CN109614732A - A kind of the electromagnetic compatibility modeling method and device of object - Google Patents

A kind of the electromagnetic compatibility modeling method and device of object Download PDF

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CN109614732A
CN109614732A CN201811571165.9A CN201811571165A CN109614732A CN 109614732 A CN109614732 A CN 109614732A CN 201811571165 A CN201811571165 A CN 201811571165A CN 109614732 A CN109614732 A CN 109614732A
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model
unit
component
cell
plane
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CN109614732B (en
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童心
王显赫
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Beijing Jingwei Hirain Tech Co Ltd
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    • G06F30/20Design optimisation, verification or simulation

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Abstract

The present invention provides the electromagnetic compatibility modeling method and device of a kind of object, method includes: to modeling object being decomposed into electrical connection and P assembly unit;Each assembly unit is converted into the assembly unit by the face structure of the surface composition of no thickness, after conversion as target element unit by body structure;It determines at least one corresponding object element plane of each target element unit, and constructs the component model of each component by least one corresponding object element plane of each target element unit;Construct the equivalent-circuit model of electrical connection, the model as electrical connection;The component model of all components unit and the model of electrical connection are combined, the model after combination is as the Emulation of EMC model to modeling object.The electromagnetic compatibility modeling method and device of object provided by the invention can ensure the accuracy of simulation calculation, moreover it is possible to promote computation efficiency, and the execution of modeling process is simpler, strong operability is suitble to practical engineering application.

Description

A kind of the electromagnetic compatibility modeling method and device of object
Technical field
The present invention relates to technical field of electromagnetic compatibility, more specifically to a kind of electromagnetic compatibility modeling method of object And device.
Background technique
EMC analysis is carried out using modeling and simulating, is the development trend of electric system EMC Design.Electricity The compatible modeling and simulating of magnetic can obtain the analysis of quantization as a result, and assessing electromagnetic compatibility risk early period in design, positioning Therefore, there is important meaning in the reason of risk in engineering development.
The implementation of electromagnetic compatibility modeling and simulating includes two aspects of model and algorithm.The algorithm of Emulation of EMC has been at present Through more mature, as the Time-limited integral (Finite Integration Technique, FIT) in Time-Domain algorithm, time domain have It limits calculus of finite differences (Finite Difference in Time Domain, FDTD), moment method (the Method of in frequency domain algorithm Moments, MoM), FInite Element (Finite Element Method, FEM) etc..
However, how the structure of electric system be established as that result is accurate and calculation amount have in engineering can be real The model for the property applied is always the difficult point of electromagnetic compatibility modeling and simulating in engineering practice, becomes electromagnetic compatibility modeling and simulating The limiting factor of engineer application.It is understood that actual product especially for automobile, flies often with fine structure The larger and more complex structure of machine, locomotive equidimension, electromagnetic compatibility modeling will obtain balance between computational accuracy and accuracy More difficult, there presently does not exist reasonable, effective electromagnetic compatibility modeling methods.
Summary of the invention
In view of this, the present invention provides the electromagnetic compatibility modeling method and device of object, rationally, effectively to treat The electromagnetic compatibility of modeling object is modeled, and its technical solution is as follows:
A kind of electromagnetic compatibility modeling method of object, comprising:
Electrical connection and P assembly unit is decomposed into modeling object, any component unit includes at least one component, Wherein, P is according to the structure determination to modeling object;
Each assembly unit is converted to by body structure to the component list by the face structure of the surface composition of no thickness, after conversion Member is used as target element unit;
It determines at least one corresponding object element plane of each target element unit, and passes through each target element unit At least one corresponding object element plane constructs the component model of each target element unit, wherein a target element list Three-dimensional space where first is divided into R cell, and the size of cell is based on the highest for the electromagnetic compatibility problem for needing to pay close attention to Frequency setting, an object element plane are internal single in the presence of Q defined on the cell for needing the component segment modeled A unit plane in first plane, the corresponding component segment of a unit plane, wherein R is based on corresponding target element unit The size of the three-dimensional space at place and the size of cell determine that Q is a fixed value preset, greater than 1;
The equivalent-circuit model for constructing the electrical connection, the model as the electrical connection;
Combine the component model of all components unit and the model of the electrical connection, model after combination as it is described to The Emulation of EMC model of modeling object.
Optionally, at least one corresponding object element plane of each target element unit of the determination, comprising:
For either objective assembly unit:
It is R cell by the three-dimensional space subdivision where the target element unit;For any cell, the list is determined It whether there is the component segment for needing to model in first lattice, if being based on should in the presence of the component segment for needing to model in the cell The Q unit plane defined on cell the correlation with component segment in the cell respectively, determines component in the cell The corresponding object element plane of segment, it is flat with the corresponding object element of all components segment for obtaining the target element unit Face, as at least one corresponding object element plane of the target element unit;
To obtain at least one corresponding object element plane of each target element unit.
Optionally, with the presence or absence of the component segment for needing to model in the determination cell, comprising:
Intercept component segment of the target element unit inside the cell;
Component segment of the target element unit inside the cell is calculated on the surface of the preset direction of the cell On projection to the coverage rate on perspective plane;
Determine whether component segment of the target element unit inside the cell is to need to build based on the coverage rate The component segment of mould.
Optionally, it is described based on the Q unit plane defined on the cell respectively with component segment in the cell Correlation determines the corresponding object element plane of component segment in the cell, comprising:
The Q unit plane defined on the cell the relative coefficient with component segment in the cell respectively is calculated, The relative coefficient is used for the degree of correlation of characterization unit plane and component segment;
By the corresponding unit plane of maximal correlation property coefficient in all relative coefficients being calculated, it is determined as the list The corresponding object element plane of component segment in first lattice.
Optionally, described that each target is constructed by least one corresponding object element plane of each target element unit The component model of assembly unit, comprising:
For either objective assembly unit:
By at least one corresponding object element plane combination of the target element unit;Traverse target element unit place The cell that is divided of three-dimensional space, if in the presence of the component segment for needing to model in two adjacent cells lattice, and described two The corresponding object element plane of two component segments in a adjacent cells lattice is discontinuous, and the target element unit passes through The public face of described two adjacent cells lattice then connects the target of two object element planes on described two adjacent cells lattice Unit plane is repaired to be formed in vertex, wherein the representative points are the vertex on the public face;
To obtain the component model of each target element unit.
