film material for grinding and packaging semiconductor |
| CN112277412A (en) * | 2020-10-15 | 2021-01-29 | 河北泰达包装材料有限公司 | Special upper cover tape for plastic carrier tape |
| CN114162462A (en) * | 2021-12-31 | 2022-03-11 | 浙江洁美电子科技股份有限公司 | Cover tape and electronic component packaging body |
| CN114229231A (en) * | 2021-12-28 | 2022-03-25 | 浙江洁美电子科技股份有限公司 | Cover tape and electronic component packaging body |
| CN115216242A (en) * | 2021-04-16 | 2022-10-21 | 俊驰材料科技股份有限公司 | Hot melt adhesive tape and method of making and using same |
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| CN102971227A (en) * | 2010-06-15 | 2013-03-13 | 电气化学工业株式会社 | Cover tape |
| CN103459146A (en) * | 2011-04-01 | 2013-12-18 | 电气化学工业株式会社 | Cover film |
| CN104960292A (en) * | 2015-06-17 | 2015-10-07 | 浙江洁美电子科技股份有限公司 | Packaging tape for carrier belt for electronic components and production method of packaging tape |
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| CN110699000A (en) * | 2019-10-11 | 2020-01-17 | 上海固柯胶带科技有限公司 | Film material for grinding and packaging semiconductor |
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| CN115216242A (en) * | 2021-04-16 | 2022-10-21 | 俊驰材料科技股份有限公司 | Hot melt adhesive tape and method of making and using same |
| CN114229231A (en) * | 2021-12-28 | 2022-03-25 | 浙江洁美电子科技股份有限公司 | Cover tape and electronic component packaging body |
| CN114229231B (en) * | 2021-12-28 | 2023-03-31 | 浙江洁美电子科技股份有限公司 | Cover tape and electronic component packaging body |
| CN114162462A (en) * | 2021-12-31 | 2022-03-11 | 浙江洁美电子科技股份有限公司 | Cover tape and electronic component packaging body |
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Application publication date: 20190416 |