CN109596914A - Electronic component test method, device, system and storage medium - Google Patents
Electronic component test method, device, system and storage medium Download PDFInfo
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/001—Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing
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Abstract
This application involves a kind of electronic component test method, device, system and storage mediums.The described method includes: sending synchronization signal to signal collecting device, and receive each optical signal that signal collecting device is fed back based on synchronization signal when predetermined period arrives；Predetermined period is to be used for transmission the pulse period of the pulse signal to electronic component to be measured；Synchronization signal is used to indicate signal collecting device and carries out light signal collection in acquisition duration, to electronic component to be measured in corresponding preset；Processing is overlapped to each optical signal, and the result according to superposition positions the static discharge channel of electronic component to be measured, therefore, the application electronic component test method can accurately acquire the optical signal of electronic component to be measured, avoid noise it is excessive caused by be difficult to the problem of differentiating effective optical signal, the accurate positioning in the static discharge channel of electronic component to be measured is realized by the optical signal accurately acquired, provides test basis with the design to improve electronic component.
Description
Technical field
This application involves electronic component electrostatic discharge testing technical fields, test more particularly to a kind of electronic component
Method, apparatus, system and storage medium.
Background technique
Transmission line pulse test, which refers to, generates short pulse (50 nanoseconds to 200 nanoseconds) using transmission line to measure electronics member device
The method of the I-E characteristic of ESD (Electro-Static discharge, Electro-static Driven Comb) protection structure in part,
In, short pulse is the short esd pulse for dummy activity in electronic component, by using short pulse can be accurately measured to
The electric current and voltage of sample, so as to obtain the I-E characteristic of sample to be tested.
Currently, traditional technology majority utilizes electronic component in light emission microscope acquisition transmission line pulse test process
Optical signal, the carry out performance evaluation using optical signal image to electronic component, realizes the static discharge channel of electronic component
With the positioning of impaired loci, still, during realization, inventor has found that at least there are the following problems: traditional skill in traditional technology
Art can not accurately acquire optical signal during electronic component pulse test.
Summary of the invention
Based on this, it is necessary in view of the above technical problems, provide a kind of electronic component test method, device, system and
Storage medium.
To achieve the goals above, on the one hand, the embodiment of the invention provides it is a kind of from TLP test equipment angle implement
Electronic component test method, comprising the following steps:
When predetermined period arrives, synchronization signal is sent to signal collecting device, and receives signal collecting device and is based on together
Walk each optical signal of signal feedback；Predetermined period is to be used for transmission the pulse period of the pulse signal to electronic component to be measured；
Synchronization signal is used to indicate signal collecting device and carries out optical signal in acquisition duration, to electronic component to be measured in corresponding preset
Acquisition；
Processing is overlapped to each optical signal, and the result according to superposition position electronic component to be measured static discharge it is logical
Road.
It further comprises the steps of: in one of the embodiments,
Result according to superposition positions the impaired loci of electronic component to be measured.
In one of the embodiments, receive signal collecting device fed back based on synchronization signal each optical signal the step of it
Afterwards, it further comprises the steps of:
When the frame number of the optical signal received is equal to default frame number, is transmitted to signal collecting device and stop acquisition instructions；
Stop acquisition instructions and is used to indicate signal collecting device stopping acquisition optical signal.
In one of the embodiments, when the frame number of the optical signal received is equal to default frame number, set to signal acquisition
Before the step of standby transmission stops acquisition instructions, further comprise the steps of:
Obtain the frame number of the optical signal received.
On the other hand, the embodiment of the invention provides a kind of electronic component tests implemented from signal collecting device angle
Method, comprising the following steps:
Receive the synchronization signal that TLP test equipment is transmitted when predetermined period arrives；Predetermined period is TLP test equipment biography
It is defeated by the pulse period of the pulse signal of electronic component to be measured；
Based on synchronization signal, in corresponding default acquisition duration, light signal collection is carried out to electronic component to be measured；
Give collected each optical signal transmission to TLP test equipment.
Another aspect, the embodiment of the present application also provides a kind of electronic component surveys implemented from TLP test equipment angle
Trial assembly is set, comprising:
Signal transmitting and receiving module, for sending synchronization signal to signal collecting device, and receive letter when predetermined period arrives
Number each optical signal for being fed back based on synchronization signal of acquisition equipment；Predetermined period is to be used for transmission to the pulse of electronic component to be measured
The pulse period of signal；Synchronization signal is used to indicate signal collecting device and presets corresponding in acquisition duration, to electronics to be measured
Component carries out light signal collection；
Static discharge locating module, for being overlapped processing to each optical signal, and it is to be measured according to the positioning of the result of superposition
The static discharge channel of electronic component.
