CN109600536A - Image quick obtaining microchip, preparation method and image fast acquiring method - Google Patents
Image quick obtaining microchip, preparation method and image fast acquiring method Download PDFInfo
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- CN109600536A CN109600536A CN201811476802.4A CN201811476802A CN109600536A CN 109600536 A CN109600536 A CN 109600536A CN 201811476802 A CN201811476802 A CN 201811476802A CN 109600536 A CN109600536 A CN 109600536A
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- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000002360 preparation method Methods 0.000 title claims description 22
- 230000005540 biological transmission Effects 0.000 claims description 36
- 238000004891 communication Methods 0.000 claims description 16
- 238000006243 chemical reaction Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000010410 layer Substances 0.000 description 19
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/024—Details of scanning heads ; Means for illuminating the original
- H04N1/028—Details of scanning heads ; Means for illuminating the original for picture information pick-up
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
Abstract
The present invention provides a kind of image quick obtaining microchip and image fast acquiring methods, image acquisition unit is integrated on MEMS scanning micro-mirror, especially image acquisition unit is arranged on the mirror, it can receive extraneous the reflected beams along the swing of torque arm along with reflecting mirror, also, quickly generating for pixel is realized using the swing of MEMS scanning micro-mirror.The image advantage that there is quickly scanning, high resolution can be obtained due to MEMS scanning micro-mirror, image quick obtaining microchip of the invention can quickly scan extraneous object and image obtains, and, the drawbacks of being separated compared to image grabber in traditional image acquiring device with mirror chip, the present invention effectively reduces light loss, improves brightness of image and clarity.
Description
Technical field
The present invention relates to technical field of image acquisition, and in particular to a kind of image quick obtaining microchip, preparation method
And image fast acquiring method.
Background technique
Existing various image acquiring devices, generally use light source output, and reflecting mirror reflection is different light of reflecting mirror
On the road, object reflected light beam signal is obtained using image acquisition device.Since image acquisition device is mutually separated with reflecting mirror, cause
Beam energy consumption, distorted signals.Moreover, obtained image acquiring device volume is larger, it is unfavorable for miniaturization and lightening.
With the improvement of people's living standards and technological progress, various electronic equipments increasingly tend to miniaturization and light
Thinning, it is easy to carry.And it is higher and higher for the image quality requirements of acquisition, for the acquisition speed and transmission speed of image
Also an urgent demand improves.
Therefore, the requirement in epoch is complied with, it is very heavy for studying lightening and quick obtaining high quality image device technology
It wants.
Summary of the invention
In order to overcome the above problems, the present invention is intended to provide a kind of image quick obtaining microchip, is scanned using MEMS
Integrated image acquiring unit on micro mirror realizes the quick scanning and acquisition of image.
In order to achieve the above object, the present invention provides a kind of image quick obtaining microchips, comprising:
MEMS scanning micro-mirror includes reflecting mirror and torque arm；Reflecting mirror is suspended in entire chip by torque arm；
Image acquisition unit is set in reflecting mirror, for obtaining extraneous light beam；And it is mutually electric with external circuitry element
Even, by external circuitry element come feedback image signal；Wherein, MEMS scanning micro-mirror is swung along torque arm, every to swing one
It is secondary, outside reflection source light beam, and receive extraneous the reflected beams.
In some embodiments, the figure acquiring unit is White-light image sensor, infrared image sensor or both
Mixed image sensor.
In some embodiments, wireless communication module is set in described image acquiring unit；Described image acquiring unit is logical
Wireless communication signal is crossed mutually to be electrically connected with external circuitry element.
In some embodiments, described image acquiring unit is connected with transmission circuit, and transmission circuit is mutually multiple with the torque arm
It closes, is connected using the path that transmission torque arm provides with external circuitry element.
In some embodiments, the chip has groove, and the scanning micro-mirror is placed in the groove, and passes through torsion
Arm connects the chip part of the scanning micro-mirror periphery；The scanning micro-mirror is reversed by torque arm.
In some embodiments, there is interconnection circuit around the chip of the scanning micro-mirror；The interconnection circuit connects
Connect the reflecting mirror and described image acquiring unit；The chip includes at least:
Processor is mutually electrically connected respectively with the scanning micro-mirror and described image acquiring unit, micro- for handling the scanning
The driving logic of mirror and the information transmission logic of described image acquiring unit；
Memory, for storing the image data of image acquisition unit acquisition.