Optionally, the electromagnetic compatibility modeling method further include:
Before the component model of combination all components unit and the model of the electrical connection, various components model is verified Whether default required precision is all satisfied;
If the various components model is all satisfied the default required precision, the group of the combination all components unit is executed The model of part model and the electrical connection;
It is unsatisfactory for the component model of default required precision if it exists, then the three-dimensional space where reducing corresponding assembly unit is drawn The size of the cell divided, to rebuild component model based on the cell after reduction size.
Optionally, whether the verifying various components model is all satisfied default required precision, comprising:
For any component model:
It determines on the corresponding original component unit of the component model between two points of distance farthest, in preset frequency spectrum model Interior impedance curve is enclosed, as the first curve;
Determine that the impedance on the component model between two points of distance farthest, in the preset spectral range is bent Line, as the second curve;
Calculate the related coefficient of first curve and second curve;
If the related coefficient of first curve and second curve is greater than or equal to preset correlation coefficient threshold, Determine that the component model meets the default required precision;
If the related coefficient of first curve and second curve is less than the correlation coefficient threshold, it is determined that the group Part model is unsatisfactory for the default required precision;
To obtain the verification result of each component model.
A kind of electromagnetic compatibility model building device of object, comprising: decomposing module, modular construction conversion module, component model structure Model block, electrical connection model construction module and Emulation of EMC model construction module;
The decomposing module is decomposed into electrical connection and P assembly unit, any component unit to modeling object for Including at least one component, wherein P is according to the structure determination to modeling object;
The modular construction conversion module, for each assembly unit to be converted to the surface group by no thickness by body structure At face structure, the assembly unit after conversion is as target element unit;
The component model constructs module, for determining that at least one corresponding object element of each target element unit is flat Face, and construct by least one corresponding object element plane of each target element unit the component of each target element unit Model, wherein the three-dimensional space where a target element unit is divided into R cell, and the size of cell is based on needing The highest frequency of the electromagnetic compatibility problem of concern is set, and an object element plane is internal in the presence of the component segment for needing to model A cell on a unit plane in Q unit plane defining, the corresponding component segment of a unit plane, wherein R The size of size and cell based on the three-dimensional space where corresponding target element unit determines that Q is preset for one, is greater than 1 fixed value;
The electrical connection model construction module, for constructing the equivalent-circuit model of the electrical connection, as described The model of electrical connection;
The Emulation of EMC model construction module, for combining the component model of all components unit and described electrical The model of connection, the model after combination is as the Emulation of EMC model to modeling object.
Optionally, the component model building module includes: that object element plane determines submodule;
The object element plane determines submodule, for being directed to either objective assembly unit:
It is R cell by the three-dimensional space subdivision where the target element unit;For any cell, the list is determined It whether there is the component segment for needing to model in first lattice, if being based on should in the presence of the component segment for needing to model in the cell The Q unit plane defined on cell the correlation with component segment in the cell respectively, determines component in the cell The corresponding object element plane of segment, it is flat with the corresponding object element of all components segment for obtaining the target element unit Face, as at least one corresponding object element plane of the target element unit;
To obtain at least one corresponding object element plane of each target element unit.
Optionally, the electromagnetic compatibility model building device of the object further include: component model authentication module and cell size Adjust module;
The component model authentication module, for verifying whether various components model is all satisfied default required precision;
The Emulation of EMC model construction module, for being all satisfied the default precision when the various components model It is required that when, combine the component model of all components unit and the model of the electrical connection;
The cell size adjustment module, for reducing when there is the component model for being unsatisfactory for default required precision The size for the cell that three-dimensional space where corresponding assembly unit divides, so that component model building module is based on reducing Cell after size rebuilds component model.
It can be seen from the above technical scheme that the electromagnetic compatibility modeling method and device of object provided by the invention, first It will first be split as electrical connection and P assembly unit to modeling object, then construct the component model of various components unit respectively With the model of electrical connection, finally, combine the component model of various components unit and the model of electrical connection, thus obtain to The Emulation of EMC model of modeling object.Modeling method provided by the invention, modeling process are simple and efficient, strong operability, It has been synchronously completed during constructing model and simple optimization is deleted to structure, without excessively relying on the experience of engineer and repeatedly adjusting Examination is suitble to practical implementation, also, the present invention uses the basic element of unit plane and equivalent circuit as model, structure Simply, not only computational efficiency is high, and can be adapted for subdivision and the calculating of various mainstream electromagnetic calculations, Stability and adaptability Preferably, modeling method provided by the invention also ensures modeling accuracy while ensuring modeling efficiency.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis The attached drawing of offer obtains other attached drawings.
Fig. 1 is the flow diagram of the electromagnetic compatibility modeling method of object provided in an embodiment of the present invention;
The comparable metal structure of all directions size is converted to face knot by body structure to be provided in an embodiment of the present invention by Fig. 2 The schematic diagram of structure;
Fig. 3 is to determine either objective assembly unit in the electromagnetic compatibility modeling method of object provided in an embodiment of the present invention The flow diagram of at least one corresponding object element plane;
Fig. 4 is the schematic diagram of a cell provided in an embodiment of the present invention;
Fig. 5 is the 12 unit planes provided in an embodiment of the present invention defined on the cell for being located at the space xyz Schematic diagram;
Fig. 6 is replaced the schematic diagram of xyz coordinate system by uvw coordinate system provided in an embodiment of the present invention;
Fig. 7 is formed between two discontinuous object element planes in provided in an embodiment of the present invention two adjacent cells Repair the schematic diagram of unit plane;
Fig. 8 a and Fig. 8 b are respectively the schematic diagram of cabinet structure, and the cabinet of the modeling method building provided using this case The schematic diagram of the Emulation of EMC model of structure;
Fig. 9 is the simulation result of letter modeling to be deleted in CAD pre-processing software provided in an embodiment of the present invention and using this case The simulation result comparison diagram of modeling pattern modeling;
Figure 10 is the structural schematic diagram of the electromagnetic compatibility model building device of object provided in an embodiment of the present invention;
Figure 11 is the structural schematic diagram of the electromagnetic compatibility modelling apparatus of object provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
In the prior art, the method that modeling object carries out electromagnetic compatibility modeling is treated are as follows: before ANSA, HyperMesh etc. The CAD digital-to-analogue that simulation object is treated in processing software such as is deleted, is simplified at the processing, and then gridding generates structural model.
Inventor has found that there are some problems for scheme in the prior art, specifically during realizing the invention It is embodied in:
The pre-processing softwares such as ANSA, HyperMesh are usually and are the mechanical analyses such as fluid, collision and design, and do not examine Consider the technical need of Emulation of EMC model, experience and debugging repeatedly of the implementation process dependent on engineer, and it is scarce Weary reasonable mechanism assessment models are used for the applicability of Emulation of EMC, therefore model is used for the accuracy of Emulation of EMC There is no guarantee that and implement to take considerable time, be unfavorable for practical implementation.In addition, the model generated using aforesaid way Bad adaptability is often only applicable to one or more of derivation algorithms by deleting the model that letter repairing obtains, but one in engineering development As need to analyze all kinds of electromagnetic compatibility problems with different algorithm, therefore, the application range of above-mentioned modeling pattern is limited.
