CN109590907A - A kind of conveying swing arm of polishing fluid and polissoir - Google Patents

A kind of conveying swing arm of polishing fluid and polissoir Download PDF

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Publication number
CN109590907A
CN109590907A CN201910027857.5A CN201910027857A CN109590907A CN 109590907 A CN109590907 A CN 109590907A CN 201910027857 A CN201910027857 A CN 201910027857A CN 109590907 A CN109590907 A CN 109590907A
Authority
CN
China
Prior art keywords
polishing fluid
swing arm
arm body
polishing
drop point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910027857.5A
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Chinese (zh)
Inventor
靳阳
李伟
尹影
李思
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Semiconductor Equipment Institute
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Beijing Semiconductor Equipment Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Semiconductor Equipment Institute filed Critical Beijing Semiconductor Equipment Institute
Priority to CN201910027857.5A priority Critical patent/CN109590907A/en
Publication of CN109590907A publication Critical patent/CN109590907A/en
Priority to TW108135167A priority patent/TW202026107A/en
Priority to PCT/CN2019/111085 priority patent/WO2020143260A1/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces

Abstract

The invention discloses a kind of conveying swing arm of polishing fluid and polissoir, including arm body, the polishing fluid delivery pipe for conveying polishing fluid is provided on the arm body;Sliding is provided with slurry drop point adjusting block on the arm body, and the slurry drop point adjusting block is used to fix the discharge end of the polishing fluid delivery pipe.The adjusting that the discharging end position of polishing fluid delivery pipe can be realized by mobile slurry drop point adjusting block, so that drop point of the polishing fluid on polishing pad can be adjusted under the premise of not moving arm body.