In some embodiments, the thickness that described image obtains microchip is not more than 500 μm.
In order to achieve the above object, the figure that microchip carries out is obtained using above-mentioned image the present invention also provides a kind of
As fast acquiring method comprising following procedure: the MEMS scanning micro-mirror is every swing it is primary, while outside the reflected beams also
Receive extraneous the reflected beams.
In some embodiments, it specifically includes:
Step 01: source emissioning light beam to MEMS scanning micro-mirror；
Step 02:MEMS scanning micro-mirror is swung along torque arm, to be emitted to the MEMS scanning micro-mirror to light source
On light beam of light source quickly scanned, and the external world is reflected by the reflecting mirror；
Step 03: described image acquiring unit is swung with the swing of the MEMS scanning micro-mirror；The external world is by the light
Source beam reflect to form in the reflected beams to the reflecting mirror, and image acquisition unit receives the reflected beams and generates image letter
Number.
In some embodiments, every swing of the MEMS scanning micro-mirror once scans extraneous the reflected beams generation one
Pixel.
In some embodiments, further includes: repeat step 02~03, the external world is scanned using the MEMS scanning micro-mirror
The reflected beams obtain complete image to image acquisition unit.
In some embodiments, in the step 03, described image acquiring unit is believed image by wireless communication signal
Number it is transmitted to external circuitry element；Alternatively, transmission circuit is arranged using the torque arm, picture signal is transmitted using transmission circuit
To external circuitry element.
In some embodiments, in the step 02, further includes: at the driving logic of the MEMS scanning micro-mirror
Reason, and the information transmission logic of image acquisition unit is handled；
In the step 03, further includes: the picture signal generated to described image acquiring unit stores；And carry out
Format conversion, re-sends in external circuitry element.
In order to achieve the above object, the present invention also provides the preparation method that a kind of above-mentioned image obtains microchip,
Include:
Step 01: a chip is provided；MEMS scanning micro-mirror and image acquisition unit and interconnection line are prepared on chip；Its
In, there is reflecting mirror and torque arm in MEMS scanning micro-mirror, be connected by torque arm with interconnection line；Image is prepared in reflecting mirror to obtain
Take unit；Image acquisition unit, reflecting mirror are connected with interconnection line；
Step 02: another chip is provided；By another chip thinning；
Step 03: by another chip bonding of the chip of step 01 and step, so that obtaining 3-D image generates chip.
In order to achieve the above object, the present invention also provides the preparation method that a kind of above-mentioned image obtains microchip,
Include:
Step 01: a chip is provided；
Step 02: MEMS scanning micro-mirror and image acquisition unit and interconnection line are prepared on chip；And it is obtained in image
It takes and prepares wireless communication module in unit；Wherein, there is reflecting mirror and torque arm in MEMS scanning micro-mirror, pass through torque arm and interconnection line
It is connected；Image acquisition unit is prepared in reflecting mirror；Image acquisition unit is connected by wireless communication module with processor.
In order to achieve the above object, the present invention also provides the preparation method that a kind of above-mentioned image obtains microchip,
Include:
Step 01: a chip is provided；On chip prepare MEMS scanning micro-mirror, image acquisition unit, processor and mutually
Line；Contact hole also is prepared in processor bottom simultaneously；Wherein, there is reflecting mirror and torque arm in MEMS scanning micro-mirror, pass through torsion
Arm is connected with interconnection line；Image acquisition unit is prepared in reflecting mirror；Computing unit is arranged around MEMS scanning micro-mirror；
Processor, image acquisition unit and MEMS scanning micro-mirror are connected with interconnection line；
Step 02: another chip being provided, prepares interconnection layer on another chip；
Step 03: by another chip bonding of the chip of step 01 and step 02, contact hole bottom interconnection layer bottom phase key
It closes, so that MEMS scanning micro-mirror and image acquisition unit circuit corresponding with interconnection layer are electrically connected.
