CN109609953A - A kind of ultralimit copper alloy and preparation method thereof - Google Patents
A kind of ultralimit copper alloy and preparation method thereof Download PDFInfo
- Publication number
- CN109609953A CN109609953A CN201811645724.6A CN201811645724A CN109609953A CN 109609953 A CN109609953 A CN 109609953A CN 201811645724 A CN201811645724 A CN 201811645724A CN 109609953 A CN109609953 A CN 109609953A
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- CN
- China
- Prior art keywords
- layer
- copper alloy
- ultralimit
- thickness
- ceramics
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Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 147
- 238000002360 preparation method Methods 0.000 title claims abstract description 31
- 239000010410 layer Substances 0.000 claims abstract description 171
- 239000011159 matrix material Substances 0.000 claims abstract description 65
- 239000000919 ceramic Substances 0.000 claims abstract description 58
- 238000000576 coating method Methods 0.000 claims abstract description 53
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- 239000000843 powder Substances 0.000 claims description 26
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- 229910045601 alloy Inorganic materials 0.000 claims description 10
- 229910052580 B4C Inorganic materials 0.000 claims description 7
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 6
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- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910000510 noble metal Inorganic materials 0.000 claims description 4
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- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- 229910001182 Mo alloy Inorganic materials 0.000 claims description 3
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- 229910052763 palladium Inorganic materials 0.000 claims description 3
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- 229910052697 platinum Inorganic materials 0.000 claims description 3
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 10
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- 238000002156 mixing Methods 0.000 description 4
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- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 4
- 239000004576 sand Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 4
- 229910052692 Dysprosium Inorganic materials 0.000 description 3
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- 239000002344 surface layer Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
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- 230000003026 anti-oxygenic effect Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
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- 230000005540 biological transmission Effects 0.000 description 1
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- 229910052796 boron Inorganic materials 0.000 description 1
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- 238000009690 centrifugal atomisation Methods 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
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- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
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- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
- C23C28/3455—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer with a refractory ceramic layer, e.g. refractory metal oxide, ZrO2, rare earth oxides or a thermal barrier system comprising at least one refractory oxide layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
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- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
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- B05D7/50—Multilayers
- B05D7/56—Three layers or more
- B05D7/58—No clear coat specified
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C14/08—Oxides
- C23C14/083—Oxides of refractory metals or yttrium
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/321—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
- C23C28/3215—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer at least one MCrAlX layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/06—Metallic material
- C23C4/073—Metallic material containing MCrAl or MCrAlY alloys, where M is nickel, cobalt or iron, with or without non-metal elements
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/10—Oxides, borides, carbides, nitrides or silicides; Mixtures thereof
- C23C4/11—Oxides
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- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
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Abstract
The invention belongs to Cu alloy material preparation technical fields, disclose a kind of ultralimit copper alloy and preparation method thereof, including copper alloy matrix, copper alloy matrix surface has been sequentially depositing composite tie layer, composite ceramic layer, reflecting layer, catadioptric layer, insulating layer and foam carbon-coating;Composite tie layer includes the adhesive layer for being deposited on copper alloy matrix surface and the layer of precious metal for being deposited on tie layer surface;Composite ceramic layer includes B layers of A layers of ceramics and ceramics.It by that can be promoted to using temperature higher than 100-500 DEG C of fusing point of native copper alloy substrate, to realize use of the copper alloy under ultralimit environment in copper alloy matrix surface depositing multilayer coatings by the present invention.Ultralimit copper alloy provided by the invention has splendid high-temperature mechanics and chemical stability, can use under conditions of being more than its copper alloy matrix fusing point, increase use scope.
Description
Technical field
The invention belongs to Cu alloy material preparation technical field, and in particular to a kind of ultralimit copper alloy and its preparation side
Method.
Background technique
Copper alloy refers to using copper as matrix as a kind of current important metal material, the alloy of other elements composition is added.
Copper has good mechanics, physical and chemical properties, and the inoxidizability, resistance to for the copper alloy that appropriate elements are formed is added in copper
Corrosion, elevated temperature strength are strong, and can improve certain physical properties, therefore copper alloy is widely used in energy development, chemical industry, electricity
Son, navigation, aerospace field.Copper alloy is due to its intensity, hardness, shock resistance, corrosion resistance, inoxidizability, elevated temperature strength
It is stronger with the comprehensive performances such as certain physical properties, irreplaceable role has been played in aerospace field.Such as: rocket motor
The combustion chamber of machine and the liner of thrust chamber can use the superior thermal conductivity of copper to be cooled down, to guarantee the temperature of engine
In allowed limits.The combustion liner of No. 5 rockets in Anna processes 360 in this liner using Kufil in Asia
A cooling duct, when rocket launching, are passed through liquified hydrogen and are cooled down.