Description

A kind of conveying swing arm of polishing fluid and polissoir
Technical field
The present invention relates to polishing technology field more particularly to a kind of conveying swing arm of polishing fluid and polissoirs.
Background technique
Chemically mechanical polishing is commonly used for a kind of technique of manufacture high density integrated circuit, needs to convey when being polished Polishing fluid is to corresponding position, wherein the work for conveying polishing fluid is all to convey swing arm by polishing fluid to complete.
Current polishing fluid conveys swing arm, and polishing fluid outlet port is fixed relative to swing arm.According to polishing process Difference requires, and drop point of the polishing fluid on polishing pad needs to adjust therewith, and existing method needs to adjust polishing fluid conveying swing arm Position, be just able to achieve the adjusting of slurries drop point on polishing pad.
Summary of the invention
It is an object of the invention to overcome the deficiencies of existing technologies, a kind of conveying swing arm of polishing fluid and polissoir are provided, To solve the problems of the prior art.
To solve the above problems, the present invention provides: a kind of polishing fluid conveys swing arm, including arm body, sets on the arm body It is equipped with the polishing fluid delivery pipe for conveying polishing fluid;
Sliding is provided with slurry drop point adjusting block on the arm body, and the slurry drop point adjusting block is for fixing the polishing The discharge end of liquid delivery pipe.
As a further improvement of the above technical scheme, it is provided on the slurry drop point adjusting block for making the polishing Liquid delivery pipe penetrates therein wear and connects hole, wherein the discharge end of the polishing fluid delivery pipe is pierced by from described wear in connection hole.
As a further improvement of the above technical scheme, it is provided on the arm body for installing the polishing fluid delivery pipe The first mounting groove;
The slurry drop point adjusting block is located in first mounting groove, and the bottom of first mounting groove is provided with cunning Road, the slurry drop point adjusting block are slidably connected with the slideway.
As a further improvement of the above technical scheme, the first retainer, first stop are provided on the arm body Part makes it keep relatively fixed with the slideway for limiting the slurry drop point adjusting block.
As a further improvement of the above technical scheme, the cleaning solution for conveying cleaning solution is additionally provided on the arm body Delivery pipe;
The spray head being connected with its inner cavity is provided on the cleaning fluid conveying pipeline, the spray head there are several, each described The water outlet of spray head is provided with nozzle;
The hydrojet channel being connected with the spray head is provided on the nozzle, the hydrojet channel is for making the spray head The cleaning solution ejected is flowed along its inner wall;Wherein, along the injection direction of the nozzle, the inner wall in the hydrojet channel it is transversal The area or length in face are gradually increased.
As a further improvement of the above technical scheme, the spray head is rotatably coupled with the cleaning fluid conveying pipeline.
It as a further improvement of the above technical scheme, further include the shaft being vertically arranged, the arm body is fixed on described The top of shaft.
As a further improvement of the above technical scheme, it is provided on the arm body for installing the cleaning fluid conveying pipeline The second mounting groove, wherein the cleaning fluid conveying pipeline is slidably connected with second mounting groove.
As a further improvement of the above technical scheme, the second retainer, second stop are provided on the arm body Part makes it keep relatively fixed with second mounting groove for limiting the cleaning fluid conveying pipeline.
Present invention further provide that a kind of polissoir, including as above described in any item polishing fluids convey swing arm.
The beneficial effects of the present invention are: the present invention proposes a kind of polishing fluid conveying swing arm, including arm body, it is provided on arm body For conveying the polishing fluid delivery pipe of polishing fluid, sliding is provided with slurry drop point adjusting block on arm body, and slurry drop point adjusting block is used In the discharge end of fixed polishing fluid delivery pipe.The discharging of polishing fluid delivery pipe can be realized by mobile slurry drop point adjusting block The adjusting of the position at end, so that drop point of the polishing fluid on polishing pad can be adjusted under the premise of not moving arm body.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached Figure is briefly described.It should be appreciated that the following drawings illustrates only certain embodiments of the present invention, therefore it is not construed as pair The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this A little attached drawings obtain other relevant attached drawings.
Fig. 1 is a kind of first shaft side figure of polishing fluid conveying swing arm in the embodiment of the present invention;
Fig. 2 is a kind of first shaft side figure of polishing fluid conveying swing arm in the embodiment of the present invention;
Fig. 3 is a kind of positional diagram of polishing fluid conveying swing arm and polishing pad in the embodiment of the present invention;
Fig. 4 is a kind of schematic diagram of slurry drop point adjusting block in the embodiment of the present invention;
Fig. 5, which is that a kind of outlet end of the second sub-aperture on slurry drop point adjusting block in the embodiment of the present invention is linear distributing, to be shown It is intended to;
Fig. 6 shows for what the outlet end of the second sub-aperture on slurry drop point adjusting block a kind of in the embodiment of the present invention was distributed in a ring It is intended to.
Main element symbol description:
