CN109598711A - A kind of thermal image defect extracting method based on feature mining and neural network - Google Patents

A kind of thermal image defect extracting method based on feature mining and neural network Download PDF

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CN109598711A
CN109598711A CN201811451815.6A CN201811451815A CN109598711A CN 109598711 A CN109598711 A CN 109598711A CN 201811451815 A CN201811451815 A CN 201811451815A CN 109598711 A CN109598711 A CN 109598711A
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程玉华
殷春
张昊楠
薛婷
黄雪刚
陈凯
石安华
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University of Electronic Science and Technology of China
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Abstract

The thermal image defect extracting method based on feature mining and neural network that the invention discloses a kind of removes redundancy by choosing the step-length in thermal image sequence for image block, and according to piecemeal, extracts representative transient thermal response.The present invention extracts the total amount of heat of transient thermal response, the rate of temperature change of endothermic phase, the rate of temperature change of exothermic phase, temperature mean value, temperature peak these features using feature extraction formula, and according to the feature extracted, construct neural network, and transient thermal response is classified, then, three-dimensional matrice is converted, obtain the two dimensional image containing defect area, cluster and binaryzation finally are carried out to the two dimensional image containing defect area using FCM Algorithms, final defect image is obtained, to extract the defect characteristic of thermal image.The present invention improves the reasonability of cluster by the profound physical message excavated transient thermal response curve and included, to improve the precision of defect extraction.

Description

A kind of thermal image defect extracting method based on feature mining and neural network
Technical field
The invention belongs to defect detecting technique fields, more specifically, are related to a kind of based on feature mining and nerve net The thermal image defect extracting method of network.
Background technique
Thermal-induced imagery detection technique obtains material by the thermal field variation of control thermal excitation method and measurement material surface Surface and its surface structural information below, to achieve the purpose that detection.When obtaining structural information, infrared heat is usually used As the thermal field information that instrument record surface of test piece or sub-surface change over time, and it is converted into thermal image sequence and shows Come.Since the data volume of the thermal image sequence obtained with thermal infrared imager is huge, noise jamming is strong, in order to obtain better detection Effect needs to carry out feature extraction to thermal image sequence.
When handling thermal image sequence, there is the method based on single-frame images processing, also there is the side based on image sequence processing Method.Method based on single-frame images processing only considered test specimen in the temperature distribution information at some moment, can not embody examination Part in the temperature conditions of different moments, obtained processing result be it is incomplete, it is unilateral.Therefore based on image sequence processing Method has obtained extensive concern and research.
What infrared thermal imaging detection was commonly used is vortex thermal imaging.According to the law of electromagnetic induction, when the friendship for being passed through high frequency When the induction coil of time-dependent current is close to conductor test specimen (abbreviation test specimen), vortex can be generated on the surface of test specimen.If in test specimen Defective, vortex will be forced to change its flow direction, this will be so that measured piece internal vortex density changes around defect.By coke Ear law is converted into Joule heat it is found that being vortexed in test specimen, causes the heat generated in test specimen uneven, to generate high-temperature region And low-temperature space, due to the otherness of temperature, high-temperature region heat, to low temperature block transitive, leads to test specimen different zones temperature by heat transfer Degree changes, and the change procedure of test specimen temperature is acquired by thermal infrared imager, then gives the thermal image sequence of acquisition to meter Calculation machine is analyzed and processed, and to obtain test specimen relevant information, realizes the qualitative and quantitative detection of defect.
On October 30th, 2018 announce, publication No. CN108712069A, it is entitled " one kind based on row variable step divide In the Chinese invention patent application of the high-pressure bottle thermal imaging imperfection detection method cut ", be utilized step length searching method carry out it is scarce The extraction of feature is fallen into, uses FCM Algorithms by transient thermal response curve classification after this.In the application for a patent for invention In, FCM Algorithms by cluster centre and subordinating degree function by transient thermal response curve classification, can by its objective function Know, principle of classification is to minimize the distance between sample and cluster centre, however this method rings every thermal transient The physical significance for answering curve to be contained is not excavated further.By there is no the profound transient thermal response curve that excavates to be wrapped The physical message contained, so that the reasonability of cluster reduces, to affect the precision of defect extraction.
Summary of the invention
The heat based on feature mining and neural network that it is an object of the invention to overcome the deficiencies of the prior art and provide a kind of Image deflects extracting method, by the profound physical message excavated transient thermal response curve and included, to improve the conjunction of cluster Rationality, to improve the precision of defect extraction.