In another aspect, the embodiment of the present application also provides a kind of electronic component surveys implemented from signal collecting device angle
Trial assembly is set, comprising:
Signal receiving module, the synchronization signal transmitted for receiving TLP test equipment when predetermined period arrives；Default week
Phase is the pulse period for the pulse signal that TLP test equipment is transferred to electronic component to be measured；
Signal acquisition module, for being based on synchronization signal, in corresponding default acquisition duration, to electronic component to be measured
Carry out light signal collection；
Signal transmission module, for giving collected each optical signal transmission to TLP test equipment.
Also on the one hand, the embodiment of the present application also provides a kind of electronic component test macro, including TLP test equipment with
And the signal collecting device of connection TLP test equipment；
TLP test equipment is for realizing the above-mentioned electronic component test method implemented from TLP test equipment angle；
Signal collecting device is for realizing the above-mentioned electronic component test method implemented from signal collecting device angle.
Signal collecting device is photodetector in one of the embodiments,.
A kind of computer readable storage medium, is stored thereon with computer program, and the computer program is held by processor
Above-mentioned electronic component test method is realized when row.
A technical solution in above-mentioned technical proposal is had the following advantages and beneficial effects:
By sending synchronization signal to signal collecting device, and receive signal collecting device base when predetermined period arrives
In each optical signal of synchronization signal feedback, wherein predetermined period is to be used for transmission to the pulse signal of electronic component to be measured
Pulse period, synchronization signal are used to indicate signal collecting device and preset corresponding in acquisition duration, to electronic component to be measured
Carry out light signal collection；Processing is overlapped to each optical signal, and the result according to superposition positions the quiet of electronic component to be measured
Discharge of electricity channel, therefore, the application electronic component test method can accurately acquire the optical signal of electronic component to be measured,
Avoid noise it is excessive caused by be difficult to the problem of differentiating effective optical signal, in turn, pass through the optical signal that accurately acquires and realize
The accurate positioning in the static discharge channel of electronic component to be measured provides good test with the design for improvement electronic component
Basis.
Detailed description of the invention
Fig. 1 is the first pass for the electronic component test method implemented in one embodiment from TLP test equipment angle
Schematic diagram；
Fig. 2 is the schematic diagram of pulse signal and sampling period in one embodiment；
Fig. 3 is the second procedure for the electronic component test method implemented in one embodiment from TLP test equipment angle
Schematic diagram；
Fig. 4 is the flow diagram of the frame number of optical signal and default frame number decision process in one embodiment；
Fig. 5 is the process signal for the electronic component test method implemented in one embodiment from signal collecting device angle
Figure；
Fig. 6 is the structural block diagram for the electronic component test device implemented in one embodiment from TLP test equipment angle；
Fig. 7 is the structural block diagram that impaired loci obtains module in one embodiment；
Fig. 8 is the structural frames for the electronic component test device implemented in one embodiment from signal collecting device angle
Figure；
Fig. 9 is the structural block diagram of electronic component test macro in one embodiment.
Specific embodiment
It is with reference to the accompanying drawings and embodiments, right in order to which the objects, technical solutions and advantages of the application are more clearly understood
The application is further elaborated.It should be appreciated that specific embodiment described herein is only used to explain the application, not
For limiting the application.
In order to solve the problems, such as optical signal during traditional technology can not accurately acquire electronic component pulse test,
In one embodiment, as shown in Figure 1, providing a kind of electronic component test method implemented from TLP test equipment angle, packet
Include following steps:
Step S110 sends synchronization signal to signal collecting device, and receive signal acquisition and set when predetermined period arrives
Standby each optical signal based on synchronization signal feedback；Predetermined period is the arteries and veins for being used for transmission the pulse signal to electronic component to be measured
Rush the period；Synchronization signal be used to indicate signal collecting device in corresponding default acquisition duration, to electronic component to be measured into
Traveling optical signal acquisition.
