CN109613413B - Method and system for increasing number of test samples of high-temperature environment aging test - Google Patents

Method and system for increasing number of test samples of high-temperature environment aging test Download PDF

Info

Publication number
CN109613413B
CN109613413B CN201811603170.3A CN201811603170A CN109613413B CN 109613413 B CN109613413 B CN 109613413B CN 201811603170 A CN201811603170 A CN 201811603170A CN 109613413 B CN109613413 B CN 109613413B
Authority
CN
China
Prior art keywords
temperature
air door
test
test chamber
constant temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201811603170.3A
Other languages
Chinese (zh)
Other versions
CN109613413A (en
Inventor
张文亮
雷小阳
李文江
朱阳军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shandong Yuexin Electronic Technology Co ltd
Original Assignee
Shandong Yuexin Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shandong Yuexin Electronic Technology Co ltd filed Critical Shandong Yuexin Electronic Technology Co ltd
Priority to CN201811603170.3A priority Critical patent/CN109613413B/en
Publication of CN109613413A publication Critical patent/CN109613413A/en
Application granted granted Critical
Publication of CN109613413B publication Critical patent/CN109613413B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2642Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)

Abstract

The invention relates to a method and a system for increasing the number of test samples in an aging test in a high-temperature environment, which comprisesThe device to be tested is subjected to an environmental aging test to provide an environmental test chamber of a required environment; the air door baffle plate control mechanism can control the opening state of the air door baffle plate of the environmental test chamber. During the test, according to the current opening angle alpha of the air door baffle and the current temperature T in the environmental test chamberrealThe opening angle alpha of the air door baffle is accurately and rapidly adjusted through the air door baffle control mechanism, so that the maximum allowable heating power of the test system can be changed, the test system can contain more test samples on one hand, on the other hand, the electric energy can be saved to the maximum degree, and the smooth proceeding of the test is ensured.