For achieving the above object, the present invention is based on the thermal image defect extracting method of feature mining and neural network, Characterized by comprising the following steps:
(1), the thermal image sequence that thermal infrared imager obtains is indicated with three-dimensional matrice S, element S (i, j, t) table therein Show the i-th row of the t frame thermal image of thermal image sequence, the pixel value of jth column;
(2), max pixel value S (i is selected from three-dimensional matrice Szz,jzz,tzz), wherein izz、jzzAnd tzzRespectively indicate maximum The frame number of pixel value pixel line number of the row, the columns of column and place frame;
(3), for the t of three-dimensional matrice SzzFrame chooses jthzzRow chooses P according to the variation of pixel value (i.e. temperature value) A pixel value trip point, trip point are located between two jump pixel value pixels, are carried out by row to three-dimensional matrice S with trip point It divides, obtains P+1 row data block;
In p-th of row data block SpIn (p=1,2 ..., P+1), find max pixel value, be denoted asIts In,Respectively indicate p-th of row data block SpMiddle max pixel value pixel line number of the row, column columns with And the frame number of place frame, then max pixel valueCorresponding transient thermal response is T is the total quantity of three-dimensional matrice S frame;
P-th of row data block S is setpTemperature threshold be THREp, calculate transient thermal responseMost with distance Big pixel value, that is, temperature maximumPixel column from the near to the distant ring by the corresponding thermal transient of pixel pixel value It answersBetween degree of correlation Reb, b successively takes 1,2 ..., and judges degree of correlation RebWhether temperature threshold is less than THREp, when being less than, stop calculating, at this point, pixel spacing b is p-th of row data block row data block SpRow step-length, be denoted as CLp
(4), for the t of three-dimensional matrice SzzFrame chooses i-thzzRow chooses Q according to the variation of pixel value (i.e. temperature value) A pixel value trip point, trip point are located between two jump pixel value pixels, are carried out by column to three-dimensional matrice S with trip point It divides, obtains Q+1 column data block;
In q-th of column data block SqIn (q=1,2 ..., Q+1), find max pixel value, be denoted asIts In,Respectively indicate q-th of column data block SqMiddle max pixel value pixel line number of the row, column columns with And the frame number of place frame, then max pixel valueCorresponding transient thermal response is T is the total quantity of three-dimensional matrice S frame;
Q-th of column data block S is setqTemperature threshold be THREq, calculate transient thermal responseMost with distance Big pixel value, that is, temperature maximumThe pixel corresponding thermal transient of pixel pixel value from the near to the distant of being expert at is rung It answersBetween degree of correlation Red, d successively takes 1,2 ..., and judges degree of correlation RedWhether temperature threshold is less than THREq, when being less than, stop calculating, at this point, pixel spacing d is d-th of column data block SqColumn step-length, be denoted as CLq
(5), piecemeal substep is long chooses transient thermal response
(5.1), the K pixel value that the P pixel value trip point chosen according to step (3) is chosen by column and step (4) Trip point carries out piecemeal to three-dimensional matrice S by row, obtains a data block of (P+1) × (Q+1), pth, upper q-th of the data of column on row Block is expressed as Sp,q
(5.2), for each data block Sp,q, threshold value DD is set, set number g=1, initialized pixel point are initialized Set i=1, j=1, and by max pixel value S (izz,jzz,tzz) corresponding transient thermal response S (izz,jzz, t), t=1,2 ..., T is stored in set X (g);Then data block S is calculatedp,qMiddle pixel is located at i row, the transient thermal response S of j columnp,q(i,j, T), t=1, the degree of correlation Re between 2 ..., T, with set X (g)i,j, and judge:
If Rei,j< DD, then g=g+1, and by transient thermal response Sp,q(i, j, t), t=1,2 ..., T are new as one Characteristic storage is in set X (g);Otherwise, i=i+CL is enabledp, continue to calculate next transient thermal response Sp,q(i, j, t), t=1, 2 ..., the degree of correlation of T and set X (g);If i > Mp,q, then i=i-M is enabledp,q, j=j+CLq, that is, change to jth+CLqArrange into Row calculates, if j > Np,q, then transient thermal response is chosen and is finished, wherein Mp,q、Np,qRespectively data block Sp,qLine number, column Number;
(6), all set X (g) the i.e. transient thermal response for all a data blocks of (P+1) × (Q+1) that step (5) is chosen is G item carries out feature extraction to this G transient thermal response, and is divided into L class
(6.1), feature extraction
Calculate the energy of every transient thermal response:
Wherein, g is transient thermal response serial number, g=1,2 ..., G, xg,tIt is (warm in the pixel value of t frame for transient thermal response g Angle value);
Calculate rate of temperature change of the every transient thermal response in endothermic process:
Wherein, tmidIndicate heating termination frame number, t0Indicate heating starting frame number (usually 1, i.e. the 1st frame);
Calculate rate of temperature change of the every transient thermal response in exothermic process:
Wherein, tendIndicate that heat release terminates frame number;
Calculate the average temperature value of every transient thermal response:
Calculate the maximum temperature values of every transient thermal response:
After completing feature extraction, every transient thermal response can be indicated are as follows:
(6.2), clusters number L is set, wherein not only having contained the classification of defective part, but also contains zero defect part Classification;
Triumph neuron neighborhood σ (0), Studying factors η (0) are initialized, input layer number is equal to Characteristic Number 5, Mapping layer neuron number is L, and initializing each mapping layer neuron weight is When initializing the number of iterations k=0, then it is iterated
(6.3), a transient thermal response X at the kth iteration, is chosen from G transient thermal response at randomgAs And it indicates are as follows:
It calculatesWith the weight of each mapping layer neuronBetween Euclidean distance, to select triumph neuron:
Wherein, l=1,2 ..., L;
It will be apart from transient thermal response XgNearest mapping layer neuron is as triumph neuron l*, it may be assumed that
(6.4), according to the weight of triumph neuronAnd in its neighborhood neuron weight, to each mapping layer mind Weight through member is updated:
Wherein, Studying factors η (k) is a monotonic decreasing function, and its value is greater than 0 less than 1, and characterization weight changes fast Slowly, hcl*(k) are as follows:
Wherein, | | rc-rl*||2Indicate the distance of neuron c to triumph neuron l* in triumph neuron neighborhood, σ (k) table Show the size of triumph neuron neighborhood;
As η (k) < ηminOr k < kmaxOrWhen, iteration terminates;Otherwise k=k+1 and return (6.3), In, ηminIndicate the minimum value of Studying factors, kmaxIndicate maximum number of iterations, ε indicates the worst error allowed;
At the end of iteration, final mapping layer neuron weight is obtainedRemove the number of iterations label, and Again it is denoted as: W1,W2,...,WL, then it is used for the classification of the test specimen transient thermal response;
