CN109600913A - A kind of modularizing integrated circuit plate and its design method - Google Patents
A kind of modularizing integrated circuit plate and its design method Download PDFInfo
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- CN109600913A CN109600913A CN201811560995.1A CN201811560995A CN109600913A CN 109600913 A CN109600913 A CN 109600913A CN 201811560995 A CN201811560995 A CN 201811560995A CN 109600913 A CN109600913 A CN 109600913A
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- layer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
Abstract
The invention discloses a kind of modularizing integrated circuit plate and its design methods.The circuit is vertically to successively including the first signals layer, power supply positive layer, power supply negative layer and second signal layer；The power supply positive layer is the positive integrated layer of component power supply；The power supply negative layer is component power supply cathode integrated layer；Cabling between first and second described signals layer and power supply positive layer and negative layer is not parallel to each other.The method, including step (1) obtain hardware function schematic diagram；(2) selection corresponding device is laid；(3) each layer cabling.Circuit provided by the invention and its design method, so that integrated circuit board realizes power supply and signal lead separation by four layers of independent cabling, and electromagnetic interference reduces.
Description
Technical field
The invention belongs to integrated circuit board design fields, inherit circuit and its design more particularly, to a kind of modularization
Method.
Background technique
Integrated circuit board (integrated circuit) is a kind of microelectronic device or component.Using certain work
Skill interconnects the elements such as transistor, resistance, capacitor and inductance needed for a circuit and wiring together, is produced on a fritter
Or on a few fritter semiconductor wafers or dielectric substrate, it is then encapsulated in a shell, becomes with the micro- of required circuit function
Type structure；Wherein all elements have formed a whole in structure, make electronic component towards microminaturization, low-power consumption, intelligence
Change and high reliability aspect has strided forward major step.
Current integrated circuit panel element, which has had, significantly to be innovated, many kinds of, including power supply, controller, sensing
Device etc..These numerous and disorderly electric elements, the electric elements of electromagnetic performance, electrical property, electrocaloric effect as compared with the past have very very much not
Together, the integrated circuit board succession closeness in modern times is significantly increased in addition, and the bearing capacity of integrated circuit board is by integrated circuit
Plate physicochemical property itself is related, and causing integrated circuit board to occur, electromagnetic environment anti-interference ability is insufficient, fusing phenomenon, signal occurs
The problems such as interference, brings hardware unstability, even hardware paralysis risk.
Summary of the invention
Aiming at the above defects or improvement requirements of the prior art, the present invention provides a kind of modular integrated circuit board and
Its design method, its object is to by vertically to plane in cabling and component are laid carry out modularization respectively and set
Thus meter solves existing integrated circuit board component and lays electromagnetic environment anti-interference ability caused by chaotic, cabling complexity not
Easily there is the technical issues of fusing, signal interference in foot.
To achieve the above object, according to one aspect of the present invention, provide a kind of modularizing integrated circuit plate, vertically to
It successively include the first signals layer, power supply positive layer, power supply negative layer and second signal layer；Or
Vertically to successively including the first signals layer, power supply negative layer, power supply positive layer and second signal layer；
Circuit in first and second described signals layer is signal path；
The power supply positive layer is the positive integrated layer of component power supply；
The power supply negative layer is component power supply cathode integrated layer；
Cabling between first and second described signals layer and power supply positive layer and negative layer is not parallel to each other.
Preferably, the modularizing integrated circuit plate, surface include signal circuit region and power circuit region.
Preferably, the modularizing integrated circuit plate, signal circuit region arrangement include digital signal amount class device.
Preferably, the modularizing integrated circuit plate, digital signal amount class device are as follows: micro-controller processor device,
Digital Logic and signal processor, and/or digital communication switching device.
Preferably, the modularizing integrated circuit plate, power circuit region arrangement include energy work rate class device.
Preferably, the modularizing integrated circuit plate, energy work rate class device are as follows: power adapter part and/or power
Driving element.
Preferably, the modularizing integrated circuit plate, power circuit region input terminal pass through power supply positive layer and/or power supply
Negative layer is connected with electrostatic protection device.
Preferably, the modularizing integrated circuit plate, power circuit region are connected by power supply positive layer and/or power supply negative layer
It is connected to fuse.