Description

Method and system for increasing number of test samples of high-temperature environment aging test
Technical Field
The invention relates to a method and a system, in particular to a method and a system for increasing the number of test samples of a high-temperature environment aging test, and belongs to the technical field of high-temperature environment aging tests.
Background
The High Temperature environment aging Life test is a method commonly used for evaluating the quality of semiconductor devices, such as HTRB (High Temperature Reverse Bias test), HTGB (High Temperature Gate Bias test), HTFB (High Temperature Forward Bias test), HTOL (High Temperature Operating Life), and the like. The principle of the aging life test in the high-temperature environment is that a semiconductor device is placed under the high-temperature environment condition and is applied with specific electric stress, and the aging process of the device is accelerated to quickly evaluate the life and reliability of the device. In making such tests, a high temperature environment test chamber is required to provide the constant high temperature conditions required for the test on the sample being tested. However, in actual testing, the tested sample has a relatively significant heating power. When the heating power of the tested sample exceeds a specific value, the high-temperature environment test chamber cannot maintain the temperature condition constant, and finally the test condition is seriously deviated and fails. In order to ensure that the test can be performed properly, the number of samples to be tested needs to be limited as necessary.
The working principle of the high-temperature environment test chamber is shown in figure 1. The test box is composed of a heat-insulating layer 1, a fan 4, a heater 7, an air door 8 and an air door baffle 9. The heat-insulating layer 1 is used for reducing the heat diffusion inside the environmental test chamber to the outside. The heater 7 is used for heating the temperature of the gas inside the high-temperature environment test chamber. The fan 4 is used for driving the air flow inside the environmental test chamber. The insulating layer 1 is provided with an opening, and the opening is provided with a rotatable air door baffle 9. The damper baffle 9 is used for adjusting the exchange rate of the gas inside the environmental test chamber and the external environment. The opening degree of the air door 8 can be controlled by controlling the opening angle alpha of the air door baffle 9, and the opening angle alpha can be adjusted within the range of 0-90 degrees in a manual mode.
When the high-temperature environment test box works in the constant-temperature mode, the opening angle alpha of the air door 8 is 0. At the moment, the gas in the high-temperature environment test box is isolated from the outside, and a convection passage is formed in the space in the high-temperature environment test box, so that the gas in the high-temperature environment test box can circularly flow under the driving of the fan. The arrows in fig. 1 with light and thick lines indicate the flowing direction of the gas inside the environmental test chamber. When the high-temperature environment test chamber works, a target temperature value T needs to be set. When the gas inside the high-temperature environment test chamber is lower than the target temperature value T, the heater 7 works, and the temperature of the gas inside the high-temperature environment test chamber rises. When the gas in the high-temperature environment test box is higher than the target temperature value T, the heater 7 stops working, the heat of the gas in the high-temperature environment test box is dissipated through the heat preservation layer 1, and the temperature of the gas in the high-temperature environment test box is reduced. In this manner, by controlling the heater 7 to operate intermittently, the temperature of the gas inside the high-temperature environmental test chamber can fluctuate around the target temperature value T, thereby achieving an approximate temperature condition constancy. When the high-temperature environment test chamber enters a constant-temperature mode, the heating power P of the heater 7H(T, T) and dissipation power P of heat-insulating layer 1 of high-temperature environment test chamberD(T) equal, i.e. PH(t,T)=PD(T). In general, the dissipation power of the insulating layer 1 of the high-temperature environment test chamber is very small. Therefore, the average power of the heater 7 is very low after the high temperature environment test chamber enters the constant temperature mode.
When the air door baffle 9 of the high-temperature environment test chamber is opened (the opening angle is 0 degrees and less than or equal to 90 degrees), a part of high-temperature gas in the high-temperature environment test chamber is discharged out of the environment test chamber, and meanwhile, some low-temperature gas from the external environment is sucked into the high-temperature environment test chamber. Therefore, the high-temperature environment test chamber can realize gas exchange between the inside and the outside through the damper 8. And the larger the opening angle of the damper baffle 9 is, the faster the exchange rate of the internal and external gas of the high-temperature environment test chamber is.
In general, the damper 8 of the high-temperature environmental test chamber has two main purposes; specifically, the method comprises the following steps: firstly, the air is ventilated to remove the unnecessary gas in the environment test. For example, the device under test 3 in the high-temperature environment test chamber volatilizes harmful gas and is ventilated through the damper 8. This function is hardly adopted in the high-temperature aging life test of the semiconductor device, on one hand, because no special gas is volatilized during the test and ventilation is not needed, and on the other hand, because the temperature deviates from the target value and affects the test if the opening degree of the damper 9 is improperly controlled during ventilation. (note: the high temperature environment test chamber is a general purpose test instrument, and its product is designed not only for semiconductor device testing).