In view of the above problems, inventor furthers investigate, and finally proposes a solution, followed by following The electromagnetic compatibility modeling method of object provided by the invention is introduced in embodiment.
Referring to Fig. 1, the flow diagram of the electromagnetic compatibility modeling method of object provided in an embodiment of the present invention is shown, This method may include:
Step S101: being decomposed into electrical connection and P assembly unit to modeling object.
Wherein, for P according to the structure determination to modeling object, an assembly unit includes at least one group to modeling object Part.
It wherein, can be electrically large sizes structure to modeling object, it should be noted that electric size is to be based on object and closed The relationship of the corresponding wavelength of note highest frequency is come what is defined, and the size of object is within a wavelength, then it is believed that object is electricity The size of small size, object is greater than several wavelength, then it is believed that object is electrically large sizes.Illustratively, electromagnetic compatibility is paid close attention to Highest frequency is usually 1~3GHz, and the corresponding wavelength of the highest frequency is 30~10cm, then mobile phone is electric small-size, and vapour Vehicle, motor-car are electrically large sizes.
Numerous components are generally included to modeling object such as electrically large sizes structure, the present embodiment will be decomposed into P to modeling object A assembly unit models P assembly unit respectively.
There are many implementations for treating modeling object progress assembly unit decomposition, in a kind of possible implementation In, P component can will be split as to modeling object, each component is an assembly unit, it is contemplated that includes to modeling object Component it is relatively more, if modeled respectively to each component, will definitely increase the complexity of modeling process, reduce modeling Efficiency, in view of this, in another more preferably implementation, it can be based on the specific structure to modeling object, determination is not required to The structure division to be decomposed forms car door using each structure division for not needing to decompose as an assembly unit, such as car door Metalwork between be mutually interconnected into a good hardened structure, therefore, can by car door be form car door all metalworks make Component is broken down into, each component is as an assembly unit for other parts for an assembly unit.That is, It decomposes after completing, some assembly units may include a component, and some assembly units may include multiple components.
It is relatively large sized in view of assembly unit, and the existing electrical connection size between assembly unit is smaller, In view of the difference of size, in order to accurate modeling, the present embodiment to assembly unit and electrical connection in different ways into Row modeling, is based on this, this step needs will be decomposed into P assembly unit and electrical connection to modeling object.
Step S102: each assembly unit is converted to by body structure by the face structure of the surface composition of no thickness, conversion Component afterwards is as target element unit.
For metal structure, in the radio frequency range of electromagnetic compatibility concern, due to skin effect, electric current is distributed only over Metal surface, therefore, the present embodiment wait for the metal structure in modeling object with the Surface Characterization of no thickness, can drop significantly in this way The complexity of low modeling improves modeling efficiency.
The thin metal structure such as vehicle body, cabinet, shell etc. of length and width dimensions is much smaller than for thickness, with the median plane of structure or On the basis of inner surface, it is converted into no thickness surface;Metal structure such as tubing string, beam comparable for all directions size etc., On the basis of the outer surface of structure, it is converted into the sealing surface that no thickness surface is constituted, referring to Fig. 2, showing each side The schematic diagram of face structure is converted to by body structure to the comparable metal structure of size.For nonmetal medium, with the outer of structure On the basis of surface, first it is converted into the sealing surface that no thickness surface is constituted and carries out subsequent processing, with medium to it after the completion of modeling Inside is filled.
Step S103: it determines at least one corresponding object element plane of each target element unit, and passes through each mesh At least one corresponding object element plane of mark assembly unit constructs the component model of each target element unit.
Wherein, the three-dimensional space where a target element unit is divided into R cell, and target element unit, which is located at, to be drawn The inside for the R cell got, an object element plane are an internal unit in the presence of the component segment for needing to model The unit plane in Q unit plane defined on lattice, the corresponding component segment of a unit plane, a unit plane are corresponding Model of the component segment as the component segment, wherein R is big based on the three-dimensional space where corresponding target element unit Small and cell size determines that Q is a fixed value preset, greater than 1.
It determines at least one corresponding object element plane of each target element unit, and passes through each target element unit The component model that at least one corresponding object element plane constructs each target element unit can be found in the detailed of subsequent embodiment It describes in detail bright.
Step S104: constructing the equivalent-circuit model of electrical connection, the model as electrical connection.
The equivalent circuit between the connectivity port of component is established in the electrical connection that the present embodiment decomposes step S101 Model characterizes the connection impedance of electrical connection.Electrical connection uses three dimensional joint element generally than the much smaller size of assembly unit The number of grid of system-level model can be obviously increased, and be electrically connected needs Local grid density and system-level mesh-density It differs larger, may cause the unstable of numerical value calculating, and being electrically connected on the main influence of electromagnetic compatibility is connection impedance, because This, the present embodiment has combined modeling efficiency and modeling accuracy using equivalent circuit modeling.
There are many implementations for constructing the equivalent-circuit model of electrical connection, in one possible implementation, can The impedance between each connectivity port is emulated in Direct Modeling in electromagnetic simulation software, using the impedance data of acquisition as a black box Equivalent-circuit model.Electrical connection is usually small scale structures, and the computing resource and time that Straight simulation occupies are seldom.
It, can be according to the design feature of electrical connection and the impedance computation of typical structure in alternatively possible implementation Formula constructs RCL, that is, resistance, capacitor, induction equivalent circuit, and calculates each element on equivalent circuit according to structure size formula Parameter.It can include the capacitor etc. between the resistance-inductance of metal strip, metal covering with the typical structure of formula computing impedance.
Step S105: the component model of combination all components unit and the model of electrical connection, the model conduct after combination Emulation of EMC model to modeling object.
It is integrated to component model using the equivalent circuit of electrical connection as circuit parameter, port is connected on component model Corresponding position, for nonmetal medium component, the space surrounded to the surface being converted to is filled using dielectric material.Finally The face of formation and circuit integration model, as the Emulation of EMC model to modeling object.