It is also higher and higher to the rate request of aircraft with the development of technology with the actual demand of society, aircraft
Speed-raising means that the running speed of engine is gradually increased, and the surface temperature of engine blade is just caused to be gradually increased, although
Copper alloy possesses numerous excellent performances, but since its fusing point is at 1080 DEG C or so, and the characteristic easily aoxidized at high temperature
Greatly limit the use of copper alloy under the high temperature conditions.In addition metal be more than its fusing point half at a temperature of work, will
There is a phenomenon where softening, i.e., when copper alloy works in the environment of 540 DEG C, it will soften, the phenomenon that reduced performance.And show
Current copper alloy is not able to satisfy the requirement after aircraft speed-raising, and (i.e. copper alloy cannot (be more than that copper closes in ultralimit temperature
Gold melting temperature) under use), in other words in order to realize aircraft speed-raising requirement, must just sacrifice the service life of aircraft.
Therefore develop in aircraft, the development of even entire copper alloy is rather limited, and the use of copper alloy is restricted, and is reached
To a bottleneck.
Summary of the invention
The invention is intended to provide a kind of ultralimit copper alloy and preparation method thereof, it is unable to satisfy with solving existing copper alloy
The problem of being used at a temperature of ultralimit.
To achieve the above object, the present invention provides following base case:
A kind of ultralimit copper alloy, including copper alloy matrix, the copper alloy matrix surface have been sequentially depositing compoiste adhering
Layer and composite ceramic layer;Composite tie layer includes being deposited on the adhesive layer on copper alloy matrix surface and being deposited on tie layer surface
Layer of precious metal;Composite ceramic layer includes B layers of A layers of ceramics and ceramics.
The technical program the utility model has the advantages that
Inventor has developed a kind of ultralimit copper alloy, it is (super in ultralimit temperature to meet copper alloy by largely studying
Cross its melting temperature) under use.In R&D process, it is generally believed that when environment temperature be higher than alloy use temperature it
Afterwards, it will think that the alloy cannot be carried out at such a temperature using and then other dystectic alloys being needed to carry out using and sending out
Bright people goes around, and trial improves copper alloy, to meet the needs of aircraft manufacture.It is continuously attempted in inventor
Copper alloy can be used temperature by depositing the coating centainly matched in copper alloy surface by very pleasantly surprised discovery in the process
It is increased to above 100-500 DEG C of former fusing point, the use temperature of copper alloy will be greatly improved, to meet the need of manufacture aircraft
It asks;And under high temperature environment, it is all very difficult that the use temperature of copper alloy, which is promoted 2-3 DEG C, thus applicant this
Research is the very big progress in the use of copper alloy.
The technical program can be greatly improved by depositing composite tie layer and composite ceramic layer on copper alloy matrix
The use temperature of copper alloy, to adapt to use of copper alloy under the conditions of ultralimit temperature.Composite tie layer is deposited, can be improved
Bond effect between each coating and copper alloy matrix, avoids coating from falling off in use.Composite ceramic layer is deposited, it can
The conduction for reducing heat, to improve the use temperature of copper alloy matrix.The technical program is by the cooperation of each coating, so that copper
The use temperature of alloy has obtained greatly being promoted.
In conclusion the present invention has following technical effect that
1, ultralimit copper alloy provided by the invention has splendid high-temperature mechanics and chemical stability, can be more than it
It is used under conditions of copper alloy matrix fusing point, increases use scope.
2, it by that can be promoted to using temperature and be higher than original in copper alloy matrix surface depositing multilayer coatings by the present invention
100-500 DEG C of copper alloy matrix fusing point, to realize use of the copper alloy under ultralimit environment.
3, ultralimit copper alloy provided by the invention has splendid corrosion resistance, thus under acid or alkaline conditions
Greatly increased using the time, thus can be reduced material corrosion and caused by waste, save the cost.
4, ultralimit copper alloy provided by the invention breaches the development bottleneck of traditional copper alloy, can have at it higher
On the basis of fusing point, it is further promoted using temperature, and the temperature promoted is a tremendous progress.The present invention is mentioned
The ultralimit copper alloy of confession can be applied in the preparation of the engine blade of aircraft, and be able to satisfy hair when aircraft raises speed
The raised use demand of motivation temperature, realizes the speed-raising of aircraft.
Further, the composite tie layer with a thickness of 100-200 μm, composite ceramic layer with a thickness of 150-500 μm, it is multiple
Close the insulation that the reflecting layer of 10-30 μ m-thick, the catadioptric layer, 10-200 μ m-thick of 10-30 μ m-thick are also sequentially depositing outside ceramic layer
The foam carbon-coating of layer and 20-200 μ m-thick.