1- arm body;2- cleaning fluid conveying pipeline;3- polishing fluid delivery pipe;4- spray head;5- nozzle;6- shaft;7- slurry drop point Adjusting block;8-, which is worn, connects hole;9- polishing pad;The first sub-aperture of 10-;The second sub-aperture of 11-.
Specific embodiment
Hereinafter, various embodiments of the present invention will be described more fully.The present invention can have various embodiments, and It can adjust and change wherein.It should be understood, however, that: there is no various embodiments of the present invention are limited to spy disclosed herein Determine the intention of embodiment, but should invention is construed as cover in the spirit and scope for falling into various embodiments of the present invention All adjustment, equivalent and/or optinal plan.
Hereinafter, disclosed in the term " includes " that can be used in various embodiments of the present invention or " may include " instruction Function, operation or the presence of element, and do not limit the increase of one or more functions, operation or element.In addition, such as existing Used in various embodiments of the present invention, term " includes ", " having " and its cognate are meant only to indicate special characteristic, number Word, step, operation, the combination of element, component or aforementioned item, and be understood not to exclude first one or more other Feature, number, step, operation, element, component or aforementioned item combined presence or increase one or more features, number, Step, operation, element, component or aforementioned item combination a possibility that.
In various embodiments of the present invention, statement " A or/and B " includes any combination or the institute of the text listed file names with There is combination, such as, it may include A, it may include B or may include A and B both.
The statement (" first ", " second " etc.) used in various embodiments of the present invention can be modified in various implementations Various constituent element in example, but respective sets can not be limited into element.For example, the above statement is not intended to limit the suitable of the element Sequence and/or importance.The above statement is only used for the purpose for differentiating an element and other elements.For example, the first user fills It sets and indicates different user device with second user device, although the two is all user apparatus.For example, of the invention each not departing from In the case where the range of kind embodiment, first element is referred to alternatively as second element, and similarly, second element is also referred to as first Element.
It should also be noted that in the present invention, unless otherwise specific regulation and definition, the arts such as " installation ", " connection ", " fixation " Language shall be understood in a broad sense, and can be and is directly connected to, and can be indirectly connected through an intermediary;It can be inside two elements Connection.For the ordinary skill in the art, it can understand above-mentioned term in the present invention as the case may be Concrete meaning.
In the present invention, those skilled in the art are it is to be appreciated that indicating position or positional relationship in text Term be orientation based on the figure or positional relationship, be merely for convenience of description of the present invention and simplification of the description, without It is that the device of indication or suggestion meaning or element must have a particular orientation, be constructed and operated in a specific orientation, therefore It is not considered as limiting the invention.
The term used in various embodiments of the present invention is used only for the purpose of describing specific embodiments and not anticipates In limitation various embodiments of the present invention.Unless otherwise defined, otherwise all terms used herein (including technical term and Scientific term) there is contain identical with the normally understood meaning of various embodiments of the present invention one skilled in the art Justice.The term (term such as limited in the dictionary generally used) be to be interpreted as have in the related technical field The identical meaning of situational meaning and Utopian meaning or meaning too formal will be interpreted as having, unless this It is clearly defined in the various embodiments of invention.
Embodiment 1
It proposes a kind of polishing fluid conveying swing arm, including arm body 1 in the present embodiment with Fig. 2 refering to fig. 1, is set on arm body 1 It is equipped with the cleaning fluid conveying pipeline 2 for conveying cleaning solution and the polishing fluid delivery pipe 3 for conveying polishing fluid.
Also sliding is provided with slurry drop point adjusting block 7 on arm body 1, and slurry drop point adjusting block 7 is for fixing polishing fluid conveying The discharge end of pipe 3.Since the discharge end of polishing fluid delivery pipe 3 is fixed with 7 phase of slurry drop point adjusting block, so passing through mobile slurry Drop point adjusting block 7 can realize the adjusting of the discharging end position of polishing fluid delivery pipe 3.
As shown in figure 4, in the present embodiment, may be provided on slurry drop point adjusting block 7 for wearing polishing fluid delivery pipe 3 Enter therein wear and connect hole 8, the discharge end of polishing fluid delivery pipe 3 can be installed and be consolidated by slurry drop point adjusting block 7 It is fixed, wherein the discharge end of polishing fluid delivery pipe 3 is pierced by from wearing to connect in hole 8.As shown in Fig. 2, the discharging of polishing fluid delivery pipe 3 End in slurry drop point adjusting block 7 after being pierced by, then stretches out from the opening of 1 bottom of arm body and towards polishing pad.
After polishing fluid is transported in polishing fluid delivery pipe 3, polishing fluid will make a clean sweep of stream from the discharging of polishing fluid delivery pipe 3 It is dropped on polishing pad out and under gravity.
