CN109614648A - Heating device layout method on a kind of pcb board - Google Patents
Heating device layout method on a kind of pcb board Download PDFInfo
- Publication number
- CN109614648A CN109614648A CN201811331458.XA CN201811331458A CN109614648A CN 109614648 A CN109614648 A CN 109614648A CN 201811331458 A CN201811331458 A CN 201811331458A CN 109614648 A CN109614648 A CN 109614648A
- Authority
- CN
- China
- Prior art keywords
- pcb
- heating device
- layout
- pcb board
- power resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/08—Thermal analysis or thermal optimisation
Abstract
The invention discloses heating device layout methods on a kind of pcb board comprising the steps of: is laid out Step 1: completing preliminary pcb board according to functional requirement, and selected heating device；Step 2: being laid out according to the power consumption of heating device and preliminary PCB, hot emulation and optimization are carried out, the PCB layout after being optimized；Step 3: the power resistor with the power consumptions such as heating device equidimension is pasted onto according to the PCB layout after optimization the corresponding position of the PCB substrate with grid coordinates, test platform is formed；Step 4: carrying out Thermal test to the test platform of steady operation using thermal imaging system, whether the layout for assessing power resistor reasonable, and pcb board layout is adjusted if unreasonable, re-execute the steps one to four, until assess power resistor it is rationally distributed until.The present invention can verify PCB Thermal layout scheme under the premise of not producing pcb board and heating device in kind, reduce product the number of iterations.
Description
Technical field
The invention belongs to electric mechanical engineering field, it is related to heating device layout method on a kind of pcb board.
Background technique
Modern airborne electronic equipment produces equipment to be developed towards miniature compactization, higher and higher to the cooling requirements of equipment, existing rank
The airborne electronic equipment design of section, at design initial stage, main consideration meets electrical property, considers the heating device heat distribution of PCB
It is less, it goes to emulate or test the Temperature Distribution for removing verifying PCB again after model machine output, this stage considers Temperature Distribution, and modification is set
The remaining of meter is smaller, and if that can fully consider that the heat distribution of PCB heating device is designed in conceptual phase, product will be obtained
Better heat distribution, the present invention are to be used to design the PCB heating device layout thermal design at initial stage.
Summary of the invention
Goal of the invention of the invention is to provide heating device layout method on a kind of pcb board, is not producing PCB in kind
Under the premise of plate and heating device, PCB Thermal layout scheme is verified, reduces product the number of iterations.
Goal of the invention of the invention is achieved through the following technical solutions:
Heating device layout method on a kind of pcb board comprising the steps of:
It is laid out Step 1: completing preliminary pcb board according to functional requirement, and selected heating device；
Step 2: being laid out according to the power consumption of heating device and preliminary PCB, hot emulation and optimization are carried out, after being optimized
PCB layout；
Step 3: the power resistor with the power consumptions such as heating device equidimension is pasted onto band according to the PCB layout after optimization
There is the corresponding position of the PCB substrate of grid coordinates, forms test platform；
Step 4: carrying out Thermal test using test platform of the thermal imaging system to steady operation, the layout of power resistor is assessed
Whether rationally, pcb board layout is adjusted if unreasonable, re-execute the steps one to four, until the layout of assessment power resistor is closed
Until reason.
The placement scheme of heating device on circuit boards can be fully considered in design early stage using the method, from original
It goes to verify again after the completion of layout designs, after being changed into sufficiently verifying, then removes trial-production finished product, shorten the R&D cycle, reduce iteration time
Number.
Detailed description of the invention
Fig. 1 is the PCB substrate of tape square coordinate；
Fig. 2 is the hot analogous diagram of PCB；
Fig. 3 is test platform schematic diagram；
The flow chart of heating device layout method on Fig. 4 pcb board.
Specific embodiment
The present invention is made with reference to the accompanying drawings and examples further detailed.
