CN109604309A - A kind of microbial process of selectively removing waste print circuit board surface component - Google Patents
A kind of microbial process of selectively removing waste print circuit board surface component Download PDFInfo
- Publication number
- CN109604309A CN109604309A CN201811515776.1A CN201811515776A CN109604309A CN 109604309 A CN109604309 A CN 109604309A CN 201811515776 A CN201811515776 A CN 201811515776A CN 109604309 A CN109604309 A CN 109604309A
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- Prior art keywords
- wiring board
- component
- circuit board
- surface component
- microbial process
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- 239000002699 waste material Substances 0.000 title claims abstract description 44
- 230000007483 microbial process Effects 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 52
- 241000605222 Acidithiobacillus ferrooxidans Species 0.000 claims abstract description 13
- 239000001963 growth medium Substances 0.000 claims description 27
- 241000894006 Bacteria Species 0.000 claims description 21
- 238000002386 leaching Methods 0.000 claims description 20
- ZPWVASYFFYYZEW-UHFFFAOYSA-L dipotassium hydrogen phosphate Chemical compound [K+].[K+].OP([O-])([O-])=O ZPWVASYFFYYZEW-UHFFFAOYSA-L 0.000 claims description 10
- 229910000396 dipotassium phosphate Inorganic materials 0.000 claims description 10
- 229910052564 epsomite Inorganic materials 0.000 claims description 10
- 229910052603 melanterite Inorganic materials 0.000 claims description 10
- 239000002054 inoculum Substances 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 238000003379 elimination reaction Methods 0.000 claims description 5
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052921 ammonium sulfate Inorganic materials 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims 2
- 241000605118 Thiobacillus Species 0.000 claims 2
- 229910052742 iron Inorganic materials 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 230000000813 microbial effect Effects 0.000 abstract description 17
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract description 2
- 239000006227 byproduct Substances 0.000 abstract 1
- 238000005265 energy consumption Methods 0.000 abstract 1
- 239000012943 hotmelt Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- WURBVZBTWMNKQT-UHFFFAOYSA-N 1-(4-chlorophenoxy)-3,3-dimethyl-1-(1,2,4-triazol-1-yl)butan-2-one Chemical compound C1=NC=NN1C(C(=O)C(C)(C)C)OC1=CC=C(Cl)C=C1 WURBVZBTWMNKQT-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 244000005700 microbiome Species 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010297 mechanical methods and process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 230000003698 anagen phase Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 230000001850 reproductive effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
The invention discloses a kind of microbial process of selectively removing waste print circuit board surface component.It includes three steps of removing of wiring board pretreatment, strain domestication and component.The present invention using Acidithiobacillus ferrooxidans (Acidithiobacillus ferrooxidans) strain leaches the wiring board of the component containing surface, and the plumber's solder in printed wiring board is made to dissolve that the component of welding is promoted to fall off, realize that component is separated with printed wiring board substrate, and recycle electronic component therein.The present invention uses microbial technique process circuit plate surface component environmental-friendly, without secondary pollution, pass through Optimizing Process Parameters, byproduct after dismantling can be carried out resource reutilization, it is high to can effectively solve removing discarded circuit board surface component conventional hot melt disassembling method energy consumption, temperature is high, and treating capacity is low, and pollution is big, the problems such as risk is strong, and component damage degree is big.
Description
Technical field
The present invention relates to waste dismantling recovery technology field more particularly to a kind of selectively removing abandoned printed circuit boards
The microbial process of surface component.
Background technique
As China's economic liftoff develops, urbanization process constantly accelerates, the shortage of resource and the pollution of environment at
For the conspicuous contradiction in social development.Rationally increasingly mentioned in the work schedule of economic development using waste and old material regenerated resources
Come.The reproductive vibration for being considered as " city mineral products " has become that global evolution is most fast, maximum industry of containing energy.Regeneration
Resource reclaim System Construction is the relationship people's livelihood and socially harmonious important process, it is for developing a circular economy, establishing resource section
About type, friendly environment society are of great significance.In recent years, governments at all levels, China were in terms of waste reduction and classification recycling
A large amount of elaborations have been done, but have all been produced little effect since method is not proper, the goods and materials rate of recovery can be recycled according to statistics and only have
40%.In recent years, most of scholar is higher to the recycling treatment attention rate for the waste printed circuit board for having removed component, and how to have
The component on the removing waste printed circuit board surface of effect tends to ignored.