The utility model has the advantages that reflecting layer has the effect of reflecting heat source, so that the heat source of copper alloy surface is reduced, so that improving makes
Use temperature.Catadioptric layer is deposited, refraction of the infrared ray in coating can be stopped, to reduce the temperature of copper alloy matrix, therefore
So that the use temperature of the copper alloy of preparation improves.The effect of depositing insulating layer is, due in superfast environment, material
Surface be easy to happen ionization, and insulating layer can completely cut off conductive ion that ionization generates or electronics enters copper alloy matrix
In, to resist erosion of the charge to copper alloy matrix.The carbon of foam carbon-coating vaporizes cooling when in use, and in copper alloy matrix
Surface forms vaporization film, Heat transmission is further prevented, to improve the use temperature of copper alloy.And pass through the thickness to each coating
The setting of degree enables to the use temperature of the ultralimit copper alloy of preparation to improve, and goes back simultaneously in the heat insulation for guaranteeing coating
Its weight is controlled, convenient for the use of aircraft.
Further, the bonding composition of layer is the mixing of one or more of MCrAlY, NiAl, NiCr-Al, Mo alloy
Object, MCrAlY NiCrCoAlY, NiCoCrAlY, CoNiCrAlY or CoCrAlY;The ingredient of layer of precious metal be Au, Pt, Ru,
One of Rh, Pd, Ir or a variety of alloys.
The utility model has the advantages that in tri- kinds of materials of NiCrCoAlY, NiCoCrAlY, CoNiCrAlY, according to chemical formula each element content
It successively reduces, and the proportion in three kinds of materials between each element is different, therefore material obtained is different.Adhesive layer has good
Bond effect reduces the probability that falls off of coating so that the bond effect of subsequent coating and copper alloy matrix is good;And noble metal sheet
Body has oxidation resistant characteristic, can effectively prevent, under high temperature, oxygen is spread into adhesive layer and copper alloy matrix, to improve
The antioxygenic property of coating improves the service life of coating.
Further, the ingredient of A layers of the ceramics is YSZ or rare earth zirconate (RE2Zr2O7), ceramic B layers of ingredient is
ZrO2-RETaO4。
The utility model has the advantages that YSZ or rare earth zirconate are the ingredient that ceramic layer is most-often used in current thermal barrier coating, preparation process
Maturation is conveniently bought;And ZrO2-RETaO4Have the effect of high expansion coefficient and lower thermal conductivity, wherein lower thermal conductivity can be reduced
External heat is transmitted in copper alloy matrix, so that copper alloy matrix is able to maintain lower temperature under hot environment;And
For high expansion coefficient, due to being used as a whole between coating, be not it is single in action, and high expansion
Coefficient is in order to match with the thermal expansion coefficient of adhesive layer, since the thermal expansion coefficient of noble metal adhesive layer is also larger, in this way
In Thermal Cycling (during i.e. constantly heating is cooling), the thermal mismatch stress (thermal expansion coefficient of ceramic layer and adhesive layer
The stress that difference generates) it is smaller, and then improve the service life of coating.(for popular, when two thermal expansion coefficient differences are larger
Coating when being deposited together, when heating or cooling, the degrees of expansion of two coatings is seriously different, will lead to two coatings
Between stress increase, the problem of cracking, or even fall off so as to cause between two coatings.)
Further, the ingredient in the reflecting layer is REVO4、RETaO4、Y2O3One or more of mixture.
The utility model has the advantages that the reflection coefficient of REVO4, RETaO4, Y2O3 are high, therefore good to the reflecting effect of heat radiation, greatly
Reduction hot environment under, the temperature of copper alloy matrix, to improve the use temperature of the copper alloy of preparation.
Further, the ingredient of the catadioptric layer is the mixture of one or both of graphene or boron carbide, and stone
The spatial distribution of black alkene and boron carbide is in disorderly arranged state.
The utility model has the advantages that since the spatial distribution of graphene or boron carbide is in disorderly arranged state, although graphene or carbon
Change boron refractive index with higher, when infrared light is when being irradiated on graphene catadioptric layer, disorderly arranged graphene can be with
Enhance the refraction of light in all directions, incident light is avoided to reflect in the same direction, achievees the effect that refraction dispersion, in this way
The intensity decline for entering the infrared light in coating, to reduce the temperature of coating and copper alloy matrix.
Further, the ingredient of the insulating layer is the mixed of one or more of epoxy resin, phenolic resin, ABS resin
Close object.
The utility model has the advantages that during high-speed flight, outer surface and the air of aircraft rub by taking aircraft as an example
It wipes, so that air generates ionization and forms conductive ion or electronics, and inventor uses epoxy resin, phenol by experimental verification
The organic coatings such as urea formaldehyde can effectively resist charge and enter in coating and copper alloy matrix, thus reduce conduction electrons or
The erosion of ion pair tin alloy weld seam.