Image quick obtaining microchip of the invention is integrated with image acquisition unit on MEMS scanning micro-mirror, especially
Image acquisition unit is arranged on the mirror, can receive extraneous the reflected beams along the swing of torque arm along with reflecting mirror,
Also, quickly generating for pixel is realized using the swing of MEMS scanning micro-mirror.Quickly scanned since MEMS scanning micro-mirror has,
The image advantage of high resolution can be obtained, image quick obtaining microchip of the invention can carry out extraneous object fast
Speed scanning and image obtain, moreover, separated compared to image grabber in traditional image acquiring device with mirror chip
Drawback, the present invention effectively reduce light loss, improve brightness of image and clarity.Also, image quick obtaining of the invention
The preparation of microchip can be compatible with existing CMOS technology, at low cost, especially suitable for large-scale production.
Detailed description of the invention
Fig. 1 is the overlooking structure diagram of the image quick obtaining microchip of one embodiment of the present of invention
Fig. 2 be Fig. 1 in along the direction AA ' image quick obtaining microchip cross section structure schematic diagram
Fig. 3 be Fig. 1 in along the direction BB ' image quick obtaining microchip cross section structure schematic diagram
Fig. 4 be Fig. 1 in along the direction NN ' image quick obtaining microchip cross section structure schematic diagram
Fig. 5 is the different cross section structure schematic diagram of only circuit transmission mode identical as the structure of Fig. 4
The step of Fig. 6~8 are the preparation method of the image quick obtaining microchip of one embodiment of the present of invention is illustrated
Figure
The step of Fig. 9~11 are the preparation method of the image quick obtaining microchip of one embodiment of the present of invention is illustrated
Figure
Figure 12 is the flow diagram of the image fast acquiring method of one embodiment of the present of invention
Figure 13 is the schematic illustration of the image fast acquiring method of one embodiment of the present of invention
Specific embodiment
To keep the contents of the present invention more clear and easy to understand, below in conjunction with Figure of description, the contents of the present invention are made into one
Walk explanation.Certainly the invention is not limited to the specific embodiment, general replacement known to those skilled in the art
It is included within the scope of protection of the present invention.
Below in conjunction with attached drawing 1~13 and specific embodiment, invention is further described in detail.It should be noted that attached drawing
It is all made of very simplified form, using non-accurate ratio, and only to facilitate, clearly reach aid illustration the present embodiment
Purpose.
Referring to Fig. 1, the image quick obtaining microchip of the present embodiment includes:
MEMS scanning micro-mirror includes reflecting mirror 101 and torque arm 103,105；Reflecting mirror 101 passes through torque arm 103,105 suspensions
In entire chip 00.Here, balance ring 104 is also surrounded with around reflecting mirror 101, balance ring 104 passes through torque arm 105 and chip
Connection.Reflecting mirror 101 is connect by torque arm 103 with balance ring.
Here chip has groove, and MEMS scanning micro-mirror is placed in groove, and connects MEMS by torque arm 103,105
00 part of chip of scanning micro-mirror periphery；MEMS scanning micro-mirror is reversed by torque arm 103,105.MEMS scanning micro-mirror can be with
Using conventional biaxial MEMS scanning micro-mirror.The microchip 00 also can directly use MEMS scanning micro-mirror chip, nothing
Chip need to be additionally set.The thickness that image obtains microchip can be made thin, such as no more than 500 μm.
Image acquisition unit 102 is set in reflecting mirror 101, for obtaining extraneous light beam；And with external circuitry member
Part is mutually electrically connected, by external circuitry element come feedback image signal.Here, on the basis of MEMS scanning micro-mirror chip 00,
Image acquisition unit 102 is set in reflecting mirror 101.Figure acquiring unit 102 can pass for White-light image sensor, infrared image
Sensor or both mixed image sensor.
MEMS scanning micro-mirror is swung along torque arm 103,105, every to swing once, outside reflection source light beam, and
Extraneous the reflected beams are received, so that swinging for MEMS scanning micro-mirror can quickly be scanned extraneous the reflected beams
And great amount of images signal is formed, since image acquisition unit is swung with the swing of MEMS scanning micro-mirror, so that figure obtains list
Member can obtain picture signal in real time, and every picture signal once obtained that swings generates a pixel, to constitute the figure of completion
Picture.