Waste printed circuit board (Waste Printed Circuit Board,It WPCB) is resource valence in discarded electric appliance and electronic equipment
Be worth it is higher it can be difficult to scientific disposal important component.With the quickening of various electric equipment products update speed, and use
The arrival of time limit, more and more electric equipment products are eliminated.With scrapping for electric equipment products, contain a large amount of electronic components and dilute
The printed wiring board of noble metal is also scrapped therewith.If proper to waste printed circuit board processing, it can recycle, turn waste into wealth.
The method of traditional removing PCB surface can be divided into: Mechanical Method, pyrolysismethod, chemical method.Mechanical Method is to equipment
It is more demanding, and the maintenance cost of equipment is expensive.Pyrolysismethod melts component leg by heating, from making component de-
It falls.Traditional pyrolysismethod risk is higher.There is scholar once to use water soluble ion liquid as heat medium, in 250 DEG C of conditions
Under, so that the component of PCB surface falls off.In addition scholar develops a set of right under 265 ± 5 DEG C of heating air conditions
The system that waste printed circuit board is disassembled automatically.But these methods are at high cost.Chemical method makes component by various chemical reagent
Leg dissolution, falls off.If traditional chemical method, which is dealt with improperly, to cause serious secondary pollution to environment.
It is an important link to being reused after waste printed circuit board dismantling component.Waste printed circuit board dismantling is mostly used at present
Component dismantling is carried out after tin melting furnace melting, this method temperature height, low efficiency, pollution is big, and risk is strong, component serviceability rate
It is low, the volatilization of simultaneous organic gas.Therefore how PCB is quickly and safely disassembled, is that entire electron wastes industry faces
Common problem.
Summary of the invention
For overcome the deficiencies in the prior art, the purpose of the present invention is to provide a kind of environmentally protective selectively removing is useless
Abandon the microbial process of print circuit board surface component.Dismantling subtractive process reaction temperature of the invention is low, does not need the external world
Heat source, secondary amount of waste is few, disassemble it is high-efficient, be able to achieve the lossless dismantling to component on waste printed circuit board, reach save resource,
The multipurposes such as waste decrement and reduction environmental pollution.
In the present invention, using Acidithiobacillus ferrooxidans (Acidithiobacillus ferrooxidans) strain
The wiring board of the component containing surface is leached, the plumber's solder in printed wiring board is made to dissolve to promote first device of welding
Part falls off, and realizes that component is separated with printed wiring board substrate, and recycle electronic component therein.The technology that the present invention uses
Scheme is as described below.
The present invention provides a kind of microbial process of selectively removing waste print circuit board surface component, including as follows
Step:
1. wiring board pre-processes
Wiring board is handled to the bulk for being the 1 cm * cm of 1 cm ~ 20 *, 20 cm for size, is placed in leaching device；
2. strain domestication
To contain Acidithiobacillus ferrooxidans (Acidithiobacillus ferrooxidans) bacterium solution be inoculated in cupric
In the culture medium of powder, under conditions of it is 28 ~ 35 DEG C that initial pH value, which is 1 ~ 2, cultivation temperature, filters out and wiring board is resistant to
The bacterium containing A.f solution；
The removing of component
By the solution containing Acidithiobacillus ferrooxidans tamed be connected to equipped with wiring board, culture medium leaching device in,
Elimination reaction is carried out under conditions of initial pH value be 1.5 ~ 2.5, temperature is 28 ~ 35 DEG C, realizes abandoned printed circuit board
The removing of surface component；Wherein:
Culture medium composition are as follows: (NH4)2SO4: 3g/L, K2HPO4: 0.5g/L, MgSO4·7H2O:0.1 ~ 0.5g/L, KCl:
0.5g/L, Ca (NO3)2: 0.01g/L, FeSO4·7H2O:10 ~ 40g.
