CN109614011A - Condenser type refers to touching functional product and preparation method thereof more - Google Patents

Condenser type refers to touching functional product and preparation method thereof more Download PDF

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Publication number
CN109614011A
CN109614011A CN201910034180.8A CN201910034180A CN109614011A CN 109614011 A CN109614011 A CN 109614011A CN 201910034180 A CN201910034180 A CN 201910034180A CN 109614011 A CN109614011 A CN 109614011A
Authority
CN
China
Prior art keywords
layer
extexine
touching
condenser type
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910034180.8A
Other languages
Chinese (zh)
Inventor
高谊恬
李昭松
何宗勋
薛娇奎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Fengshi Electronic Appearance Technology Co Ltd
Original Assignee
Kunshan Fengshi Electronic Appearance Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Fengshi Electronic Appearance Technology Co Ltd filed Critical Kunshan Fengshi Electronic Appearance Technology Co Ltd
Priority to CN201910034180.8A priority Critical patent/CN109614011A/en
Publication of CN109614011A publication Critical patent/CN109614011A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412Digitisers structurally integrated in a display
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416Control or interface arrangements specially adapted for digitisers
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04104Multi-touch detection in digitiser, i.e. details about the simultaneous detection of a plurality of touching locations, e.g. multiple fingers or pen and finger

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)

Abstract

The present invention discloses condenser type and refers to touching functional product and preparation method thereof more, and wherein touch-control product includes the successively extexine of stacked distribution, plastic central base layer, bottom surface conductive circuit layer and with referring to the circuit board for touching IC electronic building brick from top to bottom more;Extexine plastic central base layer, bottom surface conductive circuit layer, is integrally formed using in-mould injection technique, and is connect with circuit board by bottom surface conductive circuit layer.The present invention integrally combines with multi-point touch IC component forms the product that tool receives multiple spot human body electric field or charge species touching, compact-sized secured, process simplification, environmental protection, waterproof, it is antifouling etc., the product of more finger signal input operations such as automobile interior decoration, consumer electrical product, household appliances can be widely used in.