Here, image acquisition unit 102 can be mutually electrically connected by wireless communication signal and external circuitry element, and image obtains
Wireless communication module is set in unit 102, such as wifi etc. can also pass through line transmission.For example, image acquisition unit 102
It is connected with transmission circuit.In this way, being provided with interconnection circuit C in the chip 00 of scanning micro-mirror；Interconnection circuit C connection reflecting mirror
101 and image acquisition unit 102；The chip includes at least: Fig. 2 and Fig. 3 are please referred to, it can be in cross section structure figure, in Fig. 3
See, transmission circuit C2 is provided with below reflecting mirror 101, and reflecting mirror 101 is connect by contact hole C1 with transmission circuit C2.?
Interconnection layer C is provided in chip 00 around reflecting mirror 101.For connecting each circuit in interconnection layer C.Need exist for explanation
It is that interconnection layer C also can be set internal in the flute surfaces below reflecting mirror 101.In the combination of Fig. 3 and Fig. 2, transmission circuit
C2 is transferred on interconnection layer C along the bottom and side wall and torque arm 103 and balance ring 104 and torque arm 105 of reflecting mirror 101, is passed
Transmission of electricity road C2 is set in torque arm 103 and 105 and the mode of balance ring 104 can be in torque arm 103 and 105, balance ring 104
Surface, or in torque arm 103 and 105 and the center interlayer of balance ring 104 has transmission circuit C2.It should be noted that i.e.
Make in the scanning swing process of reflecting mirror 101, torque arm 103 and 105 can generate certain deformation, due to the ruler of transmission circuit C2
It is very little very tiny, usually metal material, such as copper, or conductive polymer material has certain elasticity, will not produce
Raw fracture.It in the microchip of the present embodiment, can also include at least: processor 202 and memory 203.
Processor 202 is mutually electrically connected respectively with scanning micro-mirror 101 and image acquisition unit 102, for handling scanning micro-mirror 101
Driving logic and image acquisition unit 102 information transmission logic.
The image data that memory 203 is used to store the acquisition of image acquisition unit 102 is closed, and transmission torque arm 103,105 is utilized
The path of offer is connected with external circuitry element.
Format converter can also be set in the chip 00 around reflecting mirror 101, for converting image acquisition unit 102
The format of the picture signal of acquisition is docked with external circuitry unit.
It please refers to Fig. 4 and combines Fig. 1, the chip around MEMS scanning micro-mirror is arranged in processor 202 and memory 203
In, the connecting line between processor 202, memory 203 and interconnection line C can be set in chip surface.In addition, please referring to Fig. 5
And Fig. 1 is combined, the connection between processor 202, memory 203 and interconnection line C can use contact hole C3 and be set to chip
The interconnection layer C4 at 00 back side is connected, and interconnection line C is connect with interconnection layer C4 at this time.Interconnection layer C4 can be located at the processing in Fig. 1
The connecting line aligned beneath position of device 202, memory 203, at this point, connecting line is not provided with.It should be noted that interconnection layer
C4 can be arbitrarily arranged, as long as by each unit or device connection in chip 00.
In the present embodiment, processor 202 is mutually electrically connected respectively with scanning micro-mirror 101 and image acquisition unit 102, for handling
The driving logic of scanning micro-mirror 101 and the information transmission logic of image acquisition unit 102.Memory 203 is obtained for storing image
The image data for taking unit 102 to obtain is closed, and is connected using the path that transmission torque arm 103,105 provides with external circuitry element.
In addition, the above-mentioned image of the present embodiment obtains the preparation method of microchip, following process can be used:
Step 01: please referring to Fig. 6 and combine Fig. 1, the cross section structure in the direction AA ' is shown from Fig. 1 in Fig. 6；There is provided one
Chip X01；MEMS scanning micro-mirror and image acquisition unit 102 and interconnection line C are prepared on chip X01；Have in interconnection line C
The connection circuit to match with MEMS scanning micro-mirror, reflecting mirror 101 is connect by torque arm 103 and 105 with interconnection line C here.?
Image acquisition unit 102 is prepared on reflecting mirror 101.In this step 01, processor 202 and memory are also prepared in chip X01
203；Processor 202 is mutually electrically connected by interconnection line C with scanning micro-mirror and image acquisition unit 102 respectively, micro- for handling scanning
The driving logic of mirror and the information transmission logic of image acquisition unit 102；Memory 203 is obtained single by interconnection line C and image
Member 102 is connected；Image processor 202, memory 203 are connected with interconnection line C.