The electromagnetic compatibility modeling method of object provided in an embodiment of the present invention will be split as electrically connecting first to modeling object Connect with P assembly unit, then respectively construct various components unit component model and electrical connection model, finally, by each The component model of a assembly unit and the model combination of electrical connection, to obtain the Emulation of EMC mould to modeling object Type.Modeling method provided in an embodiment of the present invention, modeling process are simple and efficient, strong operability, during constructing model It has synchronously completed and simple optimization is deleted to structure, without excessively relying on the experience of engineer and repeatedly debug, be suitble to that engineering is practical to answer With, also, the embodiment of the present invention uses the basic element of unit plane and equivalent circuit as model, and structure is simple, not only counts It is high-efficient, and can be adapted for various mainstream electromagnetic calculations subdivision and calculating, Stability and adaptability it is preferable.The present invention The modeling method that embodiment provides also ensures modeling accuracy while ensuring modeling efficiency.
In another embodiment of the invention, " step S103: each target element unit is determined in above-described embodiment At least one corresponding object element plane, and pass through at least one corresponding object element plane structure of each target element unit Build the component model of each target element unit " it is introduced.
Referring to Fig. 3, showing the process signal of the corresponding Q object element plane of determining either objective assembly unit Scheme, may include:
Step S301: being R cell by the three-dimensional space subdivision where target element unit.
Three-dimensional space where target element unit is split into cell by the present embodiment, which is space cell Lattice, target element unit are located at the inside in the space of R cell composition.
It should be noted that the size of cell determines the fine degree of constructed component model, i.e. cell Size determines the precision that electromagnetism numerical simulation calculating is carried out to the model of generation.The electricity that the size of cell is paid close attention to based on needs The highest frequency f of magnetic compatibling problem0Setting, for example, can setup unit lattice size be less than λ/20, wherein λ=c/f0, λ is The corresponding wavelength of the highest frequency of electromagnetic compatibility problem of interest, wherein c is the light velocity.It should be noted that any one electromagnetism Wave or signal have frequency range, for example, move 4G be 1880~2635MHz, brush direct current motor generate interference be usually DC The interference that~1GHz, PWM driving motor generates is usually tens of kHz~hundreds of MHz, and the above-mentioned electromagnetism of interest referred to is simultaneous The highest frequency of appearance problem refers to the various signals or electromagnetism that in the electromagnetic compatibility problem that modeling and simulating to be studied, are included The highest frequency of wave.
The numerical algorithm of Electromagnetic Simulation uses discrete difference or integral calculation, and the level of detail of structure meets discrete steps Resolution requirement, can be obtained accurately and effectively calculated result.Structural resolution or thin is further increased in discrete steps Section degree, it is very limited to the promotion of calculated result accuracy, but will increase the required resource of calculating and time.Therefore, using full The cell that sufficient electromagnetism numerical algorithm discrete steps require can characterize the architectural characteristic considered needed for electromagnetic compatibility.
Step S302: being directed to any cell, determines with the presence or absence of the component segment for needing to model in the cell, if should In the presence of the component segment for needing to model in cell, then based on the Q unit plane defined on the cell respectively with the unit The correlation of component segment in lattice determines the corresponding object element plane of component segment in the cell, to obtain the target group The corresponding object element plane of all components segment of part unit, as at least one corresponding mesh of the target element unit Mark unit plane.
Wherein it is determined that the process of the component segment modeled in the cell with the presence or absence of needs may include: to intercept the mesh Mark component segment of the assembly unit inside the cell;Calculate component segment of the target element unit inside the cell The coverage rate of projection on the surface of the preset direction of the cell to perspective plane;The target element list is determined based on coverage rate Whether component segment of the member inside the cell is the component segment for needing to model.
Referring to Fig. 4, showing the schematic diagram of a cell, which is located at the space xyz, illustratively, is calculating Component segment projection on the surface of the preset direction of the cell of the one target element unit inside cell is to projection When the coverage rate in face, projection of the component segment on the surface in tri- directions cell xyz can be calculated to its projection surface Coverage rate Δ x, Δ y, Δ z, it may be assumed that
Wherein, Sx、Sy、SzComponent segment respectively inside cell is on the surface in tri- directions xyz of cell The area of projection, Ax、Ay、AzThe respectively area on tri- directions the xyz surface of cell.
If the maximum value in Δ x, Δ y, Δ z is greater than preset value 1, alternatively, Δ x+ Δ y+ Δ z is greater than preset value 2, it is determined that Component segment in the cell is the component segment for needing to model, that is, needs to establish the mould of the component segment in the cell Type, otherwise it is assumed that not needing to establish component sheets in the cell there is no the component segment for needing to model in the cell The model of section.
For any cell, when determining to need to establish the model of component segment in the cell, it is based on the list The Q unit plane defined on first lattice the correlation with component segment in the cell respectively, determines component sheets in the cell The corresponding object element plane of section.
Specifically, based on the Q unit plane defined on the cell respectively in the cell component segment it is related Property, determine that the process of the corresponding object element plane of component segment in the cell may include: to calculate to define on the cell The Q unit plane relative coefficient with component segment in the cell respectively;All relative coefficients that will be calculated In the corresponding unit plane of maximal correlation property coefficient, be determined as the corresponding object element plane of component segment in the cell. Wherein, relative coefficient is used for the degree of relevancy of characterization unit plane and component segment.
Illustratively, cell is located at the space xyz, and the minimum value and maximum value in the direction x are respectively X1 and X2, the direction y Minimum value and maximum value are respectively Y1 and Y2, and the minimum value and maximum value in the direction z are respectively Z1 and Z2, can be determined on a cell Adopted 12 unit planes, referring to Fig. 5, the schematic diagram of the 12 unit planes defined on a cell is shown, 12 lists First plane includes 6 surfaces and 6 diagonal planes, wherein the expression formula on 6 surfaces is respectively as follows: x=X1, x=X2, y=Y1, y= The expression formula of Y2, z=Z1, z=Z2,6 diagonal planes are respectively as follows:
In one possible implementation, for example above-mentioned 12 units of the Q unit plane defined on computing unit lattice are flat Process of the face respectively with the relative coefficient of component segment in the cell include:
(1) N number of point is uniformly sampled in component segment, for any cell plane, calculates N number of point to the unit plane Minimum range root-mean-square value, make the inverse of the root-mean-square value as the relative coefficient of the unit plane and component segment For the first relative coefficient, to obtain first relative coefficient of the Q unit plane respectively with component segment in the cell.
Specifically, the root-mean-square value of the N number of o'clock minimum range to a unit plane can be calculate by the following formula:
Wherein, RMSEiFor component segment to the root-mean-square value of i-th of unit plan range, dnIndicate that n-th of sampled point arrives The minimum range of i-th of unit plane.