(6.5), by each transient thermal response X of G transient thermal responseg, g=1,2 ..., G, input neural network, It calculates each transient thermal response and arrives L final mapping layer neuron weight W respectively1,W2,...,WLDistance, distance recently Mapping layer neuron weight corresponding to classification be transient thermal response XgCorresponding classification, it may be assumed that
Wherein,Indicate transient thermal response XgFinal classification, Wl be first of final mapping layer neuron weight;
(7), the representative of every one kind is found for L class transient thermal response, and constitutes the matrix Y for constituting a T × L
(7.1), the center for seeking every a kind of transient thermal response first, such center is indicated with the mean value of every one kindThat is:
Wherein, the mean value of each frameIt can be calculate by the following formula:
Wherein,For clThe quantity of class transient thermal response,Respectively indicate clThe 1st article of class,Transient state Pixel value (temperature value) of the thermal response in t frame;
(7.2), it usesIndicate clThe representative of class, and it is calculate by the following formula the representative of every one kind:
Wherein,It indicates in addition to classification clOther category sets in addition;
I.e. in classification cl'sA transient thermal response is found in transient thermal responseMeet and other classifications cu's Transient thermal response centerDistance and maximum;
(7.3), the transient response of L class is represented(one is classified as the pixel value i.e. temperature value at T moment) is placed by column, Constitute the matrix Y of a T × L;
(8), by each frame in three-dimensional matrice S since first row, latter column are connect at the end of previous column, are constituted new A column, obtain the corresponding T column pixel value of T frame, then, according to time order and function, T column pixel value be sequentially placed, constitutes I × J Row, T column two dimensional image matrix O, carry out linear transformation to two-dimensional matrix O with matrix Y, it may be assumed thatObtain two dimensional image Matrix R, whereinIt is the pseudo inverse matrix of matrix Y, O for L × T matrixTThe transposed matrix of two dimensional image matrix O, obtained two dimension Image array R is L row, I × J column;
Every a line of two dimensional image matrix R is intercepted by J Leie, and the J of interception is arranged to be sequentially placed by row, constitutes one I × J two dimensional image is opened, such L row obtains L I × J two dimensional images, these pictures all contain defect area, for convenience of lacking Contours extract is fallen into, a two dimensional image of defect area and non-defective region pixel value (temperature value) disparity is selected, and is remembered For f (x, y);
(9), image segmentation is carried out to two dimensional image f (x, y) using FCM Algorithms, realizes feature extraction:
It is clustered using the two dimensional image f (x, y) of FCM Algorithms pair, according to degree of membership maximum, is obtained every first A pixel generic, then amplitude of the value of category cluster centre as the pixel, the image after being divided, most Afterwards, image after segmentation is converted into bianry image, i.e. given threshold is TH, and pixel amplitude is greater than TH in image after segmentation When, which is set as 1, otherwise amplitude is set as 0;Bianry image is defect image, to complete the extraction of defect.
Goal of the invention of the invention is achieved in that
The present invention is based on the thermal image defect extracting methods of feature mining and neural network, by choosing in thermal image sequence Step-length remove redundancy by image block, and according to piecemeal, extract representative transient thermal response.The present invention passes through for it The analysis of preceding result finds different classes of transient thermal response, and there are biggish othernesses in some physical quantitys.Such as total heat Amount, the rate of temperature change of endothermic phase, the rate of temperature change of exothermic phase, temperature mean value, temperature peak, the present invention utilize feature It extracts formula to extract these features of transient thermal response, and according to the feature extracted, constructs neural network, and will Transient thermal response classification, then, converts three-dimensional matrice, obtains the two dimensional image containing defect area, finally uses mould Paste C mean algorithm carries out cluster and binaryzation to the two dimensional image containing defect area, final defect image is obtained, to mention Take out the defect characteristic of thermal image.The present invention is improved by the profound physical message excavated transient thermal response curve and included The reasonability of cluster, to improve the precision of defect extraction.
Meanwhile the present invention is based on the thermal image defect extracting methods of feature mining and neural network also to have below beneficial to effect Fruit:
(1), the present invention sufficiently excavates the physical characteristic of transient thermal response, and according to different classes of transient thermal response not jljl Reason characteristic between otherness transient thermal response is classified, in terms of the classification for transient thermal response than conventional method more adduction Reason;
(2), the present invention establishes defects detection using self-organizing feature map after extracting transient thermal response physical characteristic Model.Final result compared with ICA algorithm result, the present invention no matter in trend or in physical significance for former thermal transient The reduction degree of response is higher;
(3), the present invention realizes the defects of high efficiency extraction test specimen information using ranks variable step-size search, and accurately carves Defect profile is drawn, some shortcomings that conventional method extracts defect are compensated for.
Detailed description of the invention
Fig. 1 is a kind of specific embodiment of thermal image defect extracting method the present invention is based on feature mining and neural network Flow chart;
Fig. 2 is containing defective test specimen;
Fig. 3 is directly rung from the thermal transient that zero defect position and defect 1,2 positions are extracted according to known defective locations Answer curve graph;
Fig. 4 is the curve graph that the present invention extracts zero defect position and defect 1, the three classes transient response of 2 positions represent;
Fig. 5 is that defect characteristic of the present invention extracts to obtain three two dimensional images;
Fig. 6 is the transient thermal response curve graph extracted using ICA from zero defect position and defect 1,2 positions;
Fig. 7 is the normalized curve figure that three kinds of 1 position of defect mode obtains;
Fig. 8 is the normalized curve figure that three kinds of 2 position of defect mode obtains;
Fig. 9 is the normalized curve figure that three kinds of zero defect position mode obtains;
Figure 10 is the defect image comparison diagram that the present invention is extracted with ICA algorithm.