Step 02: referring to Fig. 7, providing another chip X02；Here, chip X02 can be subtracted by reduction process
It is thin.
Step 03: referring to Fig. 8, the chip X01 of the step 01 and chip X02 of step 02 is bonded, to obtain image
Obtain microchip 00.
The specific structure for obtaining microchip 00 about image repeats no more, and may refer to foregoing description.
In addition, in conjunction with Fig. 1 and Fig. 5, in Fig. 5, processor 202 and memory 203 using 00 back side of chip interconnection
Layer C4 mode to connect with interconnection line C, and the above-mentioned image of the present embodiment obtains the preparation method of microchip, can also be using such as
Lower process:
Step 01: please referring to Fig. 9 and combine Fig. 1, the cross section structure in the direction NN ' is shown from Fig. 1 in Fig. 9；There is provided one
Chip Y01；On chip Y01 prepare MEMS scanning micro-mirror, image acquisition unit 102, processor 202, memory 203 and mutually
Line C；There is the connection circuit to match with MEMS scanning micro-mirror in interconnection line C；Here reflecting mirror 101 passes through 103 He of torque arm
105 connect with interconnection line C.In this step 01, processor 202 and memory 203 are also prepared in chip Y01；It also prepares simultaneously
Contact hole C3 positioned at 203 bottom of processor 202 and memory.Image acquisition unit 102 passes through torque arm 103 and 105 and interconnection
Line C is connected.
Step 02: referring to Fig. 10, providing another chip Y02, preparing interconnection layer C4 on another chip Y02；Specifically,
Processor 202, memory 203 are mutually electrically connected respectively by interconnection layer C4 and interconnection line C, scanning micro-mirror and image acquisition unit 102,
For handling the driving logic of scanning micro-mirror and the information transmission logic of image acquisition unit 102；Processor 202, memory 203
It is connected by interconnection layer C4 with interconnection line C, image acquisition unit 102；Image processor 202, memory 203 are and interconnection layer
C4, interconnection line C are connected.Preparation about interconnection layer C4 can be using conventional interconnection layer preparation process, such as etching and filling
Conductive metal etc..
Step 03: please referring to Figure 11, the chip Y01 of the step 01 and chip Y02 of step 02 is bonded, so that MEMS is scanned
Micro mirror and image acquisition unit circuit corresponding with interconnection layer are electrically connected.
In addition, the preparation method of microchip is obtained for the above-mentioned image using wireless communication mode of the present embodiment,
Incorporated by reference to Fig. 1, following process can also be used:
Step 01: a chip 00 is provided；
Step 02: MEMS scanning micro-mirror and image acquisition unit 102 and interconnection line C are prepared on chip 00；Interconnection line C
In there is the connection circuit that matches with MEMS scanning micro-mirror；Here, in step 02, processor 202 is also prepared in chip 00
With memory 203；Processor 202 is mutually electrically connected by interconnection line C with scanning micro-mirror, for handling the driving logic of scanning micro-mirror；
Memory 203 is connected by interconnection line C with image acquisition unit 102；Image processor 202, memory 203 with interconnection line C
It is connected.In step 02 further include: prepare wireless communication module in image acquisition unit；Pass through wireless communication module and processor
202 connections and signal transmission.
The production that image obtains microchip is completed based on above-mentioned steps 01 and step 02.Chip is generated about 3-D image
Specific structure may refer to foregoing description, which is not described herein again.
It should be noted that since the preparation process of MEMS scanning micro-mirror is mature, the image of the present embodiment is fast
The preparation that speed obtains microchip can be prepared in the preparation process of MEMS scanning micro-mirror, and image acquisition unit is usually adopted
It is prepared with CMOS technology, and the preparation of MEMS scanning micro-mirror is also compatible in CMOS technology, therefore, the two can be fine
Compatibility, without increasing cost.Image acquisition unit can be prepared while preparing the reflecting mirror of MEMS scanning micro-mirror,
For example, groove and through-hole structure are arranged in reflecting mirror, by filling through-hole and preparing image acquisition unit in the trench come real
Existing structure and electrical transmission, can also first prepare the transmission circuit of image acquisition unit and bottom using CMOS technology, then
The structure such as carrying out lithography and etching technique and prepare reflecting mirror and torque arm around image acquisition unit.About reflecting mirror and torque arm
Preparation can use common process, which is not described herein again.