Wherein, predetermined period is for controlling TLP (Transmission Line Pulse, transmission line pulse) test equipment
Synchronization signal is sent, predetermined period and the pulse period for the pulse signal that TLP test equipment is sent to electronic component to be measured are same
Step, in other words, when each pulse of pulse signal arrives (namely pulse signal be transformed by low level high level time point),
TLP test equipment all can send synchronization signal to signal collecting device.
Synchronization signal is used to indicate signal collecting device and acquires the optical signal generated in electronic component to be measured.
Shown in Fig. 2, during the test, TLP test equipment sends the pulse comprising multiple pulses to electronic component
Signal, when each pulse in pulse signal arrives, TLP test equipment can all generate a synchronization signal, and by each synchronization
Signal is transferred to signal collecting device, so that the signal acquisition starting point of signal collecting device and the pulse starting point in pulse signal are same
Step, can not collect useful optical signal to avoid signal collecting device in collection period, also can avoid signal acquisition and set
Standby the problem of being sampled within the pulse spacing of pulse signal and not acquiring optical signal.It should be noted that TLP test equipment produces
The pulse width of raw pulse signal is 50ns (nanosecond) to 200ns, and pulse spacing duration is generally 2s (second) to 3s.
Preset duration is a sampling period of signal collecting device, preset duration can according to actual test precision and
Fixed, the optical signal noise of the shorter acquisition of preset duration is smaller, in one example, preset duration and electronic component to be measured
Pulse width in the pulse signal of TLP test equipment transmission is identical, so that the noise of the optical signal of acquisition is preferably minimized.
Optical signal is that pulse signal injects generation inside electronic component to be measured.Specifically, existing inside semiconductor
The release of hot carrier energy and two kinds of luminous mechanisms of electron-hole recombinations, wherein hot carrier energy release luminous mechanism refers to
Removable mobile carriers (electronics or hole) obtain enough kinetic energy, the kinetic energy accumulated by photon radiation by electric field acceleration
Release；Electron-hole recombinations luminous mechanism refer to the electron transition of conduction band to valence band the radioluminescence in conjunction with hole.Using partly leading
The principle of luminosity of body carries out failure positioning to electronic component, is a kind of very effective electronic component failure analysis methods.
Step S120 is overlapped processing to each optical signal, and the result according to superposition positions electronic component to be measured
Static discharge channel.
Wherein, in one example, using Fourier series theory and Di Liheli condition, by several different frequencies, no
Optical signal with amplitude and out of phase is overlapped, and Signal averaging mode is the signal amplitude superposition at corresponding moment.In turn, divide
The signal that multiple optical signals are superimposed is analysed, the static discharge channel of electronic component to be measured is oriented.By analyzing electricity to be measured
The static discharge channel of sub- component can orient the transmission path of electronics in electrical measurement electronic component, thus for optimization electronics
The electrostatic designs of component provide test and support.
In each embodiment of the application electronic component, by being sent to signal collecting device when predetermined period arrives
Synchronization signal, and receive each optical signal that signal collecting device is fed back based on synchronization signal, wherein predetermined period is to be used for transmission
To the pulse period of the pulse signal of electronic component to be measured, synchronization signal is used to indicate signal collecting device and presets accordingly
It acquires in duration, light signal collection is carried out to electronic component to be measured；Processing is overlapped to each optical signal, and according to superposition
As a result the static discharge channel of electronic component to be measured is positioned, therefore, the application electronic component test method can be accurately
The optical signal for acquiring electronic component to be measured, avoid noise it is excessive caused by be difficult to the problem of differentiating effective optical signal, into
And the optical signal by accurately acquiring realizes the accurate positioning in the static discharge channel of electronic component to be measured, with electric to improve
The design of sub- component provides good test basis.
In one embodiment, as shown in figure 3, providing a kind of electronic component test method, comprising the following steps:
Step S310 sends synchronization signal to signal collecting device, and receive signal acquisition and set when predetermined period arrives
Standby each optical signal based on synchronization signal feedback；Predetermined period is the arteries and veins for being used for transmission the pulse signal to electronic component to be measured
Rush the period；Synchronization signal be used to indicate signal collecting device in corresponding default acquisition duration, to electronic component to be measured into
Traveling optical signal acquisition；
Step S320 is overlapped processing to each optical signal, and the result according to superposition positions electronic component to be measured
Impaired loci.
Wherein, step S310 is identical as the step S110 in above-described embodiment, and details are not described herein again.
The process of optical signal superposition processing described in step S320 is identical as the step S120 in above-described embodiment, herein
It repeats no more.