In the present embodiment, wearing and connecting hole 8 may include having interconnected the first sub-aperture 10 and the second sub-aperture 11, wherein Second sub-aperture 11 is vertically arranged and is right against polishing pad.Polishing fluid delivery pipe 3 is penetrated from the first sub-aperture 10, then from the second sub-aperture 11 Outlet end be pierced by, to guarantee that the discharge end of polishing fluid delivery pipe 3 is right against polishing pad.
Wear and connect hole 8 and delivery pipe and correspond, wherein wear the quantity for connecting hole 8 and position can according to need into Row setting.
Specifically, as shown in figure 5, the outlet end of second sub-aperture 11 can be distributed in straight line on slurry drop point adjusting block 7 On;As shown in fig. 6, the outlet end of second sub-aperture 11 can be distributed on same circumference on slurry drop point adjusting block 7.Due to different size The shape and size of polishing pad are different, it is possible to by the way that the position of the second sub-aperture 11 is arranged, so that conveying from each polishing fluid Polishing fluid in pipe 3 can be by the drippage of the forms such as lineal layout or annular spread on polishing pad, to facilitate polishing fluid can It is dispersed on polishing pad under the influence of centrifugal force.In other specific embodiments, the second sub-aperture 11 on slurry drop point adjusting block 7 The distribution form of outlet end can also be configured as needed.
It may be provided with the first mounting groove for installing polishing fluid delivery pipe 3 on arm body 1, meanwhile, slurry drop point adjusting block 7 It also is located in the first mounting groove, wherein the settable slideway in the bottom of the first mounting groove, slurry drop point adjusting block 7 can be slided with slideway It connects dynamicly.Specifically, the bottom of slurry drop point adjusting block 7 may be provided with protrusion, protrusion is inserted into slideway and sliding connects therewith It connects.
Slurry drop point adjusting block 7 is slided along slideway, so that the position that the discharge end of polishing fluid delivery pipe 3 is aligned changes Become, drops to corresponding position on polishing pad with facilitate polishing fluid.
For automatically moving for realization slurry drop point adjusting block 7, a driving motor can be installed on arm body 1, driving motor Gear can be fixedly installed on output shaft, meanwhile, it can be fixedly installed on the outer wall of slurry drop point adjusting block 7 and mutually be nibbled with gear The spur rack of conjunction.After starting driving motor, it can drive spur rack and slurry drop point adjusting block 7 in the first mounting groove by gear Sliding.
In the present embodiment, polishing fluid delivery pipe 3 can be used hose and have scalability, specifically, wave can be used Line pipe or helix tube etc..Since polishing fluid delivery pipe 3 has scalability, so making it can be according to the distance between with polishing pad Adjust the length of itself.
Wherein, be provided with the first retainer on arm body 1, the first retainer for limit slurry drop point adjusting block 7 make its with Slideway keeps relatively fixed.
During the polishing process, polishing pad need to be cleaned, to remove the abrasive material fallen in process of lapping.For this purpose, needing benefit Cleaning solution is conveyed with the cleaning fluid conveying pipeline 2 being arranged on arm body 1, the cleaning to polishing pad is completed by cleaning solution.Wherein, changing It learns in mechanical polishing, aqueous generally can be used in cleaning solution.
The spray head 4 being connected with its inner cavity is provided on cleaning fluid conveying pipeline 2, spray head 4 there are several, and each spray head 4 goes out Water end (W.E.) is provided with nozzle 5.For convenience of observation, nozzle 5 is not shown in Fig. 1.
The hydrojet channel being connected with spray head 4, the cleaning that hydrojet channel is used to that spray head 4 to be made to eject are provided on nozzle 5 Liquid is flowed along its inner wall.Wherein, along the injection direction of nozzle 5, the area or length of the cross section of the inner wall in hydrojet channel are gradually Increase.
Injection direction of the cross section of the inner wall in hydrojet channel perpendicular to nozzle 5.
Chemically mechanical polishing (Chemical Mechanical Polishing, CMP) is that one kind is usually used in manufacturing high density The technique of integrated circuit.
The process flow of chemically mechanical polishing is as follows: polishing dish driving polishing pad makes its rotation;It adsorbs the bottom of rubbing head Wafer, rubbing head is pressed down under external force, so that garden crystalline substance is ground on polishing pad;The bottom of trimmer is equipped with sand Wheel disc, abrasive disc modify polishing pad by rotation;Polishing fluid is transported to corresponding position above polishing pad, and drips On polishing pad, under the influence of centrifugal force, polishing fluid scatters on the surface of polishing pad;Meanwhile conveying aqueous (cleaning solution) with Polishing pad is cleaned, to remove the abrasive material fallen down in process of lapping.
In the present embodiment, swing arm is conveyed by using polishing fluid, so that it may the conveying for realizing polishing fluid and cleaning solution, from And simplify the structure of polissoir.
Cleaning solution by pressurized treatments is input in the inner cavity of cleaning fluid conveying pipeline 2, and cleaning solution can be by being arranged clear Spray head 4 in washing lotion delivery pipe 2 sprays, and spray head 4 has several, correspondingly, each spray head 4 can have cleaning solution to eject.
In order to improve the range that the cleaning solution of the ejection of spray head 4 is covered, the water outlet of each spray head 4 may be provided with nozzle 5, Wherein, spray head 4 can be connected in a manner of grafting or threaded connection with spray head 4.