Preferably, the modularizing integrated circuit plate, fuse are self-recovery fuse circuit protection device.
Preferably, the modularizing integrated circuit plate, power circuit include power input port module, power supply turn
Change the mold block and electric power loop control module；
The power input port module is connected with the power conversion module by power supply positive layer and power supply negative layer；
The power conversion module is connected with signal circuit module region by power supply positive layer and power supply negative layer；The power conversion module
It is connected by power supply positive layer and power supply negative layer with the electric power loop control module；The electric power loop control module and signal electricity
Road module region is connected by the first signals layer；
The power input port module is powered for connecting external power supply to power conversion module；
The power conversion module includes concatenated stage variable pressure chip, for providing demand voltage；
The electric power loop control module is equipped with input terminal, controlled end and output end；It is used to be received according to controlled end
The control signal arrived, the voltage output that the power conversion module is provided to output end or with output end disconnect.
Other side according to the invention provides the design method of the modularizing integrated circuit plate, including following
Step:
(1) according to design requirement, hardware function schematic diagram is obtained
(2) the hardware function schematic diagram obtained for step (1) selects corresponding device to be laid in integrated circuit board phase
Answer position；
(3) by the number of hardware system inner function circuit main digital signal amount class device and energy work rate class device
The cabling of pin is laid in the first layer of vertical distribution, the cabling as the first signals layer；By digital signal amount class device and energy
The cabling for measuring the positive pole energization pins of power class device is laid in the second layer or third layer of vertical distribution, just as power supply
The cabling of layer；The cabling of the power cathode energization pins of digital signal amount class device and energy work rate class device is laid in vertically
The third layer or the second layer of distribution, the cabling as power supply negative layer；By hardware system and external input/output function circuit number
The cabling of the digital pin of word semaphore class device and energy work rate class device is laid in the 4th layer of vertical distribution, as second
The cabling of signals layer；
Wherein first to fourth layer of cabling is not parallel to each other.
Preferably, the modularizing integrated circuit plate design method, which is characterized in that wherein step (2) specifically:
(2-1) electronic component needed for hardware function schematic diagram that step (1) obtains is divided by function as number
Word semaphore class device and energy work rate class device；
The digital signal amount class device is laid in signal circuit region by (2-2), realizes signal control function；
The energy work rate class device is laid in power circuit region by (2-3), realizes power supply conversion and drive control function
Energy.
In general, through the invention it is contemplated above technical scheme is compared with the prior art, can obtain down and show
Beneficial effect:
Modularizing integrated circuit plate provided by the invention and its design method, so that integrated circuit board is independent by four layers
Cabling realizes power supply and signal lead separation, and electromagnetic interference reduces；Preferred embodiment plane figure is totally divided into signal circuit area
Domain and power circuit region, the separation of forceful electric power light current, further increase diamagnetic interference performance.
Further power circuit increases ESD electrostatic protection device and PTC self-recovery fuse circuit protection device, can be into
One step enhances the reliability of integrated circuit board, for control circuit, avoids the risk of hardware damage paralysis as far as possible,
Maintain the use reliability of control circuit.
Detailed description of the invention
Fig. 1 is integrated circuit board structure schematic diagram provided by the invention；
Fig. 2 is integrated circuit board design method flow chart provided by the invention；
Fig. 3 is integrated circuit board system block diagram provided in an embodiment of the present invention；
Fig. 4 is integrated circuit board component realization principle figure provided in an embodiment of the present invention；
Fig. 5 is integrated circuit board component circuit figure provided in an embodiment of the present invention.
In all the appended drawings, identical appended drawing reference is used to denote the same element or structure, in which: 1 is the first signal
Layer, 2,3 be power supply positive layer or power supply negative layer, and 4 be second signal layer.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.As long as in addition, technical characteristic involved in the various embodiments of the present invention described below
Not constituting a conflict with each other can be combined with each other.
Modularizing integrated circuit plate provided by the invention, vertically to successively negative including the first signals layer, power supply positive layer, power supply
Layer and second signal layer；Or vertically to successively including the first signals layer, power supply negative layer, power supply positive layer and second signal layer；
Circuit in first and second described signals layer is signal path；The power supply positive layer is the positive integrated layer of component power supply；Institute
Stating power cathode is component power supply cathode integrated layer；Between first and second described signals layer and power supply positive layer and negative layer
Cabling be not parallel to each other.