(2) for any cell plane, xyz coordinate system is replaced by the uvw coordinate system of uv plane to the unit plane, such as Shown in Fig. 6, the coordinate of uvw coordinate system is used in component segment, uniformly samples N number of point, is calculated using w coordinate value as variable The variance of the N number of point of component segment, using the inverse of the variance as the relative coefficient of component segment and the unit plane as the Two relative coefficients, to obtain second relative coefficient of the Q unit plane respectively with component segment in the cell.
Specifically, it can be calculate by the following formula by the variance of the N number of point of the component segment of variable of w coordinate value:
Wherein, CoviFor the variance of the N number of point of the corresponding component segment of i-th of unit plane, wnIt is sat for the w of n-th of sampled point Mark,For the average value of the w coordinate of N number of sampled point.
By the corresponding unit plane of maximal correlation property coefficient in all relative coefficients being calculated, it is determined as the list The corresponding object element plane of component segment in first lattice, specifically: for a cell, from Q unit plane respectively with the list Maximum first related coefficient is obtained in first lattice in first related coefficient of component segment, if maximum first related coefficient respectively with The difference of other first related coefficients is all larger than the first preset value, alternatively, maximum first relative coefficient is respectively with other The ratio of one relative coefficient is all larger than the second preset value, then is determined as the corresponding unit plane of maximum first relative coefficient The corresponding object element plane of component segment in the cell, otherwise, from Q unit plane respectively with component in the cell Maximum second relative coefficient is obtained in second relative coefficient of segment, and the corresponding unit of maximum second relative coefficient is put down Face is determined as the corresponding object element plane of the component segment in the cell.
After determining at least one corresponding object element plane of each target element unit, each target can be passed through At least one corresponding object element plane of assembly unit constructs the component model of each component, in the present embodiment, by every At least one corresponding object element plane of a target element unit constructs the process of the component model of each target element unit It may include: to execute following process for either objective assembly unit, to obtain the component model of each target element unit:
Firstly, by least one corresponding object element plane combination of the target element unit;Then, the target group is traversed The cell that three-dimensional space where part unit is divided, if in the presence of the component sheets for needing to model in two adjacent cells lattice Section, and the corresponding object element plane of two component segments in two adjacent cells lattice is discontinuous, and the target element Unit passes through the public face of two adjacent cells lattice, then connects the target of two object element planes on two adjacent cells lattice Unit plane is repaired to be formed in vertex, and repairing unit plane is a part in public face.Wherein, representative points are two targets Vertex in the vertex of unit plane, on public face.
Illustratively, referring to Fig. 7, the corresponding object element plane of a cell is 701 in two adjacent cells lattice, separately The corresponding object element plane of one cell is 702, and object element plane 701 and 702 is discontinuous, linking objective vertex such as Fig. 7 In vertex A, B, C formed repairing unit plane 703.It should be noted that repairing unit plane is also one of component model Point.
Preferably, the electromagnetic compatibility modeling method of object provided by the above embodiment can also include: to obtain each mesh After the component model for marking assembly unit, whether verifying various components model is all satisfied default required precision;If various components model It is all satisfied default required precision, then executes the component model of combination all components and the model of electrical connection;It is unsatisfactory for if it exists The component model of default required precision, the then size for the cell that the three-dimensional space where reducing corresponding component divides, so as to base Cell after reducing size rebuilds component model.
Wherein, it may include: for any group that whether verifying various components model, which is all satisfied the process of default required precision, Part model executes following process, to obtain the verification result of each component model:
It determines on the corresponding original component of the component model between two points of distance farthest, in preset spectral range Impedance curve, as the first curve;It determines on the component model between two points of distance farthest, in preset spectral range Interior impedance curve, as the second curve;Calculate the related coefficient of the first curve and the second curve;If the first curve and the second song The related coefficient of line is greater than or equal to preset correlation coefficient threshold, it is determined that the component model meets default required precision;If The related coefficient of first curve and the second curve is less than correlation coefficient threshold, it is determined that the component model is unsatisfactory for default precision and wants It asks.Wherein, the related coefficient in the related coefficient of the first curve and the second curve refers to the related coefficient in mathematical definition.It needs It is noted that the corresponding original component of component model and component model are emulated respectively using Electromagnetic Simulation tool, Farthest by distance on distance on the corresponding original component of the determining component model of emulation farthest two points and component model Two points.
It should be noted that the present embodiment carries out simulating, verifying using the prototype structure of assembly unit, not may require that big The time of amount and computing resource because, computing resource that Electromagnetic Simulation algorithm needs and time and grid number square or cube It is directly proportional, when there are many very big grid of size, time and resource at square or cube increase, but the size of components decomposed is smaller, It occupies computing resource and the time is seldom.By taking moment method as an example, it is assumed that the calculating time that each component needs is 1, then 10 components The time calculated separately is 10, and the system that is combined into is then 10^3=1000.
Inventor constructs the Emulation of EMC model that certain subway powers on power drive cabinet using the above method, should Cabinet dimensions about 3m is the electrically large sizes structure of a middle low complex degree.Fig. 8 a shows the schematic diagram of cabinet structure, and Fig. 8 b shows The schematic diagram of the Emulation of EMC model of the modeling method building provided using this case has been provided.The same electromagnetic compatibility is asked Topic, under same Electromagnetic Simulation environment, using deleting letter modeling in CAD pre-processing software, build with using the modeling method of this programme The simulation result of mould, acquisition compares 901 simulation result to delete letter modeling in CAD pre-processing software as shown in figure 9, in Fig. 9, 902 simulation result to be modeled using the modeling pattern of this case, occupies resource and the comparison of time is as shown in the table.Pass through Fig. 9 With table 1 as can be seen that the modeling method efficiency of this case is higher.
The resource and time that 1 two kinds of modeling methods of table occupy
Technical need foundation and processing model of the present invention from Emulation of EMC, it is imitative to solve current electromagnetic compatibility The problem of lacking targeted Method and kit for processing structure model in very, is conducive to promote Emulation of EMC in engineering Application;The present invention is on the basis of meeting the calculating of electromagnetism numerical value to structure precision requirement, using unit plane and equivalent circuit As the basic element of Emulation of EMC model, the accuracy of simulation calculation is not only ensured, and greatly improve calculating Efficiency, also, the basic element of model is simple, realizes that subdivision calculating is easier under various mainstream electromagnetism numerical computation methods, Therefore the Stability and adaptability of model is preferable;Modeling method modeling process provided by the invention is simple, efficient, operability By force, without excessively relying on the experience of engineer and repeatedly debugging, it is suitble to practical implementation.