After the cleaning solution sprayed in spray head 4 enters in the hydrojet channel inside nozzle 5, part cleaning solution is had along spray The inner wall in liquid channel is flowed and is sprayed.Due to the injection direction along nozzle 5, the cross section of the inner wall in the hydrojet channel on nozzle 5 Area or length be gradually increased, so the area that the cleaning solution being ejected by nozzle 5 is covered can become larger.
As shown in Fig. 2, it is in truncated cone-shaped or taper that hydrojet channel is settable in the present embodiment, on nozzle 5, at this point, hydrojet The circular in cross-section of the inner wall in channel.
In other specific embodiments, nozzle 5 is fan-shaped, wherein the cross section of the inner wall in hydrojet channel can be set on nozzle 5 It sets arc-shaped.
The quantity of spray head 4, which can according to need, to be configured, and is specifically as follows 1,2,5,8,13 etc..Its In, the quantity of spray head 4 is more, and the range that cleaning solution can be covered and be cleaned will be bigger, can spaced set between spray head 4.
In the present embodiment, spray head 4 is rotatably coupled with cleaning fluid conveying pipeline 2.In this way, user can be as needed Spray head 4 is rotated, to adjust the injection direction of corresponding spray head 4 (nozzle 5), polishing pad is carried out so as to more easily clear It washes.
Specifically, spherical spray head 4 can be used in spray head 4, correspondingly, may be provided on cleaning fluid conveying pipeline 2 and spherical spray head 4 Spherical spray head 4 is inserted into spherical groove the universal rotational that can realize spray head 4 by corresponding spherical groove.Wherein, spray head 4 and clear The junction of washing lotion delivery pipe 2 may be provided with the sealing elements such as gasket, to prevent leak-stopping water.
For the position of regulating arm body 1, polishing fluid and cleaning solution are sprayed in polishing pad different location to facilitate, in the present embodiment In, polishing fluid conveying swing arm can also include the shaft 6 being vertically arranged, and arm body 1 is fixed on the top of shaft 6.Shaft 6 can pass through Motor is driven, and rotational axis line is parallel with plumb line.
When installing to polishing fluid conveying swing arm, arm body 1 should be located above polishing pad, wherein cleaning fluid conveying pipeline 2 On spray head 4 and nozzle 5 be all located at the surface of polishing pad, the vertical range between the center and shaft 6 of polishing pad is maximum.
As shown in figure 3, in order to allow the cleaning solution sprayed to cover the center of polishing pad 9, farthest apart from shaft 6 Spray head 4 that is to say and be directed away from the side of shaft 6 with the smallest spray head 4 of the center vertical range of polishing pad 9, injection direction, And it is biased to or is right against the center of polishing pad 9.Remaining injection direction met and discussed can be right against polishing pad 9, can also be biased to polish The center of pad 9.
In the present embodiment, it to be installed to cleaning fluid conveying pipeline 2, is also provided on arm body 1 for installing cleaning Second mounting groove of liquid delivery pipe 2, wherein cleaning fluid conveying pipeline 2 is slidably connected with the second mounting groove.By in the second peace Cleaning fluid conveying pipeline 2 is slided in tankage, the region that adjustable spray head 4 and nozzle 5 are sprayed is suitable for different size to facilitate Polishing pad.The cleaning solution of conveying high-pressure is wanted in cleaning fluid conveying pipeline 2, to avoid deforming in the presence of hydraulic pressure, cleaning Liquid delivery pipe 2 can be used plastics, copper material, steel etc. and be made, so that cleaning fluid conveying pipeline 2 has certain hardness, Bu Huiyin Hydraulic pressure is acted on and is deformed, meanwhile, the cleaning fluid conveying pipeline 2 with certain degree of hardness can be with spray head 4 more convenient to install.
At work, cleaning fluid conveying pipeline 2 may be subjected to hydraulic pressure or external force influence and the offset of appearance position.For The generation of such case is avoided, the second retainer is provided on arm body 1, the second retainer makes for limiting cleaning fluid conveying pipeline 2 It keeps relatively fixed with the second mounting groove.
In the present embodiment, the first retainer and the second retainer can be using bolt or clamping screws etc..Wherein, arm It may be provided with jack or the threaded hole etc. for installing the first retainer and the second retainer on body 1.
During the polishing process, aqueous may be any standing water on top of preventing arm body 1, in the present embodiment there is a situation where splash In, the top surface of arm body 1 can be set as burnishing surface, and not perpendicular with shaft 6.In this way, when aqueous is fallen on the top surface of arm body 1, Aqueous will slide under the action of gravity.
In the present embodiment, it is also proposed that a kind of polissoir conveys swing arm including polishing fluid above.
It will be appreciated by those skilled in the art that the accompanying drawings are only schematic diagrams of a preferred implementation scenario, module in attached drawing or Process is not necessarily implemented necessary to the present invention.
It will be appreciated by those skilled in the art that the module in device in implement scene can be described according to implement scene into Row is distributed in the device of implement scene, can also be carried out corresponding change and is located at the one or more dresses for being different from this implement scene In setting.The module of above-mentioned implement scene can be merged into a module, can also be further split into multiple submodule.
Above-described embodiment serial number is for illustration only, does not represent the superiority and inferiority of implement scene.
Disclosed above is only several specific implementation scenes of the invention, and still, the present invention is not limited to this, Ren Heben What the technical staff in field can think variation should all fall into protection scope of the present invention.