And secondly, quickly reducing the temperature of the gas in the high-temperature environment test box. Because, when air door 8 closed completely, high temperature environmental test case inside gas temperature can only be through the heat dissipation cooling of high temperature environmental test case heat preservation 1. And the heat insulation effect of the heat insulation layer 1 of the high-temperature environment test box is better, which causes the temperature reduction of the high-temperature environment test box to be very slow. After opening air door 8, the inside high temperature gas of high temperature environment proof box can be discharged fast, and the low temperature gas of external environment is inhaled inside the high temperature environment proof box simultaneously to rapid cooling effect has been reached. For example, when the temperature of the gas inside the environmental test chamber is reduced from 150 ℃ to 40 ℃, it takes about two hours if the damper 8 is not opened, and it takes about 5 minutes if the damper 8 is opened to complete the temperature reduction. The function is used more in a high-temperature aging life test of a semiconductor device, and the main purpose is to reduce the test time.
In the semiconductor device environmental burn-in test, a large number of devices 3 to be tested are placed inside an environmental test chamber, and the temperature of the devices 3 to be tested is controlled to a temperature required for test conditions by the environmental test chamber. However, since environmental burn-in tests of a plurality of semiconductor devices require the simultaneous application of electrical conditions, the semiconductor devices are now subjected toHeat is also generated, and the total heating power of the device under test 3 inside the environmental test chamber is denoted as PT(T, T). In order to realize constant temperature in the test, the requirement that the total heating power is equal to the total heat dissipation power P is metD(T),PH(t,T)+PT(t,T)=PD(T). Due to PH(T, T) is not less than 0, so the total heating power P of the device under test 3 in the environmental test chamberT(t,T)≤PD(T). Defining the maximum heating power of the tested sample allowed by the test system as the maximum allowed heating power PT,max(t,T)。
From the above, the maximum allowable heating power P of the conventional test systemT,max(t,T)=PD(T). In order to satisfy this balance condition, the total heating power of the sample to be tested needs to be ensured to be less than or equal to P when the aging life test of the semiconductor device in high-temperature environment is carried outT,max(T, T). But in fact PD(T) is typically very small. For example, a commonly used 200L/200 ℃ high temperature environmental test chamber PD(T) is typically less than 100W. This makes the single test quantity small during the semiconductor device environmental aging test, and severely limits the test efficiency. The environmental burn-in test time is typically several hundred hours long, and as the device under test 3 degrades, the heating power may increase by several orders of magnitude (e.g., from a few mW to a few W). Before the test, the heating power of the tested device 3 needs to be estimated according to the worst result, and the P of the high-temperature environment test chamber is usedT,max(T, T) the number of allowed devices under test 3 is calculated. For example, if P of the high temperature environmental test chamberD(T) is 100W, the typical heating power of each sample to be tested is 10mW, but the maximum possible heating power is 10W. The number of test samples is preferably limited to 10 during the test. If the number of test samples is greater than 10, there is a risk that the test process will be aborted due to temperature runaway.
In conclusion, when the conventional high-temperature environment test box is used for the high-temperature environment aging life test, the number of test samples cannot be too large, and the test efficiency is limited.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a method and a system for increasing the number of test samples in an aging test in a high-temperature environment.
According to the technical scheme provided by the invention, the method for increasing the number of the test samples of the high-temperature environment aging test comprises an environment test box which can provide a required environment for the environment aging test of a tested device; the air door baffle plate control mechanism is electrically connected with the system controller, and the temperature tolerance sigma, the change step length delta beta of the opening angle alpha of the air door baffle plate and the temperature control feedback period T are configured in the system controllerwaitAnd period of thermal equilibrium perturbation Tcheck(ii) a The method comprises the following steps:
step S1, determining the target constant temperature T in the environmental test chamber according to the test requirementaim
Step S2, placing the required number of tested devices in the environmental test chamber and making the temperature in the environmental test chamber reach the target constant temperature Taim
Step S3, checking the current opening angle alpha of the damper, if the current opening angle alpha is 0 degrees, jumping to step S4, otherwise, jumping to step S5;
step S4, passing through temperature control feedback period TwaitThen, judging whether the constant temperature state of the environment test box needs to be ended, if so, jumping to the step S9, otherwise, jumping to the step S3;