The signal that multiple optical signals are superimposed is analyzed, the impaired loci in electronic component to be measured can be also analyzed, thus
Realize the accident analysis to electronic component to be measured.
In each embodiment of the application electronic component test method, it can be oriented by the superposition of multiple optical signals
Impaired loci in electronic component to be measured, so as to accurately analyze the failure in electronic component to be measured, so that related
Personnel can safeguard electronic component to be measured in time.
In one embodiment, as shown in figure 4, receiving each optical signal that signal collecting device is fed back based on synchronization signal
After step, further comprise the steps of:
Step S420 is transmitted to signal collecting device and is stopped when the frame number of the optical signal received is equal to default frame number
Acquisition instructions；Stop acquisition instructions and is used to indicate signal collecting device stopping acquisition optical signal.
Or
Step S430 continues to signal collecting device biography when the frame number of the optical signal received is less than default frame number
Defeated optical signal.
Further, it when the frame number of the optical signal received is equal to default frame number, transmits and stops to signal collecting device
Before the step of acquisition instructions, further comprise the steps of:
Obtain the frame number of the optical signal received.
Wherein, default frame number can be depending on actual test required precision, and default frame number is more, and measuring accuracy is higher.When
When the frame number for the optical signal that TLP test equipment receives has reached default frame number, it can stop sending to signal collecting device same
It walks signal or sends stop signal to signal collecting device, so that signal collecting device stops acquisition optical signal；When TLP is tested
When the frame number for the optical signal that equipment receives is less than default frame number, continue to synchronize when pulse arrives to signal collecting device transmission
Signal.
TLP test equipment counts the totalframes of the optical signal once received when receiving an optical signal.
In each embodiment of the application electronic component test method, guarantee the precision of test by presetting frame number, and
And by judging whether to reach default frame number, the step of to simplify sampling, testing cost is saved.
In one embodiment, for a further understanding of the application electronic component test method, as shown in figure 5, providing
A kind of electronic component test method implemented from signal collecting device angle, comprising the following steps:
Step S510 receives the synchronization signal that TLP test equipment is transmitted when predetermined period arrives；Predetermined period is TLP
Test equipment is transferred to the pulse period of the pulse signal of electronic component to be measured；
Step S520 is based on synchronization signal, in corresponding default acquisition duration, carries out light letter to electronic component to be measured
Number acquisition；
Step S530 gives collected each optical signal transmission to TLP test equipment.
Specifically, the specific test process of the application are as follows: TLP test equipment sends pulse signal to electronic component to be measured,
And pulse in pulse signal sends synchronization signal to signal collecting device, indication signal acquisition equipment starts to adopt when arriving
Collect optical signal, collected optical signal is returned to TLP test equipment by signal collecting device, and TLP test equipment believes multiple light
Number it is overlapped processing, positions static discharge channel and the impaired loci of electronic component to be measured.
In each embodiment of the application electronic component test method, the acquisition signal process of signal collecting device is realized
It is synchronous with pulse signal, while the collection period of signal collecting device (that is, preset duration) is optimized, when will be default
Length is identical as the pulse width of pulse signal, reduces the noise in optical signal, it is thus also avoided that signal collecting device is between pulse
Acquisition optical signal is also continued in.
It should be understood that although each step in the flow chart of Fig. 1,3-5 is successively shown according to the instruction of arrow,
It is these steps is not that the inevitable sequence according to arrow instruction successively executes.Unless expressly stating otherwise herein, these steps
There is no stringent sequences to limit for rapid execution, these steps can execute in other order.Moreover, in Fig. 1,3-5 extremely
Few a part of step may include that perhaps these sub-steps of multiple stages or stage are not necessarily same to multiple sub-steps
Moment executes completion, but can execute at different times, and the execution sequence in these sub-steps or stage is also not necessarily
It successively carries out, but in turn or can be handed over at least part of the sub-step or stage of other steps or other steps
Alternately execute.
In one embodiment, as shown in fig. 6, providing a kind of electronic component implemented from TLP test equipment angle
Test device, comprising:
Signal transmitting and receiving module 610, for sending synchronization signal to signal collecting device, and connect when predetermined period arrives
Receive each optical signal that signal collecting device is fed back based on synchronization signal；Predetermined period is to be used for transmission to electronic component to be measured
The pulse period of pulse signal；Synchronization signal is used to indicate signal collecting device and presets corresponding in acquisition duration, to be measured
Electronic component carries out light signal collection；
Static discharge locating module 620, for being overlapped processing to each optical signal, and according to the positioning of the result of superposition to
Survey the static discharge channel of electronic component.