In the present invention, step 2. in, when domestication, the bacterium solution of Acidithiobacillus ferrooxidans is inoculated with according to 10% (v/v)
Onto culture medium, culture medium composition are as follows: (NH4)2SO4: 3g/L, K2HPO4: 0.5g/L, MgSO4·7H2O:0.1 ~ 0.5g/L,
KCl:0.5g/L, Ca (NO3)2: 0.01g/L, FeSO4·7H2O:10 ~ 40g.In culture medium containing wiring board, wiring board
Amount is 4 g/L, when domestication, first by bacterium solution with 10%(/vv) inoculum concentration be inoculated into culture medium, solution ph is measured, to pH
When beginning to decline and tending to stablize, strain is in logarithmic growth phase, repeats above-mentioned domestication process, sieve again with 10% inoculum concentration
Select the high A.f bacterium of tolerance.
In the present invention, stepIn, when the solution containing Acidithiobacillus ferrooxidans tamed is connected to leaching device
Inoculum concentration be 5 ~ 15% (v/v).
In the present invention, stepIn, the dosage of wiring board is 20 ~ 80 g/L.Removing the time is 3 ~ 13 days.
In the present invention, the waste print circuit board surface component includes resistance, capacitor, chip and transformer.
In the present invention, stepIn, when the waste print circuit board surface component is capacitor and chip, remove the time
It is 3 ~ 5 days；When waste print circuit board surface component is resistance and transformer, the removing time is 9 ~ 13 days.
In the present invention, leaching device includes that reactor body, thermostat, wiring board set frame and shaft；The reactor sheet
Body is in the rectangular parallelepiped structure of upper opening, and thermostat is placed in reactor body, setting 2 ~ 5 routes in interval in reactor body
Plate sets frame, and each wiring board sets frame by forming in m × n parcel shelf of array distribution, and m, n are independently that one in 2 ~ 5 is whole
Number；Clip and adjustable axis, the wiring board different for fixed dimension are set on parcel shelf；Shaft is set to wiring board and sets frame
Both ends drive wiring board to set the rotation of frame when shaft rotates.
Compared to the prior art, the beneficial effects of the present invention are:
The method of the present invention removing waste printed circuit board surface component only works to waste printed circuit board surface component leg position, removes
Process can't impact other substances on waste printed circuit board surface.
Component of the present invention using the microbial technique removing waste printed circuit board surface environmental-friendly, operating cost is low, energy
Solve the problems, such as that traditional de- component method of tin melting furnace heating is at high cost, pollution is big, operating condition is severe, operational hazards, while
Pure chemistry facture bring secondary pollution weight, the demanding problem of process units are solved, there is application value.
The leaching device of this patent be able to achieve abjection component after wiring board and component respectively since in solution separation obtain
It takes.
Detailed description of the invention
Fig. 1 is the waste and old TV SKD surface component figure before the microbial method removing of embodiment 1.
Fig. 2 is the waste and old TV SKD surface component figure after the microbial method removing of embodiment 1.
Fig. 3 is the waste computer boards surface component figure before the microbial method removing of embodiment 2.
Fig. 4 is the waste computer boards surface component figure after the microbial method removing of embodiment 2.
Fig. 5 is the waste computer memory bar surface component before the microbial method removing of embodiment 3.
Fig. 6 is the waste computer memory bar surface component after the microbial method removing of embodiment 3.
Fig. 7 is process flow chart of the invention.
Fig. 8 is whole leaching device process equipment schematic diagram of the invention.
Fig. 9 is leaching device (feeding port) process equipment schematic diagram of the invention.
Figure 10 is leaching device of the present invention (feeding port) process equipment schematic diagram sectional view.