Specific embodiment
A specific embodiment of the invention is described with reference to the accompanying drawing, preferably so as to those skilled in the art Understand the present invention.Requiring particular attention is that in the following description, when known function and the detailed description of design perhaps When can desalinate main contents of the invention, these descriptions will be ignored herein.
Fig. 1 is that the present invention is based on a kind of specific embodiments of defect extracting method of feature mining weighting Bayes classifier Flow chart.
In the present embodiment, as shown in Figure 1, base of the present invention is extracted based on the defect of feature mining weighting Bayes classifier Method the following steps are included:
Step S1: thermal image sequence is expressed as three-dimensional matrice
The thermal image sequence that thermal infrared imager obtains is indicated with three-dimensional matrice S, element S (i, j, t) therein indicates heat The pixel value that i-th row of the t frame thermal image of image sequence, jth arrange.
Step S2: max pixel value is selected
Max pixel value S (i is selected from three-dimensional matrice Szz,jzz,tzz), wherein izz、jzzAnd tzzRespectively indicate maximum pixel It is worth pixel line number, the columns of column and the frame number of place frame of the row.
Step S3: it divides trip data block and calculates its row step-length
For the t of three-dimensional matrice SzzFrame chooses jthzzRow chooses P picture according to the variation of pixel value (i.e. temperature value) Element value trip point, trip point are located between two jump pixel value pixels, are drawn by row to three-dimensional matrice S with trip point Point, obtain P+1 row data block;
In p-th of row data block SpIn (p=1,2 ..., P+1), find max pixel value, be denoted asIts In,Respectively indicate p-th of row data block SpThe columns of middle max pixel value pixel line number of the row, column And the frame number of place frame, then max pixel valueCorresponding transient thermal response is T is the total quantity of three-dimensional matrice S frame;
P-th of row data block S is setpTemperature threshold be THREp, calculate transient thermal responseMost with distance Big pixel value, that is, temperature maximumPixel column from the near to the distant ring by the corresponding thermal transient of pixel pixel value It answersBetween degree of correlation Red, d successively takes 1,2 ..., and judges degree of correlation RedWhether temperature threshold is less than THREp, when being less than, stop calculating, at this point, pixel spacing d is p-th of row data block row data block SpRow step-length, be denoted as CLp
Step S4: it divides dequeued data block and calculates its column step-length
For the t of three-dimensional matrice SzzFrame chooses i-thzzRow chooses K picture according to the variation of pixel value (i.e. temperature value) Element value trip point, trip point are located between two jump pixel value pixels, are drawn by column to three-dimensional matrice S with trip point Point, obtain K+1 column data block;
In k-th of column data block SkIn (k=1,2 ..., K+1), find max pixel value, be denoted asIts In,Respectively indicate k-th of column data block SkThe columns of middle max pixel value pixel line number of the row, column And the frame number of place frame, then max pixel valueCorresponding transient thermal response is T is the total quantity of three-dimensional matrice S frame;
K-th of column data block S is setkTemperature threshold be THREk, calculate transient thermal responseMost with distance Big pixel value, that is, temperature maximumThe pixel corresponding thermal transient of pixel pixel value from the near to the distant of being expert at is rung It answersBetween degree of correlation Rec, c successively takes 1,2 ..., and judges degree of correlation RecWhether temperature threshold is less than THREk, when being less than, stop calculating, at this point, pixel spacing c is k-th of column data block SkColumn step-length, be denoted as CLk
Step S5: piecemeal substep is long to choose transient thermal response
Step S5.1: the K picture chosen according to the step S3 P pixel value trip point chosen by column and step step S4 Element value trip point carries out piecemeal to three-dimensional matrice S by row, obtains a data block of (P+1) × (K+1), upper k-th of pth, column on row Data block is expressed as Sp,k
Step S5.2: for each data block Sp,k, threshold value DD is set, set number g=1, initialized pixel point are initialized Position i=1, j=1, and by max pixel value S (izz,jzz,tzz) corresponding transient thermal response S (izz,jzz, t), t=1, 2 ..., T, is stored in set X (g);Then data block S is calculatedk,pMiddle pixel is located at i row, the transient thermal response S of j columnp,k (i, j, t), t=1, the degree of correlation Re between 2 ..., T, with set X (g)i,j, and judge:
If Rei,j< DD, then g=g+1, and by transient thermal response Sp,k(i, j, t), t=1,2 ..., T are new as one Characteristic storage is in set X (g);Otherwise, i=i+CL is enabledp, continue to calculate next transient thermal response Sp,k(i, j, t), t=1, 2 ..., the degree of correlation of T and set X (g);If i > Mp,k, then i=i-M is enabledp,k, j=j+CLk, that is, change to jth+CLkArrange into Row calculates, if j > Np,k, then transient thermal response is chosen and is finished, wherein Mp,k、Np,kRespectively data block Sp,kLine number, column Number.