Figure 12 is please referred to, obtains the image quick obtaining side that microchip carries out for the above-mentioned image using the present embodiment
Method, it is characterized in that, MEMS scanning micro-mirror is every to be swung primary, and outside the reflected beams whiles also receives extraneous the reflected beams,
Every swing once generates an image pixel.It specifically includes:
Step 01: source emissioning light beam to MEMS scanning micro-mirror.Here light source can be laser light source, LED light source etc..
Light source can be the mixing of white light source, infrared light supply or the two.And it is directed to and the mixing of the two, image acquisition unit difference
White light reflection light beam and infrared external reflection light beam is obtained to form image to integrate.
Step 02:MEMS scanning micro-mirror is swung along torque arm, to be emitted on MEMS scanning micro-mirror to light source
Light beam of light source is quickly scanned, and is reflected into the external world by reflecting mirror；
Specifically, the process of MEMS scanning micro-mirror scanning light source light beam can use conventional sweep, MEMS scanning micro-mirror is set
It sets in the optical path of source emissioning light beam.Furthermore step 02 can also include: at the driving logic to MEMS scanning micro-mirror
Reason, and the information transmission logic of image acquisition unit is handled.
Step 03: image acquisition unit is swung with the swing of MEMS scanning micro-mirror；The external world carries out light beam of light source anti-
It penetrates to be formed in the reflected beams to reflecting mirror, image acquisition unit receives the reflected beams and generates picture signal.
Specifically, picture signal is transmitted to external circuitry element by wireless communication signal by image acquisition unit；Alternatively,
Transmission circuit is set using torque arm, picture signal is transmitted to external circuitry element using transmission circuit.Further, since MEMS is swept
Processor, memory etc. can also be arranged by retouching in micromirror chip, can also include: to generate in this step to image acquisition unit
Picture signal is stored；And it formats, re-sends in external circuitry element.
In this way, repeating step 02~04, extraneous the reflected beams are scanned using MEMS scanning micro-mirror to image and obtain list
Member obtains complete image.
Figure 13 is please referred to, light source is launched light beam and projected on the reflecting mirror of MEMS scanning micro-mirror, thick dashed line table in Figure 13
Show that reflecting mirror, solid line with the arrow and dotted line indicate that optical path direction, the light beam that light source comes out are projected on reflecting mirror, had with one
Light beam towards reflecting mirror arrow filled with shallower pattern and one indicates towards the light beam filled with deeper pattern of object, from
The reflected light beam of object is indicated with a light beam filled with shallower pattern with the arrow from object to reflecting mirror.From object
The light beam that body reflection can come is acquired in image acquisition unit 102, it can be seen that light beam is covered on image acquisition unit 102.
What needs to be explained here is that since image acquisition unit is integrated on reflecting mirror, image acquisition unit is directed to
The incident light of light source and the reflected light of object are provided with identification module, the reflected beams are obtained using identification module, so that it is guaranteed that obtaining
Take the accuracy of image.This identification module can calculate acquisition according to the power of light beam, path length difference etc., for example, light source enters
It is very high to penetrate luminous intensity, and intensity of reflected light is lower, therefore, in preset threshold range, can screen out incident optical signal.Also
It is to be directed to different light sources, different Intensity threshold ranges can be set in identification module, the light within the scope of the Intensity threshold is silent
Think incident light and be removed, the identified reflected light out of image acquisition unit that is to say and only collect reflected light.
In addition, it is very small by microchip area in this present embodiment, and the area of reflecting mirror therein is smaller, it is single
A light beam is enough to cover reflecting mirror, is not in the problem that light beam cannot be irradiated on image acquisition unit.For example, MEMS is swept
The reflecting mirror in micromirror chip is retouched, for diameter dimension in 3~4 millimeters hereinafter, area is very small, common hot spot can all cover it
In.And the reflected beams reflected through object can also cover on the mirror naturally.At this point, utilizing reflecting mirror in MEMS scanning micro-mirror
Along the swing of torque arm, to obtain the beam information of each position of object, to obtain whole image information.In this way, about image
The processing and storage of signal can also be arranged in MEMS scanning micro-mirror chip, so that enormously simplifying whole image obtains chip
Volume and weight, improve image obtain chip integrated level so that the image acquiring device based on this is more light and portable.