The embodiment of the invention also provides a kind of electromagnetic compatibility model building devices of object, provide below the embodiment of the present invention The electromagnetic compatibility model building device of object be described, the electromagnetic compatibility model building device of object described below with it is above-described The electromagnetic compatibility modeling generation method of object can correspond to each other reference.
Referring to Fig. 10, the structure for showing a kind of electromagnetic compatibility model building device of object provided in an embodiment of the present invention is shown It is intended to, as shown in Figure 10, the apparatus may include: decomposing module 1001, modular construction conversion module 1002, component model building Module 1003, electrical connection model construction module 1004 and Emulation of EMC model construction module 1005.
Decomposing module 1001 is decomposed into electrical connection and P assembly unit, any component unit to modeling object for Including at least one component.Wherein, P is according to the structure determination to modeling object.
Modular construction conversion module 1002, for each assembly unit to be converted to the surface group by no thickness by body structure At face structure, the assembly unit after conversion is as target element unit.
Component model constructs module 1003, for determining that at least one corresponding object element of each target element unit is flat Face, and construct by least one corresponding object element plane of each target element unit the component of each target element unit Model, wherein the three-dimensional space where a target element unit is divided into R cell, and the size of cell is based on needing The highest frequency of the electromagnetic compatibility problem of concern is set, and an object element plane is internal in the presence of the component segment for needing to model A cell on a unit plane in Q unit plane defining, the corresponding component segment of a unit plane, wherein R The size of size and cell based on the three-dimensional space where corresponding target element unit determines that Q is preset for one, is greater than 1 fixed value.
It is electrically connected model construction module 1004, for constructing the equivalent-circuit model of electrical connection, as electrical connection Model.
Emulation of EMC model construction module 1005, for combining component model and the electrical connection of all components unit Model, the model after combination is as the Emulation of EMC model to modeling object.
The electromagnetic compatibility model building device of object provided in an embodiment of the present invention will be split as electrically connecting first to modeling object Connect with P assembly unit, then respectively construct various components unit component model and electrical connection model, finally, by each The component model of a assembly unit and the model combination of electrical connection, to obtain the Emulation of EMC mould to modeling object Type.The process that model building device provided in an embodiment of the present invention is modeled is simple and efficient, strong operability, in the mistake of building model It has been synchronously completed in journey and simple optimization is deleted to structure, without excessively relying on the experience of engineer and repeatedly debugging, be suitble to engineering real Border application, also, the embodiment of the present invention uses the basic element of unit plane and equivalent circuit as model, and structure is simple, no But computational efficiency is high, and can be adapted for various mainstream electromagnetic calculations subdivision and calculating, Stability and adaptability it is preferable.This The model building device that inventive embodiments provide also ensures modeling accuracy while ensuring modeling efficiency.
In one possible implementation, in the electromagnetic compatibility model building device of object provided by the above embodiment, component Model construction module 1003 includes: that object element plane determines submodule.
Object element plane determines submodule, for being directed to either objective assembly unit:
It is R cell by the three-dimensional space subdivision where the target element unit;For any cell, the list is determined It whether there is the component segment for needing to model in first lattice, if being based on should in the presence of the component segment for needing to model in the cell The Q unit plane defined on cell the correlation with component segment in the cell respectively, determines component in the cell The corresponding object element plane of segment, it is flat with the corresponding object element of all components segment for obtaining the target element unit Face, as at least one corresponding object element plane of the target element unit;
To obtain at least one corresponding object element plane of each target element unit.
Object element plane determines submodule, when determining in the cell with the presence or absence of the component segment for needing to model, Specifically for intercepting component segment of the target element unit inside the cell;The target element unit is calculated in the unit The coverage rate of projection of the component segment on the surface of the preset direction of the cell inside lattice to perspective plane;Based on coverage rate Determine whether component segment of the target element unit inside the cell is the component segment for needing to model.
In one possible implementation, object element plane determines the Q that submodule is defined on based on the cell A unit plane correlation with component segment in the cell respectively, determines the corresponding target list of component segment in the cell When first plane, specifically for calculating the Q unit plane defined on the cell the phase with component segment in the cell respectively Close property coefficient;By the corresponding unit plane of maximal correlation property coefficient in all relative coefficients being calculated, it is determined as this The corresponding object element plane of component segment in cell.Wherein, relative coefficient is for characterization unit plane and component segment Degree of relevancy.
In one possible implementation, in the electromagnetic compatibility model building device of above-mentioned object, component model constructs module 1003 include: that component model determines submodule.
Component model determines submodule, for being directed to either objective assembly unit:
By at least one corresponding object element plane combination of the target element unit;Traverse target element unit place The cell that is divided of three-dimensional space, if in the presence of the component segment for needing to model in two adjacent cells lattice, and two phases The corresponding object element plane of two component segments in adjacent cell is discontinuous, and the target element unit passes through two The public face of adjacent cells lattice then connects the representative points of two object element planes on two adjacent cells lattice, to be formed Repair unit plane, wherein representative points are the vertex on public face;
To obtain the component model of each target element unit.
Preferably, the electromagnetic compatibility model building device of object provided by the above embodiment can also include: component model verifying Module and cell size adjustment module.
Component model authentication module, for verifying whether various components model is all satisfied default required precision.
Emulation of EMC model construction module, for combining when various components model is all satisfied default required precision The component model of all components unit and the model of electrical connection.
Cell size adjustment module, for reducing and corresponding to when there is the component model for being unsatisfactory for default required precision The size for the cell that three-dimensional space where assembly unit divides, after constructing module based on size is reduced so as to component model Cell rebuilds component model.
In one possible implementation, component model authentication module is specifically used for for any component model:
It determines on the corresponding original component unit of the component model between two points of distance farthest, in preset frequency spectrum model Interior impedance curve is enclosed, as the first curve;It determines on the component model between two points of distance farthest, in preset frequency spectrum Impedance curve in range, as the second curve;Calculate the related coefficient of the first curve and the second curve;If the first curve and The related coefficient of two curves is greater than or equal to preset correlation coefficient threshold, it is determined that the component model, which meets default precision, to be wanted It asks;If the related coefficient of the first curve and the second curve is less than correlation coefficient threshold, it is determined that the component model is unsatisfactory for presetting Required precision;
To obtain the verification result of each component model.