step S5, monitoring the current temperature T of the environmental test chamberrealAnd obtaining the current temperature TrealConstant temperature T with the targetaimIf delta T is less than or equal to-sigma, jumping to step S6, if-sigma is less than or equal to delta T and less than or equal to sigma, jumping to step S7, and if delta T is greater than sigma, jumping to step S8;
step S6, keeping constant temperature time T of environment test boxsteadyTime-keeping zero setting ofAnd after the current opening angle alpha of the air door baffle is reduced by delta beta through the air door baffle control mechanism, the step goes to step S4;
step S7, updating the constant temperature time T of the environmental test chambersteadyTiming if the constant temperature time TsteadyGreater than the thermal equilibrium disturbance period TcheckIf so, jumping to the step S6, otherwise, jumping to the step S4;
step S8, checking the opening angle alpha, and if the current opening angle alpha is smaller than 90 degrees, keeping the constant temperature time T of the environmental test chambersteadyThe timing of (2) is set to zero, and after the current opening angle alpha of the air door baffle is increased by delta beta through the air door baffle control mechanism, the step goes to step S4; if the current opening angle alpha is larger than 90 degrees, outputting alarm information which cannot be kept at constant temperature, and jumping to the step S9;
and step S9, closing the environmental test chamber and stopping the constant temperature state control of the environmental test chamber.
The air door baffle control mechanism comprises a driving motor used for driving the air door baffle to move, a heat insulation layer is arranged on the outer wall of the environment test box, and an air channel baffle, a fan and a heater are arranged in the environment test box.
A system for increasing the number of test samples in a high-temperature environment aging test comprises an environment test box which can provide a required environment for the environment aging test of a tested device; the air door baffle plate control mechanism capable of controlling the opening state of the air door baffle plate of the environmental test chamber and the system controller electrically connected with the air door baffle plate control mechanism are further included, and the system controller can acquire the current temperature T in the environmental test chamberreal(ii) a The temperature tolerance sigma, the variation step length delta beta of the opening angle alpha of the damper baffle and the temperature control feedback period T are configured in a system controllerwaitAnd period of thermal equilibrium perturbation Tcheck(ii) a During test, the system controller sets the target constant temperature T according to the test requirementaim
The system controller is used for controlling the system controller according to the current temperature T of the environmental test chamberrealWith a target temperature TaimThe difference value delta T between the current opening angle alpha of the air door baffle plate and the current opening angle alpha of the air door baffle plate are controlled by the air door baffle plate control mechanism to ensure that the opening state of the air door baffle plate is controlled to ensure thatObtaining the current temperature T in the environmental test chamberrealAt TaimAnd within the range of +/-sigma, realizing the constant temperature control of the environmental test chamber.
The air door baffle control mechanism comprises a driving motor used for driving the air door baffle to move, a heat insulation layer is arranged on the outer wall of the environment test box, and an air channel baffle, a fan and a heater are arranged in the environment test box.
The invention has the advantages that: the target constant temperature T is set in advance according to the test requirementaimDuring the test, according to the current opening angle alpha of the air door baffle and the current temperature T in the environmental test chamberrealThe opening angle alpha of the air door baffle is adjusted through the air door baffle control mechanism, so that the constant temperature in the environmental test chamber can be effectively realized, the opening degree of the air door can be accurately and quickly adjusted, the number of allowable test samples is greatly increased, the electric energy can be saved to the maximum extent, and the smooth proceeding of the test is ensured.
Drawings
Fig. 1 is a schematic view of a conventional environmental test chamber.
FIG. 2 is a schematic view of an environmental test chamber according to the present invention.
Fig. 3 is a flow chart of the present invention for controlling the constant temperature of the environmental test chamber.
Description of reference numerals: 1-a heat insulation layer, 2-an effective constant temperature area, 3-a tested device, 4-a fan, 5-an air flow direction, 6-an air duct baffle, 7-a heater, 8-an air door, 9-an air door baffle and 10-a driving motor.
Detailed Description
The invention is further illustrated by the following specific figures and examples.
As shown in fig. 2 and 3: in order to accurately and quickly adjust the opening degree of the air door, greatly increase the number of allowable test samples, save electric energy to the maximum extent and ensure the smooth running of the test, the invention comprises an environmental test box which can provide a required environment for the environmental aging test of a tested device 3; the air door baffle control mechanism is electrically connected with the system controller, and a temperature container is arranged in the system controllerDifference sigma, change step length delta beta of opening angle alpha of air door baffle 9 and temperature control feedback period TwaitAnd period of thermal equilibrium perturbation Tcheck(ii) a The method comprises the following steps:
step S1, determining the target constant temperature T in the environmental test chamber according to the test requirementaim