Herein in relation to MEMS scanning micro-mirror, outwardly reflection source light beam with the process for scanning extraneous the reflected beams is synchronous
It carries out, is to be completed on MEMS scanning micro-mirror, thus the disadvantage for avoiding existing image acquiring device from separating with scanning micro-mirror
End reduces loss, keeps the fidelity of picture signal, shortens transmission path, accelerates transmission.Utilize the quick of MEMS scanning micro-mirror
Scanning, quick obtaining image, and available high-resolution image.
In conclusion being integrated with image acquisition unit on MEMS scanning micro-mirror, especially image acquisition unit is arranged anti-
It penetrates on mirror, extraneous the reflected beams can be received along the swing of torque arm along with reflecting mirror, also, utilize MEMS scanning micro-mirror
Swing to realize quickly generating for pixel.The figure that there is quickly scanning, high resolution can be obtained due to MEMS scanning micro-mirror
As advantage, image quick obtaining microchip of the invention can quickly scan extraneous object and image obtains, and
And the drawbacks of being separated compared to image grabber in traditional image acquiring device with mirror chip, the present invention effectively reduces
Light loss, improves brightness of image and clarity.
Although the present invention is disclosed as above with preferred embodiment, the right embodiment illustrate only for the purposes of explanation and
, it is not intended to limit the invention, if those skilled in the art can make without departing from the spirit and scope of the present invention
Dry changes and retouches, and the protection scope that the present invention is advocated should be subject to described in claims.
Claims (16)
1. a kind of image quick obtaining microchip characterized by comprising
MEMS scanning micro-mirror includes reflecting mirror and torque arm；Reflecting mirror is suspended in entire chip by torque arm；
Image acquisition unit is set in reflecting mirror, for obtaining extraneous light beam；And it is mutually electrically connected with external circuitry element,
By external circuitry element come feedback image signal；Wherein, MEMS scanning micro-mirror is swung along torque arm, every to swing once,
Outside reflection source light beam, and receive extraneous the reflected beams.
2. image according to claim 1 obtains microchip, which is characterized in that the figure acquiring unit is white light figure
As sensor, infrared image sensor or both mixed image sensor.
3. image according to claim 1 obtains microchip, which is characterized in that nothing is arranged in described image acquiring unit
Line communication module；Described image acquiring unit is mutually electrically connected by wireless communication signal with external circuitry element；.
4. image according to claim 1 obtains microchip, which is characterized in that described image acquiring unit is connected with biography
Transmission of electricity road, transmission circuit and the torque arm are mutually compound, are connected using the path that transmission torque arm provides with external circuitry element.
5. image according to claim 4 obtains microchip, which is characterized in that the chip has groove, described to sweep
It retouches micro mirror to be placed in the groove, and connects the chip part of the scanning micro-mirror periphery by torque arm；The scanning micro-mirror
It is reversed by torque arm.
6. the image according to claim 3 or 5 obtains microchip, which is characterized in that around the institute of the scanning micro-mirror
Chip is stated with interconnection circuit；The interconnection circuit connects the reflecting mirror and described image acquiring unit；The chip is at least
Include:
Processor is mutually electrically connected, respectively for handling the scanning micro-mirror with the scanning micro-mirror and described image acquiring unit
Drive the information transmission logic of logic and described image acquiring unit；
Memory, for storing the image data of image acquisition unit acquisition.
7. image according to claim 1 obtains microchip, which is characterized in that the thickness of described image acquisition microchip
Degree is not more than 500 μm.
8. a kind of obtain the image fast acquiring method that microchip carries out using image described in claim 1, feature exists
In including following procedure: the MEMS scanning micro-mirror is every to be swung primary, and outside the reflected beams whiles also receives extraneous reflection
Light beam.