In one embodiment, as shown in fig. 7, a kind of electronic component test device, further includes:
Impaired loci obtains module 710 and positions the damage of electronic component to be measured for being overlapped processing to each optical signal
Point.
In one embodiment, as shown in figure 8, providing a kind of electronic component implemented from signal collecting device angle
Test device, comprising:
Signal receiving module 810, the synchronization signal transmitted for receiving TLP test equipment when predetermined period arrives；In advance
If the period is the pulse period for the pulse signal that TLP test equipment is transferred to electronic component to be measured；
Signal acquisition module 820, for being based on synchronization signal, in corresponding default acquisition duration, to electronics member to be measured
Device carries out light signal collection；
Signal transmission module 830, for giving collected each optical signal transmission to TLP test equipment.
Specific restriction about electronic component test device may refer to above for electronic component test method
Restriction, details are not described herein.Modules in above-mentioned electronic component test device can be fully or partially through software, hard
Part and combinations thereof is realized.Above-mentioned each module can be embedded in the form of hardware or independently of in the processor in computer equipment,
It can also be stored in a software form in the memory in computer equipment, execute the above modules in order to which processor calls
Corresponding operation.
In one embodiment, as shown in figure 9, additionally providing a kind of electronic component test macro includes that TLP test is set
For 910 and the signal collecting device 920 of connection TLP test equipment 910；
TLP test equipment 910 is for realizing above-mentioned electronic component test method；
Signal collecting device 920 is used to acquire optical signal, and by optical signal transmission to TLP test equipment 910.
Wherein, TLP test equipment is transmission line pulse generator, and what is issued is electrostatic simulation square wave.TLP test equipment
By adjusting rising edge and pulse width, the lesion capability of indirect simulation electrostatic pulse form and different rising edge CLAMP touching
Hair ability.
Signal collecting device is used to acquire the optical signal of electronic component to be measured, and optical signal transmission is set to TLP test
It is standby.For example, signal collecting device can be light emission microscope.In a specific embodiment, signal collecting device is photoelectricity
Detector.
In each embodiment of the application electronic component test macro, signal acquisition is accurately controlled using TLP test equipment
Equipment acquires the opportunity of optical signal, enables the collection process of signal collecting device synchronous with pulse signal, reduces signal and adopts
The noise for collecting the optical signal of equipment acquisition, provides the accuracy of the optical signal of acquisition, so that TLP test equipment can be quasi-
Really orient static discharge channel and impaired loci.
In one embodiment, a kind of computer readable storage medium is provided, computer program is stored thereon with, is calculated
Machine program performs the steps of when being executed by processor
Signal collecting device is received to be based on each synchronization signal and acquire electronic component to be measured in corresponding preset duration
The optical signal of generation；When each synchronization signal is that each pulse in the pulse signal for being transferred to electronic component to be measured arrives, it is right
It should be sent to signal collecting device；
Processing is overlapped to each optical signal, positions the static discharge channel of electronic component to be measured.
In one embodiment, it is also performed the steps of when computer program is executed by processor
Processing is overlapped to each optical signal, positions the impaired loci of electronic component to be measured.
In one embodiment, it is also performed the steps of when computer program is executed by processor
When the frame number of the optical signal received is equal to default frame number, stop acquiring optical signal by signal collecting device.
In one embodiment, it is also performed the steps of when computer program is executed by processor
When the frame number of the optical signal received is less than default frame number, signal collecting device acquisition optical signal is continued through.
Those of ordinary skill in the art will appreciate that realizing all or part of the process in above-described embodiment method, being can be with
Relevant hardware is instructed to complete by computer program, the computer program can be stored in a non-volatile computer
In read/write memory medium, the computer program is when being executed, it may include such as the process of the embodiment of above-mentioned each method.Wherein,
To any reference of memory, storage, database or other media used in each embodiment provided herein,
Including non-volatile and/or volatile memory.Nonvolatile memory may include read-only memory (ROM), programming ROM
(PROM), electrically programmable ROM (EPROM), electrically erasable ROM (EEPROM) or flash memory.Volatile memory may include
Random access memory (RAM) or external cache.By way of illustration and not limitation, RAM is available in many forms,
Such as static state RAM (SRAM), dynamic ram (DRAM), synchronous dram (SDRAM), double data rate sdram (DDRSDRAM), enhancing
Type SDRAM (ESDRAM), synchronization link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM
(RDRAM), direct memory bus dynamic ram (DRDRAM) and memory bus dynamic ram (RDRAM) etc..