Step S6: simultaneously neural network classifies to transient thermal response for feature extraction
All set X (g) the i.e. transient thermal response for all a data blocks of (P+1) × (Q+1) that step S5 chooses is G item, Feature extraction is carried out to this G transient thermal response, and is divided into L class, specifically includes the following steps:
Step S6.1: the energy of every transient thermal response is calculated:
Wherein, g is transient thermal response serial number, g=1,2 ..., G, xg,tIt is (warm in the pixel value of t frame for transient thermal response g Angle value);
Calculate rate of temperature change of the every transient thermal response in endothermic process:
Wherein, tmidIndicate heating termination frame number, t0Indicate heating starting frame number (usually 1, i.e. the 1st frame);
Calculate rate of temperature change of the every transient thermal response in exothermic process:
Wherein, tendIndicate that heat release terminates frame number;
Calculate the average temperature value of every transient thermal response:
Calculate the maximum temperature values of every transient thermal response:
After completing feature extraction, every transient thermal response can be indicated are as follows:
Step S6.2: setting clusters number L wherein not only having contained the classification of defective part, but also contains intact concave portion The classification divided;
Triumph neuron neighborhood σ (0), Studying factors η (0) are initialized, input layer number is equal to Characteristic Number 5, Mapping layer neuron number is L, and initializing each mapping layer neuron weight is When initializing the number of iterations k=0, then it is iterated
Step S6.3: at the kth iteration, a transient thermal response X is chosen from G transient thermal response at randomgAsAnd it indicates are as follows:
It calculatesWith the weight W of each mapping layer neuronl kBetween Euclidean distance, to select triumph neuron:
Wherein, l=1,2 ..., L;
It will be apart from transient thermal response XgNearest mapping layer neuron is as triumph neuron l*, it may be assumed that
Step S6.4: according to the weight of triumph neuronAnd in its neighborhood neuron weight, to each mapping layer The weight of neuron is updated:
Wherein, Studying factors η (k) is a monotonic decreasing function, and its value is greater than 0 less than 1, and characterization weight changes fast Slowly, hcl*(k) are as follows:
Wherein, | | rc-rl*||2Indicate the distance of neuron c to triumph neuron l* in triumph neuron neighborhood, σ (k) table Show the size of triumph neuron neighborhood;
As η (k) < ηminOr k < kmaxOrWhen, iteration terminates;Otherwise k=k+1 and return (6.3), In, ηminIndicate the minimum value of Studying factors, kmaxIndicate maximum number of iterations, ε indicates the worst error allowed;
At the end of iteration, final mapping layer neuron weight is obtainedRemove the number of iterations label, and Again it is denoted as: W1,W2,...,WL, then it is used for the classification of the test specimen transient thermal response;
Step S6.5: by each transient thermal response X of G transient thermal responseg, g=1,2 ..., G input nerve net Network calculates each transient thermal response and arrives L final mapping layer neuron weight W respectively1,W2,...,WLDistance, distance Classification corresponding to nearest mapping layer neuron weight is transient thermal response XgCorresponding classification, it may be assumed that
Wherein,Indicate transient thermal response XgFinal classification, WlFor first of final mapping layer neuron weight.
Step S7: finding L class transient thermal response the representative of every one kind, and constitutes the matrix Y for constituting a T × L
Step S7.1: the center of every a kind of transient thermal response is sought first, such center is indicated with the mean value of every one kindThat is:
Wherein, the mean value of each frameIt can be calculate by the following formula:
Wherein,For clThe quantity of class transient thermal response,Respectively indicate clThe 1st article of class,Transient state Pixel value (temperature value) of the thermal response in t frame;
Step S7.2: it usesIndicate clThe representative of class, and it is calculate by the following formula the representative of every one kind:
Wherein,It indicates in addition to classification clOther category sets in addition;
I.e. in classification cl'sA transient thermal response is found in transient thermal responseMeet and other classifications cu's Transient thermal response centerDistance and maximum;
Step S7.3: the transient response of L class is representedBy column placement, (one is classified as the pixel value i.e. temperature at T moment Value), constitute the matrix Y of a T × L.
Step S8: three-dimensional matrice S is become into two-dimensional matrix, and linear transformation is carried out to it with matrix Y and obtains two dimension A two dimensional image f (x, y) of image array R and pixel value (temperature value) disparity:
By each frame in three-dimensional matrice S since first row, latter column are connect at the end of previous column, new one is constituted Column, obtain the corresponding T column pixel value of T frame, and then, according to time order and function, T column pixel value is sequentially placed, constitutes I × J row, T Column two dimensional image matrix O carries out linear transformation to two-dimensional matrix O with matrix Y, it may be assumed thatObtain two dimensional image matrix R, whereinIt is the pseudo inverse matrix of matrix Y, O for L × T matrixTThe transposed matrix of two dimensional image matrix O, obtained two dimensional image Matrix R is L row, I × J column;
Every a line of two dimensional image matrix R is intercepted by J Leie, and the J of interception is arranged to be sequentially placed by row, constitutes one I × J two dimensional image is opened, such L row obtains L I × J two dimensional images, these pictures all contain defect area, for convenience of lacking Contours extract is fallen into, a two dimensional image of defect area and non-defective region pixel value (temperature value) disparity is selected, and is remembered For f (x, y).