Claims (10)

1. a kind of polishing fluid conveys swing arm, which is characterized in that including arm body, be provided on the arm body for conveying polishing fluid Polishing fluid delivery pipe;
Sliding is provided with slurry drop point adjusting block on the arm body, and the slurry drop point adjusting block is defeated for fixing the polishing fluid Send the discharge end of pipe.
2. polishing fluid according to claim 1 conveys swing arm, which is characterized in that be provided on the slurry drop point adjusting block Hole is connected for making the polishing fluid delivery pipe penetrate therein wear, wherein the discharge end of the polishing fluid delivery pipe is from described It wears to connect in hole and be pierced by.
3. polishing fluid according to claim 1 conveys swing arm, which is characterized in that be provided on the arm body for installing State the first mounting groove of polishing fluid delivery pipe;
The slurry drop point adjusting block is located in first mounting groove, and the bottom of first mounting groove is provided with slideway, institute Slurry drop point adjusting block is stated to be slidably connected with the slideway.
4. polishing fluid according to claim 3 conveys swing arm, which is characterized in that be provided with the first stop on the arm body Part, first retainer make it keep relatively fixed with the slideway for limiting the slurry drop point adjusting block.
5. polishing fluid according to claim 1 conveys swing arm, which is characterized in that be additionally provided on the arm body for conveying The cleaning fluid conveying pipeline of cleaning solution;
The spray head being connected with its inner cavity is provided on the cleaning fluid conveying pipeline, the spray head there are several, each spray head Water outlet be provided with nozzle;
The hydrojet channel being connected with the spray head is provided on the nozzle, the hydrojet channel is for spraying the spray head Cleaning solution out is flowed along its inner wall;Wherein, along the injection direction of the nozzle, the cross section of the inner wall in the hydrojet channel Area or length are gradually increased.
6. polishing fluid according to claim 5 conveys swing arm, which is characterized in that the spray head and the cleaning fluid conveying pipeline It is rotatably coupled.
7. polishing fluid according to claim 1 conveys swing arm, which is characterized in that it further include the shaft being vertically arranged, it is described Arm body is fixed on the top of the shaft.
8. polishing fluid according to claim 5 conveys swing arm, which is characterized in that be provided on the arm body for installing State the second mounting groove of cleaning fluid conveying pipeline, wherein the cleaning fluid conveying pipeline is slidably connected with second mounting groove.
9. polishing fluid according to claim 8 conveys swing arm, which is characterized in that be provided with the second stop on the arm body Part, second retainer make it keep relatively fixed with second mounting groove for limiting the cleaning fluid conveying pipeline.
10. a kind of polissoir, which is characterized in that convey swing arm including polishing fluid of any of claims 1-9.
CN201910027857.5A 2019-01-11 2019-01-11 A kind of conveying swing arm of polishing fluid and polissoir Pending CN109590907A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201910027857.5A CN109590907A (en) 2019-01-11 2019-01-11 A kind of conveying swing arm of polishing fluid and polissoir
TW108135167A TW202026107A (en) 2019-01-11 2019-09-27 Polishing liquid conveying swing arm and polishing equipment
PCT/CN2019/111085 WO2020143260A1 (en) 2019-01-11 2019-10-14 Swing arm for polishing slurry delivery and polishing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910027857.5A CN109590907A (en) 2019-01-11 2019-01-11 A kind of conveying swing arm of polishing fluid and polissoir