Its surface includes signal circuit region and power circuit region, and the signal circuit region includes: digital signal amount
Class device, are as follows: micro-controller processor device, Digital Logic and signal processor, digital communication switching device etc., the letter
Number circuit region input terminal is connected with electrostatic protection device by power supply positive layer and/or power supply negative layer；The power circuit region
It include: energy work rate class device, are as follows: power adapter part, power drive device etc., power circuit region large driven current density
Control loop is connected with fuse, preferably self-recovery fuse circuit protection device by power supply positive layer and/or power supply negative layer.
Modularizing integrated circuit plate design method provided by the invention, comprising the following steps:
(1) according to design requirement, hardware function schematic diagram is obtained
(2) the hardware function schematic diagram obtained for step (1) selects corresponding device to be laid in integrated circuit board phase
Answer position；
(2-1) electronic component needed for hardware function schematic diagram that step (1) obtains is divided by function as number
Word semaphore class device and energy work rate class device；
The digital signal amount class device is laid in signal circuit region by (2-2), realizes signal control function；
The energy work rate class device is laid in power circuit region by (2-3), realizes power supply conversion and drive control function
Energy.
(3) by the number of hardware system inner function circuit main digital signal amount class device and energy work rate class device
The cabling of pin is laid in the first layer of vertical distribution, the cabling as the first signals layer；By digital signal amount class device and energy
The cabling for measuring the positive pole energization pins of power class device is laid in the second layer or third layer of vertical distribution, just as power supply
The cabling of layer；The cabling of the power cathode energization pins of digital signal amount class device and energy work rate class device is laid in vertically
The third layer or the second layer of distribution, the cabling as power supply negative layer；Hardware system and external input/output function circuit number
The cabling of the digital pin of semaphore class device and energy work rate class device is laid in the 4th layer of vertical distribution, as the second letter
The cabling of number floor；
Wherein first to fourth layer of cabling is not parallel to each other.
The following are embodiments:
Embodiment 1
A kind of hardware system of automobile power back door controller meets the module description that this method is divided, with processor electricity
Road is core, using vehicle power supply as working power, receives the digital switch quantity signal input of outer button and sensor, will control
The logic control result of device system processed is exported as digital switch quantity signal, while needing to export by triode constant power device
Direct current generator is driven to realize electric opening/closing function of tail-gate.
A kind of modularizing integrated circuit plate design method of automobile power back door controller, comprising the following steps:
(1) according to design requirement, hardware function schematic diagram is obtained, as shown in Figure 3.
(2) the hardware function schematic diagram for obtaining step (1) selects corresponding device to be laid in integrated circuit board corresponding
Position；
(2-1) electronic component needed for hardware function schematic diagram that step (1) obtains is divided by function as number
Word semaphore class device and energy work rate class device；
The digital signal amount class device is laid in signal circuit region by (2-2), realizes signal control function；
The energy work rate class device is laid in power circuit region by (2-3), realizes power supply conversion and drive control function
Energy.
(3) by the number of hardware system inner function circuit main digital signal amount class device and energy work rate class device
The cabling of pin is laid in the first layer of vertical distribution, the cabling as the first signals layer；By digital signal amount class device and energy
The cabling for measuring the positive pole energization pins of power class device is laid in the second layer or third layer of vertical distribution, just as power supply
The cabling of layer；The cabling of the power cathode energization pins of digital signal amount class device and energy work rate class device is laid in vertically
The third layer or the second layer of distribution, the cabling as power supply negative layer；By hardware system and external input/output function circuit number
The cabling of the digital pin of word semaphore class device and energy work rate class device is laid in the 4th layer of vertical distribution, as second
The cabling of signals layer；
Wherein first to fourth layer of cabling is not parallel to each other.
Embodiment 2
The automobile power back door controller for designing and making according to 1 design method of embodiment, as shown in Figure 4:
Vertically to successively including the first signals layer, power supply positive layer, power supply negative layer and second signal layer；
The circuit of first signals layer is the main digital signal amount class device of hardware system inner function circuit and energy
Measure the digital pin cabling connection of power class device.