Step S9: image segmentation is carried out to two dimensional image f (x, y) using FCM Algorithms, realizes feature extraction: first First clustered using the two dimensional image f (x, y) of FCM Algorithms pair, obtain each pixel generic, then such Amplitude of the value of other cluster centre as the pixel, the image after being divided, finally, image after segmentation is converted into two-value Image, i.e. given threshold are TH, and when pixel amplitude is greater than TH in the image after segmentation, which is set as 1, no Then amplitude is set as 0;Bianry image is defect image, to complete the extraction of defect, specifically, comprising the following steps:
Step S9.1: when initialization the number of iterations h=0, class number M is initialized, initializes M cluster centreSetting termination condition is ε, is then iterated calculating
Step S9.2: the subordinated-degree matrix of the h times the i-th ' class of iteration is calculatedKth ' a pixel is under the jurisdiction of the i-th ' class Degree, that is, degree of membership are as follows:
Wherein, i'=1,2 ..., M,Indicate that the i-th ' of kth ' a pixel and h iteration gathers Class centerEuclidean distance,Indicate jth ' the cluster centre of kth ' a pixel and h iterationEuclidean distance, xk'Indicate the amplitude of kth ' a pixel, τ is constant, usually takes 2;
Step S9.3: calculating target function:
If h >=1 andStop iteration, otherwise, updating cluster centre is to calculate gathering for the h+1 times iteration Class center
Wherein, K'=I × J indicates the pixel total number of two dimensional image f (x, y);
Update the number of iterations h=h+1, return step S9.2;
Step S9.4: for each pixel, according to subordinated-degree matrixObtain each pixel K', k=1,2 ..., K', maximum membership degree, where the corresponding classification of subordinated-degree matrix be denoted as the classification of pixel k'That is:Then, by the value V of category cluster centrei'As the amplitude of the pixel, after obtaining segmentation Image, finally, image after segmentation is converted into bianry image, i.e., given threshold is TH, pixel in image after segmentation When amplitude is greater than TH, which is set as 1, otherwise amplitude is set as 0;Bianry image is defect image, to complete to lack Sunken extraction.
Experiment simulation
Feature extraction is carried out to test specimen shown in Fig. 3 using the present invention and ICA separately below.In the present embodiment, it is trying There are two types of defects on part: closed pore defect, that is, defect 1 and aperture defect, that is, defect 2.
According to known defective locations, the transient thermal response directly extracted from zero defect position and defect 1,2 positions is such as Fig. 3 (a), Fig. 3 (b) and Fig. 3 (c) are shown.Zero defect position that step S6, S7 of the present invention is extracted and defect 1,2 positions three Class transient response is represented as shown in Fig. 4 (a), Fig. 4 (b) and Fig. 4 (c), then obtains three according to step S8 (defect characteristic extraction) Two dimensional image is opened, such as Fig. 5 (a), Fig. 5 (b) and Fig. 5 (c), wherein defect area and non-defective region pixel value (temperature value) are poor Away from it is maximum be Fig. 6 (c), select it as f (x, y).
On the basis of same, using the aliasing for the test specimen that ICA algorithm is extracted from zero defect position and defect 1,2 positions Vector, as shown in Fig. 6 (a), Fig. 6 (b) and Fig. 6 (c).
All by comparison diagram 3 (b), Fig. 4 (b) and Fig. 6 (b) and 3 (c), Fig. 4 (c) and Fig. 6 (c) present invention and ICA algorithm It can be similar to actual conditions in trend.However, analyze three curve discoveries respectively from physical significance proposed by the present invention, The present invention has actual physical significance, even more like with actual conditions.Same result by comparison diagram 3 (a), Fig. 4 (a) and Fig. 6 (a) is also available.
It mixes 1 position of defect that the transient thermal response for 1 position of defect extracted through the invention represents, ICA algorithm extracts Folded vector and actual conditions, that is, defective locations 1 directly choose the comparison of the transient thermal response of (reality), as shown in fig. 7, this hair Bright and ICA algorithm peak value and curve tendency are essentially identical with actual conditions, thus the bright the method for this dispatch is the same with ICA can To extract corresponding characteristic information.
It mixes 1 position of defect that the transient thermal response for 2 position of defect extracted through the invention represents, ICA algorithm extracts Folded vector and actual conditions, that is, defective locations 2 directly choose the comparison of the transient thermal response of (reality), as shown in figure 8, this hair Bright the method with essentially identical with actual conditions, however the result of ICA algorithm but with having differences property of actual result, therefore this Patent can accurately extract corresponding characteristic information.
The transient response of the defect peripheral region extracted through the invention, ICA algorithm extract the aliasing of defect peripheral region The comparison of the transient thermal response of (reality) is directly chosen in vector and actual conditions, that is, defect peripheral region, as shown in figure 9, of the invention And the peak value of ICA algorithm and curve tendency it is essentially identical with actual conditions, therefore the present invention can equally extract phase with ICA algorithm The characteristic information answered.
Finally, test specimen obtains shown in Figure 10 (a) after FCM Algorithms and binary conversion treatment in the present invention Defect, and in ICA algorithm, obtain defect shown in Figure 10 (b), by comparing, the present invention can filter off more noises, essence True extraction defect profile, visual effect are obvious.
Although the illustrative specific embodiment of the present invention is described above, in order to the technology of the art Personnel understand the present invention, it should be apparent that the present invention is not limited to the range of specific embodiment, to the common skill of the art For art personnel, if various change the attached claims limit and determine the spirit and scope of the present invention in, these Variation is it will be apparent that all utilize the innovation and creation of present inventive concept in the column of protection.