Figure 11 is each in leachate after the microbial method removing waste and old TV SKD surface component of embodiment 1
Metal ion content figure.
Figure label: 1- thermostat, 2- wiring board set frame, 3- shaft, 4- clip, and axis is adjusted in 5-.
Specific embodiment
Present invention will be further explained below with reference to the attached drawings and examples, but does not therefore limit the present invention to described
In scope of embodiments.Fig. 7 is process flow chart of the invention.
Embodiment 1
The method for removing discarded television circuit board surface component using microorganism comprising following steps:
1. wiring board pre-processes
Wiring board is handled to the bulk for being 2 cm *, 2 cm for size, is placed in leaching device；
2. strain domestication
The bacterium solution of the bacterium containing A.f is inoculated in the culture medium of the copper powder containing 4g/L, initial pH value is 1, cultivation temperature is 28 DEG C
Under conditions of, filter out the solution of the bacterium containing A.f to wiring board tolerance；(the NH of culture medium4)2SO4: 3g/L, K2HPO4: 0.5g/
L, MgSO4·7H2O:0.5g/L, KCl:0.5g/L, Ca (NO3)2: 0.01g/L, FeSO4·7H2O:40g.
Remove step
The solution for the bacterium containing A.f tamed is connected to the dress of the leaching equipped with culture medium and 20g/L wiring board according to inoculum concentration 10%
It is 1.5 in initial pH value, temperature carries out elimination reaction under conditions of being 28 DEG C in setting, in which:
Culture medium the composition are as follows: (NH of culture medium4)2SO4: 3g/L, K2HPO4: 0.5g/L, MgSO4·7H2O:0.3g/L, KCl:
0.5g/L, Ca (NO3)2: 0.01g/L, FeSO4·7H2O:10g.Started to take 1ml culture solution at the 0th day, be measured by ICP
Its tenor.Metal ion in solution has after measured: Cu, Ni, Al, Zn, Sn, Pb etc..Record is seen in real time during the cultivation process
The removing situation of component on wiring board is examined, 11 days or so, television circuit board surface component was completely fallen off.Removing the time be
At 3 ~ 5 days, the chip on television circuit board surface has fallen off；When the removing time is 11 ~ 13 days, television circuit board surface element
The resistance and transformer of device fall off.Effect takes off as shown in Fig. 1,2 before and after microbial method removes TV motherboard surface component
Except in rear leachate various tenors as shown in Figure 11.As shown in Figure 11, Cu, Ni, Al reached maximum at the 13rd day
Value, illustrates that the 13rd day TV machine circuit plate surface component leg has been dissolved, so that its surface component falls off.And Sn contains
Amount reached maximum value at first day, then increases with the reaction time and reduces, and was because television circuit board surface component welds
Sn on foot forms precipitating after being dissolved again, so that Sn content first increases and reduces afterwards in solution.
Fig. 1 is the waste and old TV SKD surface component figure before the microbial method removing of embodiment 1.Fig. 2 is real
Waste and old TV SKD surface component figure after applying the microbial method removing of example 1.
In Figure 11, CK1.0Cu is bacteria control test, this check experiment, which is arranged, can absolutely prove what this patent used
Effect of the Acidithiobacillus ferrooxidans to removing PCB surface component.CK1.0Ni, CK1.0Sn, CK1.0Al are similarly.