The power supply positive layer is the anode of various working powers needed for signal circuit region and power circuit region；
The power supply negative layer is the cathode of various working powers needed for signal circuit region and power circuit region；
The second signal layer is hardware system and external input/output function circuit digital signal amount class device and energy
Measure the digital pin cabling connection of power class device.Cabling is not parallel to each other between each layer.
Its surface includes signal circuit region and power circuit region, as shown in Figure 5, in which:
The signal circuit region includes processor system module, communication transmission module, signal input/output driving mould
Block, signal input/output end port module；Processing system modules and communication transmission module and signal input/output drive module
It is connected by the first signals layer cabling, the communication transmission module and signal input/output end port module pass through second signal layer
Cabling is connected, and is connected with processor system module by the first signals layer cabling；The signal input/output drive module with
Signal input/output end port module is connected by second signal layer cabling, passes through the first signals layer with processor system module
Cabling is connected；The signal input/output end port module and the communication transmission module, signal input/output drive module are logical
Second signal layer cabling is crossed to be connected.
The processor system module is responsible for controller system logic and motion control software operation, is equipped with reliable reset
Circuit, low power consuming clock circuit, EEPROM storage circuit and 32 high-performance processors；32 high-performance processors
It is connected respectively with reliable reset circuit, low power consuming clock circuit, EEPROM storage circuit by the first signals layer cabling.It is described can
Watchdog reset can reliably restart when being used for software anomaly by reset circuit, and it is low that the low power consuming clock circuit provides processor
Work clock when power consumption suspend mode, the EEPROM storage circuit is for storing software parameter and system state data power-failure memory
Function.
The communication transmission module carries out data interaction, including MAX232 for controller and external system module
Serial port chip, CAN driving chip；The MAX232 serial port chip serial type data communication；The CAN driving chip be responsible for
Full-vehicle CAN bus network carries out data communication；Its one side is converted to serial communication TTL signal by electrical level transferring chip
On the other hand CAN fieldbus signal is converted to CAN standard traffic by CAN driving chip and connect by RS232 standard communication interface
Mouthful, and support CAN2.0A/B standard communication protocol.
The signal input/output drive module, for ensureing that hardware system numeral input/output signal reliability passes
It is defeated, including processor system module is input to by exterior digital input signals are reliable and stable, by processor system module
Digital output signal is reliably exported to signal input/output end port module；Its one side passes through the first signals layer and processor
Module cabling is connected, and is on the other hand connected by second signal layer with signal input/output end port module cabling.
The signal input/output end port module is used for hardware system and external system numeral input/output signal object
Reason connection is summed up, the input signal of digital output signal, external system including hardware system, communication transmission module it is defeated
Enter/output signal；Its one side is connected by second signal layer and signal input/output drive module and communication transmission module cabling
It connects, on the other hand directly with numeral input/output of external system, the physical pin of the input/output of communications connected；It is logical
A spininess connection plug-in unit is crossed, all input/output signals are summarized into tissue, it is convenient to be connect with external device (ED).
The power circuit region includes power input/output end port, power conversion module, electric power loop control mould
Block and power of motor driving and sampling module；The power input port module passes through with the power conversion module
Power supply positive layer is connected with power supply negative layer；The power conversion module and the electric power loop control module pass through power supply positive layer and electricity
Source negative layer cabling is connected；The electric power loop control module and power of motor drive and sampling module passes through power supply positive layer and power supply
Negative layer cabling is connected；Power of motor driving and sampling module and power input/output end port module pass through power positive cathode
Layer cabling is connected；
The power input/output end port module, for using external power supply access hardware system as working power,
And realize that hardware system controls the power drive of external device (ED), including working power inputs physical pin, multi-channel DC motor
It is positive/negative turn power drive output physical pin；Its one side is by second signal layer and power of motor drives and sampling module
Cabling connection, is connect by the positive negative layer of power supply with power conversion module cabling, on the other hand directly defeated with the power supply of external system
Enter, the connection of DC motor positive and negative rotation physical pin；The input of controller main power source and motor driven output are summarized tissue by it, convenient
It is connect with external device (ED).