Description

Condenser type refers to touching functional product and preparation method thereof more
Technical field
The present invention relates to condenser types to refer to touching functional product and preparation method thereof more, belongs to multi-point touch device technique neck Domain.
Background technique
Currently, as electronics market continues to develop, many electronic products also more and more enter we live, In production.Operation interface of the key as electronic product, traditional mechanical key can no longer meet with the development of science and technology Beautiful, practical modernization demand.
On existing market common touch technology generally comprise surface acoustic wave type, optical profile type, resistance-type, surface capacitance type and Five kinds of projected capacitive etc., how to incorporate multipoint-touch-technology in more equipment is that those skilled in the art are badly in need of being solved Problem.
Summary of the invention
Purpose: in order to overcome the deficiencies in the prior art, the present invention provide condenser type refer to more touch functional product and Its production method.
Technical solution: in order to solve the above technical problems, the technical solution adopted by the present invention are as follows:
Condenser type refers to touching functional product more, including the successively extexine of stacked distribution, inter-matrix layer, bottom surface layer from top to bottom The shell of composition and the circuit board by conducting wire connection with mostly finger touching IC electronic building brick;The extexine, centre Base layer, bottom surface layer are integrally formed using in-mould injection technique, when human body electric field or charge species touching or close to touch-control product Extexine top surface after, micro-current is conducted to circuit board, thus more fingers in drive circuit board by bottom surface layer and conducting wire IC electronic building brick is touched, product function interface is manipulated.
As a preferred solution: the extexine is provided with decorative pattern or function instruction pattern, inter-matrix layer is using modeling Expect that matrix, bottom surface layer are provided with conductive circuit layer.
As a preferred solution: the shell structure is provided in round or cylindrical knob structure.
As a preferred solution: the decorative pattern or function instruction pattern are printed on extexine bottom surface.
As a preferred solution: the conductive circuit layer is printed on the bottom surface of bottom surface layer.
As a preferred solution: the conductive circuit layer is connected by conducting wire with circuit board.
As a preferred solution: the circuit board is pcb board or FPC plate.
The production method that the condenser type refers to touching functional product more, includes the following steps:
1) extexine is taken, prints upper decoration layer in the bottom surface of extexine;
2) bottom surface layer is taken, prints upper conductive circuit layer in the bottom surface of bottom surface layer, or successively print upper decoration layer and conductor wire Road floor;
3) extexine is placed in and is projected in mould affixed side die cavity, bottom surface layer is placed in and is projected in mould drawer at movable side die cavity, appearance The facing distribution in top surface of the bottom surface and bottom surface layer of layer;Mould drawer at movable side will be projected and project the molding of mould affixed side, through in-mould injection Inter-matrix layer is formed, extexine, inter-matrix layer and bottom surface layer are integrally formed after forming, so that decoration layer and conductor wire Road floor is coated between extexine and inter-matrix layer;
4) it takes with the circuit board for more referring to touching IC electronic building brick, the conducting wire that bottom surface layer prints is connected with circuit board.
The utility model has the advantages that condenser type provided by the invention refers to touching functional product and preparation method thereof more, using circular knob Moulding shell is applicable to the input of the signals such as automobile interior decoration, consumer electrical product, household appliances, simple structure, user Just.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention;
Fig. 2 is schematic diagram of the process of the present invention.
Specific embodiment
The present invention will be further explained with reference to the accompanying drawing.
As shown in Figure 1, condenser type refers to touching functional product more, comprising: PCBA wiring board 5, shell, PCBA wiring board 5 are set It is equipped with multi-point touch IC7, the connector 6 being arranged on multi-point touch IC7 and PCBA wiring board 5 is connected;The shell includes: outer Surface layer 1, inter-matrix layer 2, bottom surface layer 3 are suppressed with extexine 1 outside the inter-matrix layer 2, press inside inter-matrix layer 2 It is formed with bottom surface layer 3, the back up of the extexine 1 has decorative pattern or backlight pattern, the back up of the bottom surface layer 3 There are conductive circuit layer 4 or conductive circuit layer 4 and backlight pattern, the conductive circuit layer 4 is connected with connector 6.
Embodiment 1:
Shell is set as knob structure.
Embodiment 2:
Knob structure is provided in round or cylinder.
As shown in Fig. 2, condenser type refers to that the production method manufacturing process of touching functional product, specific steps include: more
Step 1: 1 back up decorative pattern 8 of extexine or backlight pattern 8;
Step 2: 3 back up backlight pattern 8 of bottom surface layer and conductive circuit layer 4;
Step 3: utilizing vacuum, high pressure and vacuum high-pressure machine, interior placement moulding mode 9, by printed decoration pattern 8 or backlight pattern 8 extexine 1 or backlight pattern 8 and the bottom surface layer of conducting wire 43, it is stretched needed for body 10, after be punched into and be put into injection mould Die cavity moulding body;
Step 4: film body 10 is put into after being punched to be projected in mould die cavity 11, will be projected mould drawer at movable side and is projected mould affixed side and closes Mould forms inter-matrix layer through in-mould injection, and extexine 1, inter-matrix layer 2 and bottom surface layer 3 are integrally formed after forming, becomes production The shell 12 of product;
Step 5: shell 12 is reserved the extension of conductive circuit layer 4 and is connect with the connector 6 on PCBA wiring board 5, complete after powering on Refer to touching functional product production method at condenser type more.
In use, since electronic building brick using touching IC is referred to more in this circuit board, through the conduction of bottom surface layer conductive circuit layer To circuit board, product function region can receive multiple spot human body electric field or electrification simultaneously for human body electric field or charge species micro-current The micro-current that substance touching generates, drives product function.When human body electric field or charge species touching or close to outside touch-control product Behind the top surface of surface layer, micro-current is conducted to circuit board, thus in drive circuit board by bottom surface layer conductive circuit layer and conducting wire Electronic building brick, manipulate product function interface.
The above is only a preferred embodiment of the present invention, it should be pointed out that: for the ordinary skill people of the art For member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also answered It is considered as protection scope of the present invention.

Claims (8)