It is as shown in table 1 to implement the tool used required for heating device layout method on pcb board shown in the present embodiment.Its
Middle PCB substrate uses modular size, and grid coordinates are drawn in PCB substrate for instructing heating device to sit in the position of PCB
Mark, as shown in Figure 1.
| Composition | Purposes |
| The PCB substrate of tape square coordinate such as Fig. 1 | Indicate the installation site of heating device |
| Size customizes, the adjustable power resistor of power consumption | Simulate heating device |
| Hot simulation software | Optimize preliminary project |
| Thermal imaging system | The precision of verifying heat emulation |
Table 1
Heating device layout method is as shown in Figure 4 on pcb board comprising the steps of:
It is laid out Step 1: completing preliminary pcb board according to functional requirement, and selected heating device；
Step 2: being laid out according to the power consumption of heating device and preliminary PCB, hot emulation is carried out using hot simulation software, is obtained
Hot analogous diagram, as shown in Figure 2.PCB optimization is carried out further according to hot analogous diagram, the PCB layout after being optimized；
Step 3: the power resistor with the power consumptions such as heating device equidimension is pasted onto band according to the PCB layout after optimization
There is the corresponding position of the PCB substrate of grid coordinates, forms test platform, as shown in Figure 3；
Step 4: carrying out Thermal test using test platform of the thermal imaging system to steady operation, the layout of power resistor is assessed
Whether rationally, pcb board layout is adjusted if unreasonable, re-execute the steps one to four, until the layout of assessment power resistor is closed
Until reason.
Advanced development, subsequent progress model machine Thermal test are laid out according to finally determining pcb board.
Claims (1)
1. heating device layout method on a kind of pcb board comprising the steps of:
It is laid out Step 1: completing preliminary pcb board according to functional requirement, and selected heating device；
Step 2: being laid out according to the power consumption of heating device and preliminary PCB, hot emulation and optimization are carried out, the PCB cloth after being optimized
Office；
Step 3: the power resistor with the power consumptions such as heating device equidimension is pasted into side according to the PCB layout after optimization
The corresponding position of the PCB substrate of lattice coordinate forms test platform；
Step 4: carry out Thermal test to the test platform of steady operation using thermal imaging system, assess power resistor layout whether
Rationally, pcb board layout is adjusted if unreasonable, re-execute the steps one to four, until assessment the rationally distributed of power resistor is
Only.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811331458.XA CN109614648A (en) | 2018-11-09 | 2018-11-09 | Heating device layout method on a kind of pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811331458.XA CN109614648A (en) | 2018-11-09 | 2018-11-09 | Heating device layout method on a kind of pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109614648A true CN109614648A (en) | 2019-04-12 |
Family
ID=66003999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811331458.XA Pending CN109614648A (en) | 2018-11-09 | 2018-11-09 | Heating device layout method on a kind of pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109614648A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111605742A (en) * | 2020-06-03 | 2020-09-01 | 中国科学院微小卫星创新研究院 | Multi-satellite vacuum thermal test method and system |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101221588A (en) * | 2007-01-09 | 2008-07-16 | 上海杰得微电子有限公司 | Radiation design method in PCB design |
| CN104424374A (en) * | 2013-09-05 | 2015-03-18 | 北汽福田汽车股份有限公司 | Calibration method and system of thermal simulation model of circuit board |
-
2018
- 2018-11-09 CN CN201811331458.XA patent/CN109614648A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101221588A (en) * | 2007-01-09 | 2008-07-16 | 上海杰得微电子有限公司 | Radiation design method in PCB design |
| CN104424374A (en) * | 2013-09-05 | 2015-03-18 | 北汽福田汽车股份有限公司 | Calibration method and system of thermal simulation model of circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 李跟宝;王扬;汪熙;石潇;: "多芯片PCB板热布局优化试验研究及数值模拟" * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111605742A (en) * | 2020-06-03 | 2020-09-01 | 中国科学院微小卫星创新研究院 | Multi-satellite vacuum thermal test method and system |
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