The embodiment of the invention also provides a kind of electromagnetic compatibility modelling apparatus of object, please refer to Figure 11, it is right to show this The structural schematic diagram of the electromagnetic compatibility modelling apparatus of elephant, the equipment may include: at least one processor 1101, at least one is logical Believe interface 1102, at least one processor 1103 and at least one communication bus 1104;
In embodiments of the present invention, the number of processor 1101, communication interface 1102, memory 1103, communication bus 1104 Amount be at least one, and processor 1101, communication interface 1102, memory 1103 by communication bus 1104 complete it is mutual Communication;
Processor 1101 may be a central processor CPU or specific integrated circuit ASIC (Application Specific Integrated Circuit), or be arranged to implement the integrated electricity of one or more of the embodiment of the present invention Road etc.;
Memory 1103 may include high speed RAM memory, it is also possible to further include nonvolatile memory (non- Volatile memory) etc., a for example, at least magnetic disk storage;
Wherein, memory is stored with program, the program that processor can call memory to store, and program is used for:
Electrical connection and P assembly unit is decomposed into modeling object, any component unit includes at least one component, Wherein, P is according to the structure determination to modeling object;
Each assembly unit is converted to by body structure to the component list by the face structure of the surface composition of no thickness, after conversion Member is used as target element unit;
It determines at least one corresponding object element plane of each target element unit, and passes through each target element unit At least one corresponding object element plane constructs the component model of each target element unit, wherein a target element list Three-dimensional space where first is divided into R cell, and the size of cell is based on the highest for the electromagnetic compatibility problem for needing to pay close attention to Frequency setting, an object element plane are internal single in the presence of Q defined on the cell for needing the component segment modeled A unit plane in first plane, the corresponding component segment of a unit plane, wherein R is based on corresponding target element unit The size of the three-dimensional space at place and the size of cell determine that Q is a fixed value preset, greater than 1;
Construct the equivalent-circuit model of electrical connection, the model as electrical connection;
The component model of all components unit and the model of electrical connection are combined, the model after combination is used as to modeling object Emulation of EMC model.
Optionally, the refinement function of program and extension function can refer to above description.
The embodiment of the present invention also provides a kind of readable storage medium storing program for executing, which can be stored with and hold suitable for processor Capable program, program are used for:
Electrical connection and P assembly unit is decomposed into modeling object, any component unit includes at least one component, Wherein, P is according to the structure determination to modeling object;
Each assembly unit is converted to by body structure to the component list by the face structure of the surface composition of no thickness, after conversion Member is used as target element unit;
It determines at least one corresponding object element plane of each target element unit, and passes through each target element unit At least one corresponding object element plane constructs the component model of each target element unit, wherein a target element list Three-dimensional space where first is divided into R cell, and the size of cell is based on the highest for the electromagnetic compatibility problem for needing to pay close attention to Frequency setting, an object element plane are internal single in the presence of Q defined on the cell for needing the component segment modeled A unit plane in first plane, the corresponding component segment of a unit plane, wherein R is based on corresponding target element unit The size of the three-dimensional space at place and the size of cell determine that Q is a fixed value preset, greater than 1;
Construct the equivalent-circuit model of electrical connection, the model as electrical connection;
The component model of all components unit and the model of electrical connection are combined, the model after combination is used as to modeling object Emulation of EMC model.
Optionally, the refinement function of program and extension function can refer to above description.
Finally, it is to be noted that, herein, relational terms such as first and second and the like be used merely to by One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant meaning Covering non-exclusive inclusion, so that the process, method, article or equipment for including a series of elements not only includes that A little elements, but also including other elements that are not explicitly listed, or further include for this process, method, article or The intrinsic element of equipment.In the absence of more restrictions, the element limited by sentence "including a ...", is not arranged Except there is also other identical elements in the process, method, article or apparatus that includes the element.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other The difference of embodiment, the same or similar parts in each embodiment may refer to each other.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one The widest scope of cause.

Claims (10)

1. a kind of electromagnetic compatibility modeling method of object characterized by comprising
Electrical connection and P assembly unit is decomposed into modeling object, any component unit includes at least one component, In, P is according to the structure determination to modeling object;
Each assembly unit is converted to the assembly unit by the face structure of the surface composition of no thickness, after conversion by body structure to make For target element unit;
Determine at least one corresponding object element plane of each target element unit, and corresponding by each target element unit At least one object element plane construct the component model of each target element unit, wherein a target element unit institute Three-dimensional space be divided into R cell, the size of cell is based on the highest frequency for the electromagnetic compatibility problem for needing to pay close attention to Setting, an object element plane are internal flat in the presence of the Q unit defined on the cell for needing the component segment modeled A unit plane in face, the corresponding component segment of a unit plane, wherein R is based on where corresponding target element unit Three-dimensional space size and cell size determine, Q be a fixed value preset, greater than 1;
The equivalent-circuit model for constructing the electrical connection, the model as the electrical connection;
The component model of all components unit and the model of the electrical connection are combined, the model after combination is as described wait model The Emulation of EMC model of object.
2. the electromagnetic compatibility modeling method of object according to claim 1, which is characterized in that each target group of determination At least one corresponding object element plane of part unit, comprising:
For either objective assembly unit:
It is R cell by the three-dimensional space subdivision where the target element unit;For any cell, the cell is determined It is interior to be based on the unit if the component segment modeled in the cell in the presence of needs with the presence or absence of the component segment for needing to model The Q unit plane defined on lattice the correlation with component segment in the cell respectively, determines component segment in the cell Corresponding object element plane, the corresponding object element plane of all components segment to obtain the target element unit, As at least one corresponding object element plane of the target element unit;
To obtain at least one corresponding object element plane of each target element unit.
3. the electromagnetic compatibility modeling method of object according to claim 2, which is characterized in that in the determination cell The component segment modeled with the presence or absence of needs, comprising:
Intercept component segment of the target element unit inside the cell;
Component segment of the target element unit inside the cell is calculated on the surface of the preset direction of the cell Project the coverage rate to perspective plane;
Determine whether component segment of the target element unit inside the cell needs to model based on the coverage rate Component segment.
4. the electromagnetic compatibility modeling method of object according to claim 2, which is characterized in that described based on the cell Q unit plane of the definition correlation with component segment in the cell respectively determines that component segment is corresponding in the cell Object element plane, comprising:
The Q unit plane defined on the cell the relative coefficient with component segment in the cell respectively is calculated, it is described Relative coefficient is used for the degree of correlation of characterization unit plane and component segment;
By the corresponding unit plane of maximal correlation property coefficient in all relative coefficients being calculated, it is determined as the cell The corresponding object element plane of middle component segment.
5. the electromagnetic compatibility modeling method of object according to claim 1, which is characterized in that described to pass through each target group At least one corresponding object element plane of part unit constructs the component model of each target element unit, comprising:
For either objective assembly unit:
By at least one corresponding object element plane combination of the target element unit;Traverse three where the target element unit The cell that dimension space is divided, if the component segment modeled in the presence of needs in two adjacent cells lattice, and described two phases The corresponding object element plane of two component segments in adjacent cell is discontinuous, and the target element unit is across described The public face of two adjacent cells lattice then connects the target top of two object element planes on described two adjacent cells lattice Point repairs unit plane to be formed, wherein the representative points are the vertex on the public face;
To obtain the component model of each target element unit.