1. condenser type refers to touching functional product more, it is characterised in that: including the successively extexine of stacked distribution, centre from top to bottom Base layer, the shell of bottom surface layer composition and the circuit board by conducting wire connection with mostly finger touching IC electronic building brick;Institute It states extexine, inter-matrix layer, bottom surface layer, be integrally formed using in-mould injection technique, when human body electric field or charge species are touched Or close to after the extexine top surface of touch-control product, micro-current is conducted to circuit board, to drive by bottom surface layer and conducting wire More fingers in circuit board touch IC electronic building brick, manipulate product function interface.
2. condenser type according to claim 1 refers to touching functional product more, it is characterised in that: the extexine is provided with dress It adorns pattern or function indicates pattern, inter-matrix layer uses plastic substrate, and bottom surface layer is provided with conductive circuit layer.
3. condenser type according to claim 1 refers to touching functional product more, it is characterised in that: the shell structure is set as Round or cylindrical knob structure.
4. condenser type according to claim 2 refers to touching functional product more, it is characterised in that: the decorative pattern or function Instruction pattern is printed on extexine bottom surface.
5. condenser type according to claim 2 refers to touching functional product more, it is characterised in that: the conductive circuit layer printing In the bottom surface of bottom surface layer.
6. condenser type according to claim 5 refers to touching functional product more, it is characterised in that: the conductive circuit layer passes through Conducting wire is connected with circuit board.
7. condenser type according to claim 1 refers to touching functional product more, it is characterised in that: the circuit board is pcb board Or FPC plate.
8. condenser type described in -7 any one refers to that the production method of touching functional product, feature exist more according to claim 1 In including the following steps:
1) extexine is taken, prints upper decoration layer in the bottom surface of extexine;
2) bottom surface layer is taken, prints upper conductive circuit layer in the bottom surface of bottom surface layer, or successively print upper decoration layer and conductor wire Road floor;
3) extexine is placed in and is projected in mould affixed side die cavity, bottom surface layer is placed in and is projected in mould drawer at movable side die cavity, appearance The facing distribution in top surface of the bottom surface and bottom surface layer of layer;Mould drawer at movable side will be projected and project the molding of mould affixed side, through in-mould injection Inter-matrix layer is formed, extexine, inter-matrix layer and bottom surface layer are integrally formed after forming, so that decoration layer and conductor wire Road floor is coated between extexine and inter-matrix layer;
4) it takes with the circuit board for more referring to touching IC electronic building brick, the conducting wire that bottom surface layer prints is connected with circuit board.
CN201910034180.8A 2019-01-15 2019-01-15 Condenser type refers to touching functional product and preparation method thereof more Pending CN109614011A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910034180.8A CN109614011A (en) 2019-01-15 2019-01-15 Condenser type refers to touching functional product and preparation method thereof more

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910034180.8A CN109614011A (en) 2019-01-15 2019-01-15 Condenser type refers to touching functional product and preparation method thereof more

Publications (1)

Publication Number Publication Date
CN109614011A true CN109614011A (en) 2019-04-12

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111245420A (en) * 2020-01-16 2020-06-05 昆山峰实电子外观应用科技有限公司 Capacitive multi-point touch three-dimensional knob and manufacturing method thereof
CN112732128A (en) * 2020-12-31 2021-04-30 昆山峰实电子外观应用科技有限公司 Capacitive touch control element and manufacturing method thereof
CN113778258A (en) * 2021-08-25 2021-12-10 昆山峰实电子外观应用科技有限公司 Touch product and production method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201698379U (en) * 2010-07-14 2011-01-05 纬创资通股份有限公司 Touch-control display device and electronic device
CN202600664U (en) * 2012-04-18 2012-12-12 赣州市德普特科技有限公司 Capacitive touch screen
CN103376957A (en) * 2012-04-18 2013-10-30 赣州市德普特科技有限公司 Capacitive touch screen and manufacturing method thereof
CN209447138U (en) * 2019-01-15 2019-09-27 昆山峰实电子外观应用科技有限公司 Condenser type refers to touching functional product more

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201698379U (en) * 2010-07-14 2011-01-05 纬创资通股份有限公司 Touch-control display device and electronic device
CN202600664U (en) * 2012-04-18 2012-12-12 赣州市德普特科技有限公司 Capacitive touch screen
CN103376957A (en) * 2012-04-18 2013-10-30 赣州市德普特科技有限公司 Capacitive touch screen and manufacturing method thereof
CN209447138U (en) * 2019-01-15 2019-09-27 昆山峰实电子外观应用科技有限公司 Condenser type refers to touching functional product more

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111245420A (en) * 2020-01-16 2020-06-05 昆山峰实电子外观应用科技有限公司 Capacitive multi-point touch three-dimensional knob and manufacturing method thereof
CN112732128A (en) * 2020-12-31 2021-04-30 昆山峰实电子外观应用科技有限公司 Capacitive touch control element and manufacturing method thereof
CN113778258A (en) * 2021-08-25 2021-12-10 昆山峰实电子外观应用科技有限公司 Touch product and production method thereof

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