Specifically, the target constant temperature TaimThe temperature tolerance σ of (a) needs to be slightly larger than the temperature control tolerance of the environmental test chamber, and generally, the temperature tolerance σ can be 1 ℃. The range of the opening angle alpha of the air door baffle 9 is 0-90 degrees, the unit of the step length delta beta is degree, the specific numerical value can be selected according to the requirement, and the detailed description is omitted here.
Target constant temperature TaimDetermined by the characteristic parameters of the device under test 3. Usually, a product manual (datasheet) for power semiconductor devices such as IGBTs has a parameter called Tvj,maxThe meaning of the parameter is the maximum junction temperature allowed by the IGBT product, and is used to instruct downstream application designers to ensure that the junction temperature of the IGBT device cannot exceed the maximum junction temperature. T isvj,maxThe manufacturer of the IGBT device determines through design and passes test verification. For example, an IGBT device is designed with a desired Tvjmax150 ℃, the design needs to be considered comprehensively to ensure TvjmaxUp to 150 c. After the samples are trial-manufactured, the samples are put in an environment of 150 ℃ for reliability test, and if the samples pass the test, the product T can be statedvjmax150 deg.c. Therefore, the target constant temperature T of the testaimIs generally equal to T of the device under testvjmax
Step S2, placing a required number of devices under test 3 in an environmental test chamber and making the temperature in the environmental test chamber reach a target constant temperature Taim
Specifically, the environment test chamber is internally provided with an air duct baffle 6, an effective constant temperature area 2 is formed above the air duct baffle 6, the tested device 3 is arranged in the effective constant temperature area 2, and the air flowing direction 5 is shown in the figure. After the heater 7 is turned on, the inside of the environmental test chamber can be heated to provide a high temperature environment required for the high temperature environment aging test of the device 3 to be tested. Is arranged atThe devices under test 3 in the environmental test chamber all have the same Tvj,maxSo that the target constant temperature T is constantaimIs adapted to all the devices under test 3 placed in the environmental test chamber.
Step S3, checking the current opening angle alpha of the damper 9, if the current opening angle alpha is 0 degrees, jumping to step S4, otherwise, jumping to step S5;
specifically, if the current opening angle α is 0 °, the damper 8 of the environmental test chamber is in a closed state, and the environmental test chamber is thermostated by using its own constant temperature mode. If the current opening angle alpha is not 0 degrees, the air door 8 of the environmental test chamber is in an open state, and at the moment, the environmental test chamber cannot be thermostated by means of the existing constant temperature mode. In order to ensure the constant temperature state of the environmental test chamber, the opening angle α of the damper baffle 9 of the environmental test chamber needs to be adjusted and controlled.
Step S4, passing through temperature control feedback period TwaitThen, judging whether the constant temperature state of the environment test box needs to be ended, if so, jumping to the step S9, otherwise, jumping to the step S3;
specifically, the temperature control feedback period TwaitThe size of the lens can be selected and determined according to actual needs, and is specifically known to those skilled in the art, and is not described herein again.
Step S5, monitoring the current temperature T of the environmental test chamberrealAnd obtaining the current temperature TrealConstant temperature T with the targetaimIf delta T is less than or equal to-sigma, jumping to step S6, if-sigma is less than or equal to delta T and less than or equal to sigma, jumping to step S7, and if delta T is greater than sigma, jumping to step S8;
in particular, the current temperature T may be acquired by means of an additionally installed temperature sensor or by means of communication with an environmental test chamberreal,ΔT=Treal-Taim. The opening angle α of the damper flap 9 is specifically adjusted and controlled in accordance with the difference Δ T as described below.
Step S6, keeping constant temperature time T of environment test boxsteadyIs set to zero and is passedAfter the air door baffle control mechanism reduces the current opening angle alpha of the air door baffle 9 by delta beta, the step goes to step S4;
specifically, after the current opening angle α of the damper baffle 9 is reduced by Δ β, the heat dissipation power through the damper is reduced, the power consumption of the environmental test chamber is reduced, and the electric energy is saved.
Step S7, updating the constant temperature time T of the environmental test chambersteadyTiming if the constant temperature time TsteadyGreater than the thermal equilibrium disturbance period TcheckIf so, jumping to the step S6, otherwise, jumping to the step S4;
in particular, when the current temperature T in the environmental test chamberrealConstant temperature T with the targetaimIs within the temperature tolerance sigma, the constant temperature time T is measuredsteadyTiming; in specific implementation, the thermal balance disturbance period T is setcheckAnd keeping the constant temperature time TsteadyAnd thermal equilibrium disturbance period TcheckComparing, if the constant temperature time TsteadyGreater than the thermal equilibrium disturbance period TcheckWhen the temperature of the environment test chamber is not constant, the current constant temperature of the environment test chamber is required to be adjusted, otherwise, the current constant temperature state can be kept.