The material of equipment therefor of the present invention is plastic material, will not be leached corrosion.Fig. 8 is the dress that this patent uses
Set overall diagram.Leaching device includes that reactor body, thermostat 1, wiring board set frame 2 and shaft 3；Reactor body is opened in top
The rectangular parallelepiped structure of mouth, thermostat 1 are placed in reactor body, and interval 2 ~ 5 wiring boards of setting set frame 2 in reactor body,
Each wiring board sets frame 2 by forming in m × n parcel shelf of array distribution, and m, n are independently an integer in 2 ~ 5；It sets
Clip 4 and adjustable axis 5, the wiring board different for fixed dimension are set on object plate；Shaft 3 is set to wiring board and sets frame 2
Both ends drive wiring board to set the rotation of frame 2 when shaft 3 rotates.The wiring board handled well is placed in wiring board and sets frame 2 by the present invention
In, in leaching process, the component of PCB surface constantly falls off sinkage equipment bottom, so that the wiring board after removing
It is separated with component.Thermostat 1 is temperature sensor, for monitoring and controlling solution temperature.It can soaked by the rotation of shaft 3
Solution oxygen content is continuously replenished during out, guarantees microbial activity, secondly frame rotation is set in its drive, is also prevented from component and is stuck in folder
Column.Fig. 9 is part (feeding port) process equipment schematic diagram of the invention.Figure 10 is that present invention part (feeding port) technique is set
Standby schematic diagram sectional view.It is set on frame 2 to the different size of wiring board of fixation in wiring board by clip 4 and adjustable axis 5.
Embodiment 2
The method for removing discarded television circuit board surface component using microorganism comprising following steps:
1. wiring board pre-processes
Computer wiring board is handled to the bulk for being 4 cm *, 4 cm for size, is placed in leaching device；
2. strain domestication
The bacterium solution of the bacterium containing A.f is inoculated in the culture medium of the copper powder containing 4g/L, initial pH value be 1.5, cultivation temperature 30
Under conditions of DEG C, the solution of the bacterium containing A.f to wiring board tolerance is filtered out；(the NH of culture medium4)2SO4: 3g/L, K2HPO4:
0.5g/L, MgSO4·7H2O:0.4g/L, KCl:0.5g/L, Ca (NO3)2: 0.01g/L, FeSO4·7H2O:40g.
3. removing step
The solution for the bacterium containing A.f tamed is connected to the dress of the leaching equipped with culture medium and 30g/L wiring board according to inoculum concentration 10%
In setting, elimination reaction is carried out under conditions of initial pH value is 1.5, temperature is 30 DEG C, in which:
Culture medium the composition are as follows: (NH of culture medium4)2SO4: 3g/L, K2HPO4: 0.5g/L, MgSO4·7H2O:0.4g/L, KCl:
0.5g/L, Ca (NO3)2: 0.01g/L, FeSO4·7H2O:30g.Started to take 1ml culture solution at the 0th day, be measured by ICP
Its tenor.After measured, the 7th day when, remaining each metal element content reaches maximum value in addition to Sn, wherein Cu content: 5121
mg/L；Ni content: 332 mg/L；Al content: 21 mg/L.Sn content reaches maximum value: 223 mg/L on day 1.At the 7th day,
Computer wiring board surface component removes completely.
Fig. 3 is the waste computer boards surface component figure before the microbial method removing of embodiment 2.Fig. 4 is to implement
Waste computer boards surface component figure after the microbial method removing of example 2.
Embodiment 3
The method for removing discarded television circuit board surface component using microorganism comprising following steps:
1. wiring board pre-processes
Computer wiring board is handled to the bulk for being 20 cm *, 20 cm for size, is placed in leaching device；
2. strain domestication
The bacterium solution of the bacterium containing A.f is inoculated in the culture medium of the copper powder containing 10g/L, initial pH value is 2, cultivation temperature is 33 DEG C
Under conditions of, filter out the solution of the bacterium containing A.f to wiring board tolerance；(the NH of culture medium4)2SO4: 3g/L, K2HPO4: 0.5g/
L, MgSO4·7H2O:0.3g/L, KCl:0.5g/L, Ca (NO3)2: 0.01g/L, FeSO4·7H2O:40g.