The present invention also provides another technical solution, a kind of preparation method of ultralimit copper alloy, comprising the following steps:
Step 1: depositing adhesive layer on copper alloy matrix surface;In tie layer surface depositing noble metal layer, so that adhesive layer
Composite tie layer is formed with layer of precious metal, the overall thickness of the composite tie layer is 100-200 μm;
Step 2: in B layers of A layers of the compoiste adhering layer surface deposition ceramics and ceramics that step 1 obtains, so that A layers of ceramics and pottery
B layers of formation composite ceramic layer of porcelain, the overall thickness of composite ceramic layer are 150-500 μm;
Step 3: in the composite ceramics layer surface deposition of reflective layer that step 2 obtains, reflecting layer with a thickness of 10-30 μm;
Step 4: the reflection layer surface obtained in step 3 deposits catadioptric layer, catadioptric layer with a thickness of 10-30 μm;
Step 5: in the catadioptric layer surface depositing insulating layer that step 4 obtains, insulating layer with a thickness of 10-200 μm;
Step 6: the surface of insulating layer obtained in step 5 deposits foam carbon-coating, foam carbon-coating with a thickness of 20-200 μm, from
And form ultralimit copper alloy.
The technical program the utility model has the advantages that
It is controlled by the thickness to each coating being deposited on copper alloy matrix, has both been able to achieve the ultralimit copper of preparation
Alloy is increased to above 100-500 DEG C of native copper alloy melting point using temperature, and has splendid corrosion resistance.Simultaneously also
The weight that can be avoided the larger caused ultralimit copper alloy prepared of coating layer thickness, which increases larger situation, to be occurred, so that
Ultralimit copper alloy is able to satisfy the use of aircraft.
Further, in the step 2, forming B layers of ceramics is ZrO2-RETaO4For powder, the ZrO2-RETaO4Powder
The partial size of body is 10~70 μm, and pattern is spherical in shape.
The utility model has the advantages that using partial size for 10~70 μm, and the ZrO that pattern is spherical in shape2-RETaO4The coating of powder preparation, by
Spherical in shape in powder, the surface of such powder is smooth, so that the mobility of powder is preferable, has obtained the ceramic coating of high quality.
Further, in the step 1, before depositing adhesive layer, copper alloy matrix surface is pre-processed, it is described pre-
Processing is including degreasing and removes impurity;After the copper alloy matrix surface preparation, shot-peening is carried out to the surface of copper alloy matrix
Processing, so that the surface roughness of copper alloy matrix is 60-100 μm.
The utility model has the advantages that carrying out degreasing to copper alloy matrix surface before depositing adhesive layer and removing impurity treatment, can keep away
Exempt from greasy dirt and impurity enters in coating, to influence the quality of coating, and then avoids what coating occurred that cracking even falls off from asking
Topic.By carrying out bead to copper alloy matrix surface, the roughness on copper alloy matrix surface can be improved, to improve copper conjunction
The adhesive strength of golden matrix surface and adhesive layer reduces the probability that adhesive layer is fallen off.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of ultralimit copper alloy of the present invention;
Fig. 2 is the embodiment of the present invention 1 and creep experiments under high temperature of the comparative example 13 under 50MPa stress, at a temperature of 1300 DEG C
Curve graph;
Fig. 3 is the salt air corrosion experimental curve diagram of the embodiment of the present invention 1 and comparative example 13.
Specific embodiment
It is further described below by specific embodiment:
Appended drawing reference in Figure of description includes: copper alloy matrix 1, adhesive layer 2, layer of precious metal 3, ceramics A layer 4, pottery
Porcelain B layer 5, reflecting layer 6, catadioptric layer 7, insulating layer 8, foam carbon-coating 9.
The present invention provides a kind of ultralimit copper alloys, as shown in Figure 1, including copper alloy matrix 1,1 table of copper alloy matrix
Face is sequentially depositing the composite tie layer with a thickness of 100-200 μm, the composite ceramic layer with a thickness of 150-500 μm, with a thickness of 10-
30 μm of reflecting layer 6, the catadioptric layer 7 with a thickness of 10-30 μm, the insulating layer 8 with a thickness of 10-200 μm and with a thickness of 20-200 μ
The foam carbon-coating 9 of m.Wherein composite tie layer is to be deposited on the adhesive layer 2 on 1 surface of copper alloy matrix and be deposited on 2 table of adhesive layer
The layer of precious metal 3 in face, the ingredient of adhesive layer 2 are the mixing of one or more of MCrAlY, NiAl, NiCr-Al, Mo alloy
Object, MCrAlY NiCrCoAlY, NiCoCrAlY, CoNiCrAlY or CoCrAlY;The ingredient of layer of precious metal 3 be Au, Pt, Ru,
One of Rh, Pd, Ir or a variety of alloys;Composite ceramic layer includes being deposited on ceramic A layer 4 and ceramics B layer 5, ceramic A layer 4
Ingredient be YSZ or rare earth zirconate (RE2Zr2O7, RE=Y, Gd, Nd, Sm, Eu or Dy), the ingredient of ceramic B layer 5 is ZrO2-
RETaO4(RE=Y, Gd, Nd, Sm, Eu, Dy, Er, Yb or Lu);Reflecting layer 6 is REVO4、RETaO4、Y2O3One or more of
Mixture, wherein RE=Y, Nd, Sm, Eu, Gd, Dy, Er, Yb or Lu.The ingredient of catadioptric layer 7 is in graphene and boron carbide
One or two kinds of mixtures, and the spatial distribution of graphene and boron carbide is in disorderly arranged state;The ingredient of insulating layer 8
For the mixture of one or more of epoxy resin, phenolic resin, ABS resin.