Each technical characteristic of above embodiments can be combined arbitrarily, for simplicity of description, not to above-described embodiment
In each technical characteristic it is all possible combination be all described, as long as however, the combination of these technical characteristics be not present lance
Shield all should be considered as described in this specification.
The several embodiments of the application above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
The limitation to claim therefore cannot be interpreted as.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the concept of this application, various modifications and improvements can be made, these belong to the protection of the application
Range.Therefore, the scope of protection shall be subject to the appended claims for the application patent.
Claims (10)
1. a kind of electronic component test method, which comprises the following steps:
When predetermined period arrives, synchronization signal is sent to signal collecting device, and receives the signal collecting device and is based on institute
State each optical signal of synchronization signal feedback；The predetermined period is the arteries and veins for being used for transmission the pulse signal to electronic component to be measured
Rush the period；The synchronization signal is used to indicate the signal collecting device and presets corresponding in acquisition duration, to described to be measured
Electronic component carries out light signal collection；
Processing is overlapped to each optical signal, and the result according to the superposition positions the quiet of the electronic component to be measured
Discharge of electricity channel.
2. electronic component test method according to claim 1, which is characterized in that further comprise the steps of:
Result according to the superposition positions the impaired loci of the electronic component to be measured.
3. electronic component test method according to claim 1 or 2, which is characterized in that receive the signal acquisition and set
After the step of standby each optical signal based on synchronization signal feedback, further comprise the steps of:
When the frame number of the optical signal received is equal to default frame number, the transmission of Xiang Suoshu signal collecting device stops acquisition and refers to
It enables；The stopping acquisition instructions being used to indicate the signal collecting device and stop acquiring the optical signal.
4. electronic component test method according to claim 3, which is characterized in that in the optical signal received
When frame number is equal to default frame number, before Xiang Suoshu signal collecting device transmits the step of stopping acquisition instructions, further comprise the steps of:
Obtain the frame number of the optical signal received.
5. a kind of electronic component test method, which comprises the following steps:
Receive the synchronization signal that TLP test equipment is transmitted when predetermined period arrives；The predetermined period is that TLP test is set
The pulse period of the standby pulse signal for being transferred to electronic component to be measured；
Based on the synchronization signal, adopted in corresponding default acquisition duration, to the electronic component progress optical signal to be measured
Collection；
Give collected each optical signal transmission to the TLP test equipment.
6. a kind of electronic component test device characterized by comprising
Signal transmitting and receiving module, for sending synchronization signal to signal collecting device, and receive the letter when predetermined period arrives
Number each optical signal for being fed back based on the synchronization signal of acquisition equipment；The predetermined period is to be used for transmission to electronics member device to be measured
The pulse period of the pulse signal of part；The synchronization signal is used to indicate the signal collecting device in corresponding default acquisition
Light signal collection is carried out in long, to the electronic component to be measured；
Static discharge locating module for being overlapped processing to each optical signal, and is positioned according to the result of the superposition
The static discharge channel of the electronic component to be measured.
7. a kind of electronic component test device characterized by comprising
Signal receiving module, the synchronization signal transmitted for receiving TLP test equipment when predetermined period arrives；The default week
Phase is the pulse period for the pulse signal that the TLP test equipment is transferred to electronic component to be measured；
Signal acquisition module, for being based on the synchronization signal, in corresponding default acquisition duration, to the electronics member to be measured
Device carries out light signal collection；
Signal transmission module, for giving collected each optical signal transmission to the TLP test equipment.
8. a kind of electronic component test macro, which is characterized in that set including TLP test equipment and the connection TLP test
Standby signal collecting device；
The TLP test equipment is for realizing the described in any item electronic component test methods of Claims 1-4；
The signal collecting device is for realizing the electronic component test method described in claim 5.
9. electronic component test macro according to claim 8, which is characterized in that the signal collecting device is photoelectricity
Detector.
10. a kind of computer readable storage medium, is stored thereon with computer program, which is characterized in that the computer program
The step of method described in any one of claims 1 to 5 is realized when being executed by processor.
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