The power conversion module, for providing different size demand voltage, including the RC capacitance-resistance filter electricity being sequentially connected in series
Road, heavy-duty diode, EDS electrostatic protection device, first and second decompression chip, with, further include with second decompression chip simultaneously
The boost chip of connection is just connected with power supply negative layer cabling by power supply；The controller power source conversion module is using " drop step by step
Former vehicle 12V input voltage is connected filter capacitor and heavy-duty diode by pressure -> boosting " mode, be depressured chip by level-one
Be converted to 5V voltage.On the one hand connection second level boost chip is converted to stable 12V power drive voltage, on the other hand connects second level
Decompression chip is converted to stable 3.3V component operating voltage.The operating voltage of 9~16V can be effectively obtained, and there is power supply
Counnter attack connection function, so that there is reliable and stable power supply performance, not by external power supply influence of fluctuations inside controller hardware.In mould
Block input terminal is connected with ESD (Electro-Static discharge) electrostatic protection device, effectively absorption electrostatic impact.
The electric power loop control module is equipped with input terminal, controlled end and output end；For being received according to controlled end
The control signal arrived, the voltage output that the power conversion module is provided to output end or with output end disconnect；Including straight
Current relay circuit.Its one side effectively turns off the power supply of other modules when controller enters Low-power-consumptiodormancy dormancy, reduces loss,
Meet automotive electronics low-power consumption harshness design requirement；On the other hand when being operated manually tail-gate, it is anti-to reduce pull-off pole motor
The impact of electromotive force and reversed drag effects, adequately protect system hardware circuit and the good user experience of enhancing.
The power of motor driving and sampling module are directed to the drive control of two-way strut motor using full-bridge (abbreviation: H
Bridge) rectifier system, by discrete component built-up circuit；Two-way direct current relay is used for the drive control of self-priming lock motor
Device circuit carries out conducting driving and commutation.It is connected with ESD electrostatic protection device in module input, effectively absorption electrostatic impact.
It is connected with self-recovery fuse (PTC) circuit protection device for two-way strut motor and self-priming lock motor power circuit, and
Design has high-precision current sampling circuit.
The signal circuit region and the power circuit region connect as follows: the power conversion module
The energization pins of two decompression chips and 32 high-performance processors of the processor system module pass through power supply positive layer and power supply
Negative layer cabling is connected, and provides 3.3 volts of operating voltage；The output end and the power of motor of the electric power loop control module
Driving and sampling module are connected by the first signals layer cabling；The control terminal of power of motor driving and sampling module with it is described
32 high-performance processors of processor system module are connected by the first signals layer cabling；The 32 of the processor system module
Position high-performance processor is connected with the control terminal of the electric power loop control module by the first signals layer cabling；The processor
32 high-performance processors and the electric power of system module drive and the control terminal of sampling module passes through the first signals layer
Cabling is connected.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to
The limitation present invention, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should all include
Within protection scope of the present invention.
Claims (10)
1. a kind of modularizing integrated circuit plate, which is characterized in that vertically to successively including the first signals layer, power supply positive layer, power supply
Negative layer and second signal layer；Or
Vertically to successively including the first signals layer, power supply negative layer, power supply positive layer and second signal layer；
Circuit in first and second described signals layer is signal path；
The power supply positive layer is the positive integrated layer of component power supply；
The power supply negative layer is component power supply cathode integrated layer；
Cabling between first and second described signals layer and power supply positive layer and negative layer is not parallel to each other.
2. modularizing integrated circuit plate as described in claim 1, which is characterized in that on surface include signal circuit region and function
Rate circuit region.
3. modularizing integrated circuit plate as claimed in claim 2, which is characterized in that the signal circuit region arrangement includes number
Word semaphore class device；Preferably, the digital signal amount class device include: micro-controller processor device, Digital Logic and
Signal processor, and/or digital communication switching device.
4. modularizing integrated circuit plate as claimed in claim 2, which is characterized in that the power circuit region arrangement includes energy
Measure power class device；Preferably, the energy work rate class device includes: power adapter part and/or power drive device.
5. modularizing integrated circuit plate as claimed in claim 2, which is characterized in that power circuit region input terminal passes through
Power supply positive layer and/or power supply negative layer are connected with electrostatic protection device.
6. modularizing integrated circuit plate as claimed in claim 2, which is characterized in that the power circuit region is passing through power supply just
Layer and/or power supply negative layer are connected with fuse.