Wherein ZrO2-RETaO4Powder is prepared using following methods, comprising the following steps:
Step (1): by ZrO2Powder, rare earth oxide (RE2O3) powder, tantalum pentoxide (Ta2O5) powder progress predry
Dry, pre-dried temperature is 600 DEG C, and the pre-dried time is 8h;According to ZrO2-RETaO4Molar ratio weigh it is dry after
ZrO2Powder, rare earth oxide (RE2O3) powder, tantalum pentoxide (Ta2O5) powder;Powder after predrying is added to ethyl alcohol
In solvent, mixed solution is obtained, so that the molar ratio of RE:Ta:Zr is 1:1:1 in mixed solution;Again using ball mill to mixing
Solution carries out ball milling 10h, and the revolving speed of ball mill is 300r/min.
The slurry obtained after ball milling is dried using Rotary Evaporators (model: N-1200B), drying temperature 60
DEG C, the dry time is 2h, and the powder after drying is used to the sieve of 300 mesh, obtains powders A.
Step (2): use high-temperature solid phase reaction method that ingredient is made as ZrO powders A obtained in step (1)2-RETaO4
Powder B, reaction temperature be 1700 DEG C, reaction time 10h;And it is sieved using the sieve of 300 mesh to powder B.
Step (3): the powder B after sieving in step (2) is mixed to get slurry with deionized water solvent, organic adhesive
C, wherein the mass percent of powder B is 25% in slurry C, and the mass percent of organic adhesive is 2%, remaining is solvent,
Organic adhesive uses polyvinyl alcohol or gum arabic,;Recycle centrifugal atomization that slurry C is dried, when dry
Temperature be 600 DEG C, centrifugal speed 8500r/min, obtain dry material grain D;
Step (4): by material grain D that step (3) obtains 1200 DEG C at a temperature of be sintered 8h, then use the sieve of 300 mesh
It is sieved to sintered material grain D, obtains the ZrO that partial size is 10~70 μm and pattern is spherical in shape2-RETaO4Ceramic powder.
The present invention utilizes ZrO2-RETaO4As B layers ceramic, have the effect of lower thermal conductivity, high expansion rate, be able to achieve drop
Conduction low in calories;And the ZrO prepared by the above method2-RETaO4Can satisfy APS spraying technology to diameter of particle and
The requirement of pattern.
Inventor has shown that in parameter area of the invention, the ultralimit copper alloy of preparation makes through a large number of experiments
Maximum is promoted with temperature, and the weight gain of copper alloy is small, each coating composition and the optimal ultralimit copper alloy of thickness, and this
30 groups therein are listed in invention to be illustrated.
Each parameter such as table 1, table 2,3 institute of table of the embodiment 1-30 of a kind of ultralimit copper alloy of the present invention and preparation method thereof
Show:
The ingredient and thickness of each coating in a kind of embodiment 1-10 of the ultralimit copper alloy of table 1 and preparation method thereof
The ingredient and thickness of each coating in a kind of embodiment 11-20 of the ultralimit copper alloy of table 2 and preparation method thereof
The ingredient and thickness of each coating in a kind of embodiment 21-30 of the ultralimit copper alloy of table 3 and preparation method thereof
Now by taking embodiment 1 as an example, to another technical solution of the invention, a kind of preparation method progress of ultralimit copper alloy
Explanation.
A kind of preparation method of ultralimit copper alloy, comprising the following steps:
Step 1: the greasy dirt and impurity on copper alloy matrix surface are removed using infusion method, copper alloy matrix in the present embodiment
Copper alloy matrix is impregnated 0.5~1.5h using solvent or aqueous slkali, wherein the master of solvent by material selection C86100 copper alloy
Wanting ingredient is ethyl alcohol and surfactant, and aqueous slkali main component is sodium hydroxide, tertiary sodium phosphate, sodium carbonate sodium metasilicate etc., alkali
The pH value of solution is 10~11, is cleaned using solvent to copper alloy matrix surface in the present embodiment, greasy dirt and impurity cleaning
Copper alloy matrix is taken out after clean, is dried after recycling deionized water to rinse well.
Recycle compressed air shotblasting machine to copper alloy matrix surface carry out bead, the compressed air shotblasting machine used be JCK-SS500-6A from
Dynamic conveying type compressed air shotblasting machine, the shot-peening material that when shot-peening uses is any one in iron sand, glass ball and ceramic pellet, the present embodiment
It is middle to use iron sand, and the partial size of iron sand is 0.3-0.8mm, the partial size of iron sand is 0.5mm in the present embodiment;Copper alloy base after shot-peening
The surface roughness of body is 60-100 μm, and the surface roughness of copper alloy matrix is 80 μm in the present embodiment, is convenient for coating and copper
The bonding of alloy substrate.