3. removing step
The solution for the bacterium containing A.f tamed is connected to the dress of the leaching equipped with culture medium and 40g/L wiring board according to inoculum concentration 10%
In setting, elimination reaction is carried out under conditions of initial pH value is 2, temperature is 33 DEG C, in which:
Culture medium the composition are as follows: (NH of culture medium4)2SO4: 3g/L, K2HPO4: 0.5g/L, MgSO4·7H2O:0.5g/L, KCl:
0.5g/L, Ca (NO3)2: 0.01g/L, FeSO4·7H2O:40g.Started to take 1ml culture solution at the 0th day, be measured by ICP
Its tenor.After measured, the 5th day when, remaining each metal element content reaches maximum value in addition to Sn, wherein Cu content: 1926
mg/L；Ni content: 212 mg/L；Al content: 16 mg/L.Sn content reaches maximum value: 112 mg/L on day 1.At the 5th day,
Cell phone lines plate surface component removes completely.
Fig. 5 is the waste computer memory bar surface component before the microbial method removing of embodiment 3.Fig. 6 is to implement
Waste computer memory bar surface component after the microbial method removing of example 3.
Claims (8)
1. a kind of microbial process of selectively removing waste print circuit board surface component, which is characterized in that including as follows
Step:
1. wiring board pre-processes
Wiring board is handled to the bulk for being the 1 cm * cm of 1 cm ~ 20 *, 20 cm for size, is placed in leaching device；
2. strain domestication
To contain Acidithiobacillus ferrooxidans (Acidithiobacillus ferrooxidans) bacterium solution be inoculated in cupric
In the culture medium of powder, under conditions of it is 28 ~ 35 DEG C that initial pH value, which is 1 ~ 2, cultivation temperature, filter out resistance to wiring board
The solution for the bacterium containing A.f received；
The removing of component
By the solution containing Acidithiobacillus ferrooxidans tamed be connected to equipped with wiring board, culture medium leaching device in,
Elimination reaction is carried out under conditions of initial pH value be 1.5 ~ 2.5, temperature is 28 ~ 35 DEG C, realizes abandoned printed circuit board
The removing of surface component；Wherein:
Culture medium composition are as follows: (NH4)2SO4: 3g/L, K2HPO4: 0.5g/L, MgSO4·7H2O:0.1 ~ 0.5g/L, KCl:0.5g/
L, Ca (NO3)2: 0.01g/L, FeSO4·7H2O:10 ~ 40g.
2. microbial process as described in claim 1, it is characterised in that: step 2. in, when domestication, by acidophilia ferrous oxide
The bacterium solution of Thiobacillus is inoculated on culture medium according to 10% (v/v), culture medium composition are as follows: (NH4)2SO4: 3g/L, K2HPO4: 0.5g/
L, MgSO4·7H2O:0.1 ~ 0.5g/L, KCl:0.5g/L, Ca (NO3)2: 0.01g/L, FeSO4·7H2O:10 ~ 40g.
3. microbial process as described in claim 1, it is characterised in that: stepIn, the oxidation containing acidophilia tamed is sub-
The inoculum concentration when solution of iron Thiobacillus is connected to leaching device is 5 ~ 15% (v/v).
4. microbial process as described in claim 1, it is characterised in that: stepIn, the dosage of wiring board is 20 ~ 80g/
L。
5. microbial process as described in claim 1, which is characterized in that stepIn, the removing time is 3 ~ 13 days.
6. microbial process as described in claim 1, which is characterized in that the waste print circuit board surface component includes
Resistance, capacitor, chip and transformer.
7. microbial process as described in claim 1, which is characterized in that stepIn, the waste print circuit board surface
When component is capacitor and chip, the removing time is 3 ~ 5 days；When waste print circuit board surface component is resistance and transformer
When, the removing time is 9 ~ 13 days.
8. microbial process as described in claim 1, which is characterized in that leaching device includes reactor body, thermostat, line
Road plate sets frame and shaft；The reactor body is in the rectangular parallelepiped structure of upper opening, and thermostat is placed in reactor body, instead
Interval 2 ~ 5 wiring boards of setting in device ontology are answered to set frame, each wiring board sets frame by the m × n glove board group in array distribution
At m, n are independently an integer in 2 ~ 5；Clip and adjustable axis are set on parcel shelf, it is different for fixed dimension
Wiring board；Shaft is set to wiring board and sets frame both ends, and wiring board is driven to set the rotation of frame when shaft rotates.
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