Claims (2)

1. a kind of thermal image defect extracting method based on feature mining and neural network, which comprises the following steps:
(1), the thermal image sequence that thermal infrared imager obtains is indicated with three-dimensional matrice S, element S (i, j, t) therein indicates heat The pixel value that i-th row of the t frame thermal image of image sequence, jth arrange;
(2), max pixel value S (i is selected from three-dimensional matrice Szz,jzz,tzz), wherein izz、jzzAnd tzzRespectively indicate maximum pixel It is worth pixel line number, the columns of column and the frame number of place frame of the row;
(3), for the t of three-dimensional matrice SzzFrame chooses jthzzRow chooses P pixel according to the variation of pixel value (i.e. temperature value) It is worth trip point, trip point is located between two jump pixel value pixels, three-dimensional matrice S divided by row with trip point, Obtain P+1 row data block;
In p-th of row data block SpIn (p=1,2 ..., P+1), find max pixel value, be denoted asWherein,Respectively indicate p-th of row data block SpMiddle max pixel value pixel line number of the row, column columns and The frame number of place frame, then max pixel valueCorresponding transient thermal response isT For the total quantity of three-dimensional matrice S frame;
P-th of row data block S is setpTemperature threshold be THREp, calculate transient thermal responseWith the maximum picture of distance Element value is temperature maximumThe pixel column corresponding transient thermal response of pixel pixel value from the near to the distantBetween degree of correlation Reb, b successively takes 1,2 ..., and judges degree of correlation RebWhether temperature threshold is less than THREp, when being less than, stop calculating, at this point, pixel spacing b is p-th of row data block row data block SpRow step-length, be denoted as CLp
(4), for the t of three-dimensional matrice SzzFrame chooses i-thzzRow chooses Q pixel according to the variation of pixel value (i.e. temperature value) It is worth trip point, trip point is located between two jump pixel value pixels, three-dimensional matrice S divided by column with trip point, Obtain Q+1 column data block;
In q-th of column data block SqIn (q=1,2 ..., Q+1), find max pixel value, be denoted asWherein,Respectively indicate q-th of column data block SqMiddle max pixel value pixel line number of the row, column columns and The frame number of place frame, then max pixel valueCorresponding transient thermal response isT For the total quantity of three-dimensional matrice S frame;
Q-th of column data block S is setqTemperature threshold be THREq, calculate transient thermal responseWith the maximum picture of distance Element value is temperature maximumPixel is expert at the corresponding transient thermal response of pixel pixel value from the near to the distantBetween degree of correlation Red, d successively takes 1,2 ..., and judges degree of correlation RedWhether temperature threshold is less than THREq, when being less than, stop calculating, at this point, pixel spacing d is d-th of column data block SqColumn step-length, be denoted as CLq
(5), piecemeal substep is long chooses transient thermal response
(5.1), the K pixel value jump that the P pixel value trip point chosen according to step (3) is chosen by column and step (4) It presses row and piecemeal is carried out to three-dimensional matrice S, obtain a data block of (P+1) × (Q+1), pth, upper q-th of data block table of column on row It is shown as Sp,q
(5.2), for each data block Sp,q, threshold value DD is set, set number g=1, initialized pixel point position i=are initialized 1, j=1, and by max pixel value S (izz,jzz,tzz) corresponding transient thermal response S (izz,jzz, t), t=1,2 ..., T are deposited Storage is in set X (g);Then data block S is calculatedp,qMiddle pixel is located at i row, the transient thermal response S of j columnp,q(i, j, t), t= Degree of correlation Re between 1,2 ..., T, with set X (g)i,j, and judge:
If Rei,j< DD, then g=g+1, and by transient thermal response Sp,q(i, j, t), t=1,2 ..., T are as a new feature It is stored in set X (g);Otherwise, i=i+CL is enabledp, continue to calculate next transient thermal response Sp,q(i, j, t), t=1, 2 ..., the degree of correlation of T and set X (g);If i > Mp,q, then i=i-M is enabledp,q, j=j+CLq, that is, change to jth+CLqArrange into Row calculates, if j > Np,q, then transient thermal response is chosen and is finished, wherein Mp,q、Np,qRespectively data block Sp,qLine number, column Number;
(6), all set X (g) the i.e. transient thermal response for all a data blocks of (P+1) × (Q+1) that step (5) is chosen is G item, Feature extraction is carried out to this G transient thermal response, and is divided into L class
(6.1), feature extraction
Calculate the energy of every transient thermal response:
Wherein, g is transient thermal response serial number, g=1,2 ..., G, xg,tFor transient thermal response g t frame pixel value (temperature Value);
Calculate rate of temperature change of the every transient thermal response in endothermic process:
Wherein, tmidIndicate heating termination frame number, t0Indicate heating starting frame number (usually 1, i.e. the 1st frame);
Calculate rate of temperature change of the every transient thermal response in exothermic process:
Wherein, tendIndicate that heat release terminates frame number;
Calculate the average temperature value of every transient thermal response:
Calculate the maximum temperature values of every transient thermal response:
After completing feature extraction, every transient thermal response can be indicated are as follows:
(6.2), clusters number L is set, wherein not only having contained the classification of defective part, but also contains the class of zero defect part Not;
Triumph neuron neighborhood σ (0), Studying factors η (0) are initialized, input layer number is equal to Characteristic Number 5, mapping layer mind It is L through first number, initializing each mapping layer neuron weight is When initializing the number of iterations k=0, then it is iterated
(6.3), a transient thermal response X at the kth iteration, is chosen from G transient thermal response at randomgAsAnd table It is shown as:
It calculatesWith the weight W of each mapping layer neuronl kBetween Euclidean distance, to select triumph neuron:
Wherein, l=1,2 ..., L;