6. electromagnetic compatibility modeling method described according to claim 1~any one of 5, which is characterized in that further include:
Before the component model of combination all components unit and the model of the electrical connection, whether verifying various components model It is all satisfied default required precision;
If the various components model is all satisfied the default required precision, the assembly mould of the combination all components unit is executed The model of type and the electrical connection;
Be unsatisfactory for the component model of default required precision if it exists, then what the three-dimensional space where reducing corresponding assembly unit divided The size of cell, to rebuild component model based on the cell after reduction size.
7. electromagnetic compatibility modeling method according to claim 6, which is characterized in that whether the verifying various components model It is all satisfied default required precision, comprising:
For any component model:
It determines on the corresponding original component unit of the component model between two points of distance farthest, in preset spectral range Impedance curve, as the first curve;
Determine that on the component model between two points of distance farthest, the impedance curve in the preset spectral range is made For the second curve;
Calculate the related coefficient of first curve and second curve;
If the related coefficient of first curve and second curve is greater than or equal to preset correlation coefficient threshold, it is determined that The component model meets the default required precision;
If the related coefficient of first curve and second curve is less than the correlation coefficient threshold, it is determined that the assembly mould Type is unsatisfactory for the default required precision;
To obtain the verification result of each component model.
8. a kind of electromagnetic compatibility model building device of object characterized by comprising decomposing module, modular construction conversion module, group Part model construction module, electrical connection model construction module and Emulation of EMC model construction module;
The decomposing module, for electrical connection and P assembly unit is decomposed into modeling object, any component unit to include At least one component, wherein P is according to the structure determination to modeling object;
The modular construction conversion module, for being converted to each assembly unit by body structure by the surface composition of no thickness Face structure, the assembly unit after conversion is as target element unit;
The component model constructs module, for determining at least one corresponding object element plane of each target element unit, And the assembly mould of each target element unit is constructed by least one corresponding object element plane of each target element unit Type, wherein the three-dimensional space where a target element unit is divided into R cell, and the size of cell is based on needing to close The highest frequency of the electromagnetic compatibility problem of note is set, and an object element plane is internal in the presence of the component segment for needing to model The unit plane in Q unit plane defined on one cell, the corresponding component segment of a unit plane, wherein R base It is determined in the size of the three-dimensional space where corresponding target element unit and the size of cell, Q is preset for one, is greater than 1 Fixed value;
The electrical connection model construction module, for constructing the equivalent-circuit model of the electrical connection, as described electrical The model of connection;
The Emulation of EMC model construction module, for combine all components unit component model and the electrical connection Model, model after combination is as the Emulation of EMC model to modeling object.
9. the electromagnetic compatibility model building device of object according to claim 8, which is characterized in that the component model constructs mould Block includes: that object element plane determines submodule;
The object element plane determines submodule, for being directed to either objective assembly unit:
It is R cell by the three-dimensional space subdivision where the target element unit;For any cell, the cell is determined The interior component segment modeled with the presence or absence of needs is based on the unit if there is the component segment for needing to model in the cell The Q unit plane defined on lattice the correlation with component segment in the cell respectively, determines component segment in the cell Corresponding object element plane, the corresponding object element plane of all components segment to obtain the target element unit, As at least one corresponding object element plane of the target element unit;
To obtain at least one corresponding object element plane of each target element unit.
10. the electromagnetic compatibility model building device of object according to claim 8, which is characterized in that further include: component model is tested Demonstrate,prove module and cell size adjustment module;
The component model authentication module, for verifying whether various components model is all satisfied default required precision;
The Emulation of EMC model construction module, for being all satisfied the default required precision when the various components model When, combine the component model of all components unit and the model of the electrical connection;
The cell size adjustment module, for reducing and corresponding to when there is the component model for being unsatisfactory for default required precision The size for the cell that three-dimensional space where assembly unit divides, so that component model building module is based on reducing size Cell afterwards rebuilds component model.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112115553A (en) * 2020-09-17 2020-12-22 东风柳州汽车有限公司 Vehicle electromagnetic compatibility simulation method, device, storage medium and device
CN113326571A (en) * 2021-06-25 2021-08-31 中车长春轨道客车股份有限公司 Train body electromagnetic compatibility confirmation method based on three-dimensional equivalent impedance network

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000077694A1 (en) * 1999-06-12 2000-12-21 American Applied Research, Inc. Improved simulation system for modeling the electromagnetic response of electronic design packages
CN104408261A (en) * 2014-12-06 2015-03-11 重庆长安汽车股份有限公司 Complete vehicle electromagnetic compatibility (EMC) model building method applicable to complex automobile structure
CN104462713A (en) * 2014-12-22 2015-03-25 南车株洲电力机车有限公司 Electromagnetic compatibility modeling method and system for rail transit vehicle
CN108387802A (en) * 2018-03-30 2018-08-10 北京经纬恒润科技有限公司 A kind of the electromagnetic compatibility appraisal procedure and device of vehicle earthed system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000077694A1 (en) * 1999-06-12 2000-12-21 American Applied Research, Inc. Improved simulation system for modeling the electromagnetic response of electronic design packages
CN104408261A (en) * 2014-12-06 2015-03-11 重庆长安汽车股份有限公司 Complete vehicle electromagnetic compatibility (EMC) model building method applicable to complex automobile structure
CN104462713A (en) * 2014-12-22 2015-03-25 南车株洲电力机车有限公司 Electromagnetic compatibility modeling method and system for rail transit vehicle
CN108387802A (en) * 2018-03-30 2018-08-10 北京经纬恒润科技有限公司 A kind of the electromagnetic compatibility appraisal procedure and device of vehicle earthed system

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
付国良 等: "整车电磁兼容多层级联仿真方法", 《汽车工程师》 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112115553A (en) * 2020-09-17 2020-12-22 东风柳州汽车有限公司 Vehicle electromagnetic compatibility simulation method, device, storage medium and device
CN113326571A (en) * 2021-06-25 2021-08-31 中车长春轨道客车股份有限公司 Train body electromagnetic compatibility confirmation method based on three-dimensional equivalent impedance network
CN113326571B (en) * 2021-06-25 2023-11-28 中车长春轨道客车股份有限公司 Train body electromagnetic compatibility confirmation method based on three-dimensional equivalent impedance network

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