Step 2: the copper alloy matrix surface after shot-peening deposits composite tie layer, first with HVOF method (supersonic speed fire
Flame spray coating method) or Ultrasonic Arc Sprayed method copper alloy matrix surface spraying layer of Ni CrCoAlY as adhesive layer, this reality
Example is applied using HVOF method, the technological parameter of HVOF method are as follows: powder diameter is 25-65 μm, oxygen flow 2000SCFH, kerosene stream
Amount is 18.17LPH, carrier gas 12.2SCFH, powder sending quantity 5RPM, barrel length 5in, spray distance 254mm.
EB-PVD method (electro beam physics vapour deposition method) is recycled to deposit layer of Au conduct on NiCrCoAlY adhesive layer
Layer of precious metal, to form composite tie layer.Gas pressure intensity when depositing Au is less than 0.01Pa, the technological parameter of EB-PVD method
Are as follows: pressure 0.008Pa, deposition rate 6nm/min, and the fusing point ratio of the temperature of copper alloy matrix and copper alloy matrix is less than
0.3.The adhesive layer of deposition with a thickness of 45 μm, layer of precious metal with a thickness of 45 μm.
Step 3: using APS (air plasma spraying), HVOF, PS-PVD or EB-PVD method on the surface of composite tie layer
It sprays one layer of YSZ and is used as A layers of ceramics, HVOF method is used in the present embodiment, HVOF method is recycled to spray one on A layers of YSZ ceramics
Layer ZrO2- YTaO4 is used as B layers of ceramics, forms composite ceramic layer, and the technological parameter of HVOF method is identical as in step 2;Wherein make pottery
A layers of porcelain with a thickness of 70 μm, ceramic B layers with a thickness of 50 μm.
Step 4: spraying one layer of Y in composite ceramics layer surface using HVOF method2O3Transparent ceramic material is as reflecting layer, spray
The reflecting layer of painting with a thickness of 20 μm.
Step 5: using brushing method in Y2O3One layer of graphene of reflecting layer external coating as catadioptric layer, catadioptric layer
With a thickness of 10 μm.
Due to graphene specific surface area with higher, extremely in the solution, therefore graphene needs indissoluble before overcoating
Ultrasonic disperse and separation of solid and liquid are carried out, i.e., graphene is mutually uniformly mixed with micron-sized carbon powder material first, then will
Mixed-powder imports and carries out ultrasonic activation mixing in solution, and solution is to be added to have the ethyl alcohol of 1% dispersing agent molten in the present embodiment
Liquid will be uniformly mixed later solution and be separated micron-sized carbon dust using filter paper, is finally blended with the molten of graphene
Liquid be coated on reflecting layer surface, after the copper alloy for being coated with graphene catadioptric layer is put into drying box, at a temperature of 60 DEG C
Dry 2h.
In addition after graphene carries out ultrasonic disperse, the spatial distribution of graphene is rearranged in all directions, so that
The spatial distribution of graphene is in disorderly arranged state, such graphene although refractive index with higher, when incident light is irradiating
When on to graphene catadioptric layer, the refraction of light in all directions is can be enhanced in disorderly arranged graphene, and incident light is avoided to exist
It is reflected in same direction, achievees the effect that refraction dispersion, enter the incident intensity decline in coating in this way.
Step 6: using brushing method in graphene catadioptric layer surface one layer of epoxy resin of brushing as insulating layer, insulating layer
With a thickness of 15 μm.
Step 7: brush one layer of foam carbon-coating on epoxy resin insulating layers using brushing method, foam carbon-coating with a thickness of 20
μm。
Embodiment 2-29 is identical as the preparation process of embodiment 1, and difference is only that the ingredient of each coating as shown in Table 1
It is different from thickness;Embodiment 30 is the difference from embodiment 1 is that A layers of ceramics are different with B layers of ceramics of spraying sequence in step 3.
In addition 13 groups of comparative examples are set and embodiment 1-30 compares experiment.
Table 4 is the ingredient and thickness of each coating of comparative example 1-12:
Comparative example 1-12 is identical as the preparation method of embodiment 1, difference be only that the ingredient of each coating as shown in table 3 with
Thickness is different, and comparative example 13 is the C86100 copper alloy matrix of non-depositing coating.
Following experiment is carried out using the copper alloy that embodiment 1-30, comparative example 1-13 are provided:
1, creep experiments under high temperature:
It will be processed as tensile test specimen using the copper alloy of embodiment 1-30 and comparative example 1-13 preparation, utilizes model RMT-
The electronic type high-temerature creep permanent strength testing machine of D5 carries out creep experiments under high temperature, and maximum test load is 50KN, test load
Controlling precision is within ± 5%, and deformation measurement range is 0~10mm, and speed adjust range is 0~50mm/min-1, deformation resolution
Rate is 0.001mm, and high temperature furnace temperature control range is 200~2000 DEG C, a length of 150mm in soaking zone.