It will be apart from transient thermal response XgNearest mapping layer neuron is as triumph neuron l*, it may be assumed that
(6.4), according to the weight of triumph neuronAnd in its neighborhood neuron weight, to each mapping layer neuron Weight is updated:
Wherein, Studying factors η (k) is a monotonic decreasing function, and its value is greater than 0 less than 1, characterizes the speed that weight changes, hcl*(k) are as follows:
Wherein, | | rc-rl*||2Indicate the distance of neuron c to triumph neuron l* in triumph neuron neighborhood, σ (k) expression obtains Win the size of neuron neighborhood;
As η (k) < ηminOr k < kmaxOrWhen, iteration terminates;Otherwise k=k+1 and return (6.3), wherein ηminIndicate the minimum value of Studying factors, kmaxIndicate maximum number of iterations, ε indicates the worst error allowed;
At the end of iteration, final mapping layer neuron weight is obtainedRemove the number of iterations label, and again It is denoted as: W1,W2,...,WL, then it is used for the classification of the test specimen transient thermal response;
(6.5), by each transient thermal response X of G transient thermal responseg, g=1,2 ..., G input neural network, calculate every One transient thermal response arrives L final mapping layer neuron weight W respectively1,W2,...,WLDistance, apart from nearest mapping Classification corresponding to layer neuron weight is transient thermal response XgCorresponding classification, it may be assumed that
Wherein,Indicate transient thermal response XgFinal classification, Wl be first of final mapping layer neuron weight;
(7), the representative of every one kind is found for L class transient thermal response, and constitutes the matrix Y for constituting a T × L
(7.1), the center for seeking every a kind of transient thermal response first, such center is indicated with the mean value of every one kindThat is:
Wherein, the mean value of each frameIt can be calculate by the following formula:
Wherein,For clThe quantity of class transient thermal response,Respectively indicate clThe 1st article of class,Thermal transient is rung It should be in the pixel value (temperature value) of t frame;
(7.2), it usesIndicate clThe representative of class, and it is calculate by the following formula the representative of every one kind:
Wherein,It indicates in addition to classification clOther category sets in addition;
I.e. in classification cl'sA transient thermal response is found in transient thermal responseMeet and other classifications cuTransient state Thermal response centerDistance and maximum;
(7.3), the transient response of L class is represented(one is classified as the pixel value i.e. temperature value at T moment) is placed by column, is constituted The matrix Y of one T × L;
(8), by each frame in three-dimensional matrice S since first row, latter column is connect at the end of previous column, new one is constituted Column, obtain the corresponding T column pixel value of T frame, and then, according to time order and function, T column pixel value is sequentially placed, constitutes I × J row, T Column two dimensional image matrix O carries out linear transformation to two-dimensional matrix O with matrix Y, it may be assumed thatTwo dimensional image matrix R is obtained, Wherein,It is the pseudo inverse matrix of matrix Y, O for L × T matrixTThe transposed matrix of two dimensional image matrix O, obtained two dimensional image square Battle array R is L row, I × J column;
Every a line of two dimensional image matrix R is intercepted by J Leie, and the J of interception arrange and is sequentially placed by going, constitute an I × J two dimensional image, such L row obtain L I × J two dimensional images, these pictures all contain defect area, for convenience of defect profile Extract, select defect area and non-defective region pixel value (temperature value) disparity a two dimensional image, and be denoted as f (x, y);
(9), image segmentation is carried out to two dimensional image f (x, y) using FCM Algorithms, realizes feature extraction:
It is clustered first using the two dimensional image f (x, y) of FCM Algorithms pair, according to degree of membership maximum, obtains each picture Vegetarian refreshments generic, then amplitude of the value of category cluster centre as the pixel, the image after being divided, finally, Image after segmentation is converted into bianry image, i.e. given threshold is TH, when pixel amplitude is greater than TH in the image after segmentation, The pixel amplitude is set as 1, otherwise amplitude is set as 0;Bianry image is defect image, to complete the extraction of defect.
2. the thermal image defect extracting method according to claim 1 based on feature mining and neural network, feature exist In step (9) specifically:
(9.1), when initializing the number of iterations h=0, class number M is initialized, initializes M cluster centreIf Setting termination condition is ε, is then iterated calculating
(9.2), the subordinated-degree matrix of the h times the i-th ' class of iteration is calculatedKth ' a pixel is under the jurisdiction of the degree of the i-th ' class i.e. Degree of membership are as follows:
Wherein, i'=1,2 ..., M, Indicate the i-th ' cluster centre of kth ' a pixel and h iterationEuclidean distance, Indicate jth ' the cluster centre of kth ' a pixel and h iterationEurope Family name's distance, xk'Indicate the amplitude of kth ' a pixel, τ is constant, usually takes 2;
(9.3), calculating target function:
If h >=1 andStop iteration, otherwise, updating cluster centre is in the cluster for calculate the h+1 times iteration The heart
Wherein, K'=I × J indicates the pixel total number of two dimensional image f (x, y);
Update the number of iterations h=h+1, return step (9.2);
(9.4), for each pixel, according to subordinated-degree matrixEach pixel k', k=1 are obtained, 2 ..., K', maximum membership degree, where the corresponding classification of subordinated-degree matrix be denoted as the classification of pixel k'That is:Then, by the value V of category cluster centrei'Figure as the amplitude of the pixel, after being divided Picture, finally, image after segmentation is converted into bianry image, i.e. given threshold is TH, pixel amplitude in image after segmentation When greater than TH, which is set as 1, otherwise amplitude is set as 0;Bianry image is defect image, to complete defect It extracts.
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