Step S8, checking the opening angle alpha, and if the current opening angle alpha is smaller than 90 degrees, keeping the constant temperature time T of the environmental test chambersteadyThe timing of the damper is set to zero, and after the current opening angle alpha of the damper 9 is increased by delta beta through the damper control mechanism, the process goes to step S4; if the current opening angle alpha is larger than 90 degrees, outputting alarm information which cannot be kept at constant temperature, and jumping to the step S9;
specifically, after the current opening angle α of the damper baffle 9 is increased by Δ β, the heat dissipation power through the damper is increased to accelerate the environmental test chamber to reach a constant temperature state. Because the range of the opening angle alpha is 0-90 degrees, if the current opening angle alpha is not less than 90 degrees, the constant temperature cannot be realized because the heating power in the environment test box is too large, namely the alarm information which cannot be constant temperature is output.
And step S9, closing the environmental test chamber and stopping the constant temperature state control of the environmental test chamber.
The air door baffle control mechanism comprises a driving motor 10 used for driving an air door baffle 9 to move, a heat preservation layer 1 is arranged on the outer wall of the environment test box, and an air channel baffle 6, a fan 4 and a heater 7 are arranged in the environment test box.
Specifically, after the environmental test chamber is closed, the high-temperature aging environmental test of the device under test 3 in the environmental test chamber is stopped. During the test, according to the current opening angle alpha of the air door baffle 9 and the current temperature T in the environmental test chamberrealThe opening angle alpha of the air door baffle plate 9 is adjusted through the air door baffle plate control mechanism, so that the constant temperature in the environment test box can be effectively realized, the opening degree of the air door can be accurately and quickly adjusted, the number of allowable test samples is greatly increased, the electric energy can be saved to the maximum extent, and the smooth proceeding of the test is ensured.
In conclusion, the system for increasing the number of the test samples of the high-temperature environment aging test comprises an environment test box which can provide the required environment for the environment aging test of the device to be tested 3; the air door baffle control device is characterized by further comprising an air door baffle control mechanism capable of controlling the opening state of an air door baffle 9 of the environmental test chamber, and a system controller electrically connected with the air door baffle control mechanism and capable of acquiring the current temperature T in the environmental test chamberreal(ii) a The specific mode can be directly obtained through an additionally installed temperature sensor, and can also be obtained through a mode of communicating with an environmental test chamber; the temperature tolerance sigma, the variation step length delta beta of the opening angle alpha of the air door baffle 9 and the temperature control feedback period T are configured in a system controllerwaitAnd period of thermal equilibrium perturbation Tcheck(ii) a During the test, the system controller sets the target constant temperature T according to the test requirementaim
The system controller is used for controlling the system controller according to the current temperature T of the environmental test chamberrealWith a target temperature TaimThe difference value delta T between the current temperature T and the current opening angle alpha of the air door baffle plate 9 controls the opening state of the air door baffle plate 9 through the air door baffle plate control mechanism so as to ensure that the current temperature T in the environmental test chamberrealAt TaimAnd within the range of +/-sigma, realizing the constant temperature control of the environmental test chamber.
In the embodiment of the invention, the air door baffle control mechanism comprises a driving motor 10 for driving an air door baffle 9 to move, a heat insulation layer 1 is arranged on the outer wall of the environment test box, and an air channel baffle 6, a fan 4 and a heater 7 are arranged in the environment test box. Of course, a connecting piece is required between the driving motor 10 and the air door baffle 9, the connecting piece can adopt a screw rod and other forms, and the connecting piece can be selected according to the requirement as long as the driving motor 10 can drive the air door baffle 9 to move and the size of the opening angle alpha can be adjusted.
The system controller can be an existing common microprocessor such as a single chip microcomputer, and can be specifically selected according to needs, and the details are not repeated here. The temperature sensor in the box can adopt the existing common form, and can detect the temperature in the environmental test box.
The invention increases the heat dissipation rate of the environmental test chamber by opening the air door. When the opening angle alpha of the air door is larger than 0 degree, the air door 8 can exhaust a part of high-temperature gas and simultaneously suck a part of low-temperature gas into the environment test box, the total heat of the gas in the high-temperature environment test box is dissipated in the process, and the heat dissipation power in the mode is recorded as PC(T, T). When the air door 8 is in an open state, the conditions when the temperature of the gas in the high-temperature environment test box can reach the constant are as follows: pT(t,T)+PH(t)=PD(T)+PC(α, T). In this case, the maximum allowable heat generation power of the device under test 3 inside the test chamber is PD(T)+PC(α, T) (in this case PH(t)=0)。PC(α, T) is much greater than PD(T), typically in the order of several kW, the number of test samples can be greatly increased. In addition, to ensure that the test system is as energy efficient as possible, P needs to be ensuredHTime (t) is at a minimum to maintain thermal equilibrium in the test system.