9. image fast acquiring method according to claim 8, which is characterized in that specifically include:
Step 01: source emissioning light beam to MEMS scanning micro-mirror；
Step 02:MEMS scanning micro-mirror is swung along torque arm, to be emitted on the MEMS scanning micro-mirror to light source
Light beam of light source is quickly scanned, and is reflected into the external world by the reflecting mirror；
Step 03: described image acquiring unit is swung with the swing of the MEMS scanning micro-mirror；The external world is by the light source light
Shu Jinhang is reflected to form in the reflected beams to the reflecting mirror, and image acquisition unit receives the reflected beams and generates picture signal.
10. image fast acquiring method according to claim 9, which is characterized in that the every swing of MEMS scanning micro-mirror
Once, extraneous the reflected beams are scanned and generate a pixel.
11. image fast acquiring method according to claim 10, which is characterized in that further include: step 02~03 is repeated,
Extraneous the reflected beams are scanned using the MEMS scanning micro-mirror obtains complete image to image acquisition unit.
12. image fast acquiring method according to claim 9, which is characterized in that in the step 03, described image is obtained
Take unit that picture signal is transmitted to external circuitry element by wireless communication signal；It is transmitted alternatively, being arranged using the torque arm
Picture signal is transmitted to external circuitry element using transmission circuit by circuit.
13. image fast acquiring method according to claim 9, which is characterized in that in the step 02, further includes: right
The driving logic of the MEMS scanning micro-mirror is handled, and is handled the information transmission logic of image acquisition unit；
In the step 03, further includes: the picture signal generated to described image acquiring unit stores；And carry out format
Conversion, re-sends in external circuitry element.
14. the preparation method that a kind of image described in claim 1 obtains microchip characterized by comprising
Step 01: a chip is provided；MEMS scanning micro-mirror and image acquisition unit and interconnection line are prepared on chip；Wherein,
There is reflecting mirror and torque arm in MEMS scanning micro-mirror, be connected by torque arm with interconnection line；Image acquisition is prepared in reflecting mirror
Unit；Image acquisition unit, reflecting mirror are connected with interconnection line；
Step 02: another chip is provided；By another chip thinning；
Step 03: by another chip bonding of the chip of step 01 and step, so that obtaining 3-D image generates chip.
15. the preparation method that a kind of image described in claim 1 obtains microchip characterized by comprising
Step 01: a chip is provided；
Step 02: MEMS scanning micro-mirror and image acquisition unit and interconnection line are prepared on chip；And it is obtained in image single
Wireless communication module is prepared in member；Wherein, there is reflecting mirror and torque arm in MEMS scanning micro-mirror, pass through torque arm and interconnection line phase
Even；Image acquisition unit is prepared in reflecting mirror；Image acquisition unit is connected by wireless communication module with processor.
16. the preparation method that a kind of image described in claim 1 obtains microchip characterized by comprising
Step 01: a chip is provided；MEMS scanning micro-mirror, image acquisition unit, processor and interconnection line are prepared on chip；
Contact hole also is prepared in processor bottom simultaneously；Wherein, there is reflecting mirror and torque arm, by torque arm and mutually in MEMS scanning micro-mirror
Line is connected；Image acquisition unit is prepared in reflecting mirror；Computing unit is arranged around MEMS scanning micro-mirror；Processing
Device, image acquisition unit and MEMS scanning micro-mirror are connected with interconnection line；
Step 02: another chip being provided, prepares interconnection layer on another chip；
Step 03: by another chip bonding of the chip of step 01 and step 02, contact hole bottom interconnection layer bottom is mutually bonded, makes
It obtains MEMS scanning micro-mirror and image acquisition unit circuit corresponding with interconnection layer is electrically connected.
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| CN108519673A (en) * | 2018-04-28 | 2018-09-11 | 重庆大学 | The scanning micro-mirror of integrated differential type angle transducer |
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| US20020024007A1 (en) * | 2000-08-03 | 2002-02-28 | Lecia Microsystems Heidelberg Gmbh | Scanning microscope, optical arrangement and method for imaging in scanning microscopy |
| CN102540672A (en) * | 2012-02-15 | 2012-07-04 | 凝辉(天津)科技有限责任公司 | Miniature single-catoptron and single-light-source array type laser scanning projection device |
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