7. modularizing integrated circuit plate as claimed in claim 6, which is characterized in that the fuse is self-recovery fuse electricity
Line protection device.
8. modularizing integrated circuit plate as claimed in claim 2, which is characterized in that the power circuit includes that power is defeated
Inbound port module, power conversion module and electric power loop control module；
The power input port module is connected with the power conversion module by power supply positive layer and power supply negative layer；It is described
Power conversion module is connected with signal circuit module region by power supply positive layer and power supply negative layer；The power conversion module passes through
Power supply positive layer and power supply negative layer are connected with the electric power loop control module；The electric power loop control module and signal circuit mould
Block region is connected by the first signals layer；
The power input port module is powered for connecting external power supply to power conversion module；
The power conversion module includes concatenated stage variable pressure chip, for providing demand voltage；
The electric power loop control module is equipped with input terminal, controlled end and output end；What it was used to be received according to controlled end
Control signal, the voltage output that the power conversion module is provided to output end or with output end disconnection.
9. the design method of the modularizing integrated circuit plate as described in claim 1 to 8, which comprises the following steps:
(1) according to design requirement, hardware function schematic diagram is obtained；
(2) the hardware function schematic diagram obtained for step (1) selects corresponding device to be laid in integrated circuit board corresponding positions
It sets；
(3) by the digital pin of hardware system inner function circuit main digital signal amount class device and energy work rate class device
Cabling be laid in the first layer of vertical distribution, the cabling as the first signals layer；By digital signal amount class device and energy function
The cabling of the positive pole energization pins of rate class device is laid in the second layer or third layer of vertical distribution, as power supply positive layer
Cabling；The cabling of the power cathode energization pins of digital signal amount class device and energy work rate class device is laid in vertical distribution
Third layer or the second layer, the cabling as power supply negative layer；Hardware system and external input/output function circuit number are believed
The cabling of the digital pin of number amount class device and energy work rate class device is laid in the 4th floor of vertical distribution, as second signal
The cabling of layer；
Wherein first to fourth layer of cabling is not parallel to each other.
10. modularizing integrated circuit plate design method as claimed in claim 9, which is characterized in that wherein step (2) is specific
Are as follows:
(2-1) electronic component needed for hardware function schematic diagram that step (1) obtains is divided by function to be believed for number
Number amount class device and energy work rate class device；
The digital signal amount class device is laid in signal circuit region by (2-2), realizes signal control function；
The energy work rate class device is laid in power circuit region by (2-3), realizes power supply conversion and drive control function.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201811560995.1A CN109600913A (en) | 2018-12-20 | 2018-12-20 | A kind of modularizing integrated circuit plate and its design method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811560995.1A CN109600913A (en) | 2018-12-20 | 2018-12-20 | A kind of modularizing integrated circuit plate and its design method |
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| CN109600913A true CN109600913A (en) | 2019-04-09 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI755315B (en) * | 2020-04-20 | 2022-02-11 | 日商日立產機系統股份有限公司 | Power conversion device |
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| JP2010135549A (en) * | 2008-12-04 | 2010-06-17 | Mitsubishi Electric Corp | On-board electronic control device |
| CN108415404A (en) * | 2018-02-12 | 2018-08-17 | 南京越博动力系统股份有限公司 | Modular entire car controller power supply and interface circuit and its design method |
| CN209676578U (en) * | 2018-12-20 | 2019-11-22 | 华中科技大学鄂州工业技术研究院 | A kind of modularizing integrated circuit plate |
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2018
- 2018-12-20 CN CN201811560995.1A patent/CN109600913A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010135549A (en) * | 2008-12-04 | 2010-06-17 | Mitsubishi Electric Corp | On-board electronic control device |
| CN108415404A (en) * | 2018-02-12 | 2018-08-17 | 南京越博动力系统股份有限公司 | Modular entire car controller power supply and interface circuit and its design method |
| CN209676578U (en) * | 2018-12-20 | 2019-11-22 | 华中科技大学鄂州工业技术研究院 | A kind of modularizing integrated circuit plate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI755315B (en) * | 2020-04-20 | 2022-02-11 | 日商日立產機系統股份有限公司 | Power conversion device |
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