The test specimen of embodiment 1-30, comparative example 1-13 are put into electronic type high-temerature creep permanent strength testing machine, and
Make test specimen be in unstress state (under unstress state, test specimen can free wxpansion, and high-temerature creep is total in temperature and stress
It is deformed increase with time under same-action, therefore heating rate does not influence creep).By testing machine be adjusted to stress be 50MPa,
Temperature is 1300 DEG C, and records following data, and as shown in table 5, a indicates the steady creep time (min) of each test specimen in table 5;B table
Show that the time (min) of creep rupture occurs for each test specimen.
By taking embodiment 1 and comparative example 13 as an example, as shown in Fig. 2, being tested for the high-temerature creep of embodiment 1 and comparative example 13 bent
Line chart, (A) indicates the C86100 copper alloy matrix material of non-depositing coating in comparative example 13 in Fig. 2, and (B) indicates to implement in Fig. 2
The material that example 1 is prepared.
From figure 2 it can be seen that there are 3 ranks for (A) and the creep of (B) test specimen at a temperature of 1300 DEG C under 50MPa stress
Section: the first stage is shorter, and creep rate is larger, is transitioned into the second stage of creep quickly, and secondary creep rate reaches
Minimum value, and this stage is longer, is substantially at steady state creep process;When the phase III, creep rate is risen rapidly, and creep becomes
Shape rapidly develops, until creep rupture occurs for material damage.It can be found that under 50MPa stress, under the conditions of 1300 DEG C of temperature,
(A) test specimen is just broken in a very short period of time, illustrates that copper alloy can hardly carry under the conditions of being higher than melting temperature
Load, and (B) test specimen can keep preferable mechanical property not broken for a long time under conditions of 1300 DEG C, have excellent
High temperature resistance.
2, salt air corrosion is tested:
Embodiment 1-30, comparative example the 1-13 copper alloy provided are processed into 50mm × 25mm × 2mm test specimen, then carried out
Oil removing and processing of rust removing, and cleaning and drying.Use YWX/Q-250B salt air corrosion case as experimental facilities, and simulates GB/
The atmospheric corrosion environment of T2967.3-2008.
Embodiment 1-30, comparative example the 1-13 test specimen provided are suspended in experimental facilities, and experimental facilities is adjusted to
Temperature is 50 ± 1 DEG C, PH 3.0-3.1, and recycling concentration is 5 ± 0.5%NaCl solution continuously to test specimen sprinkling, and in table 5
After middle record certain time (8,24,48,72h), the weight-loss ratio of each test specimen.
As shown in figure 3, for the relation curve of embodiment 1 and comparative example 13 salt air corrosion weight loss and etching time, in Fig. 3
(A) the C86100 copper alloy substrate material of non-depositing coating in comparative example 13 is indicated, (B) indicates that embodiment 1 is prepared in Fig. 3
Material.
From figure 3, it can be seen that two Albatra metals have visibly different corrosion regularity, for (A) test specimen (C86100 copper
Alloy test specimen), with the extension of etching time, corrosion weight loss numerical value is in the trend increased.Wherein, corrode initial stage (8-24h), examination
There are oxidation films on sample surface, hinder copper alloy matrix to contact with solution, corrosion rate is smaller.Corrode mid-term (24-48h), solution
In Cl-(chloride ion) has penetrated oxidation film, a large amount of Cl-It is adsorbed on matrix, increases point corrosion pit, original point corrosion pit adds
It is deep, hence it is evident that accelerate corrosion rate.Continuously by spraying after 48h, corrosion product is evenly distributed, and thickness increases, and almost covers sample
Whole surface, Cl-It needs to contact with copper alloy matrix across corrosion product, reduces matrix surface absorption Cl-Quantity,
Reduce corrosion rate.It totally sees, C86100 corrosion of copper alloy weight loss is much higher than surface composite of copper substrate, and copper-based surfaces are multiple
Condensation material corrodes since the presence of coating there is no, quality is almost without changing.
A indicates the steady creep time (min) of each test specimen in table 5;B indicates that the time of creep rupture occurs for each test specimen
(min);
C indicates the weight-loss ratio (v/mg.cm that test specimen after NaCl solution 8h is continuously sprayed to test specimen2);
D indicates the weight-loss ratio (v/mg.cm of test specimen after continuously spraying NaCl solution for 24 hours to test specimen2);
E indicates the weight-loss ratio (v/mg.cm that test specimen after NaCl solution 48h is continuously sprayed to test specimen2);
F indicates the weight-loss ratio (v/mg.cm that test specimen after NaCl solution 72h is continuously sprayed to test specimen2)。
Table 5 is the experimental result of creep experiments under high temperature and salt spray test
By table 5 it is found that the copper alloy that the comparative example beyond parameter area of the invention obtains, high temperatures are substantially
Decline, is broken, and corrosion resistance is poor in a relatively short period of time.