Claims (4)

1. A method for increasing the number of test samples of a high-temperature environment aging test comprises an environment test box which can provide a required environment for the environment aging test of a device (3) to be tested; the device is characterized by further comprising an air door baffle control mechanism capable of controlling the opening state of an air door baffle (9) of the environmental test chamber, and the air door baffle control mechanism and the systemThe system controller is electrically connected with the temperature tolerance sigma, the change step size beta of the opening angle alpha of the damper baffle (9) and the temperature control feedback period TwaitAnd period of thermal equilibrium perturbation Tcheck(ii) a The method comprises the following steps:
step S1, determining the target constant temperature T in the environmental test chamber according to the test requirementaim
Step S2, placing the required number of tested devices (3) in the environmental test chamber and making the temperature in the environmental test chamber reach the target constant temperature Taim
Step S3, checking the current opening angle alpha of the damper (9), if the current opening angle alpha is 0 degrees, jumping to step S4, otherwise, jumping to step S5;
step S4, passing through temperature control feedback period TwaitThen, judging whether the constant temperature state of the environment test box needs to be ended, if so, jumping to the step S9, otherwise, jumping to the step S3;
step S5, monitoring the current temperature T of the environmental test chamberrealAnd obtaining the current temperature TrealConstant temperature T with the targetaimIf delta T is less than or equal to-sigma, jumping to step S6, if-sigma is less than or equal to delta T and less than or equal to sigma, jumping to step S7, and if delta T is greater than sigma, jumping to step S8;
step S6, keeping constant temperature time T of environment test boxsteadyThe timing is set to zero, and after the current opening angle alpha of the air door baffle (9) is reduced to Δ β by the air door baffle control mechanism, the step S4 is skipped;
step S7, updating the constant temperature time T of the environmental test chambersteadyTiming if the constant temperature time TsteadyGreater than the thermal equilibrium disturbance period TcheckIf so, jumping to the step S6, otherwise, jumping to the step S4;
step S8, checking the opening angle alpha, and if the current opening angle alpha is smaller than 90 degrees, keeping the constant temperature time T of the environmental test chambersteadyThe timing is set to zero, and the throttle baffle (9) jumps to step after the current opening angle alpha is increased by a throttle baffle control mechanismA step S4; if the current opening angle alpha is larger than 90 degrees, outputting alarm information which cannot be kept at constant temperature, and jumping to the step S9;
and step S9, closing the environmental test chamber and stopping the constant temperature state control of the environmental test chamber.
2. The method for increasing the number of the test samples for the high temperature environment aging test according to claim 1, wherein: the air door baffle control mechanism comprises a driving motor (10) used for driving an air door baffle (9) to move, a heat preservation layer (1) is arranged on the outer wall of the environment test box, and an air channel baffle (6), a fan (4) and a heater (7) are arranged in the environment test box.
3. A system for increasing the number of test samples in a high-temperature environment aging test comprises an environment test box which can provide a required environment for an environment aging test of a device (3) to be tested; the air door baffle control device is characterized by further comprising an air door baffle control mechanism capable of controlling the opening state of an air door baffle (9) of the environmental test chamber and a system controller electrically connected with the air door baffle control mechanism, wherein the system controller can acquire the current temperature T in the environmental test chamberreal(ii) a A temperature tolerance sigma, a change step size beta of an opening angle alpha of the damper baffle (9) and a temperature control feedback period T are configured in the system controllerwaitAnd period of thermal equilibrium perturbation Tcheck(ii) a During test, the system controller sets the target constant temperature T according to the test requirementaim
The system controller is used for controlling the system controller according to the current temperature T of the environmental test chamberrealWith a target temperature TaimThe difference value delta T between the current temperature T and the current opening angle alpha of the air door baffle plate (9) controls the opening state of the air door baffle plate (9) through the air door baffle plate control mechanism so as to ensure that the current temperature T in the environmental test chamberrealAt TaimWithin the range of +/-sigma, realizing the constant temperature control of the environmental test chamber;
the control method comprises the following steps:
step S1, determining the target constant temperature T in the environmental test chamber according to the test requirementaim
Step S2, placing the required number of tested devices (3) in the environmental test chamber and making the temperature in the environmental test chamber reach the target constant temperature Taim
Step S3, checking the current opening angle alpha of the damper (9), if the current opening angle alpha is 0 degrees, jumping to step S4, otherwise, jumping to step S5;
step S4, passing through temperature control feedback period TwaitThen, judging whether the constant temperature state of the environment test box needs to be ended, if so, jumping to the step S9, otherwise, jumping to the step S3;
step S5, monitoring the current temperature T of the environmental test chamberrealAnd obtaining the current temperature TrealConstant temperature T with the targetaimIf delta T is less than or equal to-sigma, jumping to step S6, if-sigma is less than or equal to delta T and less than or equal to sigma, jumping to step S7, and if delta T is greater than sigma, jumping to step S8;
step S6, keeping constant temperature time T of environment test boxsteadyThe timing is set to zero, and after the current opening angle alpha of the air door baffle (9) is reduced to Δ β by the air door baffle control mechanism, the step S4 is skipped;
step S7, updating the constant temperature time T of the environmental test chambersteadyTiming if the constant temperature time TsteadyGreater than the thermal equilibrium disturbance period TcheckIf so, jumping to the step S6, otherwise, jumping to the step S4;
step S8, checking the opening angle alpha, and if the current opening angle alpha is smaller than 90 degrees, keeping the constant temperature time T of the environmental test chambersteadyThe timing is set to zero, and after the current opening angle alpha of the air door baffle (9) is increased by the Δ β through the air door baffle control mechanism, the step S4 is skipped; if the current opening angle alpha is larger than 90 degrees, outputting alarm information which cannot be kept at constant temperature, and jumping to the step S9;
and step S9, closing the environmental test chamber and stopping the constant temperature state control of the environmental test chamber.
4. The system for increasing the number of the test samples for the high temperature environment aging test according to claim 3, wherein: the air door baffle control mechanism comprises a driving motor (10) used for driving an air door baffle (9) to move, a heat preservation layer (1) is arranged on the outer wall of the environment test box, and an air channel baffle (6), a fan (4) and a heater (7) are arranged in the environment test box.
CN201811603170.3A 2018-12-26 2018-12-26 Method and system for increasing number of test samples of high-temperature environment aging test Active CN109613413B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811603170.3A CN109613413B (en) 2018-12-26 2018-12-26 Method and system for increasing number of test samples of high-temperature environment aging test