Publications (1)

Publication Number Publication Date
CN109590907A true CN109590907A (en) 2019-04-09

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TW (1) TW202026107A (en)
WO (1) WO2020143260A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110977622A (en) * 2019-12-13 2020-04-10 大连理工大学 Control method for multipoint variable-position automatic dropping of polishing solution
WO2020143260A1 (en) * 2019-01-11 2020-07-16 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) Swing arm for polishing slurry delivery and polishing device
CN112693228A (en) * 2020-12-30 2021-04-23 大族激光科技产业集团股份有限公司 Rotary liquid injection device and laser processing device
CN113263448A (en) * 2020-02-14 2021-08-17 南亚科技股份有限公司 Grinding and conveying equipment

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030199229A1 (en) * 2002-04-22 2003-10-23 Applied Materials, Inc. Flexible polishing fluid delivery system
CN100426470C (en) * 2005-03-01 2008-10-15 台湾积体电路制造股份有限公司 Multipurpose slurry delivery arm for chemical mechanical polishing
CN201692914U (en) * 2010-03-26 2011-01-05 中色科技股份有限公司 Universal adjustable nozzle
CN106607765A (en) * 2017-01-19 2017-05-03 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) A compact adjustable polishing solution conveying arm and a work project thereof
CN108177089A (en) * 2018-01-02 2018-06-19 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) Polishing fluid supply arm and polishing liquid supplying device
CN208020018U (en) * 2018-03-15 2018-10-30 清华大学 Automatically cleaning polishing solution delivery device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8277286B2 (en) * 2009-02-13 2012-10-02 Taiwan Semiconductor Manufacturing Co., Ltd. Slurry dispenser for chemical mechanical polishing (CMP) apparatus and method
KR20160106407A (en) * 2015-03-02 2016-09-12 주식회사 케이씨텍 Wafer treatment apparatus
CN109590907A (en) * 2019-01-11 2019-04-09 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) A kind of conveying swing arm of polishing fluid and polissoir

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030199229A1 (en) * 2002-04-22 2003-10-23 Applied Materials, Inc. Flexible polishing fluid delivery system
CN100426470C (en) * 2005-03-01 2008-10-15 台湾积体电路制造股份有限公司 Multipurpose slurry delivery arm for chemical mechanical polishing
CN201692914U (en) * 2010-03-26 2011-01-05 中色科技股份有限公司 Universal adjustable nozzle
CN106607765A (en) * 2017-01-19 2017-05-03 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) A compact adjustable polishing solution conveying arm and a work project thereof
CN108177089A (en) * 2018-01-02 2018-06-19 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) Polishing fluid supply arm and polishing liquid supplying device
CN208020018U (en) * 2018-03-15 2018-10-30 清华大学 Automatically cleaning polishing solution delivery device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020143260A1 (en) * 2019-01-11 2020-07-16 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) Swing arm for polishing slurry delivery and polishing device
CN110977622A (en) * 2019-12-13 2020-04-10 大连理工大学 Control method for multipoint variable-position automatic dropping of polishing solution
CN110977622B (en) * 2019-12-13 2021-04-02 大连理工大学 Control method for multipoint variable-position automatic dropping of polishing solution
CN113263448A (en) * 2020-02-14 2021-08-17 南亚科技股份有限公司 Grinding and conveying equipment
CN113263448B (en) * 2020-02-14 2022-08-16 南亚科技股份有限公司 Grinding and conveying equipment
CN112693228A (en) * 2020-12-30 2021-04-23 大族激光科技产业集团股份有限公司 Rotary liquid injection device and laser processing device
CN112693228B (en) * 2020-12-30 2022-04-19 大族激光科技产业集团股份有限公司 Rotary liquid injection device and laser processing device

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