In conclusion by depositing anti-oxidant composite tie layer, composite ceramic layer, reflecting layer, catadioptric on copper alloy
Copper alloy can be promoted to 100-500 DEG C higher than former fusing point using temperature by layer, insulating layer and foam carbon-coating, and resistance to
Corrosivity also greatly improves.The ultralimit copper alloy of ultralimit process for producing copper alloy preparation provided by the invention uses temperature
Degree range is big, corrosion resistance is strong, and wherein each effect of embodiment 1 is best.
What has been described above is only an embodiment of the present invention, and the common sense such as well known specific structure and characteristic are not made herein in scheme
Excessive description.It, without departing from the structure of the invention, can be with it should be pointed out that for those skilled in the art
Several modifications and improvements are made, these also should be considered as protection scope of the present invention, these all will not influence what the present invention was implemented
Effect and patent practicability.The scope of protection required by this application should be based on the content of the claims, in specification
The records such as specific embodiment can be used for explaining the content of claim.
Claims (10)
1. a kind of ultralimit copper alloy, including copper alloy matrix, it is characterised in that: the copper alloy matrix surface has been sequentially depositing
Composite tie layer and composite ceramic layer;Composite tie layer includes being deposited on the adhesive layer on copper alloy matrix surface and being deposited on bonding
The layer of precious metal of layer surface;Composite ceramic layer includes B layers of A layers of ceramics and ceramics.
2. a kind of ultralimit copper alloy according to claim 1, it is characterised in that: the composite tie layer with a thickness of
100-200 μm, composite ceramic layer with a thickness of 150-500 μm, be also sequentially depositing outside composite ceramic layer with a thickness of 10-30 μm
Reflecting layer, with a thickness of 10-30 μm of catadioptric layer, the insulating layer with a thickness of 10-200 μm and the foamy carbon with a thickness of 20-200 μm
Layer.
3. a kind of ultralimit copper alloy according to claim 2, it is characterised in that: the bonding composition of layer be MCrAlY,
The mixture of one or more of NiAl, NiCr-Al, Mo alloy, MCrAlY NiCrCoAlY, NiCoCrAlY,
CoNiCrAlY or CoCrAlY;The ingredient of layer of precious metal is one of Au, Pt, Ru, Rh, Pd, Ir or a variety of alloys.
4. a kind of ultralimit copper alloy according to claim 2, it is characterised in that: the ingredient of A layers of the ceramics be YSZ or
Rare earth zirconate (RE2Zr2O7), ceramic B layers of ingredient is ZrO2-RETaO4。
5. a kind of ultralimit copper alloy according to claim 4, it is characterised in that: the ingredient in the reflecting layer is REVO4、
RETaO4、Y2O3One or more of mixture.
6. a kind of ultralimit copper alloy according to claim 5, it is characterised in that: the ingredient of the catadioptric layer is graphite
The mixture of one or both of alkene or boron carbide, and the spatial distribution of graphene and boron carbide is in disorderly arranged state.
7. a kind of ultralimit copper alloy according to claim 6, it is characterised in that: the ingredient of the insulating layer is asphalt mixtures modified by epoxy resin
The mixture of one or more of rouge, phenolic resin, ABS resin.
8. a kind of preparation method of ultralimit copper alloy according to claim 4-7 any one, which is characterized in that including
Following steps:
Step 1: depositing adhesive layer on copper alloy matrix surface;In tie layer surface depositing noble metal layer, so that adhesive layer and expensive
Metal layer forms composite tie layer, and the overall thickness of the composite tie layer is 100-200 μm;
Step 2: in B layers of A layers of the compoiste adhering layer surface deposition ceramics and ceramics that step 1 obtains, so that A layers of ceramics and ceramics B
Layer forms composite ceramic layer, and the overall thickness of composite ceramic layer is 150-500 μm;
Step 3: in the composite ceramics layer surface deposition of reflective layer that step 2 obtains, reflecting layer with a thickness of 10-30 μm;
Step 4: the reflection layer surface obtained in step 3 deposits catadioptric layer, catadioptric layer with a thickness of 10-30 μm;
Step 5: in the catadioptric layer surface depositing insulating layer that step 4 obtains, insulating layer with a thickness of 10-200 μm;
Step 6: the surface of insulating layer obtained in step 5 deposits foam carbon-coating, foam carbon-coating with a thickness of 20-200 μm, thus shape
At ultralimit copper alloy.
9. a kind of preparation method of ultralimit copper alloy according to claim 8, it is characterised in that: in the step 2, shape
At ceramic B layers of ZrO2-RETaO4For powder, the ZrO2-RETaO4The partial size of powder is 10~70 μm, and pattern is spherical in shape.
10. a kind of preparation method of ultralimit copper alloy according to claim 8, it is characterised in that: in the step 1,
Before depositing adhesive layer, copper alloy matrix surface is pre-processed, the pretreatment is including degreasing and removes impurity;It is described
After copper alloy matrix surface preparation, bead is carried out to the surface of copper alloy matrix, so that the surface of copper alloy matrix is thick
Rugosity is 60-100 μm.
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