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811603170.3A CN109613413B (en) 2018-12-26 2018-12-26 Method and system for increasing number of test samples of high-temperature environment aging test

Publications (2)

Publication Number Publication Date
CN109613413A CN109613413A (en) 2019-04-12
CN109613413B true CN109613413B (en) 2021-05-14

Family

ID=66011611

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811603170.3A Active CN109613413B (en) 2018-12-26 2018-12-26 Method and system for increasing number of test samples of high-temperature environment aging test

Country Status (1)

Country Link
CN (1) CN109613413B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110763495B (en) * 2019-10-12 2021-04-30 中国北方车辆研究所 Performance judgment method for water pump driving motor of test system
CN115309211B (en) * 2022-10-10 2023-01-17 杭州三海电子有限公司 Heating power determination method for aging temperature control and temperature control method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1598536A (en) * 2003-09-18 2005-03-23 阿特莱斯材料检测技术有限公司 Contactless measurement methode and device of the surface temperature of aging sample
CN103394378A (en) * 2013-07-09 2013-11-20 广州国技试验仪器有限公司 Test box with independent heating channel and refrigeration channel
CN104062991A (en) * 2014-06-13 2014-09-24 南京南瑞继保电气有限公司 Temperature hysteresis control method used for high-temperature aging test
CN106769072A (en) * 2015-11-23 2017-05-31 广州汽车集团股份有限公司 The ageing test apparatus and aging testing method of three-way catalyst
CN108872052A (en) * 2018-07-27 2018-11-23 宁国市中英橡胶有限公司 A kind of high/low temperature ageing oven with spray equipment

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2073899A1 (en) * 1991-07-19 1993-01-20 Tatsuya Hashinaga Burn-in apparatus and method
JPH05256924A (en) * 1992-03-13 1993-10-08 Hitachi Ltd Method and apparatus for detecting deterioration of battery capacity
CN100573396C (en) * 2008-03-21 2009-12-23 北京创毅视讯科技有限公司 A kind of electronic equipment is carried out temperature controlled system and method
CN101644650B (en) * 2008-08-06 2011-03-23 中国农业机械化科学研究院 Device and method for testing thermal cycling performance of thermal barrel coating
CN101806814B (en) * 2010-02-26 2014-05-21 常州亿晶光电科技有限公司 Exposing frame for use in attenuation test of solar battery
CN102360047B (en) * 2011-08-31 2014-07-30 深圳市江波龙电子有限公司 High-temperature aging test instrument and constant-temperature control method thereof
WO2016063676A1 (en) * 2014-10-23 2016-04-28 株式会社村田製作所 Electronic component test device
CN105759193B (en) * 2016-04-27 2018-10-02 杭州华扬电子有限公司 A kind of thermal ageing test device and its application method
KR102670373B1 (en) * 2016-10-12 2024-05-28 삼성전자주식회사 Apparatus for testing semiconductor device and system comprising the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1598536A (en) * 2003-09-18 2005-03-23 阿特莱斯材料检测技术有限公司 Contactless measurement methode and device of the surface temperature of aging sample
CN103394378A (en) * 2013-07-09 2013-11-20 广州国技试验仪器有限公司 Test box with independent heating channel and refrigeration channel
CN104062991A (en) * 2014-06-13 2014-09-24 南京南瑞继保电气有限公司 Temperature hysteresis control method used for high-temperature aging test
CN106769072A (en) * 2015-11-23 2017-05-31 广州汽车集团股份有限公司 The ageing test apparatus and aging testing method of three-way catalyst
CN108872052A (en) * 2018-07-27 2018-11-23 宁国市中英橡胶有限公司 A kind of high/low temperature ageing oven with spray equipment

Also Published As

Publication number Publication date
CN109613413A (en) 2019-04-12

Similar Documents

Publication Publication Date Title
KR101875620B1 (en) Engine cooling system and electronic thermostat control system and method thereof
CN109613413B (en) Method and system for increasing number of test samples of high-temperature environment aging test
JP5279763B2 (en) ENVIRONMENTAL TEST DEVICE AND METHOD FOR CONTROLLING ENVIRONMENTAL TEST DEVICE
CN104503508B (en) A kind of solar cell testboard temperature control system and temp. control method
CN112880030B (en) Fresh air control method and device and air conditioner
CN103092229A (en) Temperature stabilizing and controlling system of laser
CN105974230A (en) LM-80 aging test system based on semiconductor refrigeration device and control method of system
US12007134B2 (en) Avoiding coil freeze in HVAC systems
US10788239B2 (en) Generator set louver system
CN109613414B (en) Method and system capable of controlling temperature change process of aging life test box in high-temperature environment
CN113522376B (en) High-low temperature test box and control method thereof
JP2017156120A (en) Environmental test device and air conditioning device
KR950034617A (en) Manufacturing apparatus and manufacturing method of semiconductor device
JPH1012287A (en) The lowest temperature detecting device of secondary battery
US20140137816A1 (en) Engine system having thermostat
JP6391616B2 (en) Environmental test equipment and air conditioner
KR101123026B1 (en) Environment test device
JP2004273967A (en) Chamber temperature control system
JP5329481B2 (en) Thermostatic device
JPH09178598A (en) Temperature control method in temperature characteristics test for pressure sensor
JP6735700B2 (en) Environmental test equipment
CN103068206A (en) Flow guide heat sink and flow guide heat dissipating method
KR100410518B1 (en) a thermostat diagnosis method of engine for vehicles
CN116578136A (en) Environmental test box temperature control method for high-temperature aging test
CN213244716U (en) Temperature control